JPH07140663A - PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE COMPOSITION, AND ELECTRONIC DEVICE MANUFACTURING METHOD USING THE SAME - Google Patents

Abstract

(57) [Summary] [Object] To provide a positive photosensitive resin composition developable with an aqueous solvent. A photosensitive resin composition comprising a polymer having a carboxylic acid group and a photobase generator capable of generating a base upon irradiation with electromagnetic waves. [Effect] By providing a positive photosensitive resin composition that can be developed with a water solvent system, it is possible to prevent environmental pollution, improve the working environment, and increase the density and reliability of applied products.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel photosensitive resin composition, a pattern forming method using the composition and an electronic device manufacturing method using the same.

[0002]

2. Description of the Related Art Photosensitive resin compositions are classified into a positive type in which an exposed portion is etched and a negative type in which an unexposed portion is etched. In the negative type, high-resolution fine processing is difficult because the exposed area swells with the developer. Further, from the viewpoints of preventing environmental pollution and improving the working environment, a photosensitive resin composition using a chlorine-based solvent or organic solvent-based developer can be used as a substitute for the photosensitive resin composition using an aqueous solvent-based developer. Development is strongly desired.

Conventionally, as the organic photosensitive resin, a polyimide system having excellent heat resistance has been widely studied.

For example, after coating a substrate with polyimide acid, which is a polyimide precursor, and performing heat treatment to convert it into polyimide, a relief pattern of a photoresist is formed on the polyimide film, and the polyimide is selected by a hydrazine-based etching agent. Etching is performed to transfer the relief pattern to polyimide.

However, since the patterning of the polyimide in the above steps includes steps such as photoresist coating and peeling, the process becomes very complicated. Also,
The transfer of the relief pattern through the resist causes a decrease in dimensional accuracy. Therefore, in order to simplify the microfabrication process and improve the precision, it has been desired to develop a heat resistant material that can be microfabricated by direct light.

As a material for the above purpose, a photosensitive heat-resistant material comprising polyamic acid and dichromate (Japanese Patent Publication No. Sho 49-1).
7374), a photosensitive polyamic acid derived from a pyromellitic acid derivative (JP-A-49-112241), and a photosensitive heat-resistant material comprising a polyamic acid and an unsaturated amine (JP-A-49-112).
54-145794), a photosensitive heat-resistant material obtained by reacting a polyamic acid with a saturated epoxy (JP-A-55-45746), and other materials have been proposed. However, the above-mentioned light-sensitive materials are all negative type using a crosslinking reaction. A light-sensitive material using a cross-linking reaction is disadvantageous in performing high-resolution fine processing because the exposed portion swells with the developer as described above. On the other hand, as a positive type photosensitive heat resistant material,
Positive type photosensitive heat-resistant material (Japanese Patent Publication No. 1-59571)
(JP-A-62-229242) and the like have been proposed.

[0007]

However, in order to obtain the above-mentioned positive type photosensitive heat-resistant material, it is necessary to use an acid chloride as a monomer. Therefore, the reaction temperature, the removal of water and the like must be strictly controlled during the synthesis. Need to control.
Further, the produced precursor also has a problem in terms of purity such as the need to remove chlorine ions. In addition, since the positive photosensitive heat-resistant material has a photosensitive group attached to the polyimide precursor by a strong covalent bond, it is difficult to be removed during the imidization process, and there is a problem that the film characteristics are adversely affected. Also,
The developing characteristics were also insufficient.

The present invention provides a positive photosensitive resin composition developable with an aqueous solvent which can solve the above problems, a pattern forming method using the composition, and an electronic device manufacturing method using the same. With the goal.

[0009]

The present invention uses technical means in order to achieve the above object. The first means is the general formula (I)

[0010]

[Chemical 11]

(In the formula, A is an organic group having 2 or more carbon atoms, and n is
10～200,000 integer, R ₁ is either one or more organic group having carbon, hydrogen, halogen atoms. ) The carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 with respect to the total weight of the polymer represented by A photosensitive resin composition comprising a base generator (b) in an amount of 0.2 to 2.0 molar equivalents with respect to the carboxyl groups.

