JPH0698558B2 - Polishing method - Google Patents
Polishing methodInfo
- Publication number
- JPH0698558B2 JPH0698558B2 JP60056166A JP5616685A JPH0698558B2 JP H0698558 B2 JPH0698558 B2 JP H0698558B2 JP 60056166 A JP60056166 A JP 60056166A JP 5616685 A JP5616685 A JP 5616685A JP H0698558 B2 JPH0698558 B2 JP H0698558B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- polished
- abrasive grains
- liquid
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】 〈産業上の利用分野〉 この発明は硬脆材、金属材、合成樹脂材などの被研磨材
を精密研磨仕上げするようにした研磨方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION <Industrial field of application> The present invention relates to a polishing method in which a material to be polished such as a hard brittle material, a metal material, and a synthetic resin material is precisely polished.
〈従来の技術〉 被研磨材を精密研磨仕上げする方法としては、従来から
ラッピング又はポリッシングが知られている。ラッピン
グ又はポリッシングは、被研磨材を、鋳鉄等からなるラ
ップや織布等のポリッシャに適当な圧力で押しつけ、酸
化アルミニウム、炭化けい素等の微細砥粒にラップ液を
混合して被研磨材とポリッシャとの間に介在し、被研磨
材とポリッシャとを相対的に移動させることにより砥粒
によって被研磨材の表面を切削する方法である。このラ
ッピング又はポリッシングは、研削等により精密仕上げ
された被研磨材の面を、更に平滑にして寸法精度を向上
させるものである。<Prior Art> Lapping or polishing has hitherto been known as a method for precision polishing finishing of a material to be polished. Lapping or polishing is performed by pressing a material to be polished against a polisher such as a wrap or a woven cloth made of cast iron or the like with an appropriate pressure, and mixing a lapping solution with fine abrasive grains such as aluminum oxide or silicon carbide to form a material to be polished. It is a method of cutting the surface of the material to be polished with abrasive grains by interposing it between the material and the polisher and moving the material to be polished and the polisher relatively. This lapping or polishing further smoothes the surface of the material to be polished that has been precisely finished by grinding or the like to improve dimensional accuracy.
〈発明が解決しようとする課題〉 しかし上記したラッピングやポリッシングにしても、仕
事量に比して加工量が少ないので、研磨効率が悪いとい
う欠点がある。<Problems to be Solved by the Invention> However, even with the above-mentioned lapping and polishing, there is a drawback that the polishing efficiency is poor because the processing amount is smaller than the work amount.
ラッピングやポリッシングにおいては、研磨効率は被研
磨材とポリッシャとの圧力の増加により良好になるが、
この圧力が大きくなるにつれて被研磨材が直接ラップや
ポリッシャに接触する面積が増大し、それらが荷重の一
部を分担するため、砥粒に作用する荷重が比例して増加
しない。したがって、被研磨材とポリッシャなどとの圧
力を大きくする必要があまりなく、逆に圧力を大きくす
るとラップやポリッシャの破損等の欠点が発生する。In lapping and polishing, the polishing efficiency is improved by increasing the pressure between the material to be polished and the polisher,
As the pressure increases, the area of the material to be directly contacted with the lap or the polisher increases, and they share a part of the load, so that the load acting on the abrasive grains does not increase proportionally. Therefore, it is not necessary to increase the pressure between the material to be polished and the polisher, and conversely, if the pressure is increased, defects such as damage to the wrap and the polisher occur.
そこで、通常ではあまり大きい圧力では研磨しないで、
良好な仕上げ面を保証できるということで、研磨効率を
無視していた。Therefore, normally do not polish with too much pressure,
The polishing efficiency was neglected because a good finished surface could be guaranteed.
又、上記のラッピングやポリッシングは、研磨材が弾性
であるため、被研磨面がうねりを生じたり、面だれを生
じやすい。Further, in the above-mentioned lapping and polishing, since the abrasive is elastic, the surface to be polished is likely to swell or sag.
