JPH0689714A - Electrode base plate of battery - Google Patents
Electrode base plate of batteryInfo
- Publication number
- JPH0689714A JPH0689714A JP4239432A JP23943292A JPH0689714A JP H0689714 A JPH0689714 A JP H0689714A JP 4239432 A JP4239432 A JP 4239432A JP 23943292 A JP23943292 A JP 23943292A JP H0689714 A JPH0689714 A JP H0689714A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrode substrate
- base plate
- porous
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011148 porous material Substances 0.000 claims abstract description 10
- 239000000758 substrate Substances 0.000 claims description 47
- 239000000463 material Substances 0.000 abstract description 3
- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011149 active material Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000007602 hot air drying Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Cell Electrode Carriers And Collectors (AREA)
- Connection Of Batteries Or Terminals (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】電池の電極基板に関する。TECHNICAL FIELD The present invention relates to a battery electrode substrate.
【０００２】[0002]
【従来の技術】従来より、電池の電極基板として、金属
又は炭素の繊維や発泡体で構成する導電性多孔質材料が
用いられている。特に、近年においては、活物質を上記
電極基板に高密度充填・担持して、電極を形成すること
が容易である為、電極基板に導電性多孔質材料を使用す
ることが一般的になってきた。2. Description of the Related Art Conventionally, a conductive porous material made of metal or carbon fiber or foam has been used as an electrode substrate of a battery. In particular, in recent years, it has become common to use a conductive porous material for the electrode substrate because it is easy to densely fill and carry the active material on the electrode substrate to form an electrode. It was
【０００３】[0003]
【発明が解決しようとする課題】電池としてこの電極を
作動させる為には、上記導電性多孔質材料から成る電極
基板に電極端子部を形成・付与する必要があるが、電極
基板が多孔質であるので、電極端子部を密に接合でき
ず、接触抵抗の増加により集電効率の悪化を招いてい
る。また、接合強度が十分でない為、引張り強度が弱
く、信頼性が低いという問題点もあった。In order to operate this electrode as a battery, it is necessary to form / provide an electrode terminal portion on the electrode substrate made of the above-mentioned conductive porous material, but the electrode substrate is porous. Therefore, the electrode terminal portions cannot be tightly joined, and the increase in contact resistance causes deterioration in current collection efficiency. Further, since the bonding strength is not sufficient, the tensile strength is weak and the reliability is low.
【０００４】本発明は、上記問題点に鑑みてなされたも
のであり、電極基板の多孔部の機能を損なうことなく、
電極基板に容易に電極端子部を取付けることを可能と
し、接触抵抗の低減により、集電効率を向上することを
目的とする。The present invention has been made in view of the above problems, and does not impair the function of the porous portion of the electrode substrate,
An object of the present invention is to make it possible to easily attach an electrode terminal portion to an electrode substrate and to improve contact efficiency by reducing contact resistance.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するため
に本発明においては、導電性多孔質材料からなる電極基
板の端子接続部を密な構造とする。多孔質電極基板の端
子接続部を密部とする方法は導電性を失なわない限り、
限定されない。多孔質電極基板の形成時に多孔部と密部
を同時形成し、あるいは、密部からなる導電性基板を形
成してからその一部を多孔化する。In order to achieve the above object, in the present invention, the terminal connecting portion of the electrode substrate made of a conductive porous material has a dense structure. The method of making the terminal connection part of the porous electrode substrate a dense part, unless the conductivity is lost,
Not limited. At the time of forming the porous electrode substrate, a porous portion and a dense portion are simultaneously formed, or a conductive substrate made of the dense portion is formed and then a part thereof is made porous.
【０００６】本発明では、さらに、多孔質電極基板を形
成後に端子接続部に導電性物質を含浸、充填して密部を
形成してもよい。密部は端子接続部の少なくとも表面部
に形成すれば、電極端子（リード）を接合することがで
きるので充分であるが、ある程度の深さまで至ることが
接合強度等の観点から望ましい。In the present invention, after forming the porous electrode substrate, the terminal connecting portion may be impregnated and filled with a conductive substance to form the dense portion. If the dense portion is formed on at least the surface portion of the terminal connecting portion, it is sufficient because the electrode terminals (leads) can be joined, but it is desirable to reach a certain depth from the viewpoint of joining strength and the like.