The second means is to use a polymer containing a carboxyl group and a compound of the general formula (III)

[0013]

[Chemical 12]

(In the formula, R ₄ is an organic group having 1 or more carbon atoms, hydrogen or a halogen atom. P is an integer of 0 to _4. R ₅ and R ₆ are 12 or less carbon atoms. Organic groups of R
₇ is hydrogen or an organic group having 10 or less carbon atoms. ) A positive photosensitive resin composition containing a compound represented by the formula (1) and soluble in water.

A third means is a composition comprising a compound containing a carboxyl group and a base generator, which can be patterned by irradiation of electromagnetic waves.

The fourth means is the general formula (I)

[0017]

[Chemical 13]

(In the formula, A is an organic group having 2 or more carbon atoms, and n is
10～200,000 integer, R ₁ is either one or more organic group having carbon, hydrogen, halogen atoms. ) The carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 with respect to the total weight of the polymer represented by A step of coating a substrate with a photosensitive resin composition containing a base generator (b) in an amount of 0.2 to 2.0 molar equivalents with respect to the carboxyl group, and drying, and a step of exposing to light through a light-shielding mask, A pattern forming method comprising a step of developing in a water solvent.

The fifth means is the general formula (I)

[0020]

[Chemical 14]

(Wherein A is an organic group having 2 or more carbon atoms, n is an integer of 10 to 200,000, R ₁ is an organic group having 1 or more carbon atoms,
It is either hydrogen or a halogen atom. ) A carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 relative to the total weight of the resin component containing the carboxylic acid polymer represented by
Photobase generator that generates a base by electromagnetic wave irradiation (b)
Is contained in an amount of 0.2 to 2.0 molar equivalents with respect to the carboxyl group.

The sixth means is the general formula (I)

[0023]

[Chemical 15]

(In the formula, A is an organic group having 2 or more carbon atoms, and n is
10～200,000 integer, R ₁ is either one or more organic group having carbon, hydrogen, halogen atoms. ) A carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 relative to the total weight of the resin component containing the carboxylic acid polymer represented by
Photobase generator that generates a base by electromagnetic wave irradiation (b)
A step of applying a photosensitive resin composition containing 0.2 to 2.0 molar equivalents to the carboxyl group on a substrate and drying.
A pattern forming method comprising a step of exposing to light through a light-shielding mask and a step of developing in water.

A seventh means is (a) a step of forming a wiring sheet on which a first wiring is formed, (b) a step of forming an adhesive layer between the substrate and the wiring, and on the wiring (c) ) A step of stacking wiring sheets on which second wirings are formed via the adhesive layer, (d) the stacked wiring sheets are pressed and heated to cure the adhesive layer, and the first wiring and the second wiring In the method for manufacturing a multilayer wiring circuit board, the step of forming the first wiring and the second wiring includes:

[0026]

[Chemical 16]

(In the formula, A is an organic group having 2 or more carbon atoms, and n is
10～200,000 integer, R ₁ is either one or more organic group having carbon, hydrogen, halogen atoms. ) A carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 with respect to the total weight of the resin component containing the carboxylic acid polymer represented by A photo-base generator (b) for generating a base according to (2) is coated on a substrate, wherein the photosensitive resin composition is contained in an amount of 0.2 to 2.0 molar equivalents with respect to the carboxyl group.
A step of drying, a step of exposing light through a light-shielding mask,
A method for producing a multilayer printed circuit board, comprising the step of developing in a water solvent.

According to an eighth aspect of the present invention, the circuit forming means in the large scale integrated circuit has the general formula (I).

