JPH07114832A - Self-bonding UV-curable enameled wire - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a self-welding UV-curable enameled wire. A UV curable enamel wire comprising a conductor 1 coated with a urethane acrylate UV curable resin composition 2, wherein the resin composition 2 contains at least 0.5% by weight of isocyanate. To do. By setting the isocyanate content in the resin composition 2 to 0.5% by weight or more, the adhesion of the enameled wires utilizing the alohanate bond by the heat treatment is realized. Further, when the isocyanate content in the resin composition 2 is 10% by weight or less, the original characteristics of the ultraviolet-crosslinking resin composition are not impaired.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a self-bonding UV-curable enameled wire.

[0002]

2. Description of the Related Art One of the enameled wires is a self-bonding enameled wire. The self-fusing enameled wire has the characteristic that both enameled wires can be fixed together by heat and solvent without using a treated varnish, which reduces the labor and simplification of the coil forming process of electrical equipment and communication equipment, or impregnates the equipment with varnish. It is used from the standpoint of process safety and environmental pollution control. Polyvinyl butyral resin, polyvinyl formal resin, copolymerized nylon, phenoxy resin and the like are mainly used for the heat-sealing layer of the self-bonding enameled wire. Especially, copolymerized nylon is widely used.
An enameled wire having a small thermal deformation obtained by combining a 6-12 nylon polymer and nylon 12 is used. Further, an enameled wire that can be fused at a low temperature by being modified with a phenol resin or the like is also used.

However, since the self-fusing enamel does not contribute much as an insulating layer, it is generally used by coating it on a conventional enamel wire.

Most of the conventional enameled wires use a thermosetting material (thermosetting varnish). The thermosetting varnish includes epoxy type, silicone type, polyurethane type, polyester type, polyamide imide type, polyimide type, polyester imide type, and formal type. Most of these are paints that use a solvent, and since most of them are materials in which 50% or more of the organic solvent is used, it is usually necessary to repeat the coating and baking process five times or more. Also, since a solvent is used, large-scale safety equipment is required. It is not preferable in the work environment because it requires (solvent collection, incineration, etc.). The same applies to the self-bonding enamel.

Attention is paid to a solventless liquid UV curable coating material as a coating material which does not use such a solvent. Since the ultraviolet curable coating is solvent-free, it is more safe than the thermosetting varnish, and a thick film can be obtained by applying the coating once or several times. Further, in comparison with the thermosetting varnish, it is easy to obtain a curable product having a great curability, which has a great effect on productivity, and the colorless and transparent coating material makes it easier to color than the thermosetting varnish.

[0006]

However, in general, an ultraviolet curable coating material forms a three-dimensional crosslinked body at the time of curing as in the case of a thermosetting varnish for an enameled wire, and does not melt by heat after curing, so that it is ultraviolet cured. There was a problem that the enamel wire coated with the paint could not be heat-sealed.

An object of the present invention is to solve the above-mentioned problems of the prior art and to provide an ultraviolet curable enameled wire capable of self-bonding.

[0008]

[Means for Solving the Problems] As a result of various studies on an ultraviolet curable coating material to solve the above problems, 0.5% by weight or more of isocyanate was added to a urethane acrylate type ultraviolet curable resin composition. It was found that the self-fusing property can be imparted by preliminarily setting it, and the present invention has been completed.

That is, the self-fusing UV-curable enameled wire of the present invention is based on the UV-curable enameled wire obtained by coating a conductor with a urethane acrylate UV-curable resin composition. % Or more of isocyanate is contained.

[0010]

The above urethane acrylate-based UV-crosslinking resin composition is a resin composition containing a urethane (meth) acrylate oligomer as a main component and other components such as a photopolymerizable monomer and a photopolymerization initiator. ) The acrylate oligomer is not particularly limited as long as it is produced from diisocyanate, polyol and hydroxyalkyl (meth) acrylate.

The photopolymerizable monomer includes an acryloyl group,
A known reactive diluent having a functional group having an unsaturated double bond such as a methacroyl group, an allyl group and a vinyl group can be used. Desirably, it is effective for low temperature solderability to use a monofunctional monomer whose functional group is a metacroyl group.