【０００７】電極基板の密部に対して電極端子を密に接
続する方法も限定されず、例えば、密部に穴や溝を形成
してボルトナット等で機械的に接合してもよいし、溶接
し、あるいは導電性接着剤を用いて接着してもよい。ま
た、電極基板の端子接続部表面のみに密部を形成する方
法として、それ自身が密な構造である導電性シートを多
孔質電極の端子接続部に溶接や接着等で接合しても同様
の効果が得られる。導電性シートの多孔質電極への固定
は端子の接続より強固にできる。導電性シートは必要に
応じて、厚さを任意に選択できる。The method of densely connecting the electrode terminals to the dense portion of the electrode substrate is not limited, and for example, holes or grooves may be formed in the dense portion and mechanically joined with a bolt nut or the like. It may be welded or bonded by using a conductive adhesive. Further, as a method of forming a dense portion only on the surface of the terminal connecting portion of the electrode substrate, the same can be achieved by joining a conductive sheet having a dense structure to the terminal connecting portion of the porous electrode by welding or adhesion. The effect is obtained. The fixing of the conductive sheet to the porous electrode can be made stronger than the connection of the terminals. The thickness of the conductive sheet can be arbitrarily selected as necessary.
【０００８】[0008]
【作用】本発明の導電性多孔質材料からなる電極基板
は、端子接続部が密な構造であるので、電極に電極端子
を接続付与する際、活物質が形成されている多孔部の機
能を損なうことなく、容易に電極端子部を取り付けるこ
とが可能である。又、端子を密部に密着して接合するこ
とで、接触抵抗が低減され、集電効率が向上する。又、
接合強度の強化により信頼性も向上する。導電性シート
を用いた接合によっても同様の効果を得ることができ
る。In the electrode substrate made of the conductive porous material of the present invention, the terminal connecting portion has a dense structure. Therefore, when the electrode terminal is connected to the electrode, the function of the porous portion in which the active material is formed is obtained. It is possible to easily attach the electrode terminal portion without damaging it. Further, the contact resistance is reduced and the current collecting efficiency is improved by closely bonding the terminals to the dense portion. or,
Reliability is also improved by strengthening the bonding strength. The same effect can be obtained by joining using a conductive sheet.
【０００９】[0009]
【実施例】実施例１ 導電性多孔質材料としてカーボンを用いた。図１を参照
すると、多孔質カーボン材料の電極基板１は密部１−１
と多孔部１−２から成り、密部１−１は空孔率が０．１
％以下、また、電池活物質が担持される多孔部１−２は
空孔率５５％、平均空孔径２０〜４０μｍで構成されて
おり、密部１−１を多孔部１−２を一体として製造した
電極基板１である。カーボンにより多孔部と密部を一体
に形成する方法は、例えば、電極基板１を調製時に、多
孔部１−２と密部１−１の原料の粒径バインダ、添加物
等を選択し、多孔部１−２と密部１−１を一体に成形加
工を行い、焼成し、電極基板１を得る。あるいは、成形
加工時に、多孔部１−２と密部１−１の原料充てん密度
を変えて行ない、焼成により電極基板１が得られる。 Example 1 Carbon was used as the conductive porous material. Referring to FIG. 1, an electrode substrate 1 made of a porous carbon material has a dense portion 1-1.
And the porous portion 1-2, and the dense portion 1-1 has a porosity of 0.1.
% Or less, and the porous portion 1-2 on which the battery active material is supported is configured with a porosity of 55% and an average pore diameter of 20 to 40 μm, and the dense portion 1-1 is integrated with the porous portion 1-2. It is the manufactured electrode substrate 1. The method of integrally forming the porous portion and the dense portion with carbon is, for example, when the electrode substrate 1 is prepared, selecting the particle size binder of the raw material of the porous portion 1-2 and the dense portion 1-1, the additive, etc. The part 1-2 and the dense part 1-1 are integrally molded and fired to obtain the electrode substrate 1. Alternatively, the electrode substrate 1 can be obtained by changing the filling densities of the porous portion 1-2 and the dense portion 1-1 at the time of molding, and firing.
【００１０】この電極基板１に活物質を担持し、電池電
極とする。また、図２を参照すると、密部１−１に貫通
孔を設け、密部１−１の外面に金属端子４をボルト・ナ
ット５により接合し、金属端子４はリード線６により外
部回路と電気的に結合した構造とした。An active material is carried on this electrode substrate 1 to form a battery electrode. Further, referring to FIG. 2, a through hole is provided in the dense portion 1-1, the metal terminal 4 is joined to the outer surface of the dense portion 1-1 by a bolt / nut 5, and the metal terminal 4 is connected to an external circuit by a lead wire 6. The structure is electrically coupled.
