JPH0686680B2 - Purifying method of Metsuki bath - Google Patents
Purifying method of Metsuki bathInfo
- Publication number
- JPH0686680B2 JPH0686680B2 JP27567286A JP27567286A JPH0686680B2 JP H0686680 B2 JPH0686680 B2 JP H0686680B2 JP 27567286 A JP27567286 A JP 27567286A JP 27567286 A JP27567286 A JP 27567286A JP H0686680 B2 JPH0686680 B2 JP H0686680B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- reaction
- acid
- weight
- plating bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 32
- -1 iron ions Chemical class 0.000 claims description 75
- 238000007747 plating Methods 0.000 claims description 39
- 229910021645 metal ion Inorganic materials 0.000 claims description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 239000012535 impurity Substances 0.000 claims description 15
- 229910052742 iron Inorganic materials 0.000 claims description 13
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 229920001429 chelating resin Polymers 0.000 claims description 12
- 239000011701 zinc Substances 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 230000002378 acidificating effect Effects 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 150000002500 ions Chemical class 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims 1
- 239000010959 steel Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 133
- 239000011347 resin Substances 0.000 description 133
- 238000006243 chemical reaction Methods 0.000 description 103
- 239000013522 chelant Substances 0.000 description 50
- 239000002253 acid Substances 0.000 description 32
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 27
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- 150000001409 amidines Chemical class 0.000 description 23
- 150000001875 compounds Chemical class 0.000 description 23
- 238000001179 sorption measurement Methods 0.000 description 23
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical group ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 17
- 238000006460 hydrolysis reaction Methods 0.000 description 16
- 230000007062 hydrolysis Effects 0.000 description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 150000001408 amides Chemical class 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 11
- 230000003472 neutralizing effect Effects 0.000 description 11
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 10
- 125000002560 nitrile group Chemical group 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000006482 condensation reaction Methods 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 8
- 239000003518 caustics Substances 0.000 description 8
- 125000000524 functional group Chemical group 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 235000011121 sodium hydroxide Nutrition 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 7
- 229910052783 alkali metal Inorganic materials 0.000 description 7
- 150000001340 alkali metals Chemical class 0.000 description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- ZRALSGWEFCBTJO-UHFFFAOYSA-N Guanidine Chemical compound NC(N)=N ZRALSGWEFCBTJO-UHFFFAOYSA-N 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 239000002585 base Substances 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 6
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 6
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 6
- 239000004925 Acrylic resin Substances 0.000 description 5
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 5
- 125000005396 acrylic acid ester group Chemical group 0.000 description 5
- 150000001342 alkaline earth metals Chemical class 0.000 description 5
- 230000035484 reaction time Effects 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 4
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical compound CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920000768 polyamine Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- 235000011118 potassium hydroxide Nutrition 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 3
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 description 3
- CHJJGSNFBQVOTG-UHFFFAOYSA-N N-methyl-guanidine Natural products CNC(N)=N CHJJGSNFBQVOTG-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 125000002843 carboxylic acid group Chemical group 0.000 description 3
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 3
- SWSQBOPZIKWTGO-UHFFFAOYSA-N dimethylaminoamidine Natural products CN(C)C(N)=N SWSQBOPZIKWTGO-UHFFFAOYSA-N 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 3
- 229920001281 polyalkylene Polymers 0.000 description 3
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 3
- GAWAYYRQGQZKCR-REOHCLBHSA-N (S)-2-chloropropanoic acid Chemical compound C[C@H](Cl)C(O)=O GAWAYYRQGQZKCR-REOHCLBHSA-N 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- KDPAWGWELVVRCH-UHFFFAOYSA-N bromoacetic acid Chemical compound OC(=O)CBr KDPAWGWELVVRCH-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000018044 dehydration Effects 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003480 eluent Substances 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- BPMFZUMJYQTVII-UHFFFAOYSA-N guanidinoacetic acid Chemical compound NC(=N)NCC(O)=O BPMFZUMJYQTVII-UHFFFAOYSA-N 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 239000012433 hydrogen halide Substances 0.000 description 2
- 229910000039 hydrogen halide Inorganic materials 0.000 description 2
- 125000001841 imino group Chemical group [H]N=* 0.000 description 2
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical group OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N 1,4a-dimethyl-7-propan-2-yl-2,3,4,4b,5,6,10,10a-octahydrophenanthrene-1-carboxylic acid Chemical compound C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- PIINGYXNCHTJTF-UHFFFAOYSA-N 2-(2-azaniumylethylamino)acetate Chemical compound NCCNCC(O)=O PIINGYXNCHTJTF-UHFFFAOYSA-N 0.000 description 1
- RLIANQJZDGSYAD-UHFFFAOYSA-N 2-[2-(2-aminoethylamino)ethylamino]acetic acid Chemical compound NCCNCCNCC(O)=O RLIANQJZDGSYAD-UHFFFAOYSA-N 0.000 description 1
- OISJLNZAAMOXCM-UHFFFAOYSA-N 2-[2-[(3-aminopropylamino)methylamino]ethylamino]acetic acid Chemical compound NCCCNCNCCNCC(=O)O OISJLNZAAMOXCM-UHFFFAOYSA-N 0.000 description 1
- MONMFXREYOKQTI-UHFFFAOYSA-N 2-bromopropanoic acid Chemical compound CC(Br)C(O)=O MONMFXREYOKQTI-UHFFFAOYSA-N 0.000 description 1
- OYUNTGBISCIYPW-UHFFFAOYSA-N 2-chloroprop-2-enenitrile Chemical compound ClC(=C)C#N OYUNTGBISCIYPW-UHFFFAOYSA-N 0.000 description 1
- VKNASXZDGZNEDA-UHFFFAOYSA-N 2-cyanoethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC#N VKNASXZDGZNEDA-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- TVONJMOVBKMLOM-UHFFFAOYSA-N 2-methylidenebutanenitrile Chemical compound CCC(=C)C#N TVONJMOVBKMLOM-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- XJUZRXYOEPSWMB-UHFFFAOYSA-N Chloromethyl methyl ether Chemical compound COCCl XJUZRXYOEPSWMB-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- 238000006845 Michael addition reaction Methods 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- AXCZMVOFGPJBDE-UHFFFAOYSA-L calcium dihydroxide Chemical compound [OH-].[OH-].[Ca+2] AXCZMVOFGPJBDE-UHFFFAOYSA-L 0.000 description 1
- 239000000920 calcium hydroxide Substances 0.000 description 1
- 229910001861 calcium hydroxide Inorganic materials 0.000 description 1
- 235000011116 calcium hydroxide Nutrition 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 229940061627 chloromethyl methyl ether Drugs 0.000 description 1
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- NKKMVIVFRUYPLQ-NSCUHMNNSA-N crotononitrile Chemical compound C\C=C\C#N NKKMVIVFRUYPLQ-NSCUHMNNSA-N 0.000 description 1
- HAXVIVNBOQIMTE-UHFFFAOYSA-L disodium;2-(carboxylatomethylamino)acetate Chemical compound [Na+].[Na+].[O-]C(=O)CNCC([O-])=O HAXVIVNBOQIMTE-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000010931 ester hydrolysis Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000005246 galvanizing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 235000012254 magnesium hydroxide Nutrition 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 229960003986 tuaminoheptane Drugs 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Landscapes
- Treatment Of Water By Ion Exchange (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明はメッキ浴の精製方法に関するものである。さら
に詳しくは、特殊なキレート樹脂を使用してメッキ浴中
の不純物金属イオンを効率よく除去する方法に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a method for refining a plating bath. More specifically, it relates to a method for efficiently removing impurity metal ions in a plating bath by using a special chelate resin.
〈従来の技術〉 亜鉛メッキは防錆のために用いるメッキの中で値段が安
く、耐蝕性が良いために好んで用いられている。<Prior Art> Zinc plating is preferred because it is inexpensive and has excellent corrosion resistance among platings used for rust prevention.
亜鉛メッキには、一般にアルカリ浴と酸性浴との2種類
の浴が用いられるが、均一で、且つ光沢の良い皮膜が得
られる酸性メッキ浴の方がよく用いられる。しかしなが
ら、酸性メッキ浴の場合に浴を長時間使用しているとメ
ッキ物の溶解等により鉄イオン等が蓄積し、メッキした
表面にくもりを生じさせたり、むらを生じさせる等の障
害を起こす。Two types of baths, an alkaline bath and an acidic bath, are generally used for galvanizing, but an acidic plating bath that can obtain a uniform and glossy film is often used. However, in the case of an acidic plating bath, if the bath is used for a long time, iron ions and the like accumulate due to the dissolution of the plated material, which causes hindrance and unevenness on the plated surface.
このような不都合を解決するために鉄イオン等を除去す
るいくつかの方法が提案されている。そのうちでキレー
ト樹脂を用いる吸着処理方法は操作が簡便で設備費が低
兼であるために好ましい方法であり、イミノジ酢酸基を
配位子としたキレート樹脂でメッキ浴中の鉄イオンを吸
着除去する方法(特開昭54−74224号公報、特開昭54−1
21241号公報)が知られている。In order to solve such inconvenience, some methods of removing iron ions and the like have been proposed. Among them, the adsorption treatment method using a chelate resin is a preferable method because the operation is simple and the equipment cost is low, and the iron ion in the plating bath is adsorbed and removed by the chelate resin having an iminodiacetic acid group as a ligand. Method (JP-A-54-74224, JP-A-54-1)
21241) is known.
