JPH0714883A - Electronic component supply device - Google Patents

Abstract

(57) [Summary] [Purpose] Automatically detect missing parts when starting automatic operation or restarting after tape replacement, and
By passing the defective portion through the punching position, the running time of the carrier tape is shortened, and even if the defective portion is continuously present, the electronic component is punched without lowering the punching accuracy. [Structure] Pulse motor that drives carrier tape 3
17, the defect detection sensor 22 arranged along the transport path of the carrier tape 3, the perforation sensor 23 arranged near the defect detection sensor 22 for detecting the perforation hole 7, and the perforation sensor 23 detect Counter 24 that counts the number of perforated holes 7
A position information memory 26 for storing the position information of the defective portion generated by the counter 23 and the counter 24, a punching mechanism 10 for punching the IC2 mounted on the carrier tape 3, and a control unit 18 for controlling the above-mentioned units. Composed of.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component supply device mounted on a carrier tape for separating and supplying electronic components such as I (Integrated Circuit).

[0002]

2. Description of the Related Art Conventionally, in mounting an IC, a flat package type IC is generally used in which a lead frame and a bare chip of the IC are connected by a wire bonding device, and after connection, molded with a synthetic resin.

However, in recent years, as the demand for smaller, lighter and thinner electronic devices has increased, a TAB (Tape Automa) using a carrier tape instead of a lead frame has been developed.
tedBonding) implementation is being used. In particular, the mounting of ICs for driving LCDs (Liquid Crystal Displays) has become extremely popular. With the spread of this TAB mounting, mounting devices for mounting ICs on carrier tapes, so-called ILB (Inner Lead Bonding) devices, and mounting devices for mounting carrier tapes after inner lead bonding, so-called OLB (Outer Lead Bonding) devices, have become available. Developed and commercially available. Since the above-mentioned mounting device requires handling of the carrier tape, a mechanical part such as a part for storing the tape, a part for transporting the tape, a part for applying tension to the tape for stable running of the tape, and a part for winding the tape. Is equipped with.

On the other hand, as the packaging density increases, the number of IC pins increases, and the leads to be connected have a narrow pitch. For this reason, the yield of the carrier tape is also reduced, and it is unavoidable to use a tape having many defective portions, in which the IC mounted on the component mounting portion is determined to be a defective IC. Since the defective part is usually punched in advance, it is mounted on the carrier tape.
The device that separates and supplies C determines the defective portion with a sensor while the tape is running, and I is mounted on the IC mounting portion.
Only C is punched by stopping at a predetermined punching part. That is, in the tape punching portion, the carrier tape is passed between the upper die and the lower die, the IC is punched after positioning the IC so that the IC is located at the punching position. For this reason, a defect detection sensor is arranged several pitches before the punching position, and the punch hole is detected when the carrier tape is stopped in synchronization with the punching operation. Since the detection position and the punching position do not coincide with each other in this manner, the detection result is stored in the storage device, and the punching hole is controlled not to be punched when the defective portion reaches the punching position.

[0005]

However, in the above-mentioned device for separating and supplying the IC mounted on the carrier tape, the IC is positioned at the punching position when starting the automatic operation or restarting after the tape exchange. Since it is not possible to determine whether the IC is mounted or the defective portion is located, it is necessary to make arrangements and preparatory work such as setting the mounted IC to be located at the punching position and starting it. Therefore, there is a problem that a work error may occur when the punched hole at the defective portion is small and difficult to see.

Further, even when the defective portion reaches the punching position, since the defect detection sensor detects the punch hole, it is necessary to stop the running of the carrier tape. Therefore, when the defective portion becomes large, the parts are supplied. In this case, the IC punching and the subsequent IC defect detection are performed with the carrier tape running stopped, so that when the pitch of the ICs mounted on the carrier tape is different, There is a problem in that adjustment time is required to adjust the position of the defect detection sensor, which leads to a reduction in productivity of the device.

Further, there are a plurality of consecutive defective portions,
If the IC to be punched next cannot be found at the time when the punching of the IC is completed, the tape feeding amount to the IC to be punched next cannot be determined by the above apparatus. Therefore, when an IC to be punched next while the carrier tape is being fed is found, the tape feeding is stopped when the IC reaches the punching position to deal with a plurality of consecutive defective portions. Generally, a pulse motor is used as the tape feed motor, but when the pulse motor is used in such a tape feed stop system, the accuracy of the carrier tape stop position is deteriorated, and the IC punching accuracy may be reduced. There was a problem.