[0029]

[Chemical 17]

(In the formula, A is an organic group having 2 or more carbon atoms, and n is
10～200,000 integer, R ₁ is either one or more organic group having carbon, hydrogen, halogen atoms. ) A carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 relative to the total weight of the resin component containing the carboxylic acid polymer represented by
Photobase generator that generates a base by electromagnetic wave irradiation (b)
A step of applying a photosensitive resin composition containing 0.2 to 2.0 molar equivalents to the carboxyl group on a substrate and drying.
A large-scale integrated circuit characterized by including a step of light exposure through a light-shielding mask and a step of developing in water, and a liquid crystal alignment film pattern characterized by using the composition provided by the third means. It is to provide a forming method.

The present invention has been achieved by utilizing the fact that the solubility of a molecule having a carboxylic acid group in the structure of the general formula (I) is greatly changed by the presence of a base. Therefore, any compound having a carboxylic acid group in its structure can be applied. The number average molecular weight of the carboxylic acid is 10,000 when considering the mechanical properties of the relief pattern.
It is desirable that the above, there is no particular limitation on the upper limit of the molecular weight, but when considering the ease of dissolution in a solvent
It is desirable to be 1000000 or less.

As a repeating unit which gives a polymer structure having a carboxylic acid group by chain polymerization, the Polymer Data Handbook: Basic Edition (Polymer Society of Japan, Baifukan, 198)
6) Polyacrylic acid and alkyl polyacrylate derivatives shown in Table 9.1, maleic acid and its derivatives shown in Table 14.1, fluoroalkyl arenoate, vinyl acetate and the like can be mentioned. The present invention can be directly applied to polymers of the monomers listed here and polymers having the monomers listed here as a copolymerization component. Further, even in the case of a polymer that does not contain a carboxylic acid group as a monomer during polymerization, the present invention can be applied by introducing the carboxylic acid group by chemical modification.

The above general formula (I) is replaced by the general formula (II)

[0034]

[Chemical 18]

(In the formula, R ₁ is the same as above. R ₂ is an organic group having 2 or more carbon atoms, R ₃ is an organic group having 4 or more carbon atoms, and n is the same as above.) In some cases, the effects of the present invention are more effectively exhibited.

As the polycondensation type polymer, for example, polyamic acid and chitin can be cited as typical polymers having a carboxylic acid group. In particular, when the present invention is applied to polyamic acid, a relief image excellent in heat resistance and chemical resistance can be obtained by forming a relief image and then heating or chemically imidizing it to convert it into polyimide. Excellent performance as a protective film for LSIs, insulating film for wiring boards, etc. The polyamic acid used in the present invention is obtained by reacting a diamine or diisocyanate with a tetracarboxylic acid or its derivative. Examples of tetracarboxylic acid derivatives include acid anhydrides and acid chlorides. The use of an acid anhydride is preferable in terms of reactivity and by-products. Examples of the diamine and acid anhydride derivative used in the present invention include those described in JP-A No. 61-181829.

In the present invention, the base generator (b)
Is the general formula (III)

[0038]

[Chemical 19]

(In the formula, R ₄ is an organic group having 1 or more carbon atoms, hydrogen or a halogen atom. P is an integer of 0 to _4. R ₅ and R ₆ are 12 or less carbon atoms. Organic groups,
R ₇ is hydrogen or an organic group having 10 or less carbon atoms. When the compound represented by the formula (1) is used, the effects of the present invention are more effectively exhibited.

