JPH0696757B2 - Method for producing high-strength, high-conductivity copper alloy with excellent heat resistance and bendability - Google Patents
Method for producing high-strength, high-conductivity copper alloy with excellent heat resistance and bendabilityInfo
- Publication number
- JPH0696757B2 JPH0696757B2 JP9151089A JP9151089A JPH0696757B2 JP H0696757 B2 JPH0696757 B2 JP H0696757B2 JP 9151089 A JP9151089 A JP 9151089A JP 9151089 A JP9151089 A JP 9151089A JP H0696757 B2 JPH0696757 B2 JP H0696757B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- copper alloy
- strength
- conductivity
- annealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 22
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000137 annealing Methods 0.000 claims description 31
- 238000005452 bending Methods 0.000 claims description 21
- 230000032683 aging Effects 0.000 claims description 17
- 238000001816 cooling Methods 0.000 claims description 12
- 238000005097 cold rolling Methods 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 229910052726 zirconium Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 4
- 238000005098 hot rolling Methods 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 20
- 239000000463 material Substances 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 11
- 229910052742 iron Inorganic materials 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005482 strain hardening Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- OWXLRKWPEIAGAT-UHFFFAOYSA-N [Mg].[Cu] Chemical compound [Mg].[Cu] OWXLRKWPEIAGAT-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は耐熱性および曲げ加工性に優れる高力、高導電
性銅合金の製造方法に関し、さらに詳しくは電気電子部
品用銅合金、特に半導体リードフレームおよび端子等の
材料に使用することができる引張強さ55kgf/mm2以上、
導電率68％IACS以上を有し、さらに耐熱性および曲げ加
工性に優れる高力、高導電性銅合金の製造方法に関す
る。TECHNICAL FIELD The present invention relates to a method for producing a high-strength, high-conductivity copper alloy having excellent heat resistance and bending workability, and more specifically, a copper alloy for electric and electronic parts, particularly a semiconductor. Tensile strength 55kgf / mm 2 or more, which can be used for materials such as lead frames and terminals,
The present invention relates to a method for producing a high-strength, high-conductivity copper alloy having an electric conductivity of 68% IACS or more and further excellent in heat resistance and bending workability.
［従来の技術］ 従来においても、Fe:1.5〜3.0wt％を含有する銅合金を
加工して電子部品等の材料を製造することは、特公昭55
−014134号公報および特公昭63−143246号公報に記載さ
れている。[Prior Art] In the past, it has been disclosed in JP-B-55 that the copper alloy containing Fe: 1.5 to 3.0 wt% is processed to produce a material such as an electronic component.
-014134 and Japanese Patent Publication No. 63-143246.
しかしながら、近年、電気、電子機器の小型化高密度化
が著しく進展し、必要とされる合金の特性も高性能化し
ている。この傾向は半導体分野においても最も顕著であ
り、工業的にも重要な地位を占めるようになった。即
ち、半導体産業においては高集積化および高密度実装化
が進む中で、より小型化できる表面実装型の新しい半導
体パッケージとして、SOP、QFPおよびミニトランジスタ
等のICおよびトランジスタが開発されている。従って、
このようなICおよびトランジスタに使用されるリードフ
レーム材料としては熱伝導性向上の必要から、高導電性
の要求はもちろんのこと、薄肉化して使用されるため、
耐熱性があり、かつ強度を今迄以上に高めることが要求
されている。具体的には引張強さが55kgf/mm2以上、導
電率が68％IACS以上であることが求められている。However, in recent years, the miniaturization and high densification of electric and electronic devices have made remarkable progress, and the required properties of alloys have been improved. This tendency is most remarkable also in the semiconductor field, and has come to occupy an important position industrially. That is, in the semiconductor industry, as the degree of integration and density is increasing, ICs and transistors such as SOP, QFP, and minitransistors have been developed as new surface-mounting type semiconductor packages that can be further miniaturized. Therefore,
As the lead frame material used for such ICs and transistors, it is necessary to improve the thermal conductivity, so that not only the high conductivity is required, but also the thinned structure is used.
It is required to have heat resistance and further increase strength. Specifically, it is required that the tensile strength is 55 kgf / mm 2 or more and the electrical conductivity is 68% IACS or more.
上述した特公昭55−014134号公報および特公昭63−1432
46号公報にて提案されている鉄入り高力銅合金の特性
は、導電率が50〜65％IACS引張強さが45〜53kgf/mm2を
示している。JP-B-55-014134 and JP-B-63-1432 mentioned above.
The properties of the high-strength copper alloy containing iron proposed in Japanese Patent No. 46 show that the conductivity is 50 to 65% IACS tensile strength is 45 to 53 kgf / mm 2 .