〈発明が解決しようとする問題点〉 メッキ浴から鉄イオンを吸着除去する場合に、公知のキ
レート樹脂は吸着選択性及び吸着速度の点で必ずしも満
足すべきものではない。。それ故に大量の液を吸着処理
する場合には単位時間当りの処理量が小さくなり、多数
の処理装置を必要とし、建設費、運転経費が嵩む等の欠
点を有している。<Problems to be Solved by the Invention> When chelating and removing iron ions from a plating bath, known chelate resins are not always satisfactory in terms of adsorption selectivity and adsorption rate. . Therefore, when a large amount of liquid is adsorbed, the treatment amount per unit time becomes small, a large number of treatment devices are required, and construction costs and operating costs increase.
かかる事情に鑑み、本発明者らはメッキ浴中の不純物金
属イオンを効率よく除去する方法を見出すべく鋭意検討
した結果、本発明を完成するに至った。In view of such circumstances, the present inventors have conducted intensive studies to find a method for efficiently removing impurity metal ions in a plating bath, and as a result, completed the present invention.
〈問題を解決するための手段〉 すなわち、本発明はメッキ浴を特定構造のアミノカルボ
ン酸基を有するキレート樹脂と接触させることを特徴と
するメッキ浴中に含まれる不純物金属イオンの除去方法
である。<Means for Solving the Problem> That is, the present invention is a method for removing impurity metal ions contained in a plating bath, which comprises contacting the plating bath with a chelating resin having an aminocarboxylic acid group having a specific structure. .
本発明に使用されるキレート樹脂は、一般式 で示されるアミノカルボン酸基を有するキレート樹脂で
あって、かかる官能基を有する樹脂であれば樹脂基体、
形状、製造方法には特に限定されれるものではない。The chelate resin used in the present invention has the general formula A chelate resin having an aminocarboxylic acid group represented by, a resin substrate having a resin having such a functional group,
The shape and manufacturing method are not particularly limited.
Xは前記のとおり、ヒドラジン、ポリアルキレンポリア
ミン、グアニジンおよびこれらの誘導体からなる反応体
であって、具体的には反応に用いる後述のアミノ化合物
によって、 例えば 等の構造を示すものである。ここでYは後述のアミノカ
ルボン酸化合物、ハロゲン化アルキルカルボン酸化合
物、アクリル酸系化合物の反応の進み具合により、 水素原子、またはCH2 nCOOM(nおよびMは前記の
とおりである。)になる。反応の進み具合が少ないと水
素原子となり、多いとCH2 nCOOMとなる。X is, as described above, a reactant consisting of hydrazine, polyalkylene polyamine, guanidine and derivatives thereof, and specifically, depending on the below-mentioned amino compound used in the reaction, And the like. Here, Y is a hydrogen atom or CH 2 n COOM (n and M are as described above) depending on the progress of the reaction of an aminocarboxylic acid compound, a halogenated alkylcarboxylic acid compound, and an acrylic acid-based compound described later. Become. If the progress of the reaction is small, it becomes a hydrogen atom, and if it is large, it becomes CH 2 n COOM.
樹脂基体中に一般式 (式中X、n、mおよびMは前記のとおりである。)で
示される官能基を有する本発明のキレート樹脂は公知の
アミノカルボン酸基を有するキレート樹脂に比較して金
属イオンの吸着容量及び吸着速度が著しく大きいという
特徴を有している。General formula in resin substrate The chelating resin of the present invention having a functional group represented by the formula (wherein X, n, m and M are as described above) has a metal ion adsorption capacity higher than that of a known chelating resin having an aminocarboxylic acid group. And has a characteristic that the adsorption rate is extremely high.
本発明のキレート樹脂が公知のアミノカルボン酸基を有
する樹脂と比較し金属イオンに対する吸着容量が大き
く、吸着速度が速くなる理由は定かで無いが、カルボン
酸基が (式中Xは前記のとおりである。)のスペーサーを介し
て高分子主鎖と結合しているので、水溶液中でイオン半
径の大きな水和イオンを形成している金属イオンと立体
的に安定な配位結合を形成しやすく、吸着容量が大きく
なる一方、 (式中Xは前記のとおりである。) が親水性のアミド基であるので、樹脂基体自体の親水性
が向上して結果的に吸着速度の向上に寄与するものと考
えられる。It is not clear why the chelate resin of the present invention has a large adsorption capacity for metal ions and a higher adsorption rate as compared with known resins having an aminocarboxylic acid group. (Where X is as described above) is bound to the polymer main chain via the spacer, and is sterically stable with the metal ion forming a hydrated ion with a large ionic radius in an aqueous solution. It is easy to form various coordination bonds and the adsorption capacity increases, while (In the formula, X is as described above.) Is a hydrophilic amide group, and it is considered that the hydrophilicity of the resin substrate itself is improved, and as a result, the adsorption rate is improved.
本発明のキレート樹脂は前記一般式で示される官能基を
有するキレート樹脂であれば、その形状、製造方法、樹
脂基体の種類等は特に制限されるものではなく、一般的
には以下の方法により製造される。The chelate resin of the present invention is not particularly limited as long as it is a chelate resin having a functional group represented by the general formula, its shape, manufacturing method, type of resin substrate, etc. Manufactured.
(1) カルボニルクロリド基を有した樹脂にアミノカルボン酸
化合物を反応させる方法。(1) A method of reacting a resin having a carbonyl chloride group with an aminocarboxylic acid compound.
カルボニルクロリド基を有したスチレン−ジビニルベン
ゼン共重合体、フェノール樹脂、ポリエチレン、ポリプ
ロピリレンの重合体またはポリメタクリル酸、ポリメチ
ルメタアクリル酸の酸塩化合物の重合体(以下、カルボ
ニルクロリド基を有した樹脂と称す)に5−アミノ−3
−アザペンタン酸、8−アミノ−3,6−ジアザオクタン
酸、11−アミノ−3,6,8−トリアザウンデカン酸、9−
アミノ−3−アザノナン酸、グアニジノ酢酸及びこれら
のアルカリ金属またはアルカリ土類金属塩等のアミノカ
ルボン酸化合物を反応させる方法。Styrene-divinylbenzene copolymer having a carbonyl chloride group, phenolic resin, polyethylene, a polymer of polypropylene or polymethacrylic acid, a polymer of an acid salt compound of polymethylmethacrylic acid (hereinafter, having a carbonyl chloride group Referred to as resin) to 5-amino-3
-Azapentanoic acid, 8-amino-3,6-diazaoctanoic acid, 11-amino-3,6,8-triazaundecanoic acid, 9-
A method of reacting an aminocarboxylic acid compound such as amino-3-azanonanoic acid, guanidinoacetic acid and their alkali metal or alkaline earth metal salts.
(2) ニトリル基を有した樹脂にアミノ化合物を反応し
て得られるアミジン加水分解樹脂に、ハロゲン化アルキ
ルカルボン酸化合物またはアクリル酸系化合物を反応さ
せる方法。(2) A method in which an amidine hydrolyzed resin obtained by reacting a resin having a nitrile group with an amino compound is reacted with a halogenated alkylcarboxylic acid compound or an acrylic acid compound.