【００１１】実施例２ 図３を参照すると、電極基板１として、ニッケル発泡メ
タル（住友電工、セルメット（＃７）、多孔度９６％、
０．７mm厚）を、導電性材料として導電性接着剤２（シ
ントーケミトロン、Ｅ−ＳＯＬＤＥＲ ３０２５、Ａｇ
フィラー、エポキシ系）を用いた。導電性接着剤２を電
極基板１とリード板４を接着する位置に塗布・含浸し、
リード板４を押圧・接着の後、１２０℃で１５分間熱風
乾燥処理の後、完全硬化・接着を終えた。 Example 2 Referring to FIG. 3, as the electrode substrate 1, nickel foam metal (Sumitomo Electric, Celmet (# 7), porosity 96%,
Conductive adhesive 2 (Shinto Chemitron, E-SOLDER 3025, Ag)
Filler, epoxy type) was used. The conductive adhesive 2 is applied and impregnated at the position where the electrode substrate 1 and the lead plate 4 are bonded,
After pressing and adhering the lead plate 4, a hot air drying treatment was performed at 120 ° C. for 15 minutes, and then complete curing and adhering was completed.
【００１２】これにより、電極基板１とリード板４との
接合部である電極基板１の表面及び内部に導電性接着剤
２が含浸されて密部を形成すると共に、導電性接着剤２
を介して電極基板１とリード板４が強固に接着され、ま
たこれによりこれらの間の導電性が確保された。リード
板４にはリード線５を溶接、ハンダ付け、カシメ等によ
り接続して外部回路と電気的に結合することができる。As a result, the conductive adhesive 2 is impregnated on the surface and inside of the electrode substrate 1 which is the joint between the electrode substrate 1 and the lead plate 4 to form a dense portion, and at the same time, the conductive adhesive 2 is formed.
The electrode substrate 1 and the lead plate 4 were firmly adhered to each other via, and the conductivity between them was secured. A lead wire 5 can be connected to the lead plate 4 by welding, soldering, caulking or the like to be electrically coupled to an external circuit.
【００１３】実施例３ 図４を参照すると、電極基板１は実施例２と同じものを
用い、導電性材料として導電性インク６（シントーケミ
トロン、Ｋ−３４２４、Ａｇフィラー、エポキシ系）を
用い、この導電性インク６を電極基板１の所定の位置に
塗布・含浸し、１７０℃で３０分間熱風乾燥して電極基
板１に導電性の密部１−１を形成した。 Example 3 Referring to FIG. 4, the same electrode substrate 1 as in Example 2 was used, and conductive ink 6 (Shinto Chemitron, K-3424, Ag filler, epoxy type) was used as the conductive material. The conductive ink 6 was applied and impregnated at a predetermined position on the electrode substrate 1, and dried with hot air at 170 ° C. for 30 minutes to form a conductive dense portion 1-1 on the electrode substrate 1.
【００１４】次に、リード線５を導電性材料表面に直接
ハンダ付けを行い、外部回路と電気的に結合した。Next, the lead wire 5 was directly soldered to the surface of the conductive material and electrically connected to an external circuit.
【００１５】実施例４ 図５を参照すると、電極基板１及導電性接着剤２は実施
例２と同じものである。電極基板１の所定の位置に導電
性接着剤を予め、塗布・含浸し、室温で予備乾燥の後、
この位置にリード線５を直接接合し、６５℃で３時間熱
風乾燥処理を行い、電極基板１にリード線を接着、形成
した。 Example 4 Referring to FIG. 5, the electrode substrate 1 and the conductive adhesive 2 are the same as in Example 2. A conductive adhesive is applied and impregnated in a predetermined position of the electrode substrate 1 in advance, and after predrying at room temperature,
The lead wire 5 was directly bonded to this position, and hot air drying treatment was performed at 65 ° C. for 3 hours to bond and form the lead wire to the electrode substrate 1.
【００１６】実施例５ 実施例４において、リード線５に代え、リード板４を用
いた場合も同様の効果が得られる。 Fifth Embodiment In the fourth embodiment, the same effect can be obtained when the lead plate 4 is used instead of the lead wire 5.
