JPH0717150Y2 - Bonding device - Google Patents

Description

[Detailed Description of the Invention] [Outline] A board mounting base on which a board on which a large number of electrodes are formed is mounted,
The present invention relates to a bonding apparatus including an insulating film mounting base on which an insulating film having a large number of leads connected to each of a large number of electrodes is mounted, and a tool for connecting the leads to the electrodes. The purpose is to prevent the insulating film from catching on the positioning pins of the insulating film mounting base when the insulating film mounting base is lowered by connecting with the leads of the film, and the connecting portion of the lead projects sideways. Each of the pair of through holes provided in the insulating film is fitted to the insulating film mounting surface of the insulating film mounting base that is lowered after the insulating film is mounted and the connecting portion is connected to the electrode. A pair of pins that fit together and an intake hole that fixes the insulating film in a state where the pair of through holes are fitted to the pair of pins are provided, and the through holes are fitted to the root. That the pair of pins, constitutes characterized by comprising been continuously formed thinner than the insulating film mounting surface.

[Industrial application field]

The present invention relates to a bonding device using a TAB (Tape Autmated Bonding) method, and more particularly to a structure of an insulating film mounting base on which an insulating film having a large number of leads is mounted.

[Conventional technology]

 FIG. 4 is an explanatory diagram of a connection example by the TAB method.

In FIG. 4, a large number of leads 2 are formed on the lower surface of the insulating film 1, and a large number of strip-shaped electrodes 4 are formed on the upper surface of the liquid crystal panel (substrate) 3. The opposing leads 2 and electrodes 4 are The bumps 5 formed in 2 and the portions pressed by the bumps 5 are electrically connected by the anisotropic conductive layer 6 that becomes conductive.

FIG. 5 is a schematic side view showing the main part of a conventional bonding apparatus, and FIG. 6 is a plan view of the insulating film shown in FIG.

In FIG. 5, a large number of leads 2 formed on the insulating film 1 and a large number of electrodes 4 formed on the liquid crystal panel (substrate) 3 are covered by the bumps 5 and the panel 3 formed on the connecting portions of the leads 2. The bonding device for electrically connecting with the attached anisotropic conductive layer 6 includes an insulating film mounting base 7 on which the insulating film 1 is mounted, a substrate mounting base 8 on which the panel 3 is mounted,
It has a bonding tool 9 for simultaneously connecting a large number of opposing leads 2 and electrodes 4, and a detector (camera) 10 for detecting the alignment between the leads 2 and electrodes 4.

A pair of pins are mounted on the surface (top surface) of the mounting base 7 where the insulating film is mounted.
11 are planted and a large number of leads 2 are provided as shown in FIG.
The insulating film 1 having the pair of through holes 12 formed therein is positioned by fitting the pair of through holes 12 into the pins 11.

The panel 3 is mounted on the upper surface of the mounting base 8 that faces the camera 10 and the glass 13 is fitted therein, and the panel 3 positioned by the positioning means (not shown) is fixed to the mounting base 8 by the fixture 14.

In FIG. 6, the liquid crystal panel driving IC 15 is mounted at the center of the insulating film 1, and the inner end of the lead 2 is at the IC 15
The lead 16 whose inner end is connected to IC15.
Is connected to an external circuit (not shown).

In the bonding apparatus shown in FIG. 5, the mounting table 7 can be moved at least up and down, the bonding tool 9 can be heated to an appropriate temperature and can be moved up and down, the mounting table 8 can be moved in the left-right direction, and the panel 3 can be moved. When the connecting portion (bump 5) of the insulating film 1 protruding to the right of the mounting base 7 is pressed toward the panel 3 by the bonding tool 9 with an appropriate pressing force, the lead 2 and the bump 5 are connected to each other. It is electrically connected as shown in FIG. 4, and the connection is maintained by the hardening of the anisotropic conductive layer 6.

[Problems to be solved by the device]

In the conventional bonding apparatus, the mounting base 7 is the lead 2
After connecting the bumps 5 to the bumps 5, the bumps 5 move downward and become separated from the insulating film 1. However, as shown in FIG. 5, the conventional pin 11 has a straight portion with a constant diameter at the root portion into which the through hole 12 is fitted.

Therefore, when the lead 2 and the bump 5 are connected and the mounting table 7 is moved down, the through hole 12 may be caught by the pin 11 and the insulating film 1 may be pulled down. There was a problem that the connection might be broken.

[Means for Solving the Problems]

The present invention aimed at solving the above-mentioned problems is based on FIG. 1 showing an embodiment of the present invention, and a substrate 3 having a large number of electrodes 4 formed thereon.
Insulating film 1 on which a substrate mounting base 8 on which is mounted and a large number of leads 2 connected to a large number of electrodes 4 are formed
Insulating film mounting base 21 for mounting, and lead 2 for electrode 4
Insulation of the insulating film mounting base 21 that mounts the insulating film 1 so that the connecting portion of the lead 2 protrudes to the side and connects the connecting portion to the electrode 4 and then descends. On the film mounting surface, the pair of pins 22 into which the pair of through holes 12 provided in the insulating film 1 are fitted respectively, and the pair of through holes 12 in the pair of pins 22 are fitted with the insulating film 1 The bonding apparatus is characterized in that an intake hole (23) to be fixed is provided, and a pair of pins (22) into which the through hole (12) fits is formed to be continuously thinner than the insulating film mounting surface.

