JPH07122836A - Soldering terminal for heat sink - Google Patents

Abstract

(57) [Abstract] [Purpose] A soldering terminal for a heat sink, which fixes a heat sink to a printed circuit board by soldering, has good workability during mounting, and can easily and securely fix the heat sink. I will provide a. [Structure] The heat sink 6 is sandwiched and supported by the skeleton 11,
By making the heat sink self-supporting with respect to the printed wiring board by the pedestal portion 14 provided at right angles to the skeleton portion 11, and inserting the insertion portion 15 extending downward from the skeleton portion 11 into the through hole. , The heat sink is held on the printed wiring board, and the insertion portion is soldered to fix the heat sink to the printed wiring board. Further, when soldering the insertion portion to the printed wiring board, the heat conduction preventing slit portion 16 provided at the base of the insertion portion 15 prevents heat conduction from the insertion portion to the heat sink. And facilitate soldering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering terminal for a heat sink for fixing a heat sink for radiating heat of a heat generating component to a printed board by soldering.

In the field of mounting technology of printed wiring boards, heat generating semiconductor components are sometimes mounted on the printed wiring boards. In this case, it is necessary to attach the heat generating semiconductor components to a heat sink to improve heat dissipation. Various heat sinks are used for this purpose.

For a heat sink used for such a purpose, the workability at the time of mounting on a printed wiring board is improved, and the heat sink can be easily and surely fixed by soldering. , Soldering terminals for heat sinks are required.

[0004]

2. Description of the Related Art Conventionally, as a method for attaching a heat sink to a printed wiring board, a screwing method or a fastening method using rivets has been widely used. FIG. 10 illustrates a method of assembling a conventional printed wiring board having a heat sink, in which (a) is insertion of lead parts,
(B) shows soldering by collective dipping, (c) shows lead cutting, (d) shows heat sink attachment, and (e) shows soldering of heat-generating semiconductor components.

As shown in (a), first, the lead component 2 is inserted into the through hole provided in the printed wiring board 1 from above. At this time, the heat sink mounting portion 3 is provided with masking 4 for preventing the adhesion of solder.

Next, in this state, as shown in (b), the lower surface of the printed wiring board 1 is dipped in the molten solder bath 5 to dip-solder the lead parts. After completion of soldering, as shown in (c), the printed wiring board 1
Cut unnecessary leads protruding from the bottom surface of the.

Thereafter, as shown in (d), the masking 4 is removed and the heat sink 6 is mounted. The heat sink 6 is fixed to the printed wiring board 1 by fastening screws 7.

Finally, as shown in (e), the printed wiring board 1 is turned upside down, and the leads 9 of the heat-generating semiconductor component 8 previously attached to the heat sink 6 are manually attached by using a soldering iron 9A or the like. By printed wiring board 1
Solder on the wiring surface of.

[0009]

In the conventional method for assembling a printed wiring board shown in FIG. 10, the heat-generating semiconductor component 8 cannot be soldered at the same time as the dip soldering of the lead component. The process had to be done manually.

This is because when the heat sink 6 is attached at the stage shown in FIG. 10A, the screw 7 is tightened from the lower surface of the printed wiring board 1 in order to prevent the lead components already inserted from falling off. , A heat sink must be attached, as this is extremely difficult in practice. (In this case, it is conceivable to attach the heat sink 6 in advance before inserting the lead component 2, but this is not possible because the lead component may be behind the heat sink.)

As described above, conventionally, the lead component and the heat-generating component mounted on the heat sink cannot be collectively dip-soldered, and the soldering must be performed in two steps, so that the work efficiency is lowered. There was a problem that I could not avoid doing it.

The present invention is intended to solve such a problem of the prior art, and enables the lead component and the heat sink mounted component to be collectively soldered in the assembly work of the printed wiring board. An object of the present invention is to provide a soldering terminal for a heat sink, which enables the heat sink to be fixed easily and surely by soldering.