〈課題を解決するための手段〉 本発明は上記に鑑み提案されたもので、充填混合の状態
が、砥粒の接触点を中心に液体が環状に付着して不連続
に存在するとともに空気相が連続して存在するペンドラ
ー域、又は、砥粒の接触点を含む面で液体が閉じて連続
に存在するとともに空気相が不連続に存在するファニキ
ュラー域である砥粒と液体との充填混合物を圧縮成型し
て液体がボンド作用をなして砥粒相互を結合させるとと
もに、砥粒が液体により柔らかく保持されている研磨層
に被研磨材を押圧し、研磨層と被研磨材とを相対的に移
動させることにより加工中に砥粒が自然と削り取られる
セルフドレッシング作用を生じながら研磨層で被研磨材
を研磨処理するようにしたことを特徴とする研磨方法に
関するものである。<Means for Solving the Problems> The present invention has been proposed in view of the above, and the state of filling and mixing is such that the liquid is annularly attached around the contact point of the abrasive grains and discontinuously exists in the air phase. Is a continuous mixture of a pendular region, or a filled mixture of abrasive particles and a liquid that is a funicular region in which the liquid is closed continuously at the surface containing the contact points of the abrasive grains and the air phase is discontinuously present. The liquid acts as a bond to bond the abrasive grains to each other and presses the material to be polished against the polishing layer where the particles are softly held by the liquid, and the polishing layer and the material to be polished are relatively moved. The present invention relates to a polishing method characterized in that a polishing material is used to perform a polishing treatment on a material to be polished while causing a self-dressing action in which abrasive grains are naturally scraped off during processing.
〈実 施 例〉 以下に本発明の実施例を説明する。<Examples> Examples of the present invention will be described below.
本発明の研磨方法で使用する研磨層は砥粒に液体を混合
し、圧縮成形したものである。上記した砥粒としては、
ダイヤモンド、コランダム、エメリ、ザクロ石、珪石、
トリポリ、焼成ドロマイト、熔融アルミナ、人造エメ
リ、炭化ケイ素、炭化ホウ素、酸化鉄、焼成アルミナ、
酸化クロム、酸化セリウム、酸化ジルコニウム等通常の
砥粒として使用できるものであればどのようなものでも
よい。そして、砥粒の粒径はおよそ30μｍ以下のものが
用いられ、望ましくは１〜30μｍの微細粉末が望まし
い。The polishing layer used in the polishing method of the present invention is formed by mixing abrasive grains with a liquid and compression molding. As the above-mentioned abrasive grains,
Diamond, corundum, emery, garnet, silica stone,
Tripoly, calcined dolomite, fused alumina, artificial emery, silicon carbide, boron carbide, iron oxide, calcined alumina,
Any material such as chromium oxide, cerium oxide, zirconium oxide can be used as long as it can be used as a normal abrasive grain. The abrasive grains having a grain size of about 30 μm or less are used, and a fine powder of 1 to 30 μm is desirable.
一方、本発明で使用する液体は上記した砥粒の接合用と
して利用するもので、水、アルカリ溶液、酸溶液、その
他多くの塩類の水溶液、高分子溶液、油状液体、磁性流
体などを使用することができる。On the other hand, the liquid used in the present invention is used for bonding the above-mentioned abrasive grains, and water, an alkaline solution, an acid solution, an aqueous solution of many other salts, a polymer solution, an oily liquid, a magnetic fluid or the like is used. be able to.
砥粒及び液体について多種類を挙げたが、これらは被研
磨材の材質により、最も有効なものを選択して使用する
のが望ましい。上記した砥粒と液体とを混合して研磨層
を構成するのであるが、先に例示した砥粒と液体との組
合せにおいてペンドラー域またはファニキュラー域とな
るように充填混合されるためには混合体中の砥粒は30〜
70vol％の範囲であって、本発明の研磨に最適な割合と
しては50〜60vol％であった。Although various types of abrasive grains and liquids have been mentioned, it is desirable to select and use the most effective one depending on the material of the material to be polished. The above-mentioned abrasive particles and liquid are mixed to form a polishing layer, but in order to be filled and mixed in the combination of the above-exemplified abrasive particles and liquid to be a Pendler region or a funicular region, mixing is required. Abrasive grains in the body are 30 ~
It was in the range of 70 vol% and the optimum ratio for the polishing of the present invention was 50-60 vol%.
また、砥粒径が大きな場合は、上記割合は多く砥粒径が
小さな場合は少なくするとよい。Further, when the abrasive grain size is large, the above ratio is large, and when the abrasive grain size is small, it may be small.
