JPH0686366U - Card edge structure of multilayer wiring board - Google Patents
Card edge structure of multilayer wiring boardInfo
- Publication number
- JPH0686366U JPH0686366U JP2699493U JP2699493U JPH0686366U JP H0686366 U JPH0686366 U JP H0686366U JP 2699493 U JP2699493 U JP 2699493U JP 2699493 U JP2699493 U JP 2699493U JP H0686366 U JPH0686366 U JP H0686366U
- Authority
- JP
- Japan
- Prior art keywords
- card edge
- edge portion
- wiring board
- terminal
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 239000004020 conductor Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 配線板１における端子部６，９の配列密度を
高め、カードエッジ部５，８の幅やコネクタの幅を小型
化する。
【構成】 配線板１は３枚の基板２，３，４の多層構造
をなしており、その外側に位置する第１，第２基板２，
３によって矩形の舌片状をなす外側カードエッジ部５が
形成されている。外側カードエッジ部５の両面には、多
数の端子部６が配列されている。外側カードエッジ部５
先端から突出するように第３基板４が延長され、内側カ
ードエッジ部８が形成されている。内側カードエッジ部
８の両面に、同じく多数の端子部９が配列されている。
(57) [Abstract] [Purpose] To increase the array density of the terminal portions 6 and 9 in the wiring board 1 and to reduce the width of the card edge portions 5 and 8 and the width of the connector. [Structure] The wiring board 1 has a multi-layer structure of three substrates 2, 3 and 4, and the first and second substrates 2 and 2 located on the outer side thereof.
3 forms an outer card edge portion 5 having a rectangular tongue shape. A large number of terminal portions 6 are arranged on both surfaces of the outer card edge portion 5. Outer card edge part 5
The third substrate 4 is extended so as to project from the tip, and the inner card edge portion 8 is formed. A large number of terminal portions 9 are similarly arranged on both surfaces of the inner card edge portion 8.
Description
【０００１】[0001]
この考案は、基板の端部表面に多数の端子部をパターンの一部として形成し、 コネクタに直接挿入して接続するようにしたカードエッジ構造、特に多層配線板 のカードエッジ構造に関する。 The present invention relates to a card edge structure in which a large number of terminals are formed as part of a pattern on an end surface of a substrate and is directly inserted into a connector for connection, and more particularly to a card edge structure of a multilayer wiring board.
【０００２】[0002]
種々の電子部品を実装した配線板を例えば他の配線板の回路と接続するに際し て、その接続部の構成を簡略化するために、図７のようなカードエッジ構造が従 来から多用されている。これは、エポキシ樹脂等からなる基板２１の端縁を幅広 の舌片状に形成し、かつその表面に、回路パターンの一部として導体箔からなる 多数の端子部２２をサブトラクティブ法等により形成してカードエッジ部２３と したものであって、凹溝内に端子片を対向配置した合成樹脂製の多極コネクタに 上記カードエッジ部２３を挿入することにより、各端子部２２とコネクタ内の端 子片とが導通するようになっている。尚、上記端子部２２は一般に基板２１の両 面にそれぞれ設けられている。 When connecting a wiring board on which various electronic parts are mounted to, for example, a circuit of another wiring board, a card edge structure as shown in FIG. 7 has been frequently used in order to simplify the structure of the connection portion. There is. This is because the edge of a substrate 21 made of epoxy resin or the like is formed in a wide tongue shape, and a large number of terminal portions 22 made of a conductor foil are formed on the surface thereof as a part of a circuit pattern by a subtractive method or the like. Card edge portion 23, and by inserting the card edge portion 23 into a multi-pole connector made of synthetic resin in which terminal pieces are arranged opposite to each other in the groove, It is designed to be electrically connected to the terminal piece. The terminal portions 22 are generally provided on both surfaces of the substrate 21, respectively.