[0013]

A soldering terminal for a heat sink according to the present invention is provided at a frame portion for sandwiching and supporting the heat sink and at a right angle to the body portion so that the heat sink can stand on a printed wiring board. It consists of a pedestal part and a curved pin-shaped part that extends downward from the skeleton part.It prevents the skeleton part from falling off when it is inserted into the through hole provided in the printed wiring board, and it is soldered to the printed wiring board. When the soldering part is attached to the printed wiring board, the heat from the inserting part to the heat sink is fixed. And a slit portion for preventing heat conduction formed so as to prevent conduction.

[0014]

In the soldering terminal for heat sink of the present invention, the heat sink is supported by the skeleton portion 11, and at the time of assembling the printed wiring board, the insertion portion 15 is inserted into the printed wiring board to allow the pedestal portion 14 to move. The heat sink can be free-standing on the printed wiring board. Then, in this state, the heat sink can be fixed to the printed wiring board by soldering the insertion portion 15.

Therefore, by using the soldering terminal for the heat sink of the present invention, the heat sink can be assembled on the printed wiring board at the same time as the other lead parts, and the dip soldering can be collectively performed.

Further, at this time, since the heat conduction preventing slit portion 16 is provided at the base of the insertion portion 15, it is possible to reduce the heat conduction from the insertion portion 15 to the heat sink during dip soldering. Therefore, it is possible to prevent defective soldering due to the temperature drop of the insertion portion 15.

[0017]

FIG. 1 shows an embodiment (1) of the present invention, in which the same components as those in FIG. 10 are designated by the same reference numerals. 10 is a soldering terminal for the heat sink of the present embodiment.

The heat sink soldering terminal 10 has a skeleton portion 11 having a U-shaped cross section, which is formed by bending a metal plate into a thickness that fits the side surface of the heat sink 6. A cutout window 13 is provided on an end surface of the body portion 11 so as to fit with the protrusions 12 provided on both side surfaces of the heat sink 6. The lower side of the skeleton portion 11 is bent at right angles on both sides to form pedestal portions 14, respectively. Further, a part of the surfaces on both sides of the skeleton portion 11 is extended to form each of the insertion portions 15 formed of a curved pin-shaped portion. Reference numeral 16 is a heat conduction preventing slit portion provided at the base of the insertion portion 15.

Two soldering terminals 10 for heat sink
With the projecting portion 12 and the cutout window 13 aligned with the both ends of the lower portion of the heat sink 6, and the skeleton portion 11 is fitted, the respective insertion portions 15 are inserted into the through holes provided in the printed wiring board. By inserting the heat sink 6, the heat sink 6 is sandwiched between the body portions 11 and fixed in the front-rear and left-right directions, and the pedestal portion 14 is seated on the surface of the printed wiring board so that the heat sink 6 is prevented from tilting.

In order to hold the heat sink 6 in this state, the insertion portion 15 is bent in a curved line, and has a structure that makes it difficult to pull it out when it is inserted into the through hole provided in the printed wiring board. Have

FIG. 2 illustrates the structure of the insertion portion. In the figure, the insertion portion 15 is bent in a gentle curve, and when the tip portion 17 is inserted into the through hole 18 provided in the printed wiring board 1, the tip portion 17 is formed into the through hole 18. It is formed so as to be subjected to bending stress from the inner surface. Therefore, when the insertion portion 15 is inserted into the through hole 18, the insertion portion 15 receives resistance in the direction in which the insertion portion 15 is pulled out, which makes it difficult to pull out. In order to secure such an effect, at least the insertion part 1 of the soldering terminal 10 for heat sink
5 needs to be formed of a material having elasticity.

3A and 3B are views for explaining a method of assembling a printed wiring board according to the present invention. FIG. 3A is a lead component insertion step, FIG. 3B is a heat sink assembly insertion step, and FIG. (D) shows each step of lead cutting.