この高力銅合金の引張強さを向上させるためには、冷間
圧延加工率を多くすることが考えられる。しかし、単に
冷間加工率を増やしただけでは導電率が低下し、また伸
びの低下により曲げ加工性が劣化する。In order to improve the tensile strength of this high-strength copper alloy, it is conceivable to increase the cold rolling rate. However, simply increasing the cold working ratio lowers the conductivity, and also lowers the elongation to deteriorate the bendability.
リードフレーム材料としての特性は、強度および導電率
だけでなく、耐熱性、リードの繰り返し曲げ性等あらゆ
る必須特性を満足する必要がある。The properties as a lead frame material must satisfy not only strength and conductivity but also all essential properties such as heat resistance and lead repetitive bendability.
従って、高強度、高導電性を有しながら、かつ曲げ加工
性、耐熱性等にも優れた特性を有するリードフレーム材
料が要求されるのである。Therefore, there is a demand for a lead frame material having high strength and high conductivity, and also having excellent properties such as bending workability and heat resistance.
［発明が解決しようとする課題］ 本発明は、以上の従来技術の問題点に鑑みされたもので
あり、通常の鉄入り高力銅合金（Cu−2.3％Fe−0.03％
Ｐ−0.13％Zn）と同等以上の引張強さ（55kgf/mm2以
上）および導電率（68％IACS以上）を有し、さらに耐熱
性および曲げ加工性に優れる高力、高導電性銅合金の製
造方法を発明したものである。[Problems to be Solved by the Invention] The present invention has been conceived in view of the problems of the above-mentioned conventional techniques, and a normal iron-containing high strength copper alloy (Cu-2.3% Fe-0.03%).
P-0.13% Zn) and higher tensile strength (55kgf / mm 2 or higher) and electrical conductivity (68% IACS or higher), and high strength and high conductivity copper alloy with excellent heat resistance and bending workability. Is an invention of the manufacturing method of.
［課題を解決するための手段］ 本発明に係る耐熱性および曲げ加工性に優れる高力、高
導電性銅合金の製造方法は、Fe:1.5〜3.0wt％、P:0.001
〜0.1wt％、Zn:0.01〜1.0wt％、Mg:0.001〜0.01wt％
（ただし0.01wt％は含まず）を含有し、Cr,Ti,Zrのいず
れか１種以上を0.001〜0.01wt％（ただし0.01wt％は含
まず）含有し、残部がCuと不可避不純物からなる銅合金
の鋳塊を800℃〜1050℃の温度で熱間圧延した後、650℃
以上の温度から300℃以下の温度迄５℃/sec以上の速さ
で冷却した後、加工率70％以上で冷間圧延を行ない、60
0℃〜675℃（ただし600℃を除く）の温度で30分間以上
保持した後、冷却途中で450℃〜550℃の温度で30分間以
上保持する２段時効焼鈍を行なった後、加工率70％以上
の冷間圧延を行ない、さらに400℃〜450℃の温度で30分
間以上保持する２回目の焼鈍を行ない、加工率70％以上
で仕上げ圧延を行なった後、300℃〜400℃の温度で５秒
以上の歪取り焼鈍を行なうことを特徴とする。[Means for Solving the Problems] A method for producing a high-strength, highly conductive copper alloy having excellent heat resistance and bending workability according to the present invention is Fe: 1.5 to 3.0 wt%, P: 0.001.
~ 0.1wt%, Zn: 0.01-1.0wt%, Mg: 0.001-0.01wt%
(However, 0.01 wt% is not included), 0.001 to 0.01 wt% (however, 0.01 wt% is not included) containing at least one of Cr, Ti, and Zr, and the balance is Cu and inevitable impurities. After hot rolling the ingot of copper alloy at the temperature of 800 ℃ ~ 1050 ℃, 650 ℃
After cooling from the above temperature to a temperature of 300 ℃ or less at a speed of 5 ℃ / sec or more, cold rolling is performed at a working rate of 70% or more.
After holding at a temperature of 0 ℃ to 675 ℃ (excluding 600 ℃) for 30 minutes or more, and then performing two-step aging annealing at a temperature of 450 ℃ to 550 ℃ for 30 minutes or more during cooling, the working rate is 70 % Cold-rolling, and then second annealing at 400 ℃ -450 ℃ for 30 minutes or more, finish rolling at a working rate of 70% or more, then 300-400 ℃ It is characterized by performing strain relief annealing for 5 seconds or more.
［作用］ 本発明に係る耐熱性および曲げ加工性に優れる高力、高
導電性銅合金の製造方法について以下詳細に説明する。[Operation] The method for producing a high-strength, high-conductivity copper alloy having excellent heat resistance and bending workability according to the present invention will be described in detail below.