The photopolymerization initiator is not particularly limited, and a known photopolymerization initiator may be used. Examples include acetophenone-based, benzoin-based, benzophenone-based, thioxanthone-based and the like. As the acetophenone type, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenyl ketone, 2
-Methyl-1- [4- (methylthio) phenyl] -2-
Morpholinopropane-1 and the like, benzophenone-based benzophenone, benzoyl methyl benzoate,
There are 3.3'-dimethyl-4-methoxybenzophenone and the like, and examples of the thioxanthone type include 2.4-diethylthioxanthone and 2.4-dichlorothioxanthone.

The isocyanate is not particularly limited as long as it has at least two isocyanate groups. For example, hexamerene diisocyanate, isophorone diisocyanate, m-tetramethyl xylene diisocyanate, p-tetramethyl xylene diisocyanate, p-phenylene diisocyanate,
Examples include 2.4-toluene diisocyanate, naphthalene diisocyanate, 4.4-diphenylmethane diisocyanate, xylene diisocyanate, methylenebis (4-cyclohexyl isocyanate), trimethylhexamethylene diisocyanate, 4.4'-diphenylmethane triisocyanate.

The amount of isocyanate added is at least 0.
The amount of 5% by weight or more is because if it is less than that, it is difficult to realize the adhesion between the enameled wires utilizing the alohanate bond by the heat treatment. Desirably 1% by weight or more 1
It is preferably 0% by weight or less. This is because if it is 10% by weight or more, the effect on the added amount is small and the original properties of the ultraviolet-crosslinking resin composition are impaired.

The metal constituting the conductor may be any of copper, aluminum, iron, silver, platinum, etc., and alloys thereof.
They may be alloys with tin, zinc or the like. Further, those plated with tin, silver, nickel or the like may be used. The metal conductor may be a single wire, or a stranded wire or a stranded wire further plated. Alternatively, a rectangular metal conductor may be used.

In addition, if necessary, a photopolymerization initiation auxiliary agent, an adhesion preventive agent, a thixotropic agent, a filler, a plasticizer, a non-reactive polymer, a colorant, a flame retardant, a flame retardant auxiliary agent, an anti-softening agent, a release agent. Molding agent, drying agent, dispersant, wetting agent, anti-settling agent, thickening agent, antistatic agent, antistatic agent, antifungal agent, anti-mouse agent, anti-termite agent, matting agent, anti-blocking agent, skin It is possible to use a combination of various inorganic compounds and organic compounds such as anti-tension agents.

[0017]

EXAMPLES Next, examples of the self-fusing UV-curable enameled wire of the present invention will be described.

[Example 1] A urethane acrylate oligomer M-1100 (manufactured by Toagosei Kagaku Kogyo Co., Ltd.) was used.
UV curable resin composition consisting of 0 parts by weight, phenoxyethyl methacrylate 50 parts by weight, isobornyl methacrylate 30 parts by weight, and photopolymerization initiator 2,2-dimethoxy-2-phenylacetophenone 5 parts by weight and toluene diisocyanate 5 parts by weight. Bare annealed copper wire conductor 0.13
After coating on (1 / 0.13), it was cured by passing through an ultraviolet irradiation furnace to obtain an ultraviolet curable enamel wire having an insulation thickness of 15 μm.

Example 2 100 parts by weight of urethane acrylate oligomer M-1100, 50 parts by weight of isobornyl methacrylate, 5 parts by weight of photopolymerization initiator 2,2-dimethoxy-2-phenylacetophenone and 5 parts by weight of hexamethylene diisocyanate. After coating the bare annealed copper wire conductor 0.13 (1 / 0.13) with a UV curable resin composition consisting of 10 parts, it is cured through an UV irradiation furnace to obtain an insulation thickness of 16
A UV curable enameled wire of μm was obtained.

[Example 3] 100 parts by weight of urethane acrylate oligomer U-122M (manufactured by Shin-Nakamura Chemical Co., Ltd.), 50 parts by weight of phenoxyethyl methacrylate, 50 parts by weight of isobornyl methacrylate, 2, a photopolymerization initiator, A UV-curable resin composition comprising 5 parts by weight of 2-dimethoxy-2-phenylacetophenone and 10 parts by weight of toluene diisocyanate was used as a bare annealed copper wire conductor 0.13 (1 /
0.13) and then cured through a UV irradiation furnace to obtain a UV cured enamel wire having an insulation thickness of 15 μm.