【０００３】[0003]
近年、ＬＳＩ等の素子の小型化に伴い、配線板の小型化ならびに実装密度の向 上が図られているが、ＣＰＵのビット数の増加などにより配線板間で相互に接続 すべき端子数はむしろ多くなり易い。そのため、上述したカードエッジ部２３と コネクタとの接続においては、各端子部２２の間のピッチを短くし、限定された 幅のカードエッジ部２３の中で極力多数の端子部２２を形成するようにしている が、必然的に端子部２２ならびにコネクタ側の端子片が微細なものとなり、電流 容量が小さくなるとともに接触抵抗が増大してしまうため、端子数の増加には自 ら限界があった。つまり端子数を多く確保するためには、カードエッジ部２３の 幅やコネクタが大型化する、という欠点があった。 In recent years, with the miniaturization of elements such as LSIs, wiring boards have been downsized and the packing density has been improved. However, due to the increase in the number of bits in the CPU, etc., the number of terminals that should be connected to each other between wiring boards has increased. Rather, it tends to increase. Therefore, in the above-mentioned connection between the card edge portion 23 and the connector, the pitch between the terminal portions 22 should be shortened so that as many terminal portions 22 as possible are formed within the card edge portion 23 having a limited width. However, since the terminal part 22 and the terminal piece on the connector side are inevitably made finer, the current capacity decreases and the contact resistance increases, there is a limit to the increase in the number of terminals. . That is, in order to secure a large number of terminals, there is a drawback that the width of the card edge portion 23 and the connector are increased.
【０００４】[0004]
そこで、この考案に係るカードエッジ構造は、複数の基板を積層して多層構造 とした多層配線板において、外側に位置する基板の端縁の表面に、多数の端子部 を配列して外側カードエッジ部を形成するとともに、この外側カードエッジ部先 端から突出するように内側の基板の端部を延長形成し、この突出部の表面に多数 の端子部を配列して内側カードエッジ部を形成したことを特徴としている。 Therefore, in the card edge structure according to the present invention, in a multilayer wiring board having a multilayer structure in which a plurality of substrates are laminated, a large number of terminal portions are arranged on the surface of the edge of the substrate located on the outer side to form an outer card edge structure. The inner card edge portion is formed by extending the end portion of the inner board so as to project from the front end of the outer card edge portion, and arranging a number of terminals on the surface of the projecting portion. It is characterized by that.
【０００５】[0005]
上記構成では、外側カードエッジ部に多数の端子部が配列されるとともに、こ こから突出した内側カードエッジ部に同様に多数の端子部が配列される。つまり 、カードエッジ部が限定された幅の中で２段に形成される。 In the above configuration, a large number of terminal portions are arranged on the outer card edge portion, and a large number of terminal portions are similarly arranged on the inner card edge portion protruding from this. That is, the card edge portion is formed in two steps within a limited width.
【０００６】[0006]
以下、この考案の一実施例を図面に基づいて詳細に説明する。 An embodiment of the present invention will be described below in detail with reference to the drawings.
【０００７】 図１は、この考案に係るカードエッジ構造の一実施例を示している。この配線 板１は、外側の第１基板２および第２基板３と、中間に挟まれた内側の第３基板 ４との３層構造を有している。これらの各基板２〜４は、例えばエポキシ樹脂等 からなり、内側の第３基板４の両面に所定の回路パターンが形成された上で、第 １，第２基板２，３が積層固定され、かつその外表面に更に所定の回路パターン が形成されている。FIG. 1 shows an embodiment of a card edge structure according to the present invention. The wiring board 1 has a three-layer structure of an outer first substrate 2 and a second substrate 3 and an inner third substrate 4 sandwiched between them. Each of these substrates 2 to 4 is made of, for example, an epoxy resin, and a predetermined circuit pattern is formed on both surfaces of the inner third substrate 4, and then the first and second substrates 2 and 3 are laminated and fixed. Moreover, a predetermined circuit pattern is further formed on the outer surface thereof.