As shown in (a), first, the lead component 2 is inserted into the through hole provided in the printed wiring board 1 from above. Next, as shown in (b), the heat generating semiconductor component 8 is attached to the heat sink 6 in advance, and the heat sink soldering terminal 10 is fitted therein. The lead 9 of the semiconductor component 8
The printed wiring board 1 is inserted from above into the through hole 19A provided in the printed wiring board 1.

Further, as shown in (c), the lower surface of the printed wiring board 1 is dipped in the molten solder bath 5 to dip-solder each lead portion. After completion of soldering, as shown in (d), unnecessary leads protruding from the lower surface of the printed wiring board 1 are cut.

At the time of soldering, the heat conduction from the insertion portion 15 toward the heat sink 6 is hindered by the heat conduction prevention slit portion 16, so that the temperature of the molten solder in the insertion portion 15 decreases, There is no fear that normal soldering to the insertion portion 15 will be hindered.

Thus, according to the configuration of the embodiment (1),
By inserting the heat sink and other lead components into the printed wiring board from above and soldering them as they are, the heat sink and other lead components can be soldered in the same process and fixed and electrically Connection can be made.

FIG. 4 shows an embodiment (2) of the present invention, in which the same components as those in FIG. 1 are designated by the same numbers. Reference numeral 20 denotes a soldering terminal for heat sink of this embodiment.

The heat sink soldering terminal 20 has substantially the same structure as the heat sink soldering terminal 10 shown in FIG. 1, except that a fastening structure using screws and nuts is adopted. Therefore, the through hole 22 is provided in the heat sink 6, the body portion 21 of the heat sink soldering terminal 20 has the corresponding mounting hole 23, and the body portion 21 is fitted into the heat sink 6, and the screw is attached. The heat sink 6 and the heat sink soldering terminal 2 are passed through the hole 23 and the through hole 22 and fixed by tightening with a nut.
It is configured so that 0 can be fastened. Pedestal 24,
The insertion portion 25 and the heat conduction preventing slit portion 26 are the pedestal portion 1 in the embodiment (1) shown in FIG. 1, respectively.
4, the insertion portion 15 and the heat conduction prevention slit portion 16 are similar.

Since the soldering terminal for heat sink of the embodiment (2) is fixed to the heat sink by using screws and nuts, it takes a lot of time to assemble, but on the other hand, it can be surely fixed and the soldering terminal for heat sink and the heat sink. There is an advantage that they can be attached to a printed wiring board in a state where they are integrated.

FIG. 5 shows an embodiment (3) of the present invention, which is a modification of the embodiment (2). Thirty
Is the soldering terminal for the heat sink of this embodiment.

The heat sink soldering terminal 30 has substantially the same structure as the heat sink soldering terminal shown in FIG. 4, except that it is inserted into the printed wiring board 1 for soldering. 32 is different in that 32 are provided at four positions at four corners of the body portion 31 of the soldering terminal 30 for heat sink.

In the soldering terminal 30 for the heat sink shown in the embodiment (3), the insertion portion 32 is thinned to increase the thermal resistance of this portion, thereby preventing heat conduction to the heat sink side. I am trying. Therefore, in the embodiment (2), the heat conduction preventing slit provided at the base of the inserting portion is omitted. The mounting hole 33 and the pedestal portion 34 are almost the same as the mounting hole 23 and the pedestal portion 24 in the case of the embodiment (2).

It should be noted that the embodiment (1) can be modified in the same manner as the embodiment (3) with respect to the embodiment (2).

FIG. 6 shows an embodiment (4) of the present invention, in which the same parts as those in FIG. 1 are designated by the same reference numerals, (a) is before assembly, and (b) is after assembly. Shows. 40 is a soldering terminal for a heat sink of this embodiment.