[Action]

According to the above means, the through hole of the insulating film is fitted up to the root on the insulating film mounting surface of the insulating film mounting table on which the insulating film is mounted so that the connecting portions of the leads formed on the insulating film protrude laterally. Since a pair of pins that are continuously thinner than the mounting surface and an air intake hole that adsorbs the insulating film are provided, the leads are connected to the electrodes on the substrate, and then the adsorption of the insulating film is released and insulation is performed. If the film and the mounting base are moved down, the insulating film separates without being caught by the pins due to the lowering, so that the destruction of the connection part between the substrate electrode and the lead due to the lowering of the insulating film mounting base can be eliminated. it can.

〔Example〕

A bonding apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic side view showing an essential part of a bonding apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of an insulating film mounting base shown in FIG. 1, and FIG. 3 is a bonding apparatus shown in FIG. FIG. 4 is an explanatory view of the operation of FIG. 1, and the same reference numerals are used in FIGS.

In FIG. 1, the lead 2 and the panel 3 of the insulating film 1 are shown.
The bonding apparatus for electrically connecting the electrodes 4 of No. 4 with the bumps 5 and the anisotropic conductive layer 6 is an insulating film mounting base 21 on which the insulating film 1 is mounted, a substrate mounting base 8 on which the panel 3 is mounted, It has a bonding tool 9 for simultaneously connecting a large number of opposing leads 2 and electrodes 4, and a detector (camera) 10 for detecting the alignment between the leads 2 and electrodes 4.

As shown in FIG. 1 and FIG. 2, a pair of pins 22 corresponding to the conventional pins 11 are planted on the insulating film mounting surface (upper surface) of the mounting base 21, and the intake holes 23 for adsorbing the insulating film are opened.
24 is provided, and the pin 22 into which the through hole 12 of the insulating film 1 is fitted has a base diameter at which the through hole 12 fits without looseness, and has a conical shape that becomes continuously thinner than the insulating film mounting surface ( Or hemispherical).

On the insulating film mounting surface (upper surface) of the mounting base 21 thus configured, the insulating film 1 is mounted so that the through holes 12 fit into the pair of pins 22, respectively, and is connected to an intake pump (not shown). The insulating film 1 is fixed to the mounting table 21 when sucked through the suction holes 23.

The panel 3 mounted on the upper surface of the mounting table 8 in which the glass 13 is partly fitted is fixed by the fixture 14.

Therefore, as shown in FIG. 3A, the insulating film 1 is attached to the panel 3 by the bonding tool 9 heated to an appropriate temperature.
When pressed against, the lead 2 and the electrode 4 are electrically connected.

Next, when the pressure inside the intake hole 23 is returned to atmospheric pressure and the mounting table 21 is moved down as shown in FIG. 3B, the pair of pins 22 can be smoothly removed from the through hole 12 of the insulating film 1.

[Effect of device]

As described above, according to the present invention, there is no destruction of the connecting portion between the substrate electrode and the lead due to the descending movement of the insulating film mounting base, and the manufacturing yield and reliability of the connecting portion are improved. .

[Brief description of drawings]

FIG. 1 is a schematic side view of an essential part of the apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of an insulating film mounting base shown in FIG. 1, and FIG. 3 is an operation explanatory view of the apparatus shown in FIG. 4 is an explanatory view of a connection example by the TAB method, FIG. 5 is a schematic side view of a main part of a conventional device, and FIG. 6 is a plan view of the insulating film shown in FIG. In the figure, 1 is an insulating film, 2 is a lead of an insulating film, 3 is a substrate (liquid crystal panel), 4 is an electrode of the substrate, 8 is a substrate mounting base,
Reference numeral 9 is a bonding tool, 12 is a through hole, 21 is an insulating film mounting base, 22 is an insulating film mounting base pin, and 23 is an intake hole of the insulating film mounting base.

Claims (1)

[Scope of utility model registration request] 1. A substrate (3) having a large number of electrodes (4) formed thereon.
And an insulating film mounting base (2) for mounting an insulating film (1) on which a large number of leads (2) connected to each of the plurality of electrodes (4) are formed.
1) and a bonding tool (9) for connecting the lead (2) to the electrode (4), and the insulating film (1) so that the connecting portion of the lead (2) projects laterally. On the insulating film mounting surface of the insulating film mounting base (21), which is mounted and connected to the electrode (4) and then descends, a pair of through holes ( 12) a pair of pins (22) fitted with each other, and an intake hole (a) for fixing the insulating film (1) with the pair of through holes (12) fitted in the pair of pins (22). 23) is provided, and the pair of pins (22) into which the through hole (12) is fitted up to the root
The bonding apparatus is characterized in that it is continuously formed thinner than the surface on which the insulating film is mounted.