JPH0689916A - Method for fitting capillary - Google Patents

Abstract

(57) [Summary] [Purpose] To be able to easily and accurately attach a capillary to a bonding arm in a short time with an arbitrary amount of protrusion. When the capillary 14 is attached to the bonding arm 15 with a protrusion amount H from its axis, the axis position of the bonding arm 15 is set to the bonding table 18.
And a position of height H above. After that, the capillary 14 is inserted into the holding hole 15a of the bonding arm 15, and the tip of the capillary 14 is brought into contact with the upper surface of the bonding table 18. Then, by tightening the screw 15b of the bonding arm 15 in this state, the capillary 14 is fixed to the bonding arm 15.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of attaching a capillary used in a wire bonding apparatus to a bonding arm.

[0002]

2. Description of the Related Art In a wire bonding apparatus, an electrode of a semiconductor pellet and a lead of a lead frame are electrically connected by a conductive wire by using a capillary held at the tip of a wire bonding device by vertically moving a bonding arm. It is a thing.

By the way, the capillary used in the wire bonding apparatus has dirt attached to its tip portion during repeated bonding operations, and this dirt causes a bonding failure such as a decrease in wire bonding force. Further, an accident such as abrasion or wire generation in the capillary may occur. In such a case, it is necessary to replace the capillary.

When the capillaries are replaced, it is necessary to attach the capillaries to the bonding arm so that their mounting positions do not shift. This is because if the capillary protrudes too much with respect to the bonding arm, it will damage the semiconductor pellet during bonding,
On the contrary, if the amount of protrusion is small, an appropriate bonding force cannot be obtained, and in either case, defective bonding occurs.

Then, as a method of attaching the capillary to the bonding arm, for example, Japanese Patent Laid-Open No. 50-2377.
A method using a jig as described in Japanese Patent Publication No. 4 etc. is known. FIG. 3 shows a mounting method using a jig 1 provided with two flat surfaces 1a and 1b having steps, and when mounting the capillary, first, the jig 1
Is placed on the bonding table 2 using tweezers or the like. Then, the bonding arm 3 is moved downward so that the lower surface thereof contacts the flat surface 1a of the jig 1. Next, the capillary 4 is inserted into the holding hole 3a of the bonding arm 3 and the tip end thereof is brought into contact with the flat surface 1b of the jig 1,
In this state, the capillaries 4 are fixed to the bonding arms 3 using the screws 5. As a result, the capillary 4 can be fixed to the bonding arm 3 in a state in which the tip portion thereof projects from the axial center of the bonding arm 3 by the required projection amount H.

[0006]

However, according to this method, every time the capillary 4 is replaced, the operator is forced to carry out detailed work such as placing the jig 1 on the bonding table and adjusting the downward movement of the bonding arm 3. Therefore, it has a drawback that it causes a great deal of fatigue and that the replacement work takes time.

Further, when it is necessary to replace the capillary 4 during the bonding operation due to wire trimming or the like in the capillary, it is necessary to place the jig 1 on the bonding table 2 and the lead frame existing in the bonding station. Was temporarily moved to another place, the capillary 4 was replaced as described above, and this lead frame had to be returned to the original place after the replacement was completed, resulting in a very poor work efficiency.

Further, the required protrusion amount H may differ depending on the wire bonding apparatus, but since the method using the jig 1 described above can obtain only one type of protrusion amount H with one jig. The jigs must be prepared for the required amount of protrusion H. Therefore, jig management work was also required.

It is an object of the present invention to provide a method of attaching a capillary which can easily and accurately attach the capillary to the bonding arm in a short time in a state of having an arbitrary amount of protrusion.

[0010]

SUMMARY OF THE INVENTION According to the present invention, in a method of attaching a capillary to a capillary attachment portion of a bonding arm in a state in which the capillary protrudes by an arbitrary amount required for the bonding arm, the attachment reference of the bonding arm is provided. The capillary is positioned at a position above the contacted surface of the capillary by an arbitrary amount, and the capillary is fixed to the capillary attachment portion with respect to the bonding arm in a state where the tip portion of the capillary is in contact with the contacted portion. Is characterized by.

[0011]

According to the present invention, when the capillary is attached to the bonding arm while protruding by the desired amount, the bonding arm is first positioned above the contact surface of the capillary by the arbitrary amount. .
Then, the capillary is fixed to the capillary mounting portion of the bonding arm, which is positioned, with its tip portion in contact with the contacted portion.

[0012]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a mounting operation of a capillary according to the present invention, and FIG. 2 is a configuration diagram of a bonding apparatus to which the present invention is applied.

First, the wire bonding apparatus will be described with reference to FIG. The wire bonding apparatus 10 shown here has a pair of carrying rails 11 for carrying a lead frame (not shown), and a bonding head 12 facing a bonding station. The bonding head 12 is a movable table 1 which is movable in the horizontal direction.
3 has a bonding arm 15 for holding the capillary 14 at the tip thereof. The bonding arm 15 is moved up and down by a drive mechanism (not shown), and the drive mechanism is driven and controlled by a control device 16 that controls the entire wire bonding apparatus 10, so that the bonding arm 15 is vertically moved. Will also be controlled. A bonding table 18 that can be heated by a heater 17 is provided between the transport rails 11 in the bonding station. Further, in this embodiment, the upper surface of the bonding table 18 is used as a contacted surface which is a mounting reference surface of the capillary 14. A setting unit 19 and an operation unit 20 are connected to the control device 16. Positional information for stopping the axial center position of the bonding arm 15 at a position above the upper surface of the bonding table 18 by a predetermined distance is set in the setting unit 19, which is shown in FIG. 3 here. The following description will be given on the assumption that the value H is set. Further, the operation unit 20 is provided with, for example, a start / stop button of the wire bonding apparatus 10 and a switch button for switching to the capillary exchange mode.