The heat sink soldering terminal 40 has substantially the same structure as the heat sink soldering terminal 10 shown in FIG. 1, except that a mounting structure by bending is adopted. Therefore, as shown in (a), the through holes 42 and 43 are provided in the heat sink 6, and when the heat sink 6 is fitted into the body portion 41 of the heat sink soldering terminal 40, the through holes 4 are formed.
Mounting arms 44 and 45 are provided which are slightly longer than the lengths 2, 43. Then, as shown in (b), after the skeleton portion 41 is fitted into the heat sink 6, the mounting arms 44 and 45 are passed through the through holes 42 and 43, and the tips are bent, so that the heat sink soldering terminal 40 is attached to the heat sink 6. Fix at 6.

Further, in order to fix the printed wiring board 1, there are provided two insertion portions 46. Inserting part 4
6 is provided at the tip of a pedestal portion 47 on both sides formed by bending at right angles to the skeleton portion 41, and this portion is inserted into a through hole provided in the printed wiring board 1 and soldered. The fixing point is the same as that of the embodiment shown in FIG. Further, at this time, in order to prevent heat conduction to the heat sink 6 side, heat conduction preventing slit portions 48 are provided at the bases of the inserting portions 46 on both sides.

The soldering terminal for heat sink of the embodiment (3) has the same advantages as those of the embodiment (2), and the soldering terminal for heat sink is fixed to the heat sink by bending the mounting arm. It has the advantage of easy installation.

FIG. 7 shows an embodiment (5) of the present invention, in which the same components as those in FIG. 1 are designated by the same reference numerals. 50 is a soldering terminal for a heat sink of this embodiment.

The heat sink soldering terminal 50 has substantially the same structure as the heat sink soldering terminal 10 shown in FIG. 1, but is different in that it is attached by a snap structure. Therefore, the heat sink 6
The slit portion 52 for fitting is provided, and the bent portion 53 is provided in the body portion 51 of the soldering terminal 50 for heat sink. Then, the body portion 51 is attached to the heat sink 6
The soldering terminal 50 for heat sink is fixed to the heat sink 6 by fitting the bent portion 53 into the fitting slit portion 52.

Further, in order to fix the printed wiring board 1, there are provided two insertion portions 54. Insertion part 5
4 is provided at the tip of pedestal parts 55 on both sides formed by bending at right angles to the skeleton part 51. This part is inserted into a through hole provided in the printed wiring board 1 and soldered. The point of fixing is the same as that of the embodiment (1). At this time, in order to prevent heat conduction to the heat sink 6 side, heat conduction prevention slits 56 are provided at the bases of the insertion portions 54 on both sides.

The soldering terminal for heat sink of the embodiment (4) has the same advantages as those of the embodiment (2), and the soldering terminal for heat sink is fixed to the heat sink by fitting the bent portion 53. It has the advantage of easy installation.

FIG. 8 shows an embodiment (6) of the present invention, (a) is a front view of the assembled state, (b) is
Is a side view of the assembled state, and (c) is a perspective view of the state before assembly.

In each of the drawings, reference numeral 61 denotes a soldering terminal for a heat sink, which is composed of an L-shaped metal fitting having a fixed wing portion 63 having a bent portion 62 at its tip and a pedestal portion 64 formed at a right angle thereto. Furthermore, at the tip of the base 64,
Each has a soldering fixing portion 65 for fixing. Further, a heat conduction preventing slit portion 67 is provided at a connection portion between the insertion portion 65 and the pedestal portion 64.

Two soldering terminals 61 for heat sink
Is in a state in which the bent portion 62 is aligned with the notch portions 66 provided on both side surfaces of the heat sink 6, and the insertion portion 65 is inserted into the through hole provided in the printed wiring board 1 to form the heat sink. The soldering terminal 61 for use is fixed. The heat sink 6 is fixed to the printed wiring board 1 by the bent portion 62 and the pedestal portion 64.

In this state, the lower surface of the printed wiring board 1 is dipped in a molten solder bath to simultaneously lead the other components and
The insertion portion 65 is dip-soldered, and after the soldering is completed, unnecessary leads protruding from the lower surface of the printed wiring board 1 are cut off from the insertion portion, so that the heat sink and other lead parts are made the same. Depending on the process, it can be soldered, fixed and at the same time electrically connected. At this time, by the heat conduction preventing slit portion 67,
The heat sink 6 from the insertion portion 65 through the fixed wing portion 63.
The point that the heat is prevented from being conducted to the solder and the soldering of the insertion portion 65 is normally performed is the same as in the other embodiments.