Comparative Example 1 An ultraviolet-curable resin composition comprising 100 parts by weight of urethane acrylate oligomer M-1100, 50 parts by weight of phenoxyethyl methacrylate and 5 parts by weight of 2,2-dimethoxy-2-phenylacetophenone as a photopolymerization initiator. Bare annealed copper wire conductor 0.13 (1 /
0.13) and then cured through an ultraviolet irradiation furnace to obtain an ultraviolet curable enamel wire having an insulation thickness of 16 μm.

Comparative Example 2 100 parts by weight of urethane acrylate oligomer M-1100, 60 parts by weight of phenoxyethyl methacrylate, 5 parts by weight of 2,2-dimethoxy-2-phenylacetophenone as a photopolymerization initiator and 5 parts by weight of toluene diisocyanate. A bare annealed copper wire conductor 0.13 (1 / 0.13) is coated with an ultraviolet-crosslinking resin composition consisting of
A UV curable enameled wire of μm was obtained. Example 1 above
Table 1 shows the results of evaluation of the self-bonding property of each of the ultraviolet-curing enameled wires of Nos. 3 to 3 and the ultraviolet-cured enameled wires of Comparative Examples 1 and 2.

[0023]

[Table 1]

* Evaluation method of self-bonding property * Prepared enamel wire with a brim diameter of 40 mm and a mandrel diameter of 2
The wire was wound around an aluminum bobbin having a length of 0 mm and a length of 50 mm so that the wires contact each other, and this enamel wire was treated by electric heating at about 150 ° C. for 10 minutes, and then the bonding state of the wires was observed.

In addition, 200 μm of each ultraviolet curable resin composition
Create a m-thick sheet and make it 20 mm wide and 100 mm long.
Two pieces having a thickness of 2 mm were stacked and sandwiched between two aluminum metal plates, a load of 500 g was applied, and heat treatment was performed at 150 ° C. for 30 minutes, and then the adhesive force was measured by Tensilon.

As is clear from Table 1, all of the UV-curable enameled wires of Examples 1 to 3 to which 0.5% by weight or more of isocyanate was added were capable of self-bonding. Further, it can be seen that, when the sheets are bonded together, the higher the isocyanate ratio, the higher the adhesive strength.

On the other hand, none of the UV-curable enameled wires of Comparative Examples 1 and 2 had self-bonding property, and there was no adhesive strength even when the sheets were attached.

The self-bonding UV-curable enameled wire of the present invention can be applied to a multi-core enameled wire as well as a single-core enameled wire. FIG. 1 is a single-core enamel wire formed by coating one conductor 1 with an ultraviolet curable resin composition 2. In FIG. 2, seven conductors 1 are twisted into one and coated with an ultraviolet curable resin composition 2. Examples of the seven-core enameled wire are shown. FIG. 3 shows an example of a 7-core enameled wire in which seven conductors 1 coated with an ultraviolet curable resin or a thermosetting resin 3 are twisted into one and coated with an ultraviolet curable resin composition 2.

[0029]

In summary, according to the self-fusing UV-curable enameled wire of the present invention, the urethane acrylate UV-curable resin composition for coating the conductor contains at least 0.5% by weight of isocyanate. The heat treatment makes it possible to fuse the enamel wires to each other by utilizing the alohanate bond.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of a self-bonding UV-curable enameled wire of the present invention.

FIG. 2 is a cross-sectional view showing another embodiment of the self-bonding UV-curable enameled wire of the present invention.

FIG. 3 is a cross-sectional view showing another embodiment of the self-bonding UV-curable enameled wire of the present invention.

[Explanation of symbols]

 1 conductor 2 UV curable resin composition 3 UV curable resin or thermosetting resin

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Norio Takahata 5-1-1 Hidakacho, Hitachi City, Ibaraki Prefecture Hitachi Cable Ltd. Power Systems Research Center

Claims (2)

[Claims] 1. An ultraviolet curable enamel wire comprising a conductor coated with a urethane acrylate ultraviolet curable resin composition, wherein the resin composition contains at least 0.5% by weight of isocyanate. Self-bonding UV-curable enameled wire. 2. The self-bonding UV-curable enameled wire according to claim 1, wherein the content of isocyanate in the resin composition is 1% by weight or more and 10% by weight or less.