アクリロニトリル、α−クロルアクリロニトリル、ジア
ン化ビニリデン、メタアクリロニトリル、エタアクリル
ニトリル、フマルジニトリル、クロトンニトリル、2−
ジアノエチルアクリレート、2−シアノエチルメタアク
リレート等のシアン化ビニル系単量体の重合体若しくは
シアン化ビニル系単量体と共重合が可能な他のエチレン
系不飽和単量体、例えばジビニルベンゼン、ジエチレン
グリコールジメタアクリレート、エチレングリコールジ
メタクリレート、ポリエチレングリコールジメタアクリ
レート、酢酸ビニル等の共重合体等(以下ニトリル基を
有した樹脂と称す)に、エチレンジアミン、トリメチレ
ンジアミン、テトラメチレンジアミン、ヘキサメチレン
ジアミン、ジエチレントリアミン、トリエチレンテトラ
ミン、テトラエチレンペンタミン、ペンタエチレンヘキ
サミン、ヘキサメチレンヘプタミン等のポリアルキレン
ポリアミン、ヒドラジン、グラニジン等のアミノ化合物
を水溶媒下に反応を行い、同時にまたは反応後にさらに
加水分解反応を行うか、非水系でアミノ化合物との反応
を行い、その後加水分解反応を行って前記アミノ化合物
を付加させた樹脂(以下アミジン加水分解樹脂と称す)
を得る。このアミジン加水分解樹脂にモノクロル酢酸、
モノブロム酢酸、モノクロルプロピオン酸、モノブロム
プロピオン及びこれらのアルカリ金属またはアルカリ土
類金属の塩等、ハロゲン化アルキルカルボン酸化合物を
反応させる方法。またはアミジン加水分解樹脂にアクリ
ル酸、メタクリル酸、これらの酸のアルカリ金属または
アルカリ土類金属塩、またはメチル、エチルエステル等
(以下、アクリル酸系化合物と称す)を反応させ、エス
テルの場合には加水分解を行わせる方法。Acrylonitrile, α-chloroacrylonitrile, vinylidene diane, methacrylonitrile, ethacrylonitrile, fumardinitrile, crotonnitrile, 2-
Polymers of vinyl cyanide-based monomers such as dianoethyl acrylate and 2-cyanoethyl methacrylate, or other ethylenically unsaturated monomers copolymerizable with vinyl cyanide-based monomers, such as divinylbenzene, Copolymers of diethylene glycol dimethacrylate, ethylene glycol dimethacrylate, polyethylene glycol dimethacrylate, vinyl acetate and the like (hereinafter referred to as a resin having a nitrile group), ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine , Polyethylenepolyamines such as diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine and hexamethyleneheptamine, and amino compounds such as hydrazine and granidine are reacted in an aqueous solvent. Performed, whether to further hydrolysis reactions simultaneously or after the reaction, carried out the reaction of the amino compound in a non-aqueous system, (hereinafter referred to as amidine hydrolysis resin) then hydrolysis was added so the amino compound by performing resin
To get Monochloroacetic acid,
A method for reacting a halogenated alkylcarboxylic acid compound such as monobromoacetic acid, monochloropropionic acid, monobromopropion and salts of these alkali metals or alkaline earth metals. Alternatively, the amidine hydrolyzed resin is reacted with acrylic acid, methacrylic acid, alkali metal or alkaline earth metal salts of these acids, or methyl, ethyl ester and the like (hereinafter referred to as acrylic acid compound), and in the case of ester, A method of causing hydrolysis.
(3) カルボニルクロリド基を有した樹脂にアミノ化合
物を反応して得られる酸アミド樹脂にハロゲン化アルキ
ルカルボン酸化合物またはアクリル酸系化合物を反応さ
せる方法。(3) A method in which an acid amide resin obtained by reacting a resin having a carbonyl chloride group with an amino compound is reacted with a halogenated alkylcarboxylic acid compound or an acrylic acid compound.
この反応は前記カルボニルクロリド基を有した樹脂に前
記アミノ化合物を反応させて得られる樹脂中に活性水素
を有したアミノ化合物反応樹脂(以下酸アミド樹脂と呼
ぶ)に前記(2)と同様にハロゲン化アルキルカルボン酸
化合物またはアクリル酸系化合物を反応させる方法であ
る。In this reaction, an amino compound reaction resin (hereinafter referred to as an acid amide resin) having active hydrogen in the resin obtained by reacting the resin having a carbonyl chloride group with the amino compound is treated in the same manner as in (2) above. It is a method of reacting a modified alkylcarboxylic acid compound or an acrylic acid compound.
(4) アクリル酸系樹脂にアミノ化合物を反応して得ら
れる樹脂にハロゲン化アルキルカルボン酸化合物または
アクリル酸系化合物を反応させる方法。ポリアクリル
酸、ポリメタクリル酸及びこれらの酸のメチル、エチル
等のエステル(以下、アクリル酸系樹脂と称す)に前記
アミノ化合物を縮合反応させた樹脂(以下、縮合反応酸
アミド樹脂と称す)に前記(2)、(3)と同様にハロゲン化
アルキルカルボン酸化合物またはアクリル酸系化合物を
反応させる方法。(4) A method of reacting a resin obtained by reacting an acrylic acid resin with an amino compound with a halogenated alkylcarboxylic acid compound or an acrylic acid compound. Polyacrylic acid, polymethacrylic acid, and esters of these acids such as methyl and ethyl (hereinafter referred to as acrylic acid-based resin) are subjected to a condensation reaction with the amino compound (hereinafter referred to as condensation reaction acid amide resin) A method of reacting a halogenated alkylcarboxylic acid compound or an acrylic acid compound in the same manner as in the above (2) and (3).
以下に反応について詳述する。The reaction will be described in detail below.
(1)の反応方法について カルボニルクロリド基を有する樹脂とアミノカルボン酸
化合物との反応は、水、N,N−ジメチルホルムアミド、
メチルアルコール、またはエチルアルコール等の溶媒
と、苛性ソーダ、苛性カリ、トリエチルアミン、N,N−
ジメチルアニリン、N,N−ジエチルアニリン等の中和剤
存在下に約40℃以上で、好ましくは約50〜90℃に加熱し
て行う。反応温度が約40℃で低いと反応速度が遅くなり
反応に長時間を要するので好ましくない。About the reaction method of (1) The reaction of the resin having a carbonyl chloride group and the aminocarboxylic acid compound is water, N, N-dimethylformamide,
Solvents such as methyl alcohol or ethyl alcohol, caustic soda, caustic potash, triethylamine, N, N-
The heating is performed at about 40 ° C or higher, preferably at about 50 to 90 ° C in the presence of a neutralizing agent such as dimethylaniline or N, N-diethylaniline. When the reaction temperature is low at about 40 ° C, the reaction rate becomes slow and the reaction takes a long time, which is not preferable.
反応は上記の温度で約0.1〜7時間行われる。その範囲
内で最適時間は、反応温度、反応液濃度、使用する溶
媒、アミノカルボン酸化合物の種類等によって適宜決め
られる。しかしさらに長い時間を反応させることもでき
る。The reaction is carried out at the above temperature for about 0.1 to 7 hours. The optimum time within that range is appropriately determined depending on the reaction temperature, the concentration of the reaction solution, the solvent used, the type of the aminocarboxylic acid compound, and the like. However, it is possible to react for a longer time.
反応は一般に常圧で行うが加圧下でも可能である。The reaction is generally carried out at normal pressure, but it can be carried out under pressure.
カルボニルクロリド基を有する樹脂とアミノカルボン酸
化合物との反応割合は、樹脂中のカルボニルクロリド基
1モルに対して約0.25モル以上用いられる。必要以上の
アミノカルボン酸化合物を用いることは反応後の回収処
理が伴ない、処理操作が繁雑となるし、カルボニルクロ
リド基を有する樹脂に対して用いられるアミノカルボン
酸化合物が約0.25モルより少なくなると、アミノカルボ
ン酸化合物の置換が少なくなり得られる反応生成キレー
ト樹脂の金属捕集能が低下するので、好ましくは樹脂中
のカルボニルクロリド基1モルに対して約0.5〜0.3モル
用いられる。The reaction ratio between the resin having a carbonyl chloride group and the aminocarboxylic acid compound is about 0.25 mol or more based on 1 mol of the carbonyl chloride group in the resin. If more aminocarboxylic acid compounds are used than required, the recovery process after the reaction is accompanied, the processing operation becomes complicated, and the amount of the aminocarboxylic acid compound used for the resin having a carbonyl chloride group becomes less than about 0.25 mol. Since the substitution of the aminocarboxylic acid compound is reduced and the metal-capturing ability of the resulting chelate resin obtained by the reaction is reduced, it is preferably used in an amount of about 0.5 to 0.3 mol per 1 mol of the carbonyl chloride group in the resin.
本発明のキレート樹脂の製造に於いて用いられる中和剤
は、カルボニルクロリド基とアミノカルボン酸化合物と
の反応により副生する塩酸を該中和剤と反応中和し、よ
ってカルボニルクロリド基とアミノカルボン酸化合物の
反応を促進する効果があるので、中和剤の反応割合は、
副生する塩酸量とほぼ当モル用いられる。The neutralizing agent used in the production of the chelate resin of the present invention is a hydrochloric acid by-produced by the reaction of a carbonyl chloride group and an aminocarboxylic acid compound with the neutralizing agent, thereby neutralizing the carbonyl chloride group and the amino group. Since it has the effect of promoting the reaction of the carboxylic acid compound, the reaction ratio of the neutralizing agent is
It is used in approximately the same amount as the amount of hydrochloric acid produced as a by-product.
しかしながらカルボニルクロリド基と直接反応しないア
ミノカルボン酸化合物が脱塩酸剤としても作用するので
当モル以下でも反応上特に支障はなく、又過剰に用いる
ことも反応上の支障は無いので、適宜予備実験により適
正な量が決められる。However, since the aminocarboxylic acid compound that does not directly react with the carbonyl chloride group also acts as a dehydrochlorinating agent, there is no particular problem in the reaction even if it is less than the equimolar amount, and there is no problem in the reaction when it is used in an excess amount. An appropriate amount can be decided.