【０００８】 そして、この多層配線板１の一端部において、外側に位置する第１基板２，第 ２基板３の端縁が幅広な矩形の舌片状に延長形成されており、外側カードエッジ 部５が形成されている。この外側カードエッジ部５の両面つまり各基板２，３の 表面には、回路パターンの一部として導体箔からなる多数の細長い端子部６がサ ブトラクティブ法等により形成されている。この端子部６は、カードエッジ部５ の挿入方向に沿って平行に配列されている。尚、外側カードエッジ部５の先端の 角部５ａは、後述するコネクタ７への挿入を容易にするために面取りされている 。また、内側に位置する第３基板４の端縁が、上記外側カードエッジ部５の先端 から突出するように矩形の舌片状に延長形成されており、内側カードエッジ部８ を形成している。この内側カードエッジ部８は、その幅が外側カードエッジ部５ よりも僅かに狭く、かつ先端の角部８ａが同様に面取りされている。また、内側 カードエッジ部８の両面つまり、第３基板４の両側の表面には、回路パターンの 一部として導体箔からなる多数の端子部９がサブトラクティブ法等により形成さ れている。この端子部９は、やはりカードエッジ部５，８の挿入方向に沿って平 行に配列されている。従って、カードエッジ部５，８全体としては、２段にずれ た形で計４面に端子部６，９が設けられている。尚、一般的には、第１，第２基 板２，３の回路が外側カードエッジ部５の端子部６に、第３基板４の回路が内側 カードエッジ部８の端子部９にそれぞれ接続されるが、多層配線板１の内部で各 層にまたがる回路を形成し、例えば外側の第１，第２基板２，３の回路を内側カ ードエッジ部８の端子部９に導通させるようにすることなども可能である。At one end of the multilayer wiring board 1, the outer edges of the first substrate 2 and the second substrate 3 are extended and formed in the shape of a wide rectangular tongue, and the outer card edge portion is formed. 5 is formed. On both surfaces of the outer card edge portion 5, that is, on the surfaces of the substrates 2 and 3, a large number of elongated terminal portions 6 made of a conductor foil are formed as a part of a circuit pattern by a subtractive method or the like. The terminal portions 6 are arranged in parallel along the insertion direction of the card edge portion 5. The corner portion 5a at the tip of the outer card edge portion 5 is chamfered to facilitate insertion into the connector 7 described later. Further, the edge of the third substrate 4 located on the inner side is formed in a rectangular tongue shape so as to project from the tip of the outer card edge portion 5 to form the inner card edge portion 8. . The width of the inner card edge portion 8 is slightly narrower than that of the outer card edge portion 5, and the corner portion 8a at the tip is similarly chamfered. Further, on both surfaces of the inner card edge portion 8, that is, on both surfaces of the third substrate 4, a large number of terminal portions 9 made of a conductor foil are formed as a part of the circuit pattern by a subtractive method or the like. The terminal portions 9 are also arranged in parallel along the insertion direction of the card edge portions 5 and 8. Therefore, the card edge portions 5 and 8 as a whole are provided with the terminal portions 6 and 9 on a total of four sides, which are offset in two stages. In general, the circuits of the first and second substrates 2 and 3 are connected to the terminal portion 6 of the outer card edge portion 5, and the circuit of the third substrate 4 is connected to the terminal portion 9 of the inner card edge portion 8. However, a circuit extending over each layer is formed inside the multilayer wiring board 1 so that the circuits on the outer first and second substrates 2 and 3 are electrically connected to the terminals 9 on the inner card edge portion 8, for example. It is also possible.