The present invention has been made in view of the above circumstances, and provides an electronic component supply apparatus for automatically detecting a defective portion at the time of starting automatic operation or restarting after tape exchange, thereby preventing a work error. The purpose is to provide.

It is another object of the present invention to provide an electronic component supply apparatus which shortens the running time of the carrier tape and improves the productivity of the apparatus by skipping the punching position at the detected defective portion. .

A further object of the present invention is to provide an electronic component supply device for punching an electronic component without lowering the punching accuracy even if there are a plurality of defective portions.

[0011]

In order to achieve the above-mentioned object, the present invention is an electronic component supply device for separating and supplying electronic components mounted on a component mounting portion of a carrier tape, in which the carrier tape is driven and driven. Drive means for driving the carrier tape, loss detecting means for detecting a defective portion where the electronic component is not mounted on the carrier tape, the driving means being provided along the transport path for transporting the carrier tape, and the transport driving by the driving means. The position detection means for detecting the position state of the carrier tape, and the defect detection so as to detect the defective portion of the carrier tape without stopping the conveyance of the carrier tape based on the detection result of the position detection means. And a control means for controlling the means.

Further, according to the present invention, in an electronic component supplying device for separating and supplying electronic components mounted on a component mounting portion of a carrier tape, a driving means for conveying and driving the carrier tape in forward and reverse directions, and this driving means. Is disposed along a transport path for transporting the carrier tape, and is provided in the vicinity of the loss detection means for detecting a loss location where an electronic component is not mounted on the component mounting portion of the carrier tape. Position information generating means for detecting the perforation hole formed at the end portion of the carrier tape and generating position information of the defective portion detected by the defect detecting means according to the type of the carrier tape, and this position. Memory means for storing the position information of the defective portion generated by the information generating means, and the driving means arranged downstream of the loss detecting means. Punching means for punching out the electronic components mounted on the carrier tape when the conveyance drive by the step is stopped, and the component mounting portion located on the punching means at the time of starting the automatic operation or restarting after the carrier tape is exchanged. Is reversely fed to a position where it can be detected by the defect detection means, and then the drive means is controlled so as to be forwardly fed by an amount fed backwardly. And a control means for controlling the loss detecting means so as to store the position information of the detected loss portion in the memory means.

Further, according to the present invention, in an electronic component supply device for separating and supplying electronic components mounted on a carrier tape, a driving means for conveying and driving the carrier tape, and a conveying means for conveying the carrier tape by the driving means. Defect detecting means arranged along a path for detecting a defective portion where the electronic component is not mounted on the carrier tape, and perforation formed near an edge of the carrier tape and formed at an end portion of the carrier tape. Position information generating means for detecting the hole and generating position information of the defective portion detected by the loss detecting means according to the type of the carrier tape, and the position of the defective portion generated by the position information generating means. A memory means for storing information and a storage means arranged downstream of the loss detection means when the transport drive by the drive means is stopped. The punching means for punching the electronic component mounted on the tape and the position information of the defective portion detected by the loss detecting means stored in the memory means stop the defective portion on the punching means. Control means for controlling the drive means so as to pass without passing through the punching means, and controlling the loss detecting means so as to detect the loss portion of the carrier tape when the loss portion passes through the punching means. Is characterized by.

Further, according to the present invention, in an electronic component supplying device for separating and supplying electronic components mounted on a carrier tape, a drive means for conveying and driving the carrier tape,
The drive means is disposed along the transport path for transporting the carrier tape, and the loss detection means for detecting a loss location where no electronic component is mounted on the carrier tape, and the loss detection means disposed near the loss detection means are provided. Position information generating means for detecting the perforation hole formed at the end portion of the carrier tape and generating position information of the defective portion detected by the defect detecting means according to the type of the carrier tape, and the positional information. A memory means for storing the position information of the defective portion generated by the generating means, and an electronic component mounted on the carrier tape when the conveyance drive is stopped by the driving means arranged downstream of the loss detecting means. After the punching means and the electronic component is punched by the punching means, at least between the defect detecting means and the punching means. When the detecting means detects that there are a plurality of defective portions on the carrier tape, a drive amount corresponding to the distance between the defective detecting means and the punching means is set and the carrier tape is set to the driving means. And a control means for repeatedly performing the control for causing the loss detection means to detect a loss portion while the drive means and the loss detection means are repeatedly executed until the loss detection means detects the electronic component. To do.