(2)の反応方法について 本発明のキレート樹脂の基体樹脂として用いられるアミ
ジン加水分解樹脂は、ニトリル基を有する樹脂と前記ポ
リアルキレンポリアミン、ヒドラジン、グアニジン等の
アミノ化合物を水溶媒下若しくは水を含有したジメチル
ホルムアミド、ジメチルスルホオキシド、トルエン、1,
2−ジクロルエタン等の溶媒存在下100℃以上、好ましく
は120℃以上の反応温度で製造される。反応温度が100℃
より低くなると反応が遅くなり反応に長時間を要するの
で好ましくない。Regarding the reaction method of (2), the amidine hydrolyzed resin used as the base resin of the chelate resin of the present invention contains a resin having a nitrile group and an amino compound such as the polyalkylene polyamine, hydrazine and guanidine under an aqueous solvent or containing water. Dimethylformamide, dimethyl sulfoxide, toluene, 1,
It is produced at a reaction temperature of 100 ° C or higher, preferably 120 ° C or higher in the presence of a solvent such as 2-dichloroethane. Reaction temperature is 100 ℃
If it is lower, the reaction becomes slower and the reaction takes a long time, which is not preferable.
反応は、ニトリル基へのアミノ化合物の反応とニトリル
基とアミノ化合物により生成したアミジンのイミノ基へ
の加水分解してアンモニアが副生する反応が並行して進
行する。In the reaction, a reaction of an amino compound with a nitrile group and a reaction of hydrolyzing an amidine produced by the nitrile group and the amino compound to an imino group to produce ammonia as a by-product proceed in parallel.
非水系でアミノ化合物との反応を行って反応後加水分解
してもよい。The reaction with an amino compound may be carried out in a non-aqueous system, and hydrolysis may be carried out after the reaction.
反応時間は、副生反応により発生するアンモニアの量が
ニトリル基1モルに対して0.25モル以上発生する時間行
われる。The reaction time is such that the amount of ammonia generated by the by-product reaction is 0.25 mol or more per 1 mol of the nitrile group.
一般には上記の温度で0.5〜50時間、好ましくは1〜12
時間行われるが、その範囲内で最適時間は反応温度、反
応液濃度、使用する溶媒、アミノ化合物の種類等によっ
て適宜決められる。しかしさらに長い時間反応させるこ
ともできる。Generally 0.5 to 50 hours at the above temperature, preferably 1 to 12
The reaction is carried out for a time, and the optimum time within that range is appropriately determined depending on the reaction temperature, the reaction solution concentration, the solvent used, the type of amino compound, and the like. However, it is possible to react for a longer time.
反応は、一般に常圧で行われるが、加圧下でも可能であ
る。The reaction is generally carried out at normal pressure, but it can be carried out under pressure.
ニトリル基を有する樹脂に対するアミノ化合物の反応割
合は樹脂中のニトリル基に対して各々0.5モル以上用い
られる。必要以上の反応試剤を用いることは反応後の回
収処理が伴ない、処理操作が繁雑となるし、ニトリル基
を有する樹脂に対して用いられるアミノ化合物の量が、
上記より少なくなると次工程に於けるカルボン酸基の導
入量が少なくなり得られる反応生成キレート樹脂の金属
吸着容量が低下するし、水の量が上記より少なくなると
アミジンのイミノ基の加水分解量が少くなり得られる反
応生成キレート樹脂の金属吸着速度が遅くなるので、好
ましくは樹脂中のニトリル基1モルに対してアミノ化合
物及び水を各々約1〜6倍モル、約1〜30倍モル用いら
れる。The reaction ratio of the amino compound to the resin having a nitrile group is 0.5 mol or more with respect to the nitrile group in the resin. The use of more reaction reagents than necessary involves a recovery process after the reaction, and the processing operation becomes complicated, and the amount of the amino compound used for the resin having a nitrile group is
When the amount is less than the above, the amount of carboxylic acid groups introduced in the next step is small and the metal adsorption capacity of the resulting reaction-produced chelate resin is reduced, and when the amount of water is less than the above, the amount of hydrolysis of the imino group of amidine is reduced. Since the metal adsorption rate of the resulting reaction-generated chelate resin becomes slower, the amino compound and water are preferably used in an amount of about 1 to 6 times mol and about 1 to 30 times mol per mol of the nitrile group in the resin. .
上記の様にして反応したアミジン加水分解樹脂は、次い
でそのまま、または溶媒及び未反応のアミノ化合物を分
離除去した後、または必要に応じ洗浄、乾燥した後、前
記ハロゲン化アルキルカルボン酸化合物、前記アルキル
酸化合物、または前記アクリル酸エステルとの反応を行
う。The amidine hydrolyzed resin reacted as described above is then used as it is, or after separating and removing the solvent and unreacted amino compound, or if necessary, after washing and drying, the halogenated alkylcarboxylic acid compound, the alkyl The reaction with an acid compound or the acrylic ester is performed.
アミジン加水分解樹脂とモノクロル酢酸、モノブロム酢
酸、モノクロルプロピオン酸、モノブロムプロピオン酸
等ハロゲン化アルキルカルボン酸化合物との反応は、
水、N,N−ジメチルホルムアミド、エチルアルコール、
メチルアルコール、1,2−ジクロルエタン、クロロホル
ム等の溶媒及び苛性ソーダ、苛性カリ、トリエチルアミ
ン、N,N−ジメチルアニリン、N,N−ジエチルアニリン等
の中和剤の存在下に約40℃以上で好ましくは約50〜90℃
に加熱して行う。反応温度が約40℃より低いと反応速度
が遅くなり、反応に長時間を要するので好ましくない。Reaction of amidine hydrolyzed resin with halogenated alkylcarboxylic acid compounds such as monochloroacetic acid, monobromoacetic acid, monochloropropionic acid, monobromopropionic acid
Water, N, N-dimethylformamide, ethyl alcohol,
Methyl alcohol, 1,2-dichloroethane, chloroform and the like solvent and caustic soda, caustic potash, triethylamine, N, N-dimethylaniline, N, N-diethylaniline and the like in the presence of a neutralizing agent at about 40 ℃ or more, preferably about 50 ~ 90 ℃
Heat to. If the reaction temperature is lower than about 40 ° C, the reaction rate becomes slow and the reaction takes a long time, which is not preferable.
反応は上記の温度で約0.1〜7時間行われる。その範囲
内で最適時間は反応温度、反応液濃度、ハロゲン化アル
キルカルボン酸化合物の種類等によって適宜決められ
る。しかしさらに長い時間反応させることもできる。The reaction is carried out at the above temperature for about 0.1 to 7 hours. The optimum time within the range is appropriately determined depending on the reaction temperature, the reaction solution concentration, the kind of the halogenated alkylcarboxylic acid compound, and the like. However, it is possible to react for a longer time.
反応は一般に常圧で行なわれるが加圧下でも可能であ
る。The reaction is generally carried out at normal pressure, but it can be carried out under pressure.
アミジン加水分解樹脂とハロゲン化アルキルカルボン酸
化合物の反応割合は、樹脂中の塩基性基1当量に対して
0.5モル以上好ましくは1.0モル以上用いればよいが、必
要以上のハロゲン化アルキルカルボン酸化合物を用いる
ことは反応後の回収処理が伴ない処理操作が繁雑とな
り、アミジン加水分解樹脂中の塩基性基に対して用いら
れるハロゲン化アルキルカルボン酸化合物が上記より少
なくなるとアルキルカルボン酸の付加量が少なくなり得
られる反応生成キレート樹脂の金属捕集能が低下するの
で、好ましくは樹脂中の塩基性基1等量に対してハロゲ
ン化アルキルカルボン酸化合物は1.0〜3モル用いられ
る。The reaction ratio of the amidine hydrolysis resin and the halogenated alkylcarboxylic acid compound is based on 1 equivalent of the basic group in the resin.
It may be used in an amount of 0.5 mol or more, preferably 1.0 mol or more.However, the use of more than necessary halogenated alkylcarboxylic acid compound complicates the processing operation accompanied by the recovery process after the reaction, and the basic group in the amidine hydrolyzed resin is When the amount of the halogenated alkylcarboxylic acid compound to be used is less than the above amount, the addition amount of the alkylcarboxylic acid decreases, and the metal-capturing ability of the resulting reaction-generated chelate resin decreases. Therefore, the basic group 1 or the like in the resin is preferably used. The halogenated alkylcarboxylic acid compound is used in an amount of 1.0 to 3 mol based on the amount.
本発明に於いて用いられる中和剤は、アミジン加水分解
樹脂中の塩基性基とハロゲン化アルキルカルボン酸化合
物との反応により遂時副生するハロゲン化水素とハロゲ
ン化アルキルカルボン酸化合物の塩基性塩として反応中
和する役目をするものであり、中和剤の反応割合は、副
生するハロゲン化水素量とハロゲン化アルキルカルボン
酸のカルボン酸量との合計当量用いるのが望ましい。The neutralizing agent used in the present invention is a hydrogen halide and a basicity of a halogenated alkylcarboxylic acid compound which are by-produced by a reaction between the basic group in the amidine hydrolyzed resin and the halogenated alkylcarboxylic acid compound. The salt serves to neutralize the reaction, and the reaction ratio of the neutralizing agent is preferably a total equivalent of the amount of hydrogen halide by-produced and the amount of carboxylic acid of the halogenated alkylcarboxylic acid.
