JPH06757A - Filter base plate polishing device - Google Patents

Abstract

PURPOSE:To hold a pressure contact force at a constant value by providing a pressure receiving member vertically movably responding to the polishing surface of a filter base plate and arranging a press mechanism capable of holding a pressure contact force between a polishing tape and a filter at a constant value. CONSTITUTION:A polishing work is applied on a filter base plate W, used for a crystal liquid panel, through composite operation of three operations of a transfer operation for a polishing tape T, a reciprocating movement operation of a placing table 4, and oscillating operation of the polishing tape T. In the polishing work, a pressure receiving member is vertically moved according to rise and fall of the surface to be polished of the filter base plate W and a pressure contact force between the polishing tape T and the filter base plate W is held at a constant value by means of a press mechanism 38. Further, the pressure receiving member is inclined according to rise and fall of the surface to be polished of the filter base plate W by means of an inclination mechanism.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a filter substrate polishing apparatus used for polishing a color filter substrate as a component of a color liquid crystal panel, for example.

[0002]

2. Description of the Related Art Generally, for example, a color filter substrate W
As shown in FIG. 11, each of the R, G, and B filter layers F made of a water-soluble polymer material and a dye is provided on a glass substrate G made of a square plate-shaped blue plate glass having a thickness of about 1 mm. A black matrix as a light-shielding layer S made of chrome black obtained by etching a metal thin film, for example, is provided between the filter layers F arranged corresponding to the pixels, and a protection made of acryl, epoxy resin, or the like is provided thereon. An overcoat layer is provided as the film P, and ITO (Indium Tin) as the transparent conductive film D is further provided.
Oxide) films are formed in a stacked manner.

By the way, these color filter substrates W are required to have smoothness without abnormal protrusions along with required characteristics such as spectral characteristics, heat resistance and chemical resistance, that is, the above-mentioned protective film. The smoothness of the surface of P, the surface of the transparent conductive film D, and the surface of the filter layer F is required.

Conventionally, in this type of color filter substrate, polishing is carried out in a rotation mode which is performed for ceramics or semiconductors to remove dirt and foreign matters on the filter layer F and to flatten the unevenness on the protective film P due to the presence of the filter layer. It is known to meet the demands of smoothing, removing stains on an ITO film, and removing foreign matters, and smoothing.

[0005]

However, in the case of polishing by the above-mentioned rotation mode, since the material of the filter layer F has low hardness, chipping is likely to occur at the end of the filter layer F, and the light shielding layer S and the filter layer F are easily separated. Since the phenomenon in which the position of the light-shielding layer S is dug due to the difference in hardness is likely to occur, the smoothing of the surface of the filter layer F is impaired, which in turn affects the smoothing of the surface of the protective film P and the smoothing of the transparent conductive film D. However, it is very difficult to find the optimum polishing conditions.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve such a problem, and a moving mechanism for reciprocating a mounting table on which a filter substrate used in a liquid crystal panel can be mounted, and a polishing. A pressure receiving member that can guide the tape back and form a press-contact polishing portion is provided, and a tape transfer mechanism that continuously transfers the polishing tape in the reciprocating movement direction of the mounting table, and a tape transfer mechanism in a direction facing the mounting table. A feed mechanism for moving, a tape swing mechanism for swinging the tape transport mechanism in a direction transverse to the reciprocating direction of the mounting table, and the pressure receiving member are provided so as to be vertically movable according to the polishing surface of the filter substrate. A pressing mechanism capable of maintaining a constant pressure contact force between the polishing tape and the filter substrate; and a tilting mechanism capable of tilting the pressure receiving member according to the polishing surface of the filter substrate. In that the filter substrate polishing apparatus.

[0007]

The filter substrate used in the liquid crystal panel is placed on the mounting table, the mounting table is reciprocally moved by the moving mechanism, and the polishing tape is continuously transferred by the tape transfer mechanism in the reciprocating movement direction of the mounting table. The pressure-bonding polishing part of the polishing tape formed by oscillates in a direction crossing the reciprocating movement direction of the mounting table by the tape oscillating mechanism, and in this state, the pressure-contact polishing part is moved by the feeding mechanism in the direction facing the mounting table. Then, the pressure contact polishing section is pressed against the filter substrate, and the filter substrate is subjected to polishing by the three actions of the transporting action of the polishing tape, the reciprocating action of the mounting table, and the shaking action of the polishing tape.

During this polishing process, the pressure receiving member moves up and down in accordance with the waviness of the polishing surface of the filter substrate, and the pressing mechanism maintains a constant pressure contact force between the polishing tape and the filter substrate, and the tilting mechanism receives the pressure. The member tilts in accordance with the waviness of the polishing surface of the filter substrate.

[0009]

1 to 10 show an embodiment of the present invention, in which M
Is a machine base, and 1 is a moving mechanism. In this case, a base 2 is mounted on the machine base M, and a mounting table 4 is provided on the base 2 by a sliding portion 3 so as to be capable of reciprocating in the left-right direction in FIG. , A ball screw mechanism 5 for moving the mounting table 4 left and right is provided.
The moving motor 6 for driving the screw shaft 5a is provided.