[0015]

Since the present invention is constituted as described above, the carrier tape transport time is controlled by controlling the defect detection means so that the controller detects the defective portion of the carrier tape without stopping the carrier tape transport. Can be reduced and the tact time can be shortened.

Further, according to the present invention, as an initial operation, the component mounting portion located in the punching means is reversely fed to a position where it can be detected by the defect detecting means, and then forwardly fed by an amount which is reversely fed. By detecting the defective portion by the detecting means, the defective portion existing in the downstream of the defective detecting means is automatically grasped at the initial stage, and the operator does not need to operate it, so that the carrier tape can be prevented from being set incorrectly.

Further, according to the present invention, the defect detecting section detects the defective section at the same time as the defective section is allowed to pass through the punching section without stopping based on the position information of the defective section stored in the memory means. The passing operation of passing the defective portion through the punching means and the operation of detecting the defective portion by the loss detecting means are performed in parallel, so that it is possible to reduce the wasteful time when the carrier tape is conveyed, and the tact time can be shortened.

Further, according to the present invention, when there are a plurality of defective portions on the carrier tape between at least the defect detecting means and the punching means, the drive amount corresponding to the distance between the defect detecting means and the punching means is determined. By repeating the operation of feeding the carrier tape to the drive means and causing the defect detecting means to detect the defective portion, it is possible to prevent the tape feeding accuracy from decreasing, and to minimize the increase in the takt time.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view of an electronic component supply apparatus according to an embodiment of the present invention, FIG. 2 is a schematic circuit diagram of the same, FIG. 3 is a view showing a carrier tape in an initial state, and FIG. 4 is a carrier in a normal carrying state. FIG. 5 is a diagram showing a tape, FIG. 5 is a diagram showing a carrier tape in which defective portions are continuous, FIG. 6 is a flow chart showing an operation in an initial state, FIG. 7 is a flow chart showing an operation during normal conveyance, and FIG. It is a flow chart which shows operation at the time of a state where a defective part continues. Hereinafter, an example in which the present invention is applied to an OLB device will be described.

In the above figure, 1 is an electronic component, for example I
A supply reel around which a carrier tape 3 having a C chip (hereinafter referred to as an IC) 2 mounted thereon and a spacer tape 4 attached to the back surface of the carrier tape 3 are wound, and the supply reel 1 is attached. The carrier tape 3 and the spacer tape 4 are fed out in sequence. The carrier tape 3 and the spacer tape 4 fed from the supply reel 1 are horizontally separated by a first tension roller 5 and then separated and separated.

The separated carrier tape 2 is vertically tensioned by a second tension roller 6 and then engaged with perforation holes 7 formed on both sides of the carrier tape 5 to cause the carrier tape 2 to come into contact with the carrier tape 5. It is wound around the rear sprocket wheel 8 that restricts the position of 3 in the width direction. Further, the carrier tape 2 passes through a punching mechanism 10 which will be described later installed on the base 9, and then is arranged at the same height position as the rear sprocket wheel 8. It is wound around a front sprocket wheel 11 that engages with the formed perforation holes 7 and feeds the carrier tape 3 by a predetermined length. The punched tape 3a from which the IC2 has been punched by the punching mechanism 10 is wound on the punched tape take-up reel 12 via the front sprocket wheel 11.
In this way, the carrier tape 3 fed from the supply reel 1 is wound in order of the first tension roller 5, the second tension roller 6, the rear sprocket wheel 8, and the front sprocket wheel 11, and the punching mechanism 10 The punched tape 3a punched by is wound on the punched tape take-up reel 12. On the other hand, the spacer tape 4 separated from the carrier tape 3 is taken up by the spacer tape take-up reel 13.

The punching mechanism 10 installed along the traveling path of the carrier tape 3 located between the rear sprocket wheel 8 and the front sprocket wheel 11 includes upper and lower metal plates arranged above and below the traveling path. The mold 14 is composed of a mold 14 and a lower mold 15. The upper mold 14 is moved up and down by an air cylinder 16 to punch the IC2 mounted on the carrier tape 3 into a predetermined shape.