一般にはあらかじめハロゲン化アルキルカルボン酸化合
物のカルボン酸と当量の中和剤を加えてハロゲン化アル
キルカルボン酸化合物の塩とし、ハロゲン化アルキルカ
ルボン酸化合物の塩とアミジン加水分解樹脂との反応に
より副生するハロゲン酸量に応じ、遂時中和剤と添加し
て行く方法が採用される。Generally, a carboxylic acid of a halogenated alkyl carboxylic acid compound and an equivalent amount of a neutralizing agent are added in advance to form a salt of a halogenated alkyl carboxylic acid compound, and a by-product is produced by reacting the salt of a halogenated alkyl carboxylic acid compound with an amidine hydrolysis resin. Depending on the amount of halogen acid to be used, a method of gradually adding a neutralizing agent is adopted.
中和剤の添加量、添加方法は、アミジン加水分解樹脂と
ハロゲン化アルキルカルボン酸化合物との反応条件によ
り異なるので適宜予備実験により適正な添加条件が採用
される。The amount and method of addition of the neutralizing agent differ depending on the reaction conditions of the amidine hydrolyzed resin and the halogenated alkylcarboxylic acid compound, and therefore appropriate addition conditions are adopted by preliminary experiments.
アミジン加水分解樹脂と前記アクリル酸系化合物との反
応は、いわゆるマイケル付加反応として知られている公
知反応の利用である。The reaction between the amidine hydrolyzed resin and the acrylic acid compound is a known reaction known as a so-called Michael addition reaction.
反応は、水、エチルアルコール、メチルアルコール、ジ
メチルホルムアミド等の溶媒下約50℃以上、好ましくは
約60〜100℃で行う。反応温度が50℃より低いと反応速
度が遅くなり、反応に長時間を要するので好ましくな
い。The reaction is carried out in a solvent such as water, ethyl alcohol, methyl alcohol, dimethylformamide or the like at about 50 ° C or higher, preferably about 60-100 ° C. If the reaction temperature is lower than 50 ° C, the reaction rate becomes slow and the reaction takes a long time, which is not preferable.
反応は、好ましくは、上記の温度で約0.5〜10時間行わ
れる。The reaction is preferably carried out at the above temperatures for about 0.5-10 hours.
反応は一般に常圧で行なわれるが加圧下でも可能であ
る。The reaction is generally carried out at normal pressure, but it can be carried out under pressure.
アミジン加水分解樹脂とアクリル酸系化合物との反応割
合は、樹脂中の塩基性基1当量に対して約0.25モル以
上、好ましくは約0.5モル以上用いればよいが、必要以
上のアクリル酸系化合物を用いることは、反応後の回収
処理が伴ない処理操作が繁雑となるし、アミジン加水分
解する樹脂に対して用いられるアクリル酸系化合物が約
0.25モル以下になるとアクリル酸系化合物の付加量が少
なくなり得られる反応生成キレート樹脂の金属捕集能が
低下するので、好ましくは樹脂中のアクリル酸系化合物
は、塩基性基1当量に対して約0.5〜3.0モル用いられ
る。The reaction ratio between the amidine hydrolyzed resin and the acrylic acid-based compound may be about 0.25 mol or more, preferably about 0.5 mol or more, based on 1 equivalent of the basic group in the resin. If it is used, the treatment operation without the recovery treatment after the reaction becomes complicated, and the acrylic acid compound used for the resin that hydrolyzes amidine is not used.
If the amount is less than 0.25 mol, the addition amount of the acrylic acid compound decreases and the metal-capturing ability of the resulting reaction-generated chelate resin decreases. Therefore, the acrylic acid compound in the resin is preferably contained in 1 equivalent of the basic group. About 0.5-3.0 moles are used.
上記アミジン加水分解樹脂とアクリル酸化合物または、
アクリル酸エステルとの反応により得られた樹脂のう
ち、アクリル酸エステルとの反応の場合、上記反応中、
または反応後に通常のエステルの加水分解条件にて加水
分解処理を行う。The above-mentioned amidine hydrolysis resin and acrylic acid compound, or
Among the resins obtained by the reaction with acrylic acid ester, in the case of the reaction with acrylic acid ester, during the above reaction,
Alternatively, after the reaction, hydrolysis treatment is performed under normal ester hydrolysis conditions.
エステルの加水分解処理は、一般にアクリル酸エステル
に対して約2倍モル量以上の苛性アルカリ金属または苛
性アルカリ土類金属の存在下に約80℃以上の温度で約0.
5時間以上行われる。The hydrolysis treatment of ester is generally performed in the presence of ca. 2 times or more molar amount of caustic alkali metal or caustic alkaline earth metal with respect to acrylic acid ester at a temperature of about 80.degree.
5 hours or more.
苛性アルカリ金属、苛性アルカリ土類金属の量、反応温
度、反応時間が上記条件より低い場合、エステルの加水
分解が十分に行われないので好ましくない。If the amount of caustic alkali metal or caustic alkaline earth metal, the reaction temperature, or the reaction time is lower than the above conditions, hydrolysis of the ester is not sufficiently performed, which is not preferable.
苛性アルカリ金属または苛性アルカリ土類金属の量はア
クリル酸エステルに対して約2倍モル量以上、通常は約
3〜10倍モル量で実施される。The amount of caustic alkali metal or caustic alkaline earth metal is about 2 times or more, and usually about 3 to 10 times the molar amount of acrylic acid ester.
反応温度は約80℃以上、好ましくは約90〜150℃で実施
される。反応温度が150℃以上になると反応により導入
されたアクリル酸基の脱離反応が併発するので好ましく
ない。The reaction temperature is about 80 ° C. or higher, preferably about 90 to 150 ° C. When the reaction temperature is 150 ° C. or higher, the elimination reaction of the acrylic acid group introduced by the reaction occurs concurrently, which is not preferable.
反応時間は一般には約0.5時間以上、好ましくは約1〜
8時間で実施されるが、その範囲内で最適時間は反応温
度、苛性アルカリ金属、苛性アルカリ土類金属の量、濃
度等によって適宜決められる。かしさらに長い時間反応
させることもできる。The reaction time is generally about 0.5 hours or longer, preferably about 1 to
It is carried out for 8 hours, and the optimum time within that range is appropriately determined depending on the reaction temperature, the amount and concentration of caustic alkali metal, caustic alkaline earth metal, and the like. However, the reaction can be continued for a longer time.
反応は一般に常圧で行われるが、加圧下でも可能であ
る。The reaction is generally carried out at normal pressure, but it can be carried out under pressure.
(3)の反応方法について 本発明のキレート樹脂の基体樹脂として用いられる酸ア
ミド樹脂は、前記カルボニルクロリド基を有する樹脂と
前記アミノカルボン酸化合物との反応に於いてアミノカ
ルボン酸化合物の替りにエチレンジアミン、トリメチレ
ンジアミン、テトラメチレンジアミン、ヘキサメチレン
ジアミン、ジエチレントリアミン、トリエチレンテトラ
ミン、テトラエチレンペンタミン、ペンタエチレンヘキ
サミン、ヘキサメチレンヘプタミン等のポリアルキレン
ポリアミン、ヒドラジン、グラニジン等のアミノ化合物
を用いる以外は反応モル比、溶媒の使用、反応温度、反
応時間等については、前記とほぼ同様な条件でおこなわ
れる。Regarding the reaction method of (3), the acid amide resin used as the base resin of the chelate resin of the present invention is ethylenediamine instead of the aminocarboxylic acid compound in the reaction of the resin having the carbonyl chloride group and the aminocarboxylic acid compound. Other than using amino compounds such as polyalkylene polyamines such as trimethylenediamine, tetramethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine and hexamethyleneheptamine, hydrazine and granidine. The molar ratio, the use of the solvent, the reaction temperature, the reaction time and the like are almost the same as described above.
上記のようにして製造した本発明のキレート樹脂の基体
樹脂である酸アミド樹脂は、前記アミジン加水分解樹脂
とハロゲン化アルキルカルボン酸化合物または前記アミ
ジン加水分解樹脂とアクリル酸系化合物との反応とほぼ
同様にして酸アミド樹脂中の塩基性基へアルキルカルボ
ン酸基が導入され、本願発明のアミノカルボン酸基を有
するキレート樹脂が製造される。The acid amide resin which is the base resin of the chelate resin of the present invention produced as described above is almost the same as the reaction between the amidine hydrolysis resin and the halogenated alkylcarboxylic acid compound or the amidine hydrolysis resin and the acrylic acid compound. Similarly, the alkylcarboxylic acid group is introduced into the basic group in the acid amide resin to produce the chelate resin having the aminocarboxylic acid group of the present invention.