ペンドラー域とは、各砥粒の接触点を中心に液体が環状
に付着して不連続に存在するとともに、空気相が連続し
て存在する状態である。またファニキュラー域とは上記
したペンドラー域より液体が多い状態であって、砥粒の
接触点を含む面で液体が閉じて連続に存在するとともに
空気相が不連続に存在する状態である。The Pendler region is a state in which the liquid is annularly attached around the contact point of each abrasive grain and discontinuously present, and the air phase is continuously present. Further, the funicular region is a state in which there is more liquid than the above-mentioned Pendler region, in which the liquid is closed continuously at the surface including the contact points of the abrasive grains and the air phase is discontinuously present.
このようなペンドラー域もしくはファニキュラー域の状
態にある混合物はパサパサの状態であって、これ以上液
体の割合が増えるとネバネバの状態（キャピラリー域）
となり、さらに液体が増えてドロドロの状態（スラリー
域）となる。そしてペンドラー域で行う圧縮成型を乾式
成型、ファニキュラー域で行う圧縮成型を半乾式成型と
いい、キャピラリー域で行う圧縮成型としての湿式成型
と区別される。A mixture in such a state of the Pendler region or the funicular region is in a dry state, and when the ratio of the liquid increases further, it becomes in a slimy state (capillary region).
Then, the liquid further increases and becomes a muddy state (slurry region). The compression molding carried out in the pendler region is called dry molding, and the compression molding carried out in the funicular region is called semi-dry molding, which is distinguished from wet molding as compression molding carried out in the capillary region.
研磨層における砥粒と液体との混合率を上記したペンド
ラー域とファニキュラー域との間にすることにより液体
が砥粒のボンド作用をなし、砥粒相互を結合させる。By setting the mixing ratio of the abrasive grains and the liquid in the polishing layer between the above-mentioned Pendler region and the funicular region, the liquid acts as a bond for the abrasive grains and bonds the abrasive grains to each other.
本発明に用いる研磨層の作成に際しては砥粒より液体の
方が少ないので、砥粒や液体の種類によって液体が均一
に混合しない場合がある。砥粒と液体との混合が不均一
であると、研磨層の強度が不均一となり、強度の弱い部
分から破壊して安定に研磨することができない。そこ
で、液体に、該液体より揮発性の高い他の液体（稀釈
剤）を混合して砥粒と均一に混合した後、減圧或いは加
熱により稀釈剤を除去し、砥粒と液体とを所望の状態で
均一に混合すればよい。When the polishing layer used in the present invention is formed, the amount of the liquid is smaller than that of the abrasive grains, and therefore the liquid may not be uniformly mixed depending on the types of the abrasive grains and the liquid. If the mixture of the abrasive grains and the liquid is non-uniform, the strength of the polishing layer will be non-uniform, and it will not be possible to stably polish by breaking from the weaker portion. Therefore, the liquid is mixed with another liquid (diluting agent) having a higher volatility than the liquid and uniformly mixed with the abrasive grains, and then the diluent is removed by depressurizing or heating to remove the desired abrasive grains and the liquid. It may be mixed uniformly in the state.
上記した稀釈剤としては、液体の種類によって異なる
が、ヘキサン、ヘプタン等の低分子量炭化水素、メタノ
ール、エタノール等のアルコール類、水等を使用するこ
とができる。As the above-mentioned diluent, it is possible to use low molecular weight hydrocarbons such as hexane and heptane, alcohols such as methanol and ethanol, water and the like, although it depends on the kind of liquid.
本発明に用いられる研磨層は、前記したように砥粒と液
体、必要ならば稀釈剤を混合して充填混合し、乾式又は
半乾式成型するのみであるが、砥粒と液体とを単に混合
しただけでなく、圧縮成型して砥粒を緻密な状態にする
のが望ましい。圧縮成型する場合には圧力を加えたり、
振動充填成型を補助的に用いることができる。そして圧
縮成型した場合の圧力は、少なくとも被研磨材を研磨す
るときの圧力より小さくするのであって、得られた研磨
層は、液体がボンド作用をなして砥粒相互を結合させる
とともに、砥粒が液体により柔らかく保持されているの
で、その硬度は適度な硬さを有し、本発明者が炭化珪素
系砥粒Ｃ＃3000にスピンドルオイルを用いて圧縮成型し
て得られたもののゴム硬度は85〜95度であった。このよ
うにして得られた研磨層により被研磨材を効率的に研磨
することができる。The polishing layer used in the present invention is, as described above, mixed with abrasive grains and a liquid, if necessary, a diluting agent, filled and mixed, and only dry or semi-dry molding, but the abrasive grains and the liquid are simply mixed. Not only that, but it is desirable that the abrasive grains be made compact by compression molding. When compression molding, apply pressure,
Vibration filling molding can be used supplementarily. And the pressure in the case of compression molding is at least lower than the pressure when polishing the material to be polished, and the obtained polishing layer is such that the liquid acts as a bond to bond the abrasive grains to each other and Is softly held by the liquid, the hardness is moderate, and the rubber hardness of the one obtained by compression molding silicon carbide abrasive grains C # 3000 using spindle oil is It was 85-95 degrees. The material to be polished can be efficiently polished by the polishing layer thus obtained.