まず、本発明において、銅合金の組成を上述のように規
定する理由について説明する。First, the reason for defining the composition of the copper alloy as described above in the present invention will be described.
Fe:1.5〜3.0％ Feは、素材の強度を向上させる作用があるが、その含有
量が1.5％未満では所望の高強度が得られず、また、3.0
％を越えて含有すると導電率の低下および晶出するFeが
巨大化し、その結果、半田付け性の劣化およびAu,Agめ
っきのふくれ等の不具合いを生じ易くなる。したがっ
て、Feの含有量は1.5〜3.0％とする必要がある。Fe: 1.5-3.0% Fe has the effect of improving the strength of the material, but if its content is less than 1.5%, the desired high strength cannot be obtained,
If it is contained in excess of%, the conductivity is lowered and the crystallized Fe becomes huge, and as a result, defects such as deterioration of solderability and blistering of Au and Ag plating are likely to occur. Therefore, the Fe content needs to be 1.5 to 3.0%.
P:0.001〜0.1％ Ｐは、含有量が0.001％未満では溶湯中の脱酸効果が得
られず、また、0.1％を越えて含有すると熱間加工性の
劣化および導電率の低下をきたす。したがって、Ｐの含
有量は、0.001〜0.1％とする必要がある。P: 0.001 to 0.1% If the content of P is less than 0.001%, the deoxidizing effect in the molten metal cannot be obtained, and if it exceeds 0.1%, the hot workability is deteriorated and the conductivity is lowered. Therefore, the P content needs to be 0.001 to 0.1%.
Zn:0.01〜１％ Znは、0.01％以上含有すると半田密着性および剪断加工
性が良好となる。しかし、１％を越えて含有すると半田
付け性の劣化および導電率の低下をきたす。したがっ
て、Znの含有量は、0.01〜１％とする必要がある。Zn: 0.01 to 1% When Zn is contained in an amount of 0.01% or more, solder adhesion and shear workability are improved. However, if the content exceeds 1%, the solderability deteriorates and the conductivity decreases. Therefore, the Zn content needs to be 0.01 to 1%.
Mg:0.001〜0.01％（ただし0.01％は含まず） Mgは、原料、炉材あるいは雰囲気から混入するＳを安定
なMgとの化合物の形で母相中に固定し、熱間加工性を向
上させる必須元素であり、含有量が0.001％未満では上
記効果はなく、Ｓは粒界中を移動して粒界割れを助長す
ることとなる。Mg: 0.001 to 0.01% (excluding 0.01%) Mg fixes S mixed from the raw material, furnace material or atmosphere in the matrix in the form of a stable compound with Mg to improve hot workability. If the content is less than 0.001%, the above effect is not obtained, and S moves in the grain boundaries to promote grain boundary cracking.
Mgの含有量が0.01％以上であると鋳塊内部にCu＋MgCu2
という722℃の共晶を生じ、熱間加工温度である850℃〜
950℃に加熱することが不可能となり、さらには鋳塊の
表面に酸化物の巻き込みが多くなり、健全な鋳塊が得ら
れなくなる。したがって、Mg含有量は0.001〜0.01％
（ただし0.01％は含まず）とする。If the Mg content is 0.01% or more, Cu + MgCu 2 inside the ingot
722 ℃ eutectic, which is the hot working temperature of 850 ℃ ～
It becomes impossible to heat to 950 ° C., moreover, oxides are often entrained on the surface of the ingot, and a sound ingot cannot be obtained. Therefore, the Mg content is 0.001-0.01%
(However, 0.01% is not included).
Cr,Ti,Zr:いずれか１種以上を 0.001〜0.01％（ただし0.01％は含まず） Cr,Ti,Zrのいずれか１種以上の含有量が0.001％未満で
は熱間割れの抑制効果は得られず、また、0.01％以上含
有すると溶湯が酸化し易くなり、良好な鋳塊が得られな
い。したがって、Cr,Ti,Zrのいずれか１種以上を0.001
〜0.01％（0.01％は含まず）含有する必要がある。Cr, Ti, Zr: 0.001 to 0.01% of any one or more (excluding 0.01%) If the content of any one or more of Cr, Ti, Zr is less than 0.001%, the effect of suppressing hot cracking is Further, if the content is 0.01% or more, the molten metal is easily oxidized and a good ingot cannot be obtained. Therefore, at least one of Cr, Ti, and Zr should be 0.001
~ 0.01% (not including 0.01%) must be contained.
次に製造方法および製造条件について詳述する。Next, the manufacturing method and manufacturing conditions will be described in detail.