Reference numeral 7 is a tape transfer mechanism, 8 is a tape oscillating mechanism, and 9 is a feeding mechanism. In this case, the tape oscillating mechanism 8
Has a gate-shaped mounting frame body 10 installed upright on the machine base M, a mounting plate 11 is mounted on the mounting frame body 10, and a support member 13 is attached to the mounting plate 11 by a sliding portion 12 to reciprocate the mounting table 4. The swinging motor 14 is provided so as to be swingable in the left-right direction of FIG. 3, which is a direction transverse to the moving direction, the swinging motor 14 is attached to the support member 13, and the cam follower 15 is attached to the main shaft of the swinging motor 14 in an eccentric state to support Two guide plates 16 are attached to the back surface of the member 13 so as to face each other so as to sandwich the cam follower 15, and the sliding part 12 is driven by the action of the cam follower 15 and the guide plate 16 by driving the vibration motor 14. By support member 13
It is configured to make a shaking motion.

In this case, the feed mechanism 9 has a feed base 17 provided on the support member 13 so as to be vertically movable by a sliding portion 18, and a bracket 19 is provided on the back surface of the support member 13 so as to project therefrom.
A guide post 20 is erected on the bracket 19, a balance weight 21 is vertically movably fitted to the guide post 20, and the support member 13 and the balance weight 21 are connected by a chain body 23 guided by a guide wheel 22, A ball screw mechanism 24 for moving the feed table 17 up and down is provided, and a feed motor 25 for driving a screw shaft 24a of the ball screw mechanism 24 is provided.

Further, in this case, the tape transfer mechanism 7 has support plates 26 projecting from the left and right side portions of the feed table 17,
Aluminum oxide, chromium oxide, silicon carbide, polyester film, metal, cloth, etc.
A real reel 27 and a take-up reel 28 of a polishing tape T formed by coating or bonding abrasive particles of a predetermined particle size such as diamond are axially mounted in two upper and lower stages, and the real reel 27 is mounted on one support plate 26 by a gear train. A feeding motor 30 for feeding and rotating via 29 is provided, and a winding roller 31 is provided on the support plate 26.
A winding motor 32 for rotating the winding reel is provided, and the winding motor 32 rotates the winding reel 28 via the belt 33a and the gear train 33b to rotate the polishing tape T drawn from the actual winding reel 27. 34, tension control mechanism 35
Through the dancer roll 36 and the roller 37 that constitute the pressure roller 38, and then the roll-shaped pressure receiving member 39 and the left and right rollers 40 and 41 that constitute the pressing mechanism 38 guide the folded back to press the polishing tape T against the polishing tape T. The polishing portion N is formed, and then the winding roller 31 and the bending rollers 31a and 31b arranged in parallel are detoured to be wound around the winding reel 28, and the actual winding reel 27 and the winding reel 28 are rotated. The take-up roller 31 is configured to continuously transfer the polishing tape T in one direction.

In the tension control mechanism 35, a swing arm 43 is provided on the support plate 26 so as to be swingable up and down by a fulcrum shaft 42, and the dancer roll 36 is provided at the tip of the swing arm 43. An angle detector 44 for detecting the rotation angle of the fulcrum shaft 42 is attached to the shaft 42, and the rotation speed of the feeding motor 30 is controlled by the angle detection signal from the angle detector 44 so that the swing arm 43 is maintained in a substantially horizontal state. It is configured to control and hold the transfer tension of the polishing tape T constant.

The pressing mechanism 38 is assembled to the feed table 17 via a tilting mechanism 45. In this case, the tilting mechanism 45 attaches a fixed plate 46 to the feed table 17 and a fixed plate 46.
Attach the lock shaft 47 to the
A tilting frame body 48 having a planar U-shape is provided so as to be swingable and tiltable in a direction traversing the mounting table 4 about a lock shaft 47 via a bearing body 49, and a locking brim portion 47a is formed at a tip end portion of the lock shaft 47. A lock cylinder 50 for advancing and retracting the lock shaft 47 is attached to the fixed plate 46. When the lock cylinder 50 is projected, the tilt frame 48 can be tilted, and when the lock cylinder 50 is retracted, the locking collar portion 47a is used as a bearing. The tilting frame body 48 can be locked by being pressed against the body 49.

Further, in this case, the pressing mechanism 38 includes holding plates 52, 52 by sliding parts 51 on the left and right side parts of the tilting frame body 48.
And the pressing cylinders 53, 53 are attached to the left and right side surfaces of the tilting frame body 48.
3, 53 rods 53a, 53a are connected to the holding plates 52, 52, the roll-shaped pressure receiving member 39 and the left and right rollers 40, 41 are installed between the holding plates 52, 52 by the pressing cylinders 53, 53. In a state in which the pressure receiving member 39 is provided so as to be movable up and down and is lowered by the pressing cylinders 53, 53 to form the pressure contact polishing portion N, a large pressure contact force is applied to the pressure receiving member 39 due to the undulation of the polishing surface of the filter substrate W. At this time, in order to keep the internal pressure of the pressing cylinders 53, 53 constant, the internal pressure is released to the outside, and the pressure receiving member 39 rises, whereby the pressure contact force is kept constant.