Next, the operation will be described.

When mounting the capillaries 14, the operation unit 20 first sets the capillaries exchange mode, and sends a control start command to the controller 16. Upon receipt of this command, the control device 16 controls the movement of the moving table 13 and drives a drive mechanism (not shown) according to the position information set in the setting unit 19 to move the axis of the bonding arm 15 as shown in FIG. The center position is positioned above the bonding table 18 at a height H. After this, the capillary 1 is inserted into the holding hole 15a of the bonding arm 15.
4 is inserted and the tip of the capillary 14 is brought into contact with the upper surface of the bonding table 18. Then, by tightening the screw 15b of the bonding arm 15 in this state, the capillary 14 is fixed to the bonding arm 15. As a result, the capillary 14 is attached in a state of protruding H from the axis of the bonding arm 15.

After the capillary 14 is attached to the bonding arm 15 in this manner, a normal wire bonding operation is performed.

Next, a case will be described in which it is necessary to replace the capillary 14 during the bonding operation due to, for example, a wire jam in the capillary.

In this case, the defective capillary 14 having the grip is removed from the bonding arm 15, and then the non-defective capillary 14 is attached to the bonding arm 15. However, since the bonding operation is in progress, it is not shown on the bonding table 18. The lead frame is located.

Therefore, the defective capillary 1 which has been brought into contact
After removing 4 from the bonding arm 15, the operation section 20 sets the capillary replacement mode, and sends a work start command to the control device 16. Upon receiving this command, the control device 16 controls the movement of the moving table 13 to move the holding hole 15a of the bonding arm 15 to, for example, above the lead in the lead frame, and at the same time, the setting unit 1
A drive mechanism (not shown) is driven according to the position information set in 9, and the axial center position of the bonding arm 15 is positioned at a predetermined height position above the bonding table 18. It should be noted that the predetermined height position here is a height H ′ in which the thickness h of the lead frame is added to the protrusion amount H of the capillary 14.
This means that the numerical value H'is stored in the setting unit 19 in advance. As a result, the bonding arm 1
5 is positioned so that its axial center position is above the lead frame and at a height H above the upper surface of the lead frame. After the bonding arm 15 is positioned in this manner, the capillary 14 is inserted into the holding hole 15a of the bonding arm 15, and the capillary 1
The tip end of 4 is brought into contact with the upper surface of the lead frame, and in this state, the screw 15b of the bonding arm 15 is tightened. As a result, the capillary 14 is attached in a state of protruding H from the axis of the bonding arm 15.

According to the above-described embodiment, the bonding table 1 as the contacted portion which serves as the mounting reference surface of the capillary.
The axial center position of the bonding arm 15 with respect to the upper surface of 8 or the upper surface of the lead frame is positioned above H, which is the required protrusion amount of the capillary 14 with respect to this axial center position, and the tip end of the capillary 14 is bonded to the bonding table 18
Alternatively, since it suffices to attach the bonding arm 15 to the upper surface of the lead frame, the capillary 14 can be attached to the bonding arm 15 easily and accurately in a short time. In addition, especially when replacing capillaries during the bonding operation, it is not necessary to move the lead frame existing in the bonding station to another place temporarily and return it to the original position after the capillary replacement, which is conventionally required. The replacement time can be much shorter than before. Further, in the embodiment, when the protrusion amount of the capillary 14 with respect to the bonding arm 15 is changed, it can be dealt with only by changing the position information set in the setting unit 19.

Although the upper surface of the bonding table 18 or the upper surface of the lead frame is set as the contact surface in the above embodiment, for example, a special place or a special member having the contact surface in the vicinity of the bonding table 18 is provided. It may be provided.

[0022]

According to the present invention, the capillary can be easily and accurately attached to the bonding arm in a short time in a state of having an arbitrary protrusion amount.

[Brief description of drawings]

FIG. 1 is a diagram showing a mounting operation of a capillary according to the present invention.

FIG. 2 is a configuration diagram of a bonding apparatus to which the present invention is applied.

FIG. 3 is a diagram showing an attaching operation of a conventional capillary.

[Explanation of Codes] 10 Wire Bonding Device 11 Conveying Rail 12 Bonding Head 13 Moving Table 14 Capillary 15 Bonding Arm 15a Holding Hole 15b Screw 16 Controller 17 Heater 18 Bonding Stand 19 Setting Section 20 Operating Section

Claims (1)

[Claims] 1. A method of attaching a capillary to a bonding portion of a bonding arm in a state in which the capillary protrudes from the bonding arm by a required amount, in which the bonding arm serves as a mounting reference surface. A method for mounting a capillary characterized in that the capillary is positioned at a position above the surface by an arbitrary amount, and the capillary is fixed to the capillary mounting portion in a state in which the tip portion of the bonding arm is in contact with the contacted portion. .