Specific compounds include cyclohexyl paratoluene sulfonylamine, [[(3,5-dimethylbenzyl) oxy] carbonyl] cyclohexylamine, [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine, N. -[[(2,6-Dinitrophenyl) -1-methylmethoxy] carbonyl] cyclohexylamine, N-[[(2,6-dinitrophenyl) -1- (2 ', 6'-dinitrophenyl) methoxy] carbonyl ] Cyclohexylamine, N-[[(2
-Nitrophenyl) -1- (2'-nitrophenyl) methoxy] carbonyl] cyclohexylamine, [[(2
-Nitrobenzyl) oxy] carbonyl] cyclohexylamine, N-[[(2-nitrophenyl) -1-methylmethoxy] carbonyl] cyclohexylamine,
[[(2-Nitrobenzyl) oxy] carbonyl] piperidine, bis [[(2-nitrobenzyl) oxy] carbonyl] hexane 1,6-diamine and the like can be mentioned.
For details on these compounds and structures, see J. Am. Chem. Soc. 199.
1, 113, 4303-4313, Fahey, J. et al. T. and Frechet JM
J. (1991) Proc. SPIE, 1466, 67, Frechet, JMJ, Stan
ciulescu, M., Lizawa, T., and Willson, CG, (1989) Pr
oc.ACS Div.Polym.Mater.Sci.Eng., 60,170. Grazian
o, KA, Thompson, SD, and Winkle, MR (1990) Proc.SP
IE, 1466, 75. As described in the above, a researcher in this field can easily synthesize a required base generator. In addition, cobalt (III) amine salt, cobalt (III)
Alkyl amine salts, α-ketocarboxylic acid ammonium salts, phenylglyoxy acid ammonium salts, 4-methylphenyl sulfonamide, N-cyclohexyl-4-methylphenyl sulfonamide and the like are also useful. All of these compounds decompose by irradiation with electromagnetic waves to generate a base. Among these, the base generator represented by the chemical formula 3 is
High generation efficiency and excellent characteristics are obtained. The group represented by R ₇ in the structural formula is from the viewpoint of film slippage at the time of forming a relief pattern,
An organic group having 10 or less carbon atoms is desirable. Also,
The photobase generator used in the present invention can be used regardless of the above structure as long as it can generate a water-soluble aliphatic amine by irradiation with electromagnetic waves. In order to obtain water solubility by salt formation, amines having 12 or less carbon atoms are generally desirable. In the present invention, the electromagnetic wave has a wavelength of 10 μm to 1
It is desirable to use a light beam of nm, preferably 200 to 900 nm.

The present invention can be easily achieved by mixing the polyamic acid synthesized by the above-mentioned conventional method and the base generator. It goes without saying that the present invention can be used in combination with a triplet sensitizer, an adhesion improver made of various amine compounds, a surfactant and the like.

The base generated by the light irradiation reacts with the carboxylate in the polymer and changes the solubility of the polymer. That is, the portion where the base and the carboxylic acid react to form a salt has improved solubility in water and reduced solubility in an organic solvent. As a result, a positive image can be obtained when a highly polar water solvent is used as a developing solution, and a negative image can be obtained when an organic solvent is used as a developing solution. Since the bond between the carboxylic acid group and the generated base is weak, it can be easily eliminated during the imidization process to give a relief pattern of excellent film quality. Since the relief pattern is based on salt formation, the amounts of carboxylic acid and base generator in the resin composition are important. As a result of studying the blending amount of these, it was found that a good relief pattern was obtained when the carboxylic acid was 20% by weight or more based on all the resin components. It was also found that a good relief pattern was obtained when the amount of the base generator was 0.2 to 2.0 molar equivalents with respect to the carboxylic acid. In both cases of 0.2 molar equivalent or less and 2.0 molar equivalent or more, a good relief pattern could not be obtained.

[0043]

The base generated by light irradiation reacts with the carboxylic acid group in the polymer, changes the solubility of the polymer in water, and enables development between the unexposed portion and the exposed portion. Since the bond between the carboxylic acid salt and the generated base or the carboxylic acid group and the base generator is weak, it is easily desorbed to give a relief pattern of excellent film quality.

[0044]

【Example】

(Example 1) 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) and an equivalent amount of p-phenylenediamine (PDA) were reacted in N-methyl-2-pyrrolidone to give a solid content. A polyamic acid solution having a content of 10% by weight was obtained. BPDA and an equivalent amount of [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine were added to this polyamic acid solution to obtain a photosensitive resin composition. This photosensitive resin composition was applied on a glass substrate by a spin coating method, dried at 100 ° C., and exposed with a high pressure mercury lamp through a light shielding mask. When this film was developed in water, a relief pattern could be obtained with almost no erosion of the unexposed rear part. Further, heat treatment was performed at 300 ° C. for 1 hour, and a strong relief pattern could be obtained.