(4)の反応方法について 本発明のキレート樹脂の基体樹脂として用いられる縮合
反応酸アミド樹脂は、前記アクリル酸系樹脂にエチレン
ジアミン、トリメチレンジアミン、テトラメチレンジア
ミン、ヘキサメチレンジアミン、ジエチレントリアミ
ン、トリエチレンテトラミン、テトラエチレンペンタミ
ン、ペンタエチレンヘキサミン、ヘキサメチレンヘプタ
ミン等のポリアルキレンポリアミン、ヒドラジン、グア
ニジン等のアミノ化合物を無溶媒化または、トルエン、
ベンゼン、キシレン、ジメチルホルムアミド、シクロヘ
キサン等溶媒下に約130℃以上、好ましくは約150〜180
℃で反応を行う。反応温度が130℃以下になるとアクリ
ル酸系樹脂のアクリル酸基またはアクリル酸エステル基
と、アミノ化合物との脱水縮合反応速度が遅くなり長時
間の反応を要するので好ましくない。Regarding the reaction method of (4), the condensation reaction acid amide resin used as the base resin of the chelate resin of the present invention is ethylenediamine, trimethylenediamine, tetramethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine to the acrylic acid resin. , Polyethylene polyamines such as tetraethylene pentamine, pentaethylene hexamine, hexamethylene heptamine, solvent-free amino compounds such as hydrazine and guanidine, or toluene,
Benzene, xylene, dimethylformamide, cyclohexane in a solvent such as about 130 ℃ or more, preferably about 150 ~ 180
Perform the reaction at ℃. If the reaction temperature is 130 ° C. or lower, the dehydration condensation reaction rate of the acrylic acid group or acrylic acid ester group of the acrylic acid resin and the amino compound becomes slow, and a long reaction time is required, which is not preferable.
反応は、好ましくは、上記の温度で0.5〜10時間行われ
る。その範囲内で最適時間は反応温度、反応液濃度、ア
ミノ化合物の種類等によって適宜決められる。しかしさ
らに長い時間反応させることもできる。The reaction is preferably carried out at the above temperature for 0.5 to 10 hours. The optimum time within the range is appropriately determined depending on the reaction temperature, the reaction solution concentration, the type of amino compound, and the like. However, it is possible to react for a longer time.
反応は、温度が130℃以上であれば常圧下でも可能であ
るが、一般には加圧下で行われる。The reaction can be carried out under normal pressure as long as the temperature is 130 ° C. or higher, but it is generally carried out under pressure.
前記アクリル酸系樹脂と前記アミノ化合物の反応割合は
樹脂中のアクリル酸またはアクリル酸エステル基1モル
に対して約0.5モル以上用いられる。The reaction ratio of the acrylic acid resin and the amino compound is about 0.5 mol or more based on 1 mol of the acrylic acid or acrylate group in the resin.
必要以上のアミノ化合物を用いることは反応後の回収処
理が伴ない処理操作が繁雑となるしアクリル酸樹脂に対
して用いられるアミノ化合物が上記より少くなるとアミ
ノ化合物の置換が少なくなり、次工程に於けるカルボン
酸基の導入量が少なくなり得られる反応生成キレート樹
脂の金属吸着容量が低下するので、好ましくは樹脂中の
アクリル酸またはアクリル酸エステル基1モルに対して
アミノ化合物は約1〜3モル用いられる。The use of more amino compounds than necessary complicates the processing operation accompanied by recovery treatment after the reaction, and when the amount of the amino compound used for the acrylic acid resin is less than the above, the substitution of the amino compound is reduced and the next step is performed. Since the amount of carboxylic acid groups introduced in the resin becomes small and the metal adsorption capacity of the resulting chelate resin obtained by the reaction decreases, it is preferable that the amount of the amino compound is about 1 to 3 with respect to 1 mol of acrylic acid or acrylate group in the resin. Used in moles.
上記のようにして製造した本発明のキレート樹脂の基体
樹脂である縮合反応酸アミド樹脂は、前記アミジン加水
分解樹脂とハロゲン化アルキルカルボン酸化合物または
前記アミジン加水分解樹脂とアクリル酸系化合物との反
応とほぼ同様にして縮合反応酸アミド樹脂中の塩基性基
へアルキルカルボン酸基が導入され、本願発明のアミノ
カルボン酸基を有するキレート樹脂が製造される。The condensation reaction acid amide resin, which is the base resin of the chelate resin of the present invention produced as described above, is obtained by reacting the amidine hydrolysis resin with a halogenated alkylcarboxylic acid compound or the amidine hydrolysis resin with an acrylic acid compound. Almost in the same manner as described above, the alkylcarboxylic acid group is introduced into the basic group in the condensation reaction acid amide resin to produce the chelate resin having the aminocarboxylic acid group of the present invention.
以上のように製造した本願発明のアミノカルボン酸基を
有するキレート樹脂はそのまま、あるいは洗浄、乾燥を
行った後使用できるが、必要に応じて該キレート樹脂を
さらに塩基または酸で処理して使用することもできる。The chelate resin having an aminocarboxylic acid group of the present invention produced as described above can be used as it is or after washing and drying, but if necessary, the chelate resin is further treated with a base or an acid before use. You can also
本発明は、上記の特定構造のアミノカルボン酸基を有す
るキレート樹脂とメッキ浴を接触させるものであるが、
メッキ浴とは、ニッケル、銅、亜鉛などの酸性メッキ
浴、アルミニウムあるいはアルミニウム合金の電解着色
浴、アルミニウムあるいはアルミニウム合金のアルマイ
ト染色浴、クロメート処理浴など酸性のメッキ浴をい
う。In the present invention, a chelating resin having an aminocarboxylic acid group having the above-mentioned specific structure is brought into contact with a plating bath,
The plating bath refers to an acidic plating bath such as an acidic plating bath of nickel, copper or zinc, an electrolytic coloring bath of aluminum or aluminum alloy, an alumite dyeing bath of aluminum or aluminum alloy, a chromate treatment bath, or the like.
本発明の不純物金属イオンはメッキされる材料の組成に
よるが、一般に問題となる金属イオン成分は、鉄、ニッ
ケル、銅、アルミニウム、マンガン、バナジウム、亜
鉛、鉛、カドミウム等が挙げられる。The impurity metal ions of the present invention depend on the composition of the material to be plated, but the metal ion components that are generally problematic include iron, nickel, copper, aluminum, manganese, vanadium, zinc, lead, and cadmium.
本発明に使用される特定構造のアミノカルボン酸基を有
するキレート樹脂は鉄イオン及び銅イオンに対する選択
吸着性が高く、一方ニッケル及び亜鉛に対してはほとん
ど吸着性を有しない。したがって本発明はニッケル及び
亜鉛のメッキ浴中に含まれる鉄イオン及び銅イオンの除
去に好ましく用いられる。The chelating resin having an aminocarboxylic acid group having a specific structure used in the present invention has a high selective adsorptivity for iron ions and copper ions, while having little adsorptivity for nickel and zinc. Therefore, the present invention is preferably used for removing iron ions and copper ions contained in nickel and zinc plating baths.
メッキ浴とキレート樹脂の接触処理を行うに当たり、キ
レート樹脂に対するメッキ浴中の不純物金属イオンの吸
着性の低下防止のため、メッキ浴のpHは約0.5〜4の範
囲で実施するのが好ましい。メッキ浴のpHが約0.5未満
では、不純物金属イオンの吸着量が低下し、またpHが約
4以上になると、ニッケル及び亜鉛等の吸着量が増大す
るので好ましくない。In carrying out the contact treatment between the plating bath and the chelate resin, the pH of the plating bath is preferably in the range of about 0.5 to 4 in order to prevent the adsorption of impurity metal ions in the plating bath from the chelate resin from being lowered. When the pH of the plating bath is less than about 0.5, the adsorbed amount of the impurity metal ions decreases, and when the pH becomes about 4 or more, the adsorbed amount of nickel and zinc increases, which is not preferable.
メッキ浴とキレート樹脂との接触方法は、特に制限され
るものではなく、例えばキレート樹脂を充填した塔内へ
メッキ浴を通液する方法、メッキ浴中へキレート樹脂を
浸漬し、次で濾過分離する方法等が採用される。The method of contacting the plating bath with the chelate resin is not particularly limited, and for example, a method of passing the plating bath through a tower filled with the chelate resin, immersing the chelate resin in the plating bath, and then separating by filtration. The method of doing is adopted.
メッキ浴とキレート樹脂との接触温度も特に制限される
ものではなく、通常0〜100℃で実施される。また接触
時間も特に制限されるものではない。The contact temperature between the plating bath and the chelate resin is not particularly limited, and is usually 0 to 100 ° C. Moreover, the contact time is not particularly limited.
メッキ浴量に対する使用するキレート樹脂量、接触温度
および接触時間等は適宜予備実験を行うことにより設定
することが出来る。The amount of chelating resin to be used with respect to the plating bath amount, the contact temperature, the contact time, and the like can be set by appropriately performing preliminary experiments.
本発明のキレート樹脂により吸着された不純物金属イオ
ンは適当な溶離剤を用いて溶離回収することができる。
溶離剤としては塩酸、硝酸、リン酸、硫酸等の酸性水溶
液が用いられる。Impurity metal ions adsorbed by the chelate resin of the present invention can be eluted and recovered by using an appropriate eluent.
An acidic aqueous solution of hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid or the like is used as the eluent.