上記に説明した成分範囲をもつ銅合金の鋳塊を800℃以
上の温度で熱間圧延した後、650℃〜300℃の間の冷却速
度を５℃/sec以上と限定したのは、５℃/sec未満の冷却
速度では、650℃以上の温度でCu母相中に固溶していたF
eとＰとが300℃〜650℃の温度でほとんど析出し、その
後冷間加工および時効焼鈍を繰返しても、強度の向上に
寄与するFeとＰとの化合物の析出量が少なくなることに
よる。After hot-rolling a copper alloy ingot having the above-described composition range at a temperature of 800 ° C or higher, the cooling rate between 650 ° C and 300 ° C is limited to 5 ° C / sec or more. At a cooling rate of less than / sec, F dissolved in the Cu matrix at a temperature of 650 ° C or higher.
This is because e and P are mostly precipitated at a temperature of 300 ° C. to 650 ° C., and even if cold working and aging annealing are repeated thereafter, the amount of precipitation of the compound of Fe and P, which contributes to the improvement of strength, decreases.
次いで、冷間加工率70％以上の冷間圧延と時効焼鈍の工
程を２回繰返す。１回目の時効焼鈍条件を600℃〜675℃
の温度で30分間以上保持した後、冷却途中で450℃〜550
℃の温度で30分間以上の焼鈍を行なう、いわゆる２段時
効焼鈍するのは、従来Fe1.5〜3.0wt％を含有する鉄入り
銅合金のミクロ組織はファイバー組織（繊維状の組織）
であり、この組織を１段目の焼鈍により均一に再結晶さ
せミクロ組織を整粒化し、かつその後２段目の焼鈍によ
りFeおよびFeとＰとの化合物の析出を生じさせ、強度お
よび導電率を向上させるためである。この２段時効焼鈍
は最終製品の特性向上に大きく寄与するもので、導電率
はもとより、強度の向上および耐熱性、曲げ加工性を改
善する為に必須な工程であり、この結果耐熱性、曲げ加
工性に優れ、しかも導電率が高く、強度が大きくなる。Then, the steps of cold rolling with a cold working ratio of 70% or more and aging annealing are repeated twice. The first aging annealing condition is 600 ℃ -675 ℃
After holding at the temperature for 30 minutes or more, 450 ℃ -550 during cooling.
The so-called two-step aging annealing is performed at a temperature of ℃ for 30 minutes or more. Conventionally, the microstructure of the iron-containing copper alloy containing 1.5 to 3.0 wt% of Fe has a fiber structure (fibrous structure).
This structure is uniformly recrystallized by the first-stage annealing to make the microstructure grain size, and then the second-stage annealing causes precipitation of Fe and a compound of Fe and P. Is to improve. This two-step aging annealing greatly contributes to the improvement of the properties of the final product, and is an essential step for improving the strength, heat resistance, and bending workability as well as the electrical conductivity. Excellent workability, high conductivity, and high strength.
１段目の温度が600℃未満では、冷却途中で450℃〜550
℃の温度で30分間以上の時効焼鈍を行なっても、ミクロ
組織は整粒化せず、機械的性質の強化に寄与しない。67
5℃を越える温度では、ミクロ組織が整粒化するも強度
が低下しすぎて、その後の冷間加工によっても引張強さ
が55kgf/mm2以上を具備することは困難である。If the temperature of the 1st stage is less than 600 ℃, 450 ℃ ～ 550 during cooling.
Even if an aging annealing is carried out at a temperature of ℃ for 30 minutes or more, the microstructure does not become grain-sized and does not contribute to the strengthening of mechanical properties. 67
If the temperature exceeds 5 ° C, the microstructure will be grain-sized, but the strength will be too low, and it will be difficult to provide a tensile strength of 55 kgf / mm 2 or more even by subsequent cold working.
また、600℃〜675℃の温度で30分間以上保持した後、冷
却途中で450℃未満の温度で焼鈍を行なっても、析出は
不充分となり、導電率の向上が期待できない。550℃を
越える温度では導電率の向上はあるものの、強度の向上
が期待できない。Further, even if the material is held at a temperature of 600 ° C to 675 ° C for 30 minutes or more and then annealed at a temperature of less than 450 ° C during cooling, precipitation is insufficient and improvement in conductivity cannot be expected. At temperatures above 550 ° C, there is some improvement in conductivity, but no improvement in strength can be expected.
また、時間はいずれも30分間未満では、ミクロ組織を整
粒化するには不充分であり、また強度および導電率を向
上するFeおよびFeとＰとの化合物の析出が不充分であ
る。Further, if the time is less than 30 minutes in all cases, it is insufficient for grain size control of the microstructure, and precipitation of Fe and a compound of Fe and P for improving strength and conductivity is insufficient.