さらに砥粒が液体により柔らかく保持されているため、
加工中に砥粒が自然と削り取られるセルフドレッシング
作用が生じ、被研磨材の削り粉、切り粉によって目づま
りすることがなく、研磨開始当初の高い加工能率が維持
される。Furthermore, since the abrasive grains are held soft by the liquid,
A self-dressing action occurs in which the abrasive grains are naturally scraped off during processing, and it does not become clogged by the shavings and chips of the material to be polished, and the high processing efficiency at the beginning of polishing is maintained.
加工材料によって研磨層に目づまりが生じたとしても、
混合した液体を適宜噴霧し、作用砥粒面を軟化させるこ
とによりセルフドレッシング作用を促進させることがで
きる。Even if the polishing layer is clogged with the processing material,
The self-dressing action can be promoted by appropriately spraying the mixed liquid to soften the working abrasive grain surface.
本発明の研磨方法は上記した研磨層に被研磨材を押圧
し、研磨層及び被研磨材のいずれか一方又は両方を公転
又は自転させて相対的な移動を生じさせ、被研磨材を研
磨層により研磨する。この研磨層は砥粒と液体とが均一
に混合して成るので、研磨時に砥粒が散乱したり浮動す
ることがない。また研磨層に被研磨材を充分に押圧でき
るので、研磨効率を著しく高めることができる。The polishing method of the present invention presses the material to be polished against the above-mentioned polishing layer, causes one or both of the polishing layer and the material to be revolved or revolves to cause relative movement, and the material to be polished is a polishing layer. Polish with. Since this polishing layer is formed by uniformly mixing the abrasive grains and the liquid, the abrasive grains do not scatter or float during polishing. Further, since the material to be polished can be sufficiently pressed against the polishing layer, the polishing efficiency can be remarkably enhanced.
以下に本発明の実施例を説明する。Examples of the present invention will be described below.
実施例（１） JIS−Ｒ−6001に規定する砥粒Ｃ＃3000とスピンドルオ
イルを容積比6:4で均一に混合し、500g/cm2で圧縮成型
した研磨層を用い、0.5μmRmaxに予備研磨したディスク
基板用アルミニウムを回転数2000rpm（公転半径5cm）
で、圧力を500g/cm2から2kg/cm2まで徐々に増加しなが
ら研磨したところ、加工速度20μm/min、仕上面あらさ
0.04μmRmaxであった。また、縁ダレが殆ど発生しなか
った。Example (1) Abrasive grains C # 3000 specified in JIS-R-6001 and spindle oil were uniformly mixed at a volume ratio of 6: 4 and a polishing layer compression-molded at 500 g / cm 2 was used. Rotating speed of polished aluminum for disk substrate 2000 rpm (revolution radius 5 cm)
When polishing was performed while gradually increasing the pressure from 500 g / cm 2 to 2 kg / cm 2 , the processing speed was 20 μm / min and the finished surface was rough.
It was 0.04 μm Rmax. Further, the edge sagging hardly occurred.
比較例（１） 実施例で使用した砥粒Ｃ＃3000で通常のポリッシングを
行ったら、加工速度10μm/min、仕上面あらさ0.08μmRm
axであり、縁ダレも目立って発生した。Comparative Example (1) When the ordinary polishing was performed with the abrasive grains C # 3000 used in the example, the processing speed was 10 μm / min, the finished surface roughness was 0.08 μm Rm.
It was ax, and the edge drooping was also noticeable.
実施例（２） 砥粒Ｃ＃3000と純水を、容積比1:1で均一混合し、6kg/c
m2の圧力で振動を加えながら圧縮成型した研磨層を用
い、１μmRzに予備研磨した直径５インチのシリコンウ
ェハーを圧力2kg/cm2、回転数120rpm（公転半径14cm）
で研磨したところ、加工速度12.9μm/min、仕上面あら
さ0.03μmRzであった。Example (2) Abrasive grains C # 3000 and pure water were uniformly mixed at a volume ratio of 1: 1 to obtain 6 kg / c.