このようにして、不純物金属イオンを脱着した後のキレ
ート樹脂は、そのままあるいは必要に応じて水及び/ま
たは水酸化ナトリウム、水酸化カリウム、水酸化カルシ
ウム、水酸化マグネシウム、アンモニア党の塩基性水溶
液で処理を行った後、再びメッキ浴中の不純物金属イオ
ンの吸着に繰り返し用いることができる。In this way, the chelate resin after desorbing the impurity metal ions is used as it is or if necessary, with water and / or sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide, or a basic aqueous solution of ammonia. After the treatment, it can be repeatedly used to adsorb the impurity metal ions in the plating bath again.
〈発明の効果〉 本発明の前記特定構造のアミノカルボン酸基を有するキ
レート樹脂はメッキ浴中の鉄イオン等の不純物金属イオ
ンに対する吸着容量が大きく、不純物金属イオンの吸着
平衡濃度を著しく低下させることができるので、その工
業的価値に極めて大きい。<Effects of the Invention> The chelate resin having an aminocarboxylic acid group of the above-described specific structure of the present invention has a large adsorption capacity for impurity metal ions such as iron ions in a plating bath, and significantly reduces the adsorption equilibrium concentration of impurity metal ions. Therefore, its industrial value is extremely high.
〈実施例〉 以下に本発明を実施例によってさらに詳細に説明する
が、本発明はその要旨を越えない限り以下の実施例によ
って制限されるものではない。<Examples> The present invention will be described in more detail with reference to Examples below, but the present invention is not limited to the following Examples unless the gist thereof is exceeded.
実施例1 架橋度6モル%のアクリロニトリル−ジビニルベンゼン
共重合体640重量部にアミノ化合物であるジエチレント
リアミン2060重量部と360重量部の水を加え、135〜150
℃で6時間反応したところ136重量部のアンモニアが発
生した。反応生成物を濾過、水洗したところ2310重量部
(未乾燥)のアミジン加水分解樹脂が得られた。Example 1 2060 parts by weight of diethylenetriamine, which is an amino compound, and 360 parts by weight of water were added to 640 parts by weight of an acrylonitrile-divinylbenzene copolymer having a degree of crosslinking of 6 mol%, and 135 to 150
When the reaction was carried out at 6 ° C for 6 hours, 136 parts by weight of ammonia was generated. When the reaction product was filtered and washed with water, 2310 parts by weight (undried) of amidine hydrolyzed resin was obtained.
次いで得られたアミジン加水分解樹脂の231重量部にア
クリル酸144重量と水500重量を加え、70℃で6時間反応
後、濾過、水洗した。次に得られた樹脂を10重量パーセ
ント濃度の苛性ソーダ水溶液500重量部に室温下で30分
間浸漬し、次いで濾過水洗をしたところ339重量部(未
乾燥)のキレート樹脂が得られた。Next, to 231 parts by weight of the obtained amidine hydrolyzed resin, 144 parts by weight of acrylic acid and 500 parts by weight of water were added, reacted at 70 ° C. for 6 hours, filtered and washed with water. Next, the obtained resin was immersed in 500 parts by weight of a 10% by weight aqueous caustic soda solution at room temperature for 30 minutes and then filtered and washed with water to obtain 339 parts by weight (undried) of the chelate resin.
得られたキレート樹脂中には、2.2mol/−樹脂の の官能基が認められた。In the obtained chelate resin, 2.2 mol /-resin The functional group of was recognized.
得られたキレート樹脂2mlをZn2+が120g/、Fe3+が500m
g/、Cu2+が400mg/を含む、pH1.8の亜鉛メッキ浴50m
lに加え、3時間振蘯を行った後キレート樹脂と水層に
分離した。水層中のFe及びCu濃度を分析したところ第1
表に示す結果を得た。120 ml of Zn 2+ and 500 m of Fe 3+ in 2 ml of the obtained chelating resin
50m zinc coating bath with pH 1.8 containing g /, 400mg / of Cu 2+
In addition to 1, the mixture was shaken for 3 hours and then separated into a chelate resin and an aqueous layer. First analysis of Fe and Cu concentrations in the water layer
The results shown in the table were obtained.
実施例2、3 実施例1で用いたアミノ化合物の種類と使用量を変えた
以外は実施例1と同様にして樹脂の製造および吸着試験
を行った。その結果を第2表に示した。 Examples 2 and 3 The resin production and adsorption test were performed in the same manner as in Example 1 except that the type and amount of the amino compound used in Example 1 were changed. The results are shown in Table 2.
実施例4 架橋度10モル%のメタクリル酸メチル−ジビニルベンゼ
ン共重合体1250重量部とアミノ化合物のジエチレントリ
アミン4120重量部をオートクレーブ中170℃で7時間反
応を行い、脱水縮合反応を行ったところ3530重量部(未
乾燥)の縮合反応酸アミド樹脂を得た。 Example 4 1250 parts by weight of a methyl methacrylate-divinylbenzene copolymer having a degree of crosslinking of 10 mol% and 4120 parts by weight of an amino compound, diethylenetriamine, were reacted in an autoclave at 170 ° C. for 7 hours to carry out a dehydration condensation reaction. Part (undried) condensation reaction acid amide resin was obtained.
次いでハロゲン化アルキルカルボン酸化合物であるモノ
クロ酢酸141重量部と苛性ソーダ60重量部を1000重量部
の水にあらかじめ溶解した水溶液に得られた縮合反応酸
アミド樹脂353重量部を加え、70℃で6時間の反応を行
った。Next, 141 parts by weight of monochloroacetic acid, which is a halogenated alkylcarboxylic acid compound, and 353 parts by weight of a condensation reaction acid amide resin obtained by previously dissolving 60 parts by weight of caustic soda in 1000 parts by weight of water are added, and the mixture is treated at 70 ° C. for 6 hours. Was carried out.
反応中、10重量パーセントの苛性ソーダ水溶液480重量
部を約3時間かけて加えた。反応後、濾過、水洗したと
ころ43.5重量部(未乾燥)のキレート樹脂が得られた。
得られたキレート樹脂中には、1.5mol/−樹脂の なる官能基が認められた。During the reaction, 480 parts by weight of a 10% by weight aqueous sodium hydroxide solution was added over about 3 hours. After the reaction, filtration and washing with water yielded 43.5 parts by weight (undried) of the chelate resin.
The resulting chelate resin contained 1.5 mol / -resin The following functional groups were recognized.
次いで得られた樹脂を実施例1と同様にして吸着試験を
行ったところ水層側のFe、Cu濃度は各々132、76mg/で
あった。Then, an adsorption test was conducted on the obtained resin in the same manner as in Example 1. The concentrations of Fe and Cu on the aqueous layer side were 132 and 76 mg /, respectively.
実施例5 架橋8モル%のアクリル酸−グリシジルメタクリレート
共重合体1000重量部にN,N−ジメチルホルムアミド100重
量部と、1,2−ジクロルエタン3000重量部を加え、90℃
に保温しながら塩化カルボニル1978重量部を14時間で吹
き込み、アクリル酸−グリシジルメタクリレート共重合
体のカルボン酸基を塩素化し、濾過、乾燥したところ11
80重量部のカルボニルクロリド基を有した樹脂を得た。
次いで8−アミド−3,6−アザオクタン酸162重量部と苛
性カリ112重量部を1000重量部の水にをあらかじめ溶解
した水溶液に得られたカルボニルクロリド基を有した樹
脂118重量部を加え60℃で2時間反応を行った。反応
後、濾過、水洗したところ453重量部(未乾燥)のキレ
ート樹脂が得られた。Example 5 100 parts by weight of N, N-dimethylformamide and 3000 parts by weight of 1,2-dichloroethane were added to 1000 parts by weight of a crosslinked 8 mol% acrylic acid-glycidyl methacrylate copolymer, and the mixture was heated at 90 ° C.
While maintaining the temperature at 1978, 1978 parts by weight of carbonyl chloride was blown in for 14 hours to chlorinate the carboxylic acid group of the acrylic acid-glycidyl methacrylate copolymer, which was filtered and dried.
A resin having 80 parts by weight of carbonyl chloride group was obtained.
Next, 162 parts by weight of 8-amido-3,6-azaoctanoic acid and 112 parts by weight of caustic potash were dissolved in 1000 parts by weight of water in advance, and 118 parts by weight of a resin having a carbonyl chloride group obtained was added at 60 ° C. The reaction was carried out for 2 hours. After the reaction, filtration and washing with water gave 453 parts by weight (undried) of the chelate resin.
得られたキレート樹脂中には、1.4mol/−樹脂の の官能基が認められた。In the obtained chelate resin, 1.4 mol / − resin The functional group of was recognized.
得られたキレート樹脂を実施例1と同様にして吸着試験
を行ったところ水槽側のFe、Cu濃度は各々149、73mg/
であった。An adsorption test was performed on the obtained chelate resin in the same manner as in Example 1. The concentrations of Fe and Cu in the water tank were 149 and 73 mg /
Met.