よって、１回目の時効焼鈍条件は600℃〜675℃の温度で
30分間以上の焼鈍後、冷却途中で400℃〜550℃の温度で
30分間以上とする。Therefore, the first aging annealing condition is the temperature of 600 ℃ ~ 675 ℃
After annealing for 30 minutes or more, at a temperature of 400 ° C to 550 ° C during cooling
30 minutes or more.
２回目の時効焼鈍において、400℃〜450℃の温度で30分
間以上保持するのは、FeおよびFeとＰとの化合物の析出
をさらに充分に行ない導電率の向上をはかり導電率が68
％IACS以上を具備することができる様にするためである
とともに、焼鈍前の冷間加工によって低下した伸びを回
復し、曲げ加工性を向上させるためでもある。In the second aging annealing, holding at a temperature of 400 ° C to 450 ° C for 30 minutes or more improves the conductivity by more sufficiently precipitating Fe and the compound of Fe and P and improves the conductivity.
This is not only for the purpose of making it possible to have a% IACS or more, but also for recovering the elongation reduced by the cold working before annealing and improving the bendability.
しかし、400℃未満の温度では30分間以上の焼鈍を行な
っても、析出は不充分となり、導電率を68％IACS以上に
することは困難であり、また曲げ加工性の回復も不充分
である。450℃を越える温度では導電率は向上するが、
引張強さ55kgf/mm2以上を具備することは困難である。However, at temperatures below 400 ° C, precipitation is insufficient even if annealing is performed for 30 minutes or more, it is difficult to make the conductivity 68% IACS or more, and recovery of bending workability is also insufficient. . Conductivity improves at temperatures above 450 ° C,
It is difficult to have a tensile strength of 55 kgf / mm 2 or more.
時間は、30分未満では400℃〜450℃の温度で焼鈍して
も、上記効果は不充分である。If the time is less than 30 minutes, the above effect is insufficient even if annealed at a temperature of 400 ° C to 450 ° C.
よって、２回目の時効焼鈍は400℃〜450℃の温度で30分
間以上とする。Therefore, the second aging annealing is performed at a temperature of 400 ° C to 450 ° C for 30 minutes or more.
さらに、最終冷間加工率を70％以上としたのは、70％未
満の冷間加工率では引張強さ55kgf/mm2以上を具備する
ことが困難であるためである。Furthermore, the reason why the final cold working rate is 70% or more is that it is difficult to have a tensile strength of 55 kgf / mm 2 or more at a cold working rate of less than 70%.
次に、最終製品板厚にて300℃〜400℃の温度で５秒以上
の歪取り焼鈍を行なうのは、冷間圧延歪の除去および伸
びを回復させ、耐熱性および曲げ加工性を改善するため
であり、300℃未満の温度では不充分であり、400℃以上
の温度では硬さが小さくなり、引張強さ55kgf/mm2を満
足しないためである。Next, performing strain relief annealing at a temperature of 300 ° C. to 400 ° C. for 5 seconds or more at the final product sheet thickness removes cold rolling strain and recovers elongation, and improves heat resistance and bending workability. This is because the temperature is less than 300 ° C., the hardness is insufficient at a temperature of 400 ° C. or higher, and the tensile strength of 55 kgf / mm 2 is not satisfied.
時間を５秒以上としたのは、工業的に生産性の面から連
続焼鈍炉を使用することを考慮したためであり、５秒未
満では上記効果は不充分なためである。The time was set to 5 seconds or more because it was considered to use the continuous annealing furnace from the viewpoint of industrial productivity, and if it is less than 5 seconds, the above effect is insufficient.
［実施例］ 本発明に係る耐熱性および曲げ加工性が優れる高力、高
導電性銅合金の製造方法について、その実施例によって
以下詳説する。[Examples] A method for producing a high-strength, high-conductivity copper alloy having excellent heat resistance and bending workability according to the present invention will be described below in detail with reference to Examples.
（実施例１） 第１表に示す含有成分および成分割合の銅合金を、クリ
プトル電気炉で木炭被覆下で大気溶解し、傾注式の鋳鉄
製のブックモールドに鋳込み、厚さ60mm、幅60mm、長さ
180mmの鋳塊を作製した。(Example 1) A copper alloy having the components and component ratios shown in Table 1 was melted in the atmosphere under a charcoal coating in a Cryptor electric furnace and cast into a cast iron book mold of a tilting type, a thickness of 60 mm, a width of 60 mm, length
A 180 mm ingot was prepared.