The front sprocket wheel 11 is attached to a rotating shaft of a pulse motor 17 capable of rotating in the forward and reverse directions, rotates in accordance with the rotation of the pulse motor 17, and drives the wound carrier tape 3 to run. The pulse motor 17 has a controller 18
The rotation amount, that is, the rotation position of the front sprocket wheel 11 is detected by the encoder 19 attached to the pulse motor 17 and input to the control unit 18. When the rotation amount of the pulse motor 17 reaches the control rotation amount, the control unit 18 stops the rotation of the pulse motor 17 and stops the running of the carrier tape 3. That is, since the encoder 17 detects the amount of travel of the carrier tape 3, that is, the position state, the pulse motor 17 and the encoder 19 constitute the tape drive mechanism 20 to drive the carrier tape 3 intermittently. 3 repeats running and stopping. Punching mechanism when carrier tape 3 is stopped
10 is controlled by the control unit 18, and the carrier tape 3 to IC2
Execute the punching operation.

On the carrier tape 3, a component mounting portion is set for every 75 perforation holes. The IC 2 is mounted on this component mounting portion and at the same time as the mounting density is increased in the previous process. The defective IC 21 is judged to be defective due to a defective connection between the IC 2 and the carrier tape 3, and a defective portion 21 punched out is formed. The defect portion 21 is detected by a defect detection sensor 22 arranged in front of the punching mechanism 10 along the traveling path of the carrier tape 3. This defect detection sensor 22
As shown in FIGS. 3 to 5, it is a transmissive sensor composed of a light emitting portion 22a and a light receiving portion 22b which are arranged above and below the traveling road, and in the vicinity of the defect detection sensor 22, Consists of a light emitting part 23a and a light receiving part 23b.
Are arranged.

The perforation sensor 23 is provided to detect the tape feed amount of the carrier tape 3 by the pulse motor 18 by detecting the perforation hole 7. The ON / OFF signal of the perforation sensor 23 is a counter. Output to 24. The counter 24 counts the number of times the perforation sensor 23 is turned ON / OFF, and the count value is output to the control unit 18. Also applicable carrier tape
3 is a numerical value indicating how many component mounting parts are set for each perforation hole 7, a numerical value indicating the number of ICs 2 mounted on the carrier tape 3, or the carrier tape 3
Numerical values indicating the number of defective portions 21 formed in the are created in the previous process, and these various numerical values are stored in advance in the part data memory 25 as the part data, and the parts stored in the part data memory 25 are stored. Data is control part
Output to 18.

The control unit 18 determines the detection timing of the defective portion 21 formed on the carrier tape 3 based on the information input from the counter 24 and the part data input from the part data memory 25, and the detection determination thereof. The signal is output to the defect detection sensor 22. The defect detection sensor 22 detects the defect portion 21 in accordance with this detection determination signal, and stores the detection result in the position information memory 26 as position information. Based on the detection result of the defective portion 21 stored in the position information memory 26, the control unit 18 causes the punching mechanism 10 to detect the IC2.
The tape feed amount of the carrier tape 3 after punching is calculated, and the tape drive mechanism 20 is controlled so as to feed the carrier tape 3 without stopping until the next IC2 reaches the punching position of the punching mechanism 10. Further, the relationship between the punching position of the punching mechanism 10 and the position of the defect detection sensor 22 depends on the control unit.
The IC2 or the defective portion 21 reaches the punching position of the punching mechanism 10 at the timing of detecting the defective portion 21 by the detection determination signal input from 18, that is, when the defective portion 21 reaches the position of the defective detection sensor 22. When the IC2 reaches the punching position, the tape drive mechanism 20 stops the carrier tape 3 and the IC2 is punched.

Incidentally, the method of determining the detection time of the defective portion 21 is a simple method depending on the electronic component supplying device, and an encoder for detecting the running amount (positional state) of the carrier tape 3 instead of the output from the counter 24 is used. It is also possible to make a decision based on the output of 19 and the part data from the part data memory 25.

Next, the operation of the embodiment of the present invention having the above construction will be described.

First, the operation at the time of initial processing will be described with reference to FIGS. 3 and 6.