比較例1 4重量%ジビニルベンゼン架橋ポリスチレン1090重量部
に、クロルメチルメチルエーテル2730重量部及びテトラ
クロルエチレン3540重量部を加え、室温で30分間撹拌し
てポリスチレンの膨潤を行った後、50℃に昇温した。Comparative Example 1 To 1090 parts by weight of 4% by weight divinylbenzene-crosslinked polystyrene, 2730 parts by weight of chloromethyl methyl ether and 3540 parts by weight of tetrachloroethylene were added, and the mixture was stirred at room temperature for 30 minutes to swell the polystyrene and then to 50 ° C. The temperature was raised.
これに1時間で無水塩化亜鉛550重量部を加えこの温度
で2時間反応させた後乾燥したところ、クロルメチル化
ポリスチレンが1440重量部得られた。Anhydrous zinc chloride (550 parts by weight) was added thereto over 1 hour, and the mixture was reacted at this temperature for 2 hours and dried to obtain 1440 parts by weight of chloromethylated polystyrene.
上記で得られたクロルメチル化ポリスチレン720重量部
にイミノジ酢酸ナトリウム358重量部と水2000重量部を
加え70〜80℃で6時間反応を行った。To 720 parts by weight of the chloromethylated polystyrene obtained above, 358 parts by weight of sodium iminodiacetate and 2000 parts by weight of water were added and the reaction was carried out at 70 to 80 ° C. for 6 hours.
反応開始後1規定の水酸化ナトリウム水溶液1000重量部
を3時間かけて加えた。After the reaction was started, 1000 parts by weight of 1N aqueous sodium hydroxide solution was added over 3 hours.
反応後、濾過水洗したところ2338重量部(未乾燥)のキ
レート樹脂が得られた。After the reaction, filtration and washing with water yielded 2338 parts by weight (undried) of the chelate resin.
得られたキレート樹脂中には、2.2mol/−樹脂の −CH2−N(CH2COONa)2 の官能基が認められた。The resulting Chelating resin, 2.2 mol / - is -CH 2 -N (CH 2 COONa) 2 functional groups of the resin was observed.
得られたキレート樹脂を実施例1と同様にして吸着試験
を行ったところ水層側のFeCu濃度は各々242、196mg/
であった。An adsorption test was conducted on the obtained chelate resin in the same manner as in Example 1. The FeCu concentrations on the aqueous layer side were 242 and 196 mg /
Met.
比較例2 フェノール47.0重量部、イミノジ酢酸66.5重量部、37重
量%ホルマリン40.5重量部の混合水溶液を室温より70℃
まで40分で昇温し、70〜73℃で2時間加熱撹拌を行った
後、40℃に降温し苛性ソーダ60重量部をイオン交換水10
0重量部に溶解したものを添加し、反応系のpHを12.8に
調整した。Comparative Example 2 A mixed aqueous solution of 47.0 parts by weight of phenol, 66.5 parts by weight of iminodiacetic acid and 40.5 parts by weight of 37% by weight formalin was heated to 70 ° C. from room temperature.
The temperature is raised to 40 minutes, and the mixture is heated and stirred at 70 to 73 ° C for 2 hours, then cooled to 40 ° C and 60 parts by weight of caustic soda is added to the ion-exchanged water.
What was melt | dissolved in 0 weight part was added, and pH of the reaction system was adjusted to 12.8.
次いで37重量%ホルマリン162.0重量部を添加し、徐々
に加熱して40分後に70℃に昇温し、70〜90℃で3時間反
応させた後、フェノール47.0重量部を加え、引き続き70
〜90℃で1時間反応後、反応系を90〜100℃に保ち減圧
にて水を115.0重量部留出したところ、粘稠な赤褐色の
樹脂組成物249重量部が得られた。得られた樹脂組成物
を130℃の熱風乾燥機にて3時間加熱硬化させた後、粉
砕したところ、243重量部のキレート樹脂が得られた。Next, 162.0 parts by weight of 37% by weight formalin was added, gradually heated and heated to 70 ° C. 40 minutes later, reacted at 70 to 90 ° C. for 3 hours, and then 47.0 parts by weight of phenol was added, followed by 70% by weight.
After reacting at 90 ° C for 1 hour, the reaction system was kept at 90 ° C to 100 ° C and 115.0 parts by weight of water was distilled off under reduced pressure to obtain 249 parts by weight of a viscous reddish brown resin composition. The obtained resin composition was heat-cured for 3 hours at 130 ° C. in a hot air dryer and then pulverized to obtain 243 parts by weight of a chelate resin.
得られたキレート樹脂には、2.3mol/−樹脂の −CH2N(CH2COONa)2 の官能基が認められた。The resulting chelate resin, 2.3 mol / - is -CH 2 N (CH 2 COONa) 2 functional groups of the resin was observed.
得られたキレート樹脂を実施例1と同様にして吸着試験
を行ったところ水槽側のFe、Cu濃度は各々196、172mg/
であった。An adsorption test was conducted on the obtained chelate resin in the same manner as in Example 1, and the Fe and Cu concentrations in the water tank were 196 and 172 mg /
Met.
実施例6〜11、比較例3〜5 実施例1、4及び比較例1で用いたものと同一のキレー
ト樹脂を用い、液のpHを変えた以外は実施例1と同様に
吸着試験を行った。その結果を第3表に示した。Examples 6 to 11 and Comparative Examples 3 to 5 Adsorption test was conducted in the same manner as in Example 1 except that the same chelating resin as that used in Examples 1, 4 and Comparative Example 1 was used and the pH of the solution was changed. It was The results are shown in Table 3.
実施例12、13 比較例6、7 実施例1、4及び比較例2で用いたものと同一のキレー
ト樹脂10mlを内径9mmφのガラスカラムに充填し、第4
表に示す組成のメッキ浴1をSV=10Hr-1で通液し、Fe
3+を吸着処理させた後水洗した。次いで、2N−H2SO450m
lをSV=10Hr-1で通液し、キレート樹脂に吸着した金属
イオンを溶離した。その結果を第5表に示した。 Examples 12 and 13 Comparative Examples 6 and 7 10 ml of the same chelating resin as used in Examples 1 and 4 and Comparative Example 2 was packed in a glass column having an inner diameter of 9 mmφ, and
The plating bath 1 having the composition shown in the table is passed through at SV = 10 Hr −1 , and Fe
After 3+ was adsorbed, it was washed with water. Then, 2N-H 2 SO 4 50m
1 was passed through with SV = 10 Hr −1 to elute the metal ions adsorbed on the chelate resin. The results are shown in Table 5.
実施例1〜14、比較例1〜7より、本発明のキレート樹
脂は公知のキレート樹脂よりもメッキ浴中の不純物金属
イオンに対して吸着容量が高く、且つ不純物の金属イオ
ンに対して選択吸着性が高いことは明らかである。 From Examples 1 to 14 and Comparative Examples 1 to 7, the chelate resin of the present invention has a higher adsorption capacity for impurity metal ions in the plating bath than known chelate resins, and selective adsorption for impurity metal ions. Clearly,
Claims (4)
酸性のメッキ浴とを接触させてメッキ浴中の不純物金属
イオンを吸着除去することを特徴とするメッキ浴の精製
方法。1. A general formula A method for purifying a plating bath, which comprises contacting a chelating resin having an aminocarboxylic acid group with an acidic plating bath to adsorb and remove impurity metal ions in the plating bath.
0.5〜4である特許請求の範囲第1項記載のメッキ浴の
精製方法。2. The pH of the plating bath contacted with the chelating resin is
The method for purifying a plating bath according to claim 1, wherein the method is 0.5 to 4.
である特許請求の範囲第1項記載のメッキ浴の精製方
法。3. The method for purifying a plating bath according to claim 1, wherein the plating bath is a zinc or nickel plating bath.
及び鋼イオンである特許請求の範囲第1項記載のメッキ
浴の精製方法。4. The method for purifying a plating bath according to claim 1, wherein the impurity metal ions in the plating bath are iron ions and steel ions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27567286A JPH0686680B2 (en) | 1986-11-19 | 1986-11-19 | Purifying method of Metsuki bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27567286A JPH0686680B2 (en) | 1986-11-19 | 1986-11-19 | Purifying method of Metsuki bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63130799A JPS63130799A (en) | 1988-06-02 |
| JPH0686680B2 true JPH0686680B2 (en) | 1994-11-02 |
Family
ID=17558737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27567286A Expired - Lifetime JPH0686680B2 (en) | 1986-11-19 | 1986-11-19 | Purifying method of Metsuki bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0686680B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2670614B2 (en) * | 1988-03-09 | 1997-10-29 | ミヨシ油脂株式会社 | Method for removing impure metal ions from zinc plating waste liquid |
| JPH01298200A (en) * | 1988-05-26 | 1989-12-01 | Miyoshi Oil & Fat Co Ltd | Method for removing impurity metal ion in spent nickel plating solution |
| FR2669646A1 (en) * | 1990-11-23 | 1992-05-29 | Lorraine Laminage | PROCESS FOR TREATING AN AQUEOUS EFFLUENT FROM ELECTROZYING PROCESS AND METHOD AND INSTALLATION THEREFOR. |
-
1986
- 1986-11-19 JP JP27567286A patent/JPH0686680B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63130799A (en) | 1988-06-02 |
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