これらの鋳塊の表面および裏面をそれぞれ2.5mm面削
後、850℃の温度で厚さ15mmまで熱間圧延し、700℃の温
度から水中急冷した。この熱間圧延材の表面の酸化スケ
ールをグラインダーにより除去してから、厚さ3.2mmま
で冷間圧延した後、605℃〜750℃の温度で２時間焼鈍
後、冷却途中で450℃〜525℃に達した時、さらに４時間
の焼鈍を行ない、酸洗い後、厚さ1.0mmまで冷間圧延し
た後、375℃〜500℃の温度で４時間の時効焼鈍を行な
い、酸洗い後、最終冷間圧延により0.25mmの板厚にし、
300℃〜400℃の温度のソルトバスを用いて５秒間の焼鈍
を行なった。The front surface and the back surface of these ingots were each ground by 2.5 mm, hot-rolled at a temperature of 850 ° C to a thickness of 15 mm, and rapidly cooled in water from a temperature of 700 ° C. After removing the oxide scale on the surface of this hot rolled material with a grinder, cold rolling to a thickness of 3.2 mm, annealing at 605 ° C to 750 ° C for 2 hours, and 450 ° C to 525 ° C during cooling. Temperature is reached, the product is annealed for another 4 hours, pickled, cold-rolled to a thickness of 1.0 mm, then anged for 4 hours at a temperature of 375 ° C to 500 ° C, pickled and finally cooled. To a plate thickness of 0.25 mm by hot rolling,
Annealing was performed for 5 seconds using a salt bath at a temperature of 300 ° C to 400 ° C.
NO.12およびNO.13の比較例は、厚さ15mmの熱間圧延材を
厚さ1.0mmまで冷間圧延した後、575℃の温度で２時間焼
鈍後、冷却途中で500℃の温度で４時間焼鈍する１回の
２段時効焼鈍および525℃の温度に２時間焼鈍する１回
時効焼鈍を行ない、さらに最終冷間圧延により0.25mmの
板厚にし、350℃の温度で５秒間の歪取り焼鈍を行なっ
た。Comparative examples of NO.12 and NO.13 are as follows: hot-rolled material with a thickness of 15 mm was cold-rolled to a thickness of 1.0 mm, annealed at a temperature of 575 ° C for 2 hours, and then cooled at a temperature of 500 ° C during cooling. A two-step aging annealing was performed for 4 hours, and a single aging annealing was performed for 2 hours at a temperature of 525 ° C. Further, final cold rolling was performed to obtain a plate thickness of 0.25 mm and strain at 350 ° C for 5 seconds. Pre-annealing was performed.
NO.14の比較例は、厚さ10mmの板材を冷間圧延して厚さ
2.54mmとし、この材料を490℃の温度で２時間の焼鈍を
行ない、酸洗い後、冷間圧延して厚さ1.27mmとし、次い
で、この材料を440℃の温度で２時間の焼鈍を行ない、
さらに酸洗い後、冷間圧延して厚さ0.635mmとし、この
材料を440℃の温度で２時間の焼鈍を行ない、最終冷間
圧延にて0.25mmの板厚にし、350℃の温度で５秒間の焼
鈍を行なった。In the comparative example of NO.14, a plate material with a thickness of 10 mm was cold-rolled to a thickness of
2.54 mm, this material is annealed at a temperature of 490 ° C for 2 hours, pickled and cold rolled to a thickness of 1.27 mm, then this material is annealed at a temperature of 440 ° C for 2 hours ,
After pickling, it was cold-rolled to a thickness of 0.635 mm, this material was annealed at a temperature of 440 ° C for 2 hours, and finally cold-rolled to a plate thickness of 0.25 mm, and then at a temperature of 350 ° C for 5 hours. Annealing for 2 seconds was performed.
これらの試料について下記の試験を行ない、その結果を
第２表に示す。The following tests were performed on these samples, and the results are shown in Table 2.
（１）引張試験は圧延方向に平行に切出したASTME8の試
験片を用い、また、硬さはマイクロビッカース硬度計を
用いた。(1) In the tensile test, a test piece of ASTM E8 cut in parallel to the rolling direction was used, and the hardness was measured with a micro Vickers hardness meter.
（２）導電率は10mmw×300mmlの試験片を用い、ダブル
ブリッジにより測定した。(2) Conductivity was measured by a double bridge using a test piece of 10 mmw × 300 mml.
（３）耐熱温度はソルトバスを用い、各温度で５分間加
熱した後の硬さを測定し、加熱前の硬さの80％になる温
度として求めた。(3) The heat resistant temperature was determined by measuring the hardness after heating for 5 minutes at each temperature using a salt bath, and the temperature being 80% of the hardness before heating.