【００１７】実施例６ 図６を参照する。この例では銅箔テープ７（基材：圧延
銅箔、導電フィラー：Ｎｉ粉、シントーケミトロン社
ＳＴＲ−９１５０）を用いた。電極端子部を形成する部
分の電極基板１の表裏に、予め銅箔テープ７を押圧・密
着し、この部分に電極端子のリード板４を当てスポット
溶接し、電極基板１に電極端子部を形成した。これによ
り、実施例２と同様の効果が得られた。 Example 6 Referring to FIG. In this example, copper foil tape 7 (base material: rolled copper foil, conductive filler: Ni powder, Shinto Chemitron Co., Ltd.)
STR-9150) was used. The copper foil tape 7 is previously pressed and adhered to the front and back of the portion of the electrode substrate 1 where the electrode terminal portion is to be formed, and the lead plate 4 of the electrode terminal is applied to this portion for spot welding to form the electrode terminal portion on the electrode substrate 1. did. As a result, the same effect as in Example 2 was obtained.
【００１８】実施例７ 図７を参照すると、実施例１の電極基板１の密部１−１
に穴部を設け、この中にリード線６を挿入し、さらにそ
の接合部に導電性接着剤７（シントーケミトロン、Ｅ−
ＳＯＬＤＥＲ ３０２５、Ａｇフィラー、エポキシ系）
を用いて、両者を密着・接合した。これにより、実施例
１と同様の効果が得られた。 Example 7 Referring to FIG. 7, the dense portion 1-1 of the electrode substrate 1 of Example 1
A hole is provided in the lead wire 6, the lead wire 6 is inserted into the hole, and the conductive adhesive 7 (Shinto Chemitron, E-
SOLDER 3025, Ag filler, epoxy type)
Both were adhered and joined using. As a result, the same effect as in Example 1 was obtained.
【００１９】[0019]
【発明の効果】以上の如く、本発明は、電極基板が密部
と多孔部から構成することにより、電極基板に電極端子
を接続する際、密部に容易に取り付けることが可能とな
り、電極端子を密部に密着して接合することで、接触抵
抗が低減され、集電効率が向上する。又、接合強度の強
化により信頼性が向上する。さらに、導電性材料シート
を接合する場合においても、上記の如く、同様の効果が
得られる。As described above, according to the present invention, since the electrode substrate is composed of the dense portion and the porous portion, it becomes possible to easily attach the electrode terminal to the dense portion when connecting the electrode terminal to the electrode substrate. The contact resistance is reduced and the current collection efficiency is improved by closely contacting and bonding with the dense portion. In addition, reliability is improved by strengthening the bonding strength. Further, when the conductive material sheets are joined together, the same effect can be obtained as described above.
【図１】本発明の電極基板を示す。FIG. 1 shows an electrode substrate of the present invention.
【図２】実施例１の電極基板を示す。2 shows an electrode substrate of Example 1. FIG.
【図３】実施例２の電極基板を示す。FIG. 3 shows an electrode substrate of Example 2.
【図４】実施例３の電極基板を示す。FIG. 4 shows an electrode substrate of Example 3.
【図５】実施例４の電極基板を示す。FIG. 5 shows an electrode substrate of Example 4.
【図６】実施例６の電極基板を示す。FIG. 6 shows an electrode substrate of Example 6.
【図７】実施例７の電極基板を示す。FIG. 7 shows an electrode substrate of Example 7.
１…電極基板 １−１…多孔部 １−２…密部 ２…導電性接着剤 ３…電極端子部 ４…リード板 ５…リード線 ６…導電性インク ７…銅箔テープ DESCRIPTION OF SYMBOLS 1 ... Electrode substrate 1-1 ... Porous part 1-2 ... Dense part 2 ... Conductive adhesive 3 ... Electrode terminal part 4 ... Lead plate 5 ... Lead wire 6 ... Conductive ink 7 ... Copper foil tape
Claims (1)
において、その端子接続部を密部として形成したことを
特徴とする電極基板。1. A battery electrode substrate using a conductive porous material, wherein the terminal connecting portion is formed as a dense portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4239432A JPH0689714A (en) | 1992-09-08 | 1992-09-08 | Electrode base plate of battery |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4239432A JPH0689714A (en) | 1992-09-08 | 1992-09-08 | Electrode base plate of battery |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0689714A true JPH0689714A (en) | 1994-03-29 |
Family
ID=17044691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4239432A Withdrawn JPH0689714A (en) | 1992-09-08 | 1992-09-08 | Electrode base plate of battery |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0689714A (en) |
-
1992
- 1992-09-08 JP JP4239432A patent/JPH0689714A/en not_active Withdrawn
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