Using a polishing layer compression-molded while applying vibration at a pressure of m 2 , a silicon wafer with a diameter of 5 inches pre-polished to 1 μm Rz is pressure 2 kg / cm 2 , rotation speed 120 rpm (revolution radius 14 cm).
After polishing, the processing speed was 12.9 μm / min and the finished surface roughness was 0.03 μmRz.
比較例（２） 同じ砥粒を用い、同様の圧力、回転数で通常のポリッシ
ングを行ったら、加工速度7.1μm/min、仕上面あらさ0.
06μmRzであった。又、圧力が高すぎるためにウェハー
表面には微小なうねりが発生し、ポリッシャの破損も大
きかった。Comparative Example (2) Using the same abrasive grains and performing ordinary polishing at the same pressure and rotation speed, the processing speed was 7.1 μm / min and the finished surface roughness was 0.
It was 06 μm Rz. In addition, since the pressure was too high, minute undulations were generated on the wafer surface, and the polisher was greatly damaged.
実施例（３） 砥粒Ｃ＃1000と純水を容積比7:3で均一混合し、実施例
（２）と同様の条件で研磨を行った。その結果、加工速
度32μm/min、仕上面あらさ0.1μmRzであった。Example (3) Abrasive grains C # 1000 and pure water were uniformly mixed at a volume ratio of 7: 3, and polishing was performed under the same conditions as in Example (2). As a result, the processing speed was 32 μm / min, and the finished surface roughness was 0.1 μm Rz.
実施例（４） 砥粒Ｃ＃8000と純水を容積比4:6で均一混合し、実施例
（２）と同様の条件で研磨を行ったところ、加工速度2.
4μm/min、仕上面あらさ0.01μmRzであった。Example (4) Abrasive grains C # 8000 and pure water were uniformly mixed at a volume ratio of 4: 6, and polishing was carried out under the same conditions as in Example (2).
The surface finish was 4 μm / min and the surface roughness was 0.01 μm Rz.
実施例（５） 本発明の研磨方法と従来のポリッシングによる研磨によ
る仕上げ面の性状を比較するために、アクリル樹脂の円
柱（20mmφ）の断面を研磨した。そして、第１図に示す
ように、格子１を描いた台上に上記アクリル樹脂製円柱
２を載置し、研磨面２に映った格子のゆがみ状態を斜め
上方のカメラ４により撮影し、比較した。Example (5) In order to compare the properties of the finished surface by the polishing method of the present invention and conventional polishing, the cross section of a cylinder (20 mmφ) of acrylic resin was polished. Then, as shown in FIG. 1, the acrylic resin column 2 is placed on the table on which the lattice 1 is drawn, and the distortion state of the lattice reflected on the polishing surface 2 is photographed by the camera 4 obliquely above and the comparison is made. did.
従来のポリッシングにより研磨したアクリル樹脂製円柱
2Aでは、第２図に示すように、研磨面3Aの周縁に映った
格子の線１′が湾曲する。この様に格子１の線１′が曲
って映るのは、第３図に示すように円柱2Aの研磨面3Aの
周縁に縁ダレ５が発生しているからである。Acrylic resin cylinder polished by conventional polishing
In 2A, as shown in FIG. 2, the line 1'of the lattice reflected on the periphery of the polishing surface 3A is curved. The reason that the line 1'of the lattice 1 is curved as described above is that the edge sag 5 is generated at the peripheral edge of the polishing surface 3A of the cylinder 2A as shown in FIG.
これに対し本発明により研磨した円柱2Bでは、第４図に
示すように、研磨面3B全体に格子１がそのまま映り、周
縁においても格子１の線１″が殆ど真直に映る。On the other hand, in the cylinder 2B polished according to the present invention, as shown in FIG. 4, the grating 1 is reflected as it is on the entire polishing surface 3B, and the line 1 ″ of the grating 1 is reflected almost straight even on the peripheral edge.
したがって本発明により研磨すると、縁ダレが殆ど発生
しないことが確認できる。Therefore, it can be confirmed that the edge sagging hardly occurs when polishing is performed according to the present invention.