（４）曲げ加工性は10mm幅の試験片を作製し、Ｗ曲げ治
具を用いて、R/t＝1.0の曲げ試験を行ない、曲げ部の状
況を観察した。試料数は３であり、曲げ幅は圧延方向に
直角である。(4) Bending workability: A test piece having a width of 10 mm was prepared, and a bending test of R / t = 1.0 was performed using a W bending jig to observe the condition of the bent portion. The number of samples is 3, and the bending width is perpendicular to the rolling direction.
第２表から明らかなように、本発明に係る高力、高導電
性銅合金の製造方法NO.1〜NO.5は、引張強さ55kgf/mm2
以上、導電率68％IACS以上を満足し、しかも耐熱性に優
れ、曲げ加工性が良好であり、比較例のいずれと比較し
ても優れていることが分る。As is clear from Table 2, the high-strength, high-conductivity copper alloy manufacturing methods NO.1 to NO.5 according to the present invention have a tensile strength of 55 kgf / mm 2.
As described above, it can be seen that the conductivity is 68% IACS or more, the heat resistance is excellent, and the bending workability is good, which is superior to any of the comparative examples.
ここで比較例NO.6は、第１回目時効条件において、１段
目温度が750℃であり、本発明範囲の上限を越えてお
り、引張強さ55kgf/mm2を満足していない。Here, in Comparative Example No. 6, the first stage temperature is 750 ° C. under the first aging condition, which exceeds the upper limit of the range of the present invention, and the tensile strength of 55 kgf / mm 2 is not satisfied.
比較例NO.7は、１段目温度が550℃であり、本発明範囲
の下限より低く、引張強さ55kgf/mm2を満足するも、導
電率が68％IACS以下であり、さらに曲げ加工性が劣る。Comparative Example No. 7 has the first stage temperature of 550 ° C., which is lower than the lower limit of the range of the present invention and satisfies the tensile strength of 55 kgf / mm 2 , but the electrical conductivity is 68% IACS or less, and the bending process is further performed. Inferior in nature.
比較例NO.8は、第２回目時効焼鈍温度が500℃であり、
本願特許請求範囲の上限を越えており、引張強さ55kgf/
mm2、導電率68％IACSいずれも満足していない。Comparative Example No. 8 has a second aging annealing temperature of 500 ° C.,
The upper limit of the claims of the present application is exceeded and the tensile strength is 55 kgf /
Not satisfied with mm 2 and conductivity of 68% IACS.
比較例NO.9は、第２回目時効焼鈍温度が375℃であり、
本願特許請求範囲の下限より低く、引張強さ55kgf/mm2
を満足するも、導電率が68％IACS以下であり、曲げ加工
性が劣る。Comparative Example No. 9 has a second aging annealing temperature of 375 ° C.,
Lower than the lower limit of the claims of this application, tensile strength 55 kgf / mm 2
However, the electrical conductivity is 68% IACS or less, and the bending workability is poor.
比較例NO.10は、最終歪取り焼鈍温度が450℃であり、本
願特許請求範囲の上限を越えており、引張強さ55kgf/mm
2、導電率68％IACSいずれも満足していない。比較例NO.
11は、最終冷間加工率が本願特許請求範囲の下限より少
なく、引張強さが55kgf/mm2以下である。Comparative Example NO.10 has a final strain relief annealing temperature of 450 ° C, which exceeds the upper limit of the claims of the present application, and has a tensile strength of 55 kgf / mm.
2. Neither conductivity 68% IACS is satisfied. Comparative example NO.
In No. 11, the final cold work rate is less than the lower limit of the scope of claims of the present application, and the tensile strength is 55 kgf / mm 2 or less.
比較例NO.12,NO.13は、第１回目時効や省略した工程に
よる材料であり、本発明の製造方法に比べて、引張強さ
および導電率が低い。また耐熱温度が低く、曲げ加工性
も劣っている。Comparative Examples NO. 12 and NO. 13 are materials obtained by the first aging and the omitted steps, and have lower tensile strength and conductivity than the manufacturing method of the present invention. In addition, it has a low heat resistance temperature and poor bending workability.
比較例NO.14（従来法）は、３回時効焼鈍材であり、本
発明の製造方法に比べて、引張強さおよび導電率が低
く、耐熱温度の低い。Comparative Example No. 14 (conventional method) is a triple-age annealed material, and has lower tensile strength and conductivity and lower heat resistance temperature than the manufacturing method of the present invention.