【０００９】 上記のように構成されたカードエッジ部５，８は、図２，図３に示すような多 極コネクタ７に接続される。このコネクタ７は、合成樹脂製の細長い矩形状をな し、他の配線板に固定，接続するための多数のピン１１が底面に立設されている とともに、このピン１１と反対側の面に、カードエッジ部５，８を挿入するため のスロット１２が凹設されており、かつ該スロット１２を両側から挟むように多 数の端子片１３が配設されている。尚、この端子片１３とピン１１とは一体の金 属部材にて形成されている。ここで、上記スロット１２は、外側カードエッジ部 ５の厚さおよび幅に対応した第１スロット部１２ａと、内側カードエッジ部８の 厚さおよび幅に対応した第２スロット部１２ｂとを有し、第１スロット部１２ａ の底部に更に第２スロット部１２ｂが凹設された構成となっている。そして、多 数の端子片１３も、第１スロット部１２ａに位置する第１端子片１３ａと、第２ スロット部１２ｂに位置する第２端子片１３ｂとに大別され、図３に示すように 、異なる高さ位置に配列されている。従って、上述した多層配線板１のカードエ ッジ部５，８を上記コネクタ７に挿入すれば、外側カードエッジ部５の各端子部 ６が第１端子片１３ａに接触，導通し、かつ内側カードエッジ部８の各端子部９ が第２端子片１３ｂに接触，導通する。The card edge portions 5 and 8 configured as described above are connected to the multipolar connector 7 as shown in FIGS. This connector 7 is made of a synthetic resin and has an elongated rectangular shape. A large number of pins 11 for fixing and connecting to another wiring board are erected on the bottom surface, and on the surface opposite to the pins 11. A slot 12 for inserting the card edge portions 5 and 8 is provided with a recess, and a large number of terminal pieces 13 are arranged so as to sandwich the slot 12 from both sides. The terminal piece 13 and the pin 11 are formed of an integral metal member. Here, the slot 12 has a first slot portion 12a corresponding to the thickness and width of the outer card edge portion 5 and a second slot portion 12b corresponding to the thickness and width of the inner card edge portion 8. The second slot portion 12b is further recessed in the bottom portion of the first slot portion 12a. The large number of terminal pieces 13 are also roughly divided into a first terminal piece 13a located in the first slot portion 12a and a second terminal piece 13b located in the second slot portion 12b, as shown in FIG. , Are arranged at different height positions. Therefore, when the card edge portions 5 and 8 of the multilayer wiring board 1 described above are inserted into the connector 7, each terminal portion 6 of the outer card edge portion 5 contacts and conducts with the first terminal piece 13a, and the inner card Each terminal portion 9 of the edge portion 8 comes into contact with and conducts with the second terminal piece 13b.
【００１０】 このように上記実施例の構成によれば、カードエッジ部５，８の幅やコネクタ ７の幅を従来のものと同一とした場合に端子数を略２倍に確保することができ、 端子数に比してコネクタ７等の小型化が図れる。また、相対的に、各端子部６， ９や端子片１３の接触面積を大きく確保することが可能となり、導通の確実性， 信頼性が向上する。As described above, according to the configuration of the above embodiment, the number of terminals can be approximately doubled when the widths of the card edge portions 5 and 8 and the width of the connector 7 are the same as those of the conventional one. The size of the connector 7 and the like can be reduced compared to the number of terminals. Further, it is possible to relatively secure a large contact area between each of the terminal portions 6 and 9 and the terminal piece 13, so that reliability and reliability of conduction are improved.
【００１１】 次に、図４は、この考案に係るカードエッジ構造の異なる実施例を示している 。この実施例は、コネクタ７に対する逆向きの挿入を物理的に防止するようにし たものであって、第１基板２および第２基板３からなる外側カードエッジ部５に 対し、第３基板４からなる内側カードエッジ部８を非対称に形成してある。具体 的には、内側カードエッジ部８の一方の側縁８ｂが外側カードエッジ部５の側縁 ５ｂよりも側方へ張り出して形成されているとともに、他方の側縁８ｃが外側カ ードエッジ部５の側縁５ｃよりも僅かに後退した状態に形成されている。Next, FIG. 4 shows a different embodiment of the card edge structure according to the present invention. In this embodiment, the connector 7 is physically prevented from being inserted in the reverse direction, and the outer card edge portion 5 composed of the first board 2 and the second board 3 is connected to the outer board edge part 5 from the third board 4. The inner card edge portion 8 is formed asymmetrically. Specifically, one side edge 8b of the inner card edge portion 8 is formed to project more laterally than the side edge 5b of the outer card edge portion 5, while the other side edge 8c is formed. The side edge 5c is slightly retracted.