The leader tape portion formed on the leading portion of the carrier tape 3 is unwound from the supply reel 1 and
Tension roller 5 and second tension roller 6
Then, the rear sprocket 8 and the front sprocket 11 are wound in this order and wound on the take-up reel 12. At this time,
As shown in FIG. 3, the component mounting portion that first appears on the carrier tape 3, that is, the IC 2a in the example of FIG. 3, is set at the punching position of the punching mechanism 10.

The position where the defect detection of the first component mounting portion (IC2a) on the carrier tape 3 set at the punching position of the punching mechanism 10 as described above can be detected, that is, the position where the defect detection sensor 22 is provided. The tape drive mechanism 20 starts the backward feeding of the carrier tape 3 under the control of the controller 18, and stops the backward feeding of the carrier tape 3 when the first component mounting portion (IC2a) reaches the position where the defect can be detected. To do. In this embodiment, the perforation holes 7 are 5
Since the component mounting section is set for each piece, in the example of FIG. 3, the counter 24 is fed backward until the counter 24 counts 15 perforation holes 7 based on the detection result of the perforation sensor 23. (Step S1).

When the carrier tape 3 is fed backward and the first component mounting portion (IC2a) reaches the position where the defect can be detected, the control unit 18 outputs a detection determination signal to the defect detection sensor 22 and the defect detection sensor 22. Is the first component mounting part (I
The defect detection for C2a) is performed, and the detection result is stored in the position information memory 26. (Step S2).

After the defect detection for the first IC2a, the carrier tape 3 is forwardly fed by the amount of the backward feeding and the first IC is fed.
In order to return 2a to the punching position of the punching mechanism 10, the tape drive mechanism 20 is controlled by the control device 18 to have 15 perforation holes.
The tape is controlled to be forwarded for 7 minutes and the tape forward feed is started. (Step S3).

When the normal feeding of the tape is started, the perforation hole 7 is detected by the perforation sensor 23, and the counter 24 counts the number. When the value of the counter 24 becomes “5” or a multiple of “5”, the control unit 18 instructs the defect detection sensor 22 to make a detection decision, the defect detection is performed according to this instruction, and the detection result is the position information memory 26.
Memorized in. (Step S4).

When the defect detection by the defect detection sensor 22 is completed, it is determined whether or not the normal feeding of the tape is completed and the carrier tape 3 is stopped. In the example of FIG. 3, this determination is made by the control unit 18 checking whether or not the number of 15 perforation holes 7 is counted by the counter 24. If the result of this determination is that the carrier tape 3 has not stopped, the operation returns to step S4, and the same processing is repeated. The position information memory 26 stores the status of the presence / absence of the defect portion 21 up to the component mounting portion located upstream of the component mounting portion located in the defect detection sensor 22, that is, the first IC 2a, Initial processing is completed. (Step S5).

As mentioned above, the worker is the carrier tape.
All you have to do is set 3 on the device and press the start button.
A mistake in setting the carrier tape can be prevented.

When the initial processing is completed as described above, IC2
The normal feeding operation is repeated, in which the punching, the detection of the defective portion 21, and the intermittent feeding of the carrier tape 3 are repeated.

Next, the normal operation processing will be described with reference to FIGS. 4 and 7.

Now, assuming that the shaded IC 2b in FIG. 4 has reached the punching position of the punching mechanism 10, the carrier tape 3 fed by the tape is stopped and the punching mechanism 10 is activated to operate the IC 2b. Punch out. (Step S10).

When the punching of the IC 2b is completed, the control unit 18
Calculates the tape feed amount of the carrier tape 3 up to the next IC2 to be punched based on the position information of the defective portion 21 stored in the position information memory 26, and controls the rotation amount according to the calculated tape feed amount. Then, the pulse motor 17 of the tape drive mechanism 20 is activated to start tape feeding. In the example shown in FIG. 4, since IC2 is present in the component mounting portion next to the punched IC2b, it is sufficient to feed the tape by the number of 5 perforation holes 7. (Step S11, Step S12
).

When the tape feeding is started, the counter is determined by determining whether the perforation sensor 23 is OFF or ON.
24 counts the number of perforation holes 7. Based on the count value of the counter 24, the control unit 18 determines whether or not the next component mounting portion has reached the loss detection position by the loss detection sensor 22. Ie counter 24
When the count value of is not “5” or a multiple of “5”, it is determined that the next component mounting portion has not reached the defect detection position, the above counting operation by the counter 24 is repeated, and the counting of the counter 24 is repeated. When the numerical value is “5” or a multiple of “5”, it is determined that the next component mounting portion has reached the defect detection position, and the defect detection sensor 22
The defect detection is performed by, and the detection result is stored in the position information memory 26. In the defect detection by the defect detection sensor 22, the defect detection timing is determined by the control unit 18 without stopping the conveyance of the carrier tape 3, and the defect detection is performed. (Step S13, Step S14,
Steps S15 and S16).