［発明の効果］ 以上説明したように、本発明に係る耐熱性および曲げ加
工性が優れる高力、高導電性銅合金の製造方法は、上記
の構成を有しているものであることから、引張強さが55
kgf/mm2以上、導電率が68％IACS以上あって、耐熱性、
曲げ加工性が優れ、半導体リードフレーム、端子等電
気、電子部品用材料として、信頼性が高い銅合金を製造
することができる。[Effects of the Invention] As described above, the method for producing a high-strength, high-conductivity copper alloy having excellent heat resistance and bending workability according to the present invention has the above configuration, Tensile strength is 55
kgf / mm 2 or more, conductivity of 68% IACS or more, heat resistance,
It is possible to produce a highly reliable copper alloy as a material for electric and electronic parts such as a semiconductor lead frame and terminals, which has excellent bending workability.
Claims (1)
0.01〜1.0wt％、Mg:0.001〜0.01wt％（ただし0.01wt％
は含まず）を含有し、Cr,Ti,Zrのいずれか１種以上を0.
001〜0.01wt％（0.01wt％は含まず）含有し、残部がCu
と不可避不純物からなる銅合金の鋳塊を800℃〜1050℃
の温度で熱間圧延した後、650℃以上の温度から300℃以
下の温度迄５℃/sec以上の速さで冷却した後、加工率70
％以上で冷間圧延を行ない、600℃〜675℃（但し600℃
を除く）温度で30分間以上保持した後、冷却途中で450
℃〜550℃の温度で30分間以上保持する２段時効焼鈍を
行なった後、加工率70％以上の冷間圧延を行ない、さら
に400℃〜450℃の温度で30分間以上保持する２回目の焼
鈍を行ない、加工率70％以上で仕上げ圧延を行なった
後、300℃〜400℃の温度で５秒以上の歪取り焼鈍を行な
うことを特徴とする耐熱性および曲げ加工性に優れる高
力、高導電性銅合金の製造方法。1. Fe: 1.5-3.0 wt%, P: 0.001-0.1 wt%, Zn:
0.01-1.0wt%, Mg: 0.001-0.01wt% (however 0.01wt%
Is not included), and any one or more of Cr, Ti, and Zr is added to 0.
001 to 0.01 wt% (not including 0.01 wt%), balance Cu
Ingot of copper alloy consisting of unavoidable impurities and 800 ℃ 1050 ℃
After hot rolling at the temperature of 650 ℃, after cooling from 650 ℃ or more to 300 ℃ or less at a speed of 5 ℃ / sec or more, the processing rate is 70
% Cold-rolled, 600 ℃ ~ 675 ℃ (however 600 ℃
Temperature) for 30 minutes or more, then 450 during cooling
After performing two-step aging annealing at a temperature of ℃ to 550 ℃ for 30 minutes or more, cold rolling at a working rate of 70% or more, and then holding at a temperature of 400 to 450 ℃ for 30 minutes or more High strength with excellent heat resistance and bending workability, which is characterized by performing strain relief annealing at a temperature of 300 ° C to 400 ° C for 5 seconds or more after performing annealing and finish rolling at a working rate of 70% or more, Highly conductive copper alloy manufacturing method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9151089A JPH0696757B2 (en) | 1989-04-11 | 1989-04-11 | Method for producing high-strength, high-conductivity copper alloy with excellent heat resistance and bendability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9151089A JPH0696757B2 (en) | 1989-04-11 | 1989-04-11 | Method for producing high-strength, high-conductivity copper alloy with excellent heat resistance and bendability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02270946A JPH02270946A (en) | 1990-11-06 |
| JPH0696757B2 true JPH0696757B2 (en) | 1994-11-30 |
Family
ID=14028408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9151089A Expired - Lifetime JPH0696757B2 (en) | 1989-04-11 | 1989-04-11 | Method for producing high-strength, high-conductivity copper alloy with excellent heat resistance and bendability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0696757B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6632300B2 (en) * | 2000-06-26 | 2003-10-14 | Olin Corporation | Copper alloy having improved stress relaxation resistance |
| JP4567906B2 (en) * | 2001-03-30 | 2010-10-27 | 株式会社神戸製鋼所 | Copper alloy plate or strip for electronic and electrical parts and method for producing the same |
| JP4101705B2 (en) | 2003-06-18 | 2008-06-18 | 三菱伸銅株式会社 | Metal layer forming method |
| JP4118832B2 (en) * | 2004-04-14 | 2008-07-16 | 三菱伸銅株式会社 | Copper alloy and manufacturing method thereof |
| JP5687976B2 (en) * | 2011-09-09 | 2015-03-25 | 株式会社Ｓｈカッパープロダクツ | Manufacturing method of copper alloy for electric and electronic parts |
-
1989
- 1989-04-11 JP JP9151089A patent/JPH0696757B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02270946A (en) | 1990-11-06 |
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