(Example 2-5) The amount of [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine was changed to 0.3, 0.5, 2.0 and 3.0 equivalents of BPDA. The same examination as in Example 1 was conducted. As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

(Example 6) [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine was added to N
The same study as in Example 1 was carried out by substituting-[[(2,6-dinitrophenyl) -1-methylmethoxy] carbonyl] cyclohexylamine. As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

Example 7 [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine was added to N
-[[(2,6-dinitrophenyl) -1- (2 ',
6′-Dinitrophenyl) methoxy] carbonyl] cyclohexylamine was replaced by the same examination as in Example 1. As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

Example 8 [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine was added to N
The same examination as in Example 1 was carried out by changing to-[[(2-nitrophenyl) -1- (2'-nitrophenyl) methoxy] carbonyl] cyclohexylamine. As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

Example 9 The same examination as in Example 1 was conducted by replacing BPDA with benzophenonetetracarboxylic dianhydride. As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

Example 10 The same examination as in Example 1 was carried out by changing BPDA to pyromellitic dianhydride (PMDA). As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

Example 11 The same examination as in Example 1 was carried out by changing BPDA to pyromellitic dianhydride (PMDA) and changing PDA to oxydianiline (ODA). As a result, a relief pattern could be obtained with almost no erosion of the unexposed rear part as in Example 1.

Comparative Example 1 The same examination as in Example 1 was carried out without adding [[(2,6-dinitrobenzyl) oxy] carbonyl] cyclohexylamine.
Neither the unexposed area was eroded.

(Example 12) 3,3 ', 4,4'-biphenyltetracarboxylic dianhydride (BPDA) and an equivalent amount of p-phenylenediamine (PDA) were added to N-methyl-2-.
Reaction was carried out in pyrrolidone to obtain a polyamic acid solution having a solid content of 10% by weight. BPD was added to this polyamic acid solution.
[[(2,6-Dinitrobenzyl) oxy] equivalent to A
Carbonyl] cyclohexylamine was added to obtain a light-exposed resin composition. This photosensitive resin composition was applied on a glass substrate by a spin coating method, dried at 100 ° C., and exposed with a high pressure mercury lamp through a light shielding mask. When this film was developed with N-methyl-2-pyrrolidone, a relief pattern could be obtained with almost no erosion of the back dew part. Further, heat treatment was performed at 300 ° C. for 1 hour, and a strong relief pattern could be obtained.

Examples 13-16 The amount of [[(2,6-dinitrobenzidine) oxy] carbonyl] cyclohexylamine was changed to 0.3, 0.5, 1.50, 2.0 equivalents of BPDA. The same examination as in Example 13 was performed. As a result, it was possible to obtain a relief pattern with almost no erosion of the rear dew portion as in Example 12.

Example 17 The same experiment as in Example 1 was conducted by changing the developing solution to NMP. As a result, a relief pattern could be obtained with almost no erosion of the exposed portion.
Further, it was heat-treated at 300 ° C. for 1 hour to obtain a relief pattern having a thickness of 5 μm and a line width of 5 μm.

(Example 18) The photosensitive resin composition of Example 11 was coated and exposed on a silicon wafer on which wiring of an LSI was completed, and a buffer coat film was formed in the same manner as in Example 1. Since no organic solvent is used in the development process, the burden of exhaust equipment and solvent processing is greatly reduced. As a result of performing a soldering heat resistance test after molding the obtained LSI chip, an LSI package excellent in heat resistance without generation of bulging was obtained.

(Example 19) The developing solution was changed to NMP,
A buffer coat film was formed on the LSI in the same manner as in Example 18. At this time, the mask used was the one used in Example 18 and the one used in the negative-positive reversal. As a result of performing a soldering heat resistance test after molding the obtained LSI chip, an LSI package excellent in heat resistance without generation of bulging was obtained.