When the loss detection by the loss detection sensor 22 is completed, it is determined whether or not the loss detection is continuously performed. This determination is made by the tape feed amount calculated by the control unit 18 and the perforation hole 7 by the counter 24. It is performed based on the count value of. That is, in step S11, since the feeding amount of the carrier tape 3 from the punched IC2 to the next punched IC2 is calculated, if there is a defective portion 21 between them, the defective portion 21 is By passing through the punching mechanism 10, it is necessary to continuously detect the loss of an undetected component mounting portion that passes through the loss detection sensor 22 at the timing of this passage, and as shown in FIG. If there is an IC2 at, or if the last defect that exists during tape feed passes, then continuous defect detection is not required. Therefore, continuous defect detection is determined by whether or not there is a defective portion 21 that passes during tape feeding.

When the control unit 18 determines that continuous loss detection is necessary, the process returns to step S13 and step S13.
Through step S16 are repeated, and when it is determined that it is unnecessary, the process proceeds to the next step S18. (Step
S17).

In step S18, the pulse motor 17 for feeding the tape waits until it stops, and the pulse motor 17
When the 17 stops, the control unit 18
With reference to the contents of 25, it is determined whether or not the IC2 to be punched is still present on the carrier tape 3, and as shown in FIG. 4, when the IC2 to be punched is present, the operation is performed. Returning to step S10, the above-mentioned operation is repeated. When it is determined that there is no IC2 to be punched out, the normal operation processing ends, the punching operation of IC2 is completed, and a new carrier tape 3 is loaded into the apparatus.

As described above, when the carrier tape 3 is conveyed and the defective portion 21 exists, even if the defective portion 21 reaches the punching position, the carrier tape 3 is fed without stopping at the punching position. Wasted time is reduced, and takt time can be shortened.

By the way, as shown in FIG. 5, after the shaded IC 2c reaching the punching position, there are consecutive defective portions.
If 21 is present and there is no IC2 to be punched next to the defect detection sensor 22, the following processing is required, and the processing will be described with reference to FIGS. 5 and 8.

Similar to step S10, when the IC 2c reaches the punching position of the punching mechanism 10, the carrier tape 3 fed by the tape is stopped and the punching mechanism 10 is operated to operate I
Punch C2c. (Step S20).

When the punching of the IC2c is completed, the control unit 18
Is based on the position information of the defective portion 21 stored in the position information memory 26, the defect detection sensor 22 from the punching position.
It is determined whether or not there is an IC2 to be punched next by the time. If it is determined that it exists, step S2 described later.
The operation from 5 onward is executed, and when it is determined that the operation does not exist, the process proceeds to the next step S22. (Step S2
1).

In step S22, in order to detect the defect position existing farthest from the punching position or the defect detection sensor 22, the control unit 18 feeds the tape corresponding to the distance from the punching position to the defect detection sensor 22. The amount, that is, in the example of FIG. 5, the feed amount for 15 perforation holes 7 is set, and the pulse motor of the tape drive mechanism 20 is set.
Drive 17 to start tape feeding. In this way, the method of presetting the tape feed amount can improve the tape stopping accuracy as compared with the method of randomly stopping the tape feeding when the next IC2 is detected. (Step S22).

When the tape feeding is started, the number of perforation holes 7 is counted and the counter 24 is counted while discriminating whether the perforation sensor 23 is OFF or ON, as in the operations from step S13 to step S16 in FIG. When the numerical value is not "5" or a multiple of "5", the counting operation is repeated. When the counted value of the counter 24 is "5" or a multiple of "5", the next component mounting portion is located at the defect detection position. When it is determined that it has arrived, the loss detection sensor 22 detects the loss and stores the detection result in the position information memory 26. This operation is repeated during the tape feeding set by the controller 18. When the tape feed of the set amount by the control unit 18 is completed, that is, when the feed amount of 15 perforation holes 7 is completed in the example of FIG.
Stops the drive of the pulse motor 17 and the carrier tape
Stop 3. After stopping, the operation returns to step 21.
(Step S23, Step S24).

