JPH0675009A - Semiconductor socket - Google Patents

Abstract

(57) [Summary] [Purpose] Since the inner surface of the lid is provided with an adsorbent that adsorbs the semiconductor elements housed in the housing, the semiconductor elements can be quickly taken out from the housing, improving the efficiency of the test work. Provided is a semiconductor socket which can be improved. [Constitution] The present semiconductor socket 10 is provided with a housing 11 into which the integrated circuit 1 is mounted, and a lid 12 which is openably and closably attached to the housing 11.
In addition, a magnet 15 for attracting the integrated circuit 1 housed in the housing 11 is provided on the inner surface of the lid 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor socket used when conducting a performance test or the like on a semiconductor device.

[0002]

2. Description of the Related Art A conventional semiconductor socket will be described with reference to FIG. In the figure, reference numeral 1 is an integrated circuit as a semiconductor element, and 2 is a semiconductor socket used when the integrated circuit 1 is housed and a predetermined performance test or the like is performed. As shown in the figure, the semiconductor socket 2 includes a housing 2A for housing the integrated circuit 1 and a lid 2B which is openably and closably attached to one side of the housing 2A and closes the housing 2A. On the inner surface of the lid 2B, a plurality of projections 2C for fixing the integrated circuit 1 housed in the housing 2A in the housing 2A, and the integrated circuit 1 by the projections 2C.
And a holder 2D for fixing the lid body 2B to the storage body 2A in a fixed state.

When the semiconductor socket 2 is used, the integrated circuit 1 is housed in the housing 2A with the lid 2B opened, and then the housing 2A is sealed with the lid 2B. , The lid 2B is fastened to the container 2A with the holder 2D. When a predetermined performance test or the like is completed using this semiconductor socket 2, the holder 2D is released to open the lid 2B from the container 2A, and then the integrated circuit 1 is sandwiched and housed by using tweezers or the like. The integrated circuit 1 is taken out from the body 2A. Then, when the integrated circuit 1 is tested next, the above-described operation is repeated to test each integrated circuit 1.

[0004]

However, in the case of the conventional semiconductor socket, when the integrated circuit 1 is taken out from the housing 2A of the semiconductor socket 2, the integrated circuit is removed from the housing 2A by using tweezers or the like each time. 1 had to be taken out, its working efficiency was extremely poor, and there was a problem that a quick test could not be carried out quickly.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor socket in which a semiconductor element can be quickly taken out from a container and the efficiency of test work can be improved. I am trying.

[0006]

A semiconductor socket according to the present invention comprises an inner surface of a lid body provided with an adsorbing body for adsorbing a semiconductor element housed in the housing body.

[0007]

According to the present invention, when the lid is opened after the test,
The lid body is opened in a state where the adsorbent on the inner surface of the lid body adsorbs the semiconductor element, and the semiconductor element can be easily removed from the lid body.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in FIGS. In each drawing, FIG. 1 is a side view showing one embodiment of the semiconductor socket of the present invention, and FIG. 2 is a side view showing another embodiment of the semiconductor socket of the present invention.

Embodiment 1. The semiconductor socket 10 of this embodiment
As shown in FIG. 1, is a housing 1 for housing the integrated circuit 1.
1 and a lid 12 which is attached to one side of the housing 11 so as to be openable and closable and closes the housing 11, and the lid 12
A plurality of protrusions 1 for fixing the integrated circuit 1 housed in the housing 11 on the inner surface thereof by surrounding the integrated circuit 1 in the housing 11.
3 and a hook 14 as a holder for fixing the lid 12 to the housing 11 in a state where the integrated circuit 1 is fixed by the protrusions 13.

Thus, the housing 1 is provided on the inner surface of the lid 12.
A magnet 1 for magnetically attracting an integrated circuit 1 housed in
5 are provided. As shown in FIG. 1, the magnet 15 is attached to the surface of the integrated circuit 1 housed in the housing 11 at a position surrounded by the plurality of protrusions 13 and so as to be substantially in contact therewith.

Therefore, when the semiconductor socket 10 is used, the integrated circuit 1 is housed in the housing 11 with the lid 12 opened, and then the housing 11 is sealed with the lid 12.
Further, the lid body 12 is fastened to the storage body 11 with the hook 14. Then, when a predetermined performance test or the like is completed using this semiconductor socket 10, the hook 14 is released to release the storage body 11 described above.
When the lid body 12 is opened from the inside, the integrated circuit 1 is taken out from the housing body 11 while being attracted to the magnet 15 on the inner surface of the lid body 12 as shown in FIG. Then, when the integrated circuit 1 is tested next time, the above-described operation is repeated and each integrated circuit 1 is tested.
Test.

As described above, according to this embodiment, since the magnet 15 for attracting the integrated circuit 1 housed in the housing 11 is provided on the inner surface of the lid 12, the integrated circuit 1 is tweezered from the housing 11. It can be taken out quickly without using tools such as the above, and the efficiency of the test work can be improved.

Example 2. The semiconductor socket 20 of this embodiment
Is a housing 2 for housing the integrated circuit 1 as shown in FIG.
1 and a lid 22 which is attached to one side of the storage body 21 so as to be openable and closable and closes the storage body 21, and the lid body 22.
A plurality of protrusions 2 for enclosing the integrated circuit 1 housed in the housing 21 on the inner surface thereof and fixing the integrated circuit 1 in the housing 21.
3 and a hook 24 as a holder for fixing the lid 22 to the housing 21 in a state where the integrated circuit 1 is fixed by the protrusions 23.

Thus, the housing 2 is provided on the inner surface of the lid 22.
Sucker 1 for magnetically attracting integrated circuit 1 housed in
5 are provided. As shown in FIG. 1, the suction cup 15 is attached at a position surrounded by the plurality of protrusions 23 and pressed against the surface of the integrated circuit 1 housed in the housing body 21. That is, in this embodiment, the suction cup 25 is replaced with the plurality of protrusions 2 instead of the suction cup 15 in the first embodiment.
The structure is the same as that of the first embodiment except that it is provided at a position surrounded by 3. Therefore, also in this embodiment, it is possible to obtain the same effects as those of the first embodiment.

In each of the above embodiments, the magnet 15 and the suction cup 25 are used as the suction body, but the suction body used in the semiconductor socket of the present invention is limited to the magnet 15 and the suction cup 25. Instead, the same effect as the present invention can be expected as long as the semiconductor element can be adsorbed.

[0016]

As described above, according to the present invention, since the adsorbent for adsorbing the semiconductor element housed in the housing is provided on the inner surface of the lid, the semiconductor element can be quickly taken out from the housing. Therefore, it is possible to provide a semiconductor socket which can improve the efficiency of the test work.

[Brief description of drawings]

FIG. 1 is a side view showing an embodiment of a semiconductor socket of the present invention.

FIG. 2 is a side view showing another embodiment of the semiconductor socket of the present invention.

FIG. 3 is a side view showing an example of a conventional semiconductor socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Integrated circuit (semiconductor element) 10, 20 Semiconductor socket 11, 21 Storage body 12, 22 Lid body 13, 23 Protrusion 14, 24 Hook (holding tool) 15 Magnet 25 Sucker

Claims (1)

[Claims] 1. A semiconductor socket provided with a housing body for housing a semiconductor element and a lid body attached to the housing body so as to be openable and closable, the inner surface of the lid body being housed in the housing body. A semiconductor socket having an adsorbent for adsorbing a semiconductor element.