(Comparative Example 2) A buffer coat film was formed using the polyamic acid solution (containing no base generator) of Example 11, and a resist for pattern formation was OFPR8000 manufactured by Tokyo Ohkasei Co., Ltd. . Obtained LSI
As a result of soldering heat resistance test after molding the chip,
The occurrence of blisters was obtained.

Comparative Example 3 A buffer coat film was formed using Hitachi Chemical Co., Ltd. A mixed solvent of NMP and water was used as a developing solution.

[0060]

INDUSTRIAL APPLICABILITY The present invention provides a positive type photosensitive resin composition which can be easily developed with a wide range of aqueous solvents and has great industrial value.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Mina Ishida Inventor Mina Ishida 7-1-1 Omika-cho, Hitachi City, Ibaraki Hitachi Ltd. Hitachi Research Laboratory (72) Inventor Akio Takahashi 7-chome Omika-cho, Hitachi City, Ibaraki Prefecture No. 1 Hitachi Ltd. Hitachi Research Laboratory (72) Inventor Shunichi Numata 7-1 Omika-cho, Hitachi City, Ibaraki Prefecture Hitachi Ltd. Hitachi Research Laboratory

Claims (14)

[Claims] 1. A compound represented by the general formula (I): (In the formula, A is an organic group having 2 or more carbon atoms, and n is 10 to 200,000.
And R ₁ is an organic group having 1 or more carbon atoms, hydrogen, or a halogen atom. ) The carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 with respect to the total weight of the polymer represented by The base generator (b) is used in an amount of 0.2 to the above carboxyl group.
A photosensitive resin composition comprising 2.0 molar equivalents. 2. The general formula (I) is represented by the general formula (II): (In the formula, R ₁ is the same as above. R ₂ is an organic group having 2 or more carbon atoms, R ₃ is an organic group having 4 or more carbon atoms, and n is the same as above.) The photosensitive resin composition according to claim 1, which is characterized in that. 3. The base generator (b) has the general formula (III): (In the formula, R ₄ is any one of an organic group having 1 or more carbon atoms, hydrogen, and a halogen atom. P is an integer of 0 to _4. R ₅ and R ₆ are organic groups having 12 or less carbon atoms. , R ₇ is hydrogen or an organic group having 10 or less carbon atoms.), The photosensitive resin composition according to claim 1. 4. A polymer containing a carboxyl group and a compound represented by the general formula (III): (In the formula, R ₄ is any one of an organic group having 1 or more carbon atoms, hydrogen, and a halogen atom. P is an integer of 0 to _4. R ₅ and R ₆ are organic groups having 12 or less carbon atoms. , R ₇ is hydrogen or an organic group having 10 or less carbon atoms), and is a water-soluble positive-type photosensitive resin composition. 5. A compound represented by the general formula (I): (In the formula, A is an organic group having 2 or more carbon atoms, and n is 10 to 200,000.
And R ₁ is an organic group having 1 or more carbon atoms, hydrogen, or a halogen atom. ) The carboxylic acid polymer (a) having a carboxyl group ratio of 20% by weight or more and a number average molecular weight of 10,000 to 1,000,000 with respect to the total weight of the polymer represented by The base generator (b) is used in an amount of 0.2 to the above carboxyl group.
A method for forming a pattern, which comprises a step of applying a photosensitive resin composition containing 2.0 molar equivalents on a substrate and drying, a step of exposing to light through a light-shielding mask, and a step of developing in a water solvent. . 6. A composition comprising a compound having a carboxyl group and a base generator and capable of forming a pattern by electromagnetic wave irradiation. 7. The basic generator is represented by the general formula (III): (In the formula, R ₄ is any one of an organic group having 1 or more carbon atoms, hydrogen, and a halogen atom. P is an integer of 0 to _4. R ₅ and R ₆ are organic groups having 12 or less carbon atoms. , R ₇ is hydrogen or an organic group having 10 or less carbon atoms.), The composition according to claim 6. 8. A base generator is a cobalt (III) amine salt, a cobalt (III) alkylamine salt, an α-ketocarboxylic acid ammonium salt, a phenylglyoxy acid ammonium salt, 4-methylphenylsulfone amide, N-cyclohexyl-. The composition according to claim 6, wherein at least one of 4-methylphenylsulfone amide is used. 9. The composition according to claim 1, wherein the wavelength of the electromagnetic wave is 200 to 900 mm. 10. A compound represented by the general formula (I): (In the formula, A is an organic group having 2 or more carbon atoms, and n is 10 to 200,000.