Returning to step 21, it is judged whether or not the next IC2 is present during the tape feeding, that is, a continuous defective portion in the new component mounting portion existing between the punching position and the defect detection position. It is determined whether 21 has not been interrupted. As a result of the determination, when the defective portion 21 is continuous without being interrupted, the operations from the above steps S22 to S23 are repeated until the interruption of the defective portion 21 is detected,
Further, when it is determined that the defective portion 21 is interrupted and the next IC2 exists, the defective portion 21 farthest from the punching position or the defect detection sensor 22 exists in the component mounting portion immediately before IC2. That is, the operation proceeds to step S25 and the subsequent steps.

In step S25, as in step S11 of FIG. 7, the defective portion 21 stored in the position information memory 26 is deleted.
The tape feed amount of the carrier tape 3 up to the next IC2 to be punched is calculated based on the position information of, and the tape drive is performed by controlling the rotation amount according to the calculated tape feed amount as in step S12 of FIG. The pulse motor 17 of the mechanism 20 is activated to start tape feeding. (Step S25,
Step S26).

When the tape feeding is started, the description is simplified by the two steps of step S27 and step S28, but the same processing as the processing from step S13 to step S18 in FIG. 7 is executed, and then punching is performed. IC2 punching mechanism 10
The defect is detected by the defect detection sensor 22 until the punching position is reached. When the IC2 to be punched reaches the punching position, the tape feeding is stopped and the processing in the case where the defective portions 21 are continuously present is completed. (Step S27, Step S28).

When the above process is completed, the punching of IC2 in step S10 or step S20 is executed.

Although the present invention is applied to the OLB device in the above embodiment, the present invention is not limited to this.
It is needless to say that the present invention can be applied to a device such as the B device which requires the detection of a defect using the carrier tape 3.

Further, in the above embodiment, the defective portion 21 is a punch hole, but it is not limited to this and may be a marking. In this case, the defective detection sensor 22 may be a reflective sensor.

In the above embodiment, the carrier tape 3
Although the electronic component mounted on the IC2 is IC2, the invention is not limited to this, and an electronic component such as a resistor or a capacitor may be mounted, and the present invention can be applied to all chip components.

Further, the present invention is not limited to the above embodiments, and it goes without saying that various modifications can be made without departing from the gist of the present invention.

[0060]

As described above in detail, according to the electronic component supplying apparatus of the present invention, the carrier tape transport time is reduced by detecting the defective portion of the carrier tape without stopping the transport of the carrier tape. Therefore, the tact time can be shortened.

Further, according to the present invention, as an initial operation, the component mounting portion located in the punching means is reversely fed to a position where it can be detected by the defect detection means, and then forwardly fed by the amount of the reverse feed, during which the defect is generated. By detecting the defective portion by the detecting means, it becomes possible to automatically grasp the defective portion existing downstream of the defective detecting means at the initial stage, and the operator does not need to operate it. It can be prevented.

According to the present invention, the defect detecting section detects the defective section at the same time as the defective section is allowed to pass through the punching section without stopping based on the position information of the defective section stored in the memory section. Since the passing operation of passing the defective portion through the punching means and the operation of detecting the defective portion by the loss detecting means are performed in parallel, wasteful time when the carrier tape is conveyed can be reduced and the takt time can be shortened.

Further, according to the present invention, when there are a plurality of defective portions on the carrier tape between the defect detecting means and the punching means, the driving amount corresponding to the distance between the defect detecting means and the punching means is determined. Since the operation of feeding the carrier tape to the drive unit and the operation of detecting the defective portion by the defective detection unit are repeated, it is possible to prevent the tape feeding accuracy from decreasing and to minimize the increase in the takt time.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component supply device according to an embodiment of the present invention.

FIG. 2 is a schematic circuit diagram of an electronic component supply device according to an embodiment of the present invention.

FIG. 3 is a diagram showing a carrier tape in an initial state.

FIG. 4 is a diagram showing a carrier tape in a normal carrying state.

FIG. 5 is a diagram showing a carrier tape in which defective portions are continuous.

FIG. 6 is a flowchart showing an operation in an initial state.

FIG. 7 is a flowchart showing an operation during normal conveyance.

FIG. 8 is a flowchart showing an operation in a state where the defective portions are continuous.