〈発明の効果〉 以上要するに本発明によれば、砥粒と液体を充填混合
し、ペンドラー域又はファニキュラー域とした混合物を
乾式又は半乾式成型して得られる研磨層で被研磨材を研
磨するようにしたので、被研磨材の圧力が砥粒に有効に
作用することになり、大きな圧力で加工速度が速く、研
磨効率を著しく高めることができる。又個々の砥粒に作
用する被研磨材の圧力が小さいので仕上面あらさが良好
となり、しかも弾力性が無いので縁ダレの発生が少な
く、精密な仕上げ研磨として実用的価値の高い方法であ
る。さらに、加工中に砥粒が自然と削り取られるセルフ
ドレッシング作用が生じるので、被研磨材の削り粉や切
り粉によって目づまりすることがなく、研磨開始当初の
高い加工能率が維持される。また、このことは研磨加工
量と研磨時間とが比例することを意味するので、例えば
研磨加工量を時間により制御することもできる。<Effects of the Invention> In short, according to the present invention, the abrasive is polished with a polishing layer obtained by dry-mixing or semi-dry-molding the mixture in which abrasive grains and a liquid are filled and mixed to form a pendular region or a funicular region. As a result, the pressure of the material to be polished effectively acts on the abrasive grains, the processing speed is high at a large pressure, and the polishing efficiency can be remarkably enhanced. Further, since the pressure of the material to be polished acting on each individual abrasive grain is small, the finished surface roughness is good, and since there is no elasticity, edge sagging is less likely to occur, and it is a method of high practical value as precise finishing polishing. Further, since a self-dressing action occurs in which the abrasive grains are naturally scraped off during processing, there is no clogging due to the shavings or cutting chips of the material to be polished, and high processing efficiency at the beginning of polishing is maintained. Further, this means that the polishing amount and the polishing time are proportional to each other, so that the polishing amount can be controlled by time, for example.
第１図は縁ダレの検査方法を示す斜視図、第２図は従来
のポリッシングにより研磨した円柱の斜視図、第３図は
第２図に示す円柱の断面図、第４図は本発明により研磨
した円柱の斜視図である。FIG. 1 is a perspective view showing an inspection method for edge sag, FIG. 2 is a perspective view of a cylinder polished by conventional polishing, FIG. 3 is a sectional view of the cylinder shown in FIG. 2, and FIG. It is a perspective view of a polished cylinder.
Claims (1)
ニキュラー域である砥粒と液体との充填混合物を圧縮成
型して液体がボンド作用をなして砥粒相互を結合させる
とともに、砥粒が液体により柔らかく保持されている研
磨層に被研磨材を押圧し、研磨層と被研磨材とを相対的
に移動させることにより加工中に砥粒が自然と削り取ら
れるセルフドレッシング作用を生じながら研磨層で被研
磨材を研磨処理するようにしたことを特徴とする研磨方
法1. A filling mixture of abrasive particles and a liquid whose filling and mixing state is a Pendler region or a funicular region is compression-molded so that the liquid acts as a bond to bond the abrasive grains to each other and the abrasive grains are liquid. By pressing the material to be polished against the polishing layer that is held softly, and by relatively moving the polishing layer and the material to be polished, abrasive particles are naturally scraped off during processing Polishing method for polishing a material to be polished
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60056166A JPH0698558B2 (en) | 1985-03-22 | 1985-03-22 | Polishing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60056166A JPH0698558B2 (en) | 1985-03-22 | 1985-03-22 | Polishing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61219565A JPS61219565A (en) | 1986-09-29 |
| JPH0698558B2 true JPH0698558B2 (en) | 1994-12-07 |
Family
ID=13019507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60056166A Expired - Lifetime JPH0698558B2 (en) | 1985-03-22 | 1985-03-22 | Polishing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0698558B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6464766A (en) * | 1987-09-01 | 1989-03-10 | Tadatomo Suga | Machining method for specular surface of hard and brittle material and grinding wheel member used therefor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5375590A (en) * | 1976-12-15 | 1978-07-05 | Ted Bildplatten | Method of manufacturing supporting body for abraisives |
| JPS5752193A (en) * | 1980-09-16 | 1982-03-27 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
| JPS5932507B2 (en) * | 1981-03-25 | 1984-08-09 | 東洋研磨材工業株式会社 | Polishing liquid |
-
1985
- 1985-03-22 JP JP60056166A patent/JPH0698558B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61219565A (en) | 1986-09-29 |
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