【００１２】 そして、コネクタ７においては、図５，図６に示すように、内側カードエッジ 部８の突出した側縁８ｂが嵌合するように、第２スロット部１２ｂの一端に切欠 部１４が延長形成されている。この切欠部１４はコネクタ７のスロット１２の一 端のみに設けられている。In the connector 7, as shown in FIGS. 5 and 6, a notch portion 14 is provided at one end of the second slot portion 12b so that the protruding side edge 8b of the inner card edge portion 8 fits. It is extended. The notch 14 is provided only at one end of the slot 12 of the connector 7.
【００１３】 従って、この実施例においては、内側カードエッジ８の張り出し部分８ｂをス ロット１２の切欠部１４に合わせた正規の姿勢でないとカードエッジ部５，８を コネクタ７のスロット１２に挿入することができない。従って、逆向きでの装着 を確実に防止することができる。尚、配線板１に非対称なスリットもしくは凹溝 を設けて逆向きの装着を防止することも考えられるが、上記実施例のように基板 自体をずらした構成とすれば、強度低下を招くことがない。Therefore, in this embodiment, the card edge portions 5 and 8 are inserted into the slot 12 of the connector 7 unless the protruding portion 8b of the inner card edge 8 is aligned with the cutout portion 14 of the slot 12 in a proper posture. I can't. Therefore, mounting in the opposite direction can be reliably prevented. Although it is conceivable that the wiring board 1 is provided with an asymmetric slit or groove to prevent the mounting in the opposite direction, if the board itself is displaced as in the above embodiment, the strength may be reduced. Absent.
【００１４】[0014]
【考案の効果】 以上の説明で明らかなように、この考案に係る多層配線板のカードエッジ構造 によれば、限定された幅のカードエッジ部の中に一層多くの端子部を配置するこ とが可能となり、配線板やコネクタの小型化が図れる。また相対的に端子部の寸 法を大きく確保できることになり、接触抵抗の低減や信頼性の向上が図れる。As is apparent from the above description, according to the card edge structure of the multilayer wiring board according to the present invention, it is possible to arrange more terminals in the card edge having a limited width. It is possible to reduce the size of the wiring board and the connector. Further, since the size of the terminal portion can be relatively large, the contact resistance can be reduced and the reliability can be improved.
【図１】この考案に係るカードエッジ構造の一実施例を
示す斜視図。FIG. 1 is a perspective view showing an embodiment of a card edge structure according to the present invention.
【図２】この実施例のカードエッジ構造に対応するコネ
クタの斜視図。FIG. 2 is a perspective view of a connector corresponding to the card edge structure of this embodiment.
【図３】同コネクタの断面図。FIG. 3 is a sectional view of the connector.
【図４】この考案に係るカードエッジ構造の異なる実施
例を示す斜視図。FIG. 4 is a perspective view showing another embodiment of the card edge structure according to the present invention.
【図５】この実施例に対応するコネクタの斜視図。FIG. 5 is a perspective view of a connector corresponding to this embodiment.
【図６】図５のＡ部の拡大図。FIG. 6 is an enlarged view of part A of FIG.
【図７】従来のカードエッジ構造を示す斜視図。FIG. 7 is a perspective view showing a conventional card edge structure.