FIG. 9 shows an embodiment (7) of the present invention, in which the heat sink is sandwiched and fixed by two soldering terminals for heat sink.

In FIG. 9, 71 indicates a soldering terminal for heat sink. Reference numeral 72 denotes a holding plate portion having a rectangular plate shape and having a through hole 73. The lower part of the restraining plate portion 72 is bent at a right angle to form a pedestal portion 74. Both ends of the restraining plate portion 72 and the tip of the pedestal portion 74 have insertion portions 75, 76, 77, respectively,
Slits 78, 79, 80 for preventing heat conduction are provided at the connecting portions between the insertion portions 75, 76, 77 and the restraining plate portion 72 or the pedestal portion 74, respectively.

Two soldering terminals 71 for heat sink
Apply to each side of the heat sink,
And a nut or the like by passing a screw through a hole provided in the heat sink to fix the heat sink soldering terminal 7
1 can be fixed to the heat sink 6.

In this state, the lower surface of the printed wiring board is dipped in a molten solder bath to dip-solder the insertion portions 75, 76 and 77 at the same time as the leads of other parts, and after the soldering is completed, By cutting the unnecessary lead protruding from the lower surface of the printed wiring board and the insertion portion, the heat sink and other lead parts can be soldered and fixed in the same step, and at the same time electrical connection can be performed. it can. At this time, the slit portion 7 for preventing heat conduction
Insertion part 75, 76, 77 by 8, 79, 80
The point that the heat is prevented from being conducted to the heat sink through the restraining plate portion 72 and the soldering of the insertion portion is normally performed is the same as in each of the above-described embodiments.

The embodiment of FIG. 9 is easy to manufacture because the shape of the soldering terminal for the heat sink is simple. further,
Since the number of insertion parts is increased and distributed, it is possible to securely fix the heat sink, and
Since the insertion portion can be made thin, it is advantageous from the viewpoint of preventing heat conduction.

[0051]

As described above, according to the present invention, the lead component and the heat sink mounting component can be collectively soldered and fixed in the assembly work of the printed wiring board, and the heat sink can be easily mounted. And it can be mounted on the printed wiring board with certainty.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment (1) of the present invention.

FIG. 2 is a diagram illustrating a structure of an insertion portion.

FIG. 3 is a diagram illustrating a method of assembling a printed wiring board according to the present invention.

FIG. 4 is a diagram showing an embodiment (2) of the present invention.

FIG. 5 is a diagram showing an embodiment (3) of the present invention.

FIG. 6 is a diagram showing an embodiment (4) of the present invention.

FIG. 7 is a diagram showing an embodiment (5) of the present invention.

FIG. 8 is a diagram showing an embodiment (6) of the present invention.

FIG. 9 is a diagram showing an embodiment (7) of the present invention.

FIG. 10 is a diagram illustrating a method for assembling a printed wiring board having a conventional heat sink.

[Explanation of symbols]

 1 printed wiring board 6 heat sink 11 body part 14 pedestal part 15 insertion part 16 slit part for preventing heat conduction

Claims (1)

[Claims] 1. A skeleton part (11) for sandwiching and supporting a heat sink (6), and a pedestal provided at right angles to the skeleton part (11) so that the heat sink can stand on the printed wiring board (1). A part (14) and a curved pin-shaped part extending downward from the body part (11), and prevents the body part from falling off when inserted into a through hole provided in the printed wiring board. Together with the insertion part (15) for fixing the skeleton part when soldered to the printed wiring board, the insertion part is provided at the base of the insertion part (15). A soldering terminal for a heat sink, comprising: a heat conduction preventing slit portion (16) formed so as to prevent heat conduction from the insertion portion to the heat sink when soldering to a printed wiring board. .