Since this embodiment has the above-mentioned structure, when polishing the surface of the filter layer F, the surface of the protective film P or the transparent conductive film D, the filter substrate W is placed on the mounting table 4. It is fixed by a suction fixing mechanism or the like (not shown), and in this state, the mounting table 4 is reciprocally moved by the moving mechanism 1, and the polishing tape T is continuously transferred by the tape transfer mechanism 7 in the reciprocating movement direction of the mounting table 4 to obtain a pressure receiving member. The pressure contact polishing portion N of the polishing tape T formed by 39 is oscillated by the tape oscillating mechanism 8 in a direction transverse to the reciprocating direction of the mounting table 4, and in this state, the pressure contact polishing portion N is moved by the feeding mechanism 9. 4, the pressure contact polishing section N is pressed against the filter substrate W, and the filter substrate W has three functions of transporting the polishing tape T, reciprocating the mounting table 4, and shaking the polishing tape T. Two compounds The polishing is performed by the action, and the polishing can be performed by gradually moving the press-contact polishing section N by the feed mechanism 9 in accordance with the number of reciprocations of the mounting table 4, and therefore, a good polishing is obtained. be able to.

During the polishing process, the tension of the polishing tape T can be kept constant by the tension control mechanism 35, and the pressure receiving member 39 moves up and down in accordance with the waviness of the polishing surface of the filter substrate W. The pressing mechanism 38 can keep the pressure contact force between the polishing tape T and the filter substrate W in the pressure contact polishing section N at a constant pressure by the action of the pressing cylinder 53, and the tilting frame body 48 of the tilting mechanism 45 can be tilted. In this state, the tilting frame 48 and the pressure receiving member 39 swing and tilt around the lock shaft 47 in a direction traversing the mounting table 4 in accordance with the waviness of the polishing surface of the filter substrate W and the like. The tilting frame body 48 can be fixedly held by retreating, and the polishing process of the filter substrate W can be performed to that extent.

The present invention can also be applied to polishing of other filter substrates, and the structures of the moving mechanism, the tape transporting mechanism, the tape oscillating mechanism, the feeding mechanism, etc. are not limited to those in the above embodiment, but may be appropriately changed. It is designed to be modified.

[0019]

As described above, according to the present invention, the filter substrate can be polished by the three combined actions of the transporting action of the polishing tape, the reciprocating action of the mounting table and the oscillating action of the polishing tape. You can get various polishing
During the polishing process, the pressure receiving member moves up and down according to the waviness of the polishing surface of the filter substrate, and the pressing mechanism can keep the pressure contact force between the polishing tape and the filter substrate at a constant pressure. The pressure receiving member tilts in accordance with the waviness of the polishing surface of the filter substrate, etc., and the polishing process of the filter substrate can be performed better.

As described above, the intended purpose can be sufficiently achieved.

[Brief description of drawings]

FIG. 1 is an overall side view of an embodiment of the present invention.

FIG. 2 is an overall plan view of an embodiment of the present invention.

FIG. 3 is an overall front view of an embodiment of the present invention.

FIG. 4 is a partial rear view of the embodiment of the present invention.

FIG. 5 is a partial side sectional view of an embodiment of the present invention.

FIG. 6 is a partial front view of the embodiment of the present invention.

FIG. 7 is a partially enlarged front sectional view of the embodiment of the present invention.

FIG. 8 is a partial enlarged side sectional view of the embodiment of the present invention.

FIG. 9 is a partially enlarged side sectional view of the embodiment of the present invention.

FIG. 10 is a partially enlarged plan view of the embodiment of the present invention.

FIG. 11 is an explanatory cross-sectional view of a color filter substrate.

[Explanation of symbols]

 W Filter Substrate T Polishing Tape N Pressure Welding Polishing Part 1 Moving Mechanism 4 Mounting Table 7 Tape Transfer Mechanism 8 Tape Shaking Mechanism 9 Feeding Mechanism 38 Pressing Mechanism 39 Pressure Receiving Member 45 Tilt Mechanism

Claims (1)

[Claims] 1. A polishing mechanism provided with a moving mechanism for reciprocating a mounting table on which a filter substrate used for a liquid crystal panel can be mounted, and a pressure receiving member capable of guiding a polishing tape in a folded manner to form a pressure-contact polishing portion. A tape transfer mechanism for continuously transferring the tape in a reciprocating direction of the mounting table, a feeding mechanism for moving the tape transfer mechanism in a direction facing the mounting table, and a tape transfer mechanism in a direction transverse to the reciprocating direction of the mounting table. A tape oscillating mechanism for oscillating motion, a pressing mechanism which is capable of vertically moving the pressure receiving member according to a polishing surface of a filter substrate, and which can maintain a constant pressure contact force between the polishing tape and the filter substrate, and the pressure receiving member. And a tilting mechanism capable of tilting according to the polishing surface of the filter substrate.