１…多層配線板 ２…第１基板 ３…第２基板 ４…第３基板 ５…外側カードエッジ部 ６…端子部 ８…内側カードエッジ部 ９…端子部 DESCRIPTION OF SYMBOLS 1 ... Multilayer wiring board 2 ... 1st board 3 ... 2nd board 4 ... 3rd board 5 ... Outer card edge part 6 ... Terminal part 8 ... Inner card edge part 9 ... Terminal part
Claims (1)
層配線板において、外側に位置する基板の端縁の表面
に、多数の端子部を配列して外側カードエッジ部を形成
するとともに、この外側カードエッジ部先端から突出す
るように内側の基板の端部を延長形成し、この突出部の
表面に多数の端子部を配列して内側カードエッジ部を形
成したことを特徴とする多層配線板のカードエッジ構
造。1. A multilayer wiring board having a multilayer structure in which a plurality of substrates are laminated to form an outer card edge portion by arranging a large number of terminal portions on a surface of an edge of a substrate located outside. A multilayer wiring characterized in that an end portion of an inner substrate is extended so as to project from the tip of the outer card edge portion, and a large number of terminal portions are arranged on the surface of the projecting portion to form an inner card edge portion. Board card edge structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2699493U JPH0686366U (en) | 1993-05-24 | 1993-05-24 | Card edge structure of multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2699493U JPH0686366U (en) | 1993-05-24 | 1993-05-24 | Card edge structure of multilayer wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0686366U true JPH0686366U (en) | 1994-12-13 |
Family
ID=12208718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2699493U Pending JPH0686366U (en) | 1993-05-24 | 1993-05-24 | Card edge structure of multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0686366U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008044347A1 (en) | 2008-01-25 | 2009-08-06 | DENSO CORPORATION, Kariya-shi | Direct connector and method of making this |
| DE102008044349A1 (en) | 2008-01-25 | 2009-10-15 | Denso Corporation, Kariya-City | Direct connector and method of making this |
| DE102010031416A1 (en) | 2009-07-24 | 2011-04-07 | Denso Corporation, Kariya-City | Card edge connector and method for its production |
| DE102010029682A1 (en) | 2009-07-24 | 2011-07-14 | DENSO CORPORATION, Aichi-pref. | Card edge connector and method of assembling same |
| JP2013115110A (en) * | 2011-11-25 | 2013-06-10 | Tanaka Kikinzoku Kogyo Kk | Printed wiring board of step structure |
| DE102010030723B4 (en) | 2009-07-24 | 2019-07-11 | Denso Corporation | Card edge connector and method of making a card edge connector |
| JP2021182501A (en) * | 2020-05-19 | 2021-11-25 | Ｎｅｃプラットフォームズ株式会社 | Combination structure, selection method and selection program |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51115656A (en) * | 1975-04-03 | 1976-10-12 | Hitachi Cable | Structure of connected printed substrate and connector |
| JPS5516397A (en) * | 1978-07-14 | 1980-02-05 | Philips Nv | Xxray inspecting device |
-
1993
- 1993-05-24 JP JP2699493U patent/JPH0686366U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51115656A (en) * | 1975-04-03 | 1976-10-12 | Hitachi Cable | Structure of connected printed substrate and connector |
| JPS5516397A (en) * | 1978-07-14 | 1980-02-05 | Philips Nv | Xxray inspecting device |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008044347A1 (en) | 2008-01-25 | 2009-08-06 | DENSO CORPORATION, Kariya-shi | Direct connector and method of making this |
| DE102008044349A1 (en) | 2008-01-25 | 2009-10-15 | Denso Corporation, Kariya-City | Direct connector and method of making this |
| DE102010031416A1 (en) | 2009-07-24 | 2011-04-07 | Denso Corporation, Kariya-City | Card edge connector and method for its production |
| DE102010029682A1 (en) | 2009-07-24 | 2011-07-14 | DENSO CORPORATION, Aichi-pref. | Card edge connector and method of assembling same |
| US8187038B2 (en) | 2009-07-24 | 2012-05-29 | Denso Corporation | Card edge connector and method of manufacturing the same |
| DE102010029682B4 (en) | 2009-07-24 | 2018-07-05 | Denso Corporation | Card edge connector and method of assembling same |
| DE102010031416B4 (en) | 2009-07-24 | 2018-07-05 | Denso Corporation | Card edge connector and method for its production |
| DE102010030723B4 (en) | 2009-07-24 | 2019-07-11 | Denso Corporation | Card edge connector and method of making a card edge connector |
| JP2013115110A (en) * | 2011-11-25 | 2013-06-10 | Tanaka Kikinzoku Kogyo Kk | Printed wiring board of step structure |
| JP2021182501A (en) * | 2020-05-19 | 2021-11-25 | Ｎｅｃプラットフォームズ株式会社 | Combination structure, selection method and selection program |
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