And R ₁ is an organic group having 1 or more carbon atoms, hydrogen, or a halogen atom. ) The proportion of carboxyl groups is 20% by weight or more based on the total weight of the resin component containing the carboxylic acid polymer, and the number average molecular weight is 10,000 to 1,
Photosensitivity, which comprises 0.2 million to 2.0 molar equivalents of a carboxylic acid polymer (a) and a photobase generator (b) that generates a base upon irradiation of electromagnetic waves with respect to the carboxyl group. Resin composition. 11. A compound represented by the general formula (I): (In the formula, A is an organic group having 2 or more carbon atoms, and n is 10 to 200,000.
And R ₁ is an organic group having 1 or more carbon atoms, hydrogen, or a halogen atom. ) The proportion of carboxyl groups is 20% by weight or more based on the total weight of the resin component containing the carboxylic acid polymer, and the number average molecular weight is 10,000 to 1,
A photosensitive resin composition containing 0.2 million to 2.0 molar equivalents of a carboxylic acid polymer (a) and a photobase generator (b) that generates a base upon irradiation of electromagnetic waves with respect to the carboxyl group is used as a substrate. A pattern forming method, which comprises a step of coating and drying on the surface, a step of exposing to light through a light-shielding mask, and a step of developing in water. 12. (a) forming a wiring sheet having first wiring formed on a substrate, (b) forming an adhesive layer between the substrate and the wiring and on the wiring, (c) the adhesive layer A step of stacking wiring sheets on which second wirings have been formed via (d) pressing and heating the stacked wiring sheets to cure the adhesive layer and connect the first wirings and the second wirings. A method of manufacturing a multilayer printed circuit board, the method including:
The step of forming the wiring and the second wiring is performed according to the general formula (I): (In the formula, A is an organic group having 2 or more carbon atoms, and n is 10 to 200,000.
And R ₁ is an organic group having 1 or more carbon atoms, hydrogen, or a halogen atom. ) The proportion of carboxyl groups is 20% by weight or more based on the total weight of the resin component containing the carboxylic acid polymer, and the number average molecular weight is 10,000 to 1,
A photosensitive resin composition containing 0.2 million to 2.0 molar equivalents of a carboxylic acid polymer (a) and a photobase generator (b) that generates a base upon irradiation of electromagnetic waves with respect to the carboxyl group is used as a substrate. A method for producing a multilayer printed circuit board, which comprises the steps of applying the coating on the substrate and drying it, exposing it through a light-shielding mask, and developing it in a water solvent. 13. A circuit forming means in a large scale integrated circuit is represented by the general formula (I): (In the formula, A is an organic group having 2 or more carbon atoms, and n is 10 to 200,000.
And R ₁ is an organic group having 1 or more carbon atoms, hydrogen, or a halogen atom. ) The proportion of carboxyl groups is 20% by weight or more based on the total weight of the resin component containing the carboxylic acid polymer, and the number average molecular weight is 10,000 to 1,
A photosensitive resin composition containing 0.2 million to 2.0 molar equivalents of a carboxylic acid polymer (a) and a photobase generator (b) that generates a base upon irradiation of electromagnetic waves with respect to the carboxyl group is used as a substrate. A large-scale integrated circuit characterized by including the steps of coating and drying on, light exposing through a light-shielding mask, and developing in water. 14. A method for forming a liquid crystal alignment film pattern, which comprises using the composition according to claim 6.