[Explanation of symbols]

2 ... IC (electronic component) 3 ... Carrier tape 10 ... Punching mechanism (punching means) 17 ... Pulse motor (driving means) 18 ... Control part (controlling means) 19 ... Encoder (position detecting means) 22 ... Loss detection sensor (loss) Detecting means 23 ... Perforation sensor (position detecting means, position information generating means) 24 ... Counter (position detecting means, position information generating means) 26 ... Position information memory (memory means) 21 ... Signal processing device (signal processing means)

Claims (4)

[Claims] 1. An electronic component supply device for separating and supplying electronic components mounted on a component mounting portion of a carrier tape,
Driving means for conveying and driving the carrier tape, and loss detecting means for detecting a defective portion where electronic parts are not mounted on the carrier tape, the driving means being arranged along a conveying path for conveying the carrier tape, Position detecting means for detecting the position state of the carrier tape which is conveyed and driven by the driving means, and a defective portion of the carrier tape is detected based on the detection result of the position detecting means without stopping the conveyance of the carrier tape. And a control means for controlling the defect detection means. 2. An electronic component supply device for separating and supplying electronic components mounted on a component mounting portion of a carrier tape, and driving means for conveying and driving the carrier tape in forward and backward directions, and the driving means. Loss detection means for detecting a loss location where an electronic component is not mounted on the component mounting portion of the carrier tape, which is disposed along the transport path for transporting the carrier tape, and the carrier tape disposed near the loss detection means. Position information generating means for detecting the perforation hole formed at the end and generating position information of the defective portion detected by the defect detecting means according to the type of the carrier tape, and the position information generating means. Memory means for storing the generated position information of the defect portion, and conveyance driving by the driving means arranged downstream of the defect detecting means. The punching means for punching out the electronic components mounted on the carrier tape when the movement is stopped, and the component mounting portion located on the punching means when the automatic operation is started or the restart is performed after the carrier tape is replaced. The carrier means is reversely fed to a position where it can be detected by the detecting means, and then the driving means is controlled so as to be forwardly fed by the amount fed backwardly. An electronic component supply device, comprising: a control unit that controls the defect detection unit to store the detected position information of the detected defect position in the memory unit. 3. An electronic component supply device for separating and supplying electronic components mounted on a carrier tape, wherein a drive means for conveying and driving the carrier tape, and a conveying path along which the drive means conveys the carrier tape. Detecting a defect detecting means arranged to detect a defective portion where no electronic component is mounted on the carrier tape, and a perforation hole formed at an end portion of the carrier tape arranged near the defect detecting means. And position information generating means for generating position information of the defective portion detected by the loss detecting means according to the type of the carrier tape, and position information of the defective portion generated by the position information generating means. Mounted on the carrier tape when the conveying means is arranged downstream of the memory means and the loss detecting means and is stopped by the driving means. Punching means for punching out the electronic parts and the position information of the defective portion detected by the loss detecting means stored in the memory means, and the defective portion passes through the punching means without stopping. And a control means for controlling the drive means so as to control the defect detecting means so as to detect the defective portion of the carrier tape when the defective portion passes through the punching means. Electronic component supply device. 4. An electronic component supply device for separating and supplying electronic components mounted on a carrier tape, wherein a drive means for conveying and driving the carrier tape, and a conveying path along which the drive means conveys the carrier tape. Detecting a defect detecting means arranged to detect a defective portion where no electronic component is mounted on the carrier tape, and a perforation hole formed at an end portion of the carrier tape arranged near the defect detecting means. And position information generating means for generating position information of the defective portion detected by the loss detecting means according to the type of the carrier tape, and position information of the defective portion generated by the position information generating means. Mounted on the carrier tape when the conveying means is arranged downstream of the memory means and the loss detecting means and is stopped by the driving means. It is preferable that there are a plurality of deficient portions in the carrier tape between at least the deficiency detecting means and the puncturing means after punching means for punching out the electronic component being punched and after punching the electronic component by the punching means. When detected by the detection means, a drive amount corresponding to the distance between the defect detection means and the punching means is determined to cause the drive means to convey the carrier tape and the defect detection means to detect a defective portion. An electronic component supply apparatus comprising: a control unit that repeatedly executes control until the loss detection unit detects the electronic component, and the control unit repeatedly executes the loss detection unit.