JPH0719996B2 - Electronic component insertion method and mechanism - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method and mechanism for inserting an electronic component with a lead wire into a printed circuit board, and more particularly to a lead wire for guiding the lead wire into a hole in the printed circuit board. Guide the lead wire to the printed circuit board together with the extension pin by joining them together.
The present invention relates to a method and a mechanism for holding and ejecting extension pins on the lower side of a printed circuit board in an inserting device.

[Conventional technology]

Conventionally, in order to insert an electronic component with a lead wire into a printed circuit board, there was a method of holding the lead wire from the upper side of the component body with an insertion guide and guiding the tip to the board hole. There was a limit. Therefore, the applicant of the present invention does not grasp the lead wire from the upper side of the electronic component to be inserted and directly insert it into the substrate with the insertion guide, but instead extends the lead wire tip by adding a straight pin. We proposed a so-called "extension pin system" in which the lead wire is guided and inserted into the substrate (Japanese Patent Application No. 63-218).
No. 426). According to this method, it is not necessary to prepare insertion guides having different shapes according to the shape and size of the electronic component, and even in a narrow space, high density insertion is possible without interfering with adjacent components. became.

[Problems to be Solved by the Invention]

However, after performing the insertion of the electronic component into the board using the extension pin as a guide for the lead wire, the extension pin must be retrieved under the board, and under A clinch for fixing the tip of the lead wire of the component to the board is required, so-called bending is necessary, and there is a mechanism for that, both functions are required at almost the same place, and the mechanism becomes complicated and required space There was a problem that it required a lot of.

Therefore, according to the present invention, as described above, the extension pin is held and recovered in the automatic insertion device in which the extension pin is joined to the lead wire for guiding the lead wire of the electronic component to the hole of the printed board. SUMMARY OF THE INVENTION It is an object of the present invention to provide an extension pin holding / discharging method and mechanism for an electronic component insertion device that simplifies the mechanism for eliminating the need for an extra space.

[Means for Solving the Problems]

According to the present invention, the extension pin is supported from the lower side when the electronic component is inserted into the substrate and pressure air is used as its supporting force, and the present system is made to function smoothly.

That is, according to the present invention, the extension pin is joined to the lead wire of the electronic component, and the lead wire is inserted into the hole of the printed circuit board while being guided by the extension pin. A force that ejects pressure air from below and pushes the extension pin upwards into an air jet that can be inserted and passed so that the extension pin can move freely in its longitudinal direction but is constrained in the direction of the tail. Hold the electronic component between the push rod and the extension pin on the upper side of the electronic component, and support the electronic component and the extension pin with the lifting force of the ejected air. After inserting the lead wire into the board hole, the jetting of the pressure air to the air jetting port is blocked or a negative pressure suction force is exerted to lower the extension pin through the hole. Insertion method of an electronic component so as to recover to are provided.

Further, according to the present invention, an extension pin is linearly joined to a lead wire of an electronic component, and the lead wire is provided on an upper side of the printed circuit board in an electronic component insertion device for inserting the lead wire into the hole of the printed circuit board while guiding the extension pin. A first holding mechanism that holds and releases the electronic component and can move the electronic component, a second holding mechanism that holds and releases the extension pin and can move, and a push rod that presses the electronic component from above are arranged under the printed circuit board. The extension pin on the side is movable in the longitudinal direction, but has a clinch part having an air jet port that can be inserted and passed so as to be constrained in the direction of the tail, means for supplying pressurized air to the air jet port, and the extension pin And a recovery port for the electronic component are provided.

[Action]

The extension pin is pushed upward by the pressure air ejected upward from the air ejection port, and is brought into contact with and joined to the lead wire of the electronic component. At this time, since the extension pin has some flexibility depending on the degree of fitting with the air ejection port, an error or the like in the extension pin itself or the lead wire is absorbed, and the lead wire can be held in contact with the electronic component. . In addition, after inserting the lead wire into the substrate hole, the extension pin is dropped by its own weight to be collected by shutting off the ejection of pressure air to the air ejection port or exerting a negative pressure suction force. As described above, according to the present invention, since a complicated mechanical means is not required for holding and collecting the extension pin, the structure is simplified and the space therefor can be reduced.

Embodiments Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 shows a method of inserting an electronic component with leads according to an embodiment of the present invention in the order of steps, and FIG. 2 is a diagram for explaining the operation timing thereof.

In the electronic component 1 with lead wires, the lead wires 1b are sandwiched by the tape mount 1c and the adhesive tape at predetermined intervals, and are arranged in parallel in series, and a large number are continuously held in the longitudinal direction of the tape mount 1c. The mount of the electronic component series is cut almost in the middle of the adjacent electronic components to form an electronic component cutting piece in which the lead wire of one electronic component is fixed to the holding band, and then the lead wire is cut with an appropriate cutter 2. Then, the tape mount 1c is separated from the electronic component 1. At this time, the lead wire 1b is cut into an appropriate length in advance. Incidentally, this point is disclosed in detail in Japanese Patent Application No. 63-114578, "Method for cutting and bending lead wires" (filed on May 13, 1988), which is the prior application of the present applicant.

A first holding mechanism (chuck) 4 holds a plurality of (two in the embodiment shown in FIG. 1) lead wires 1b of the electronic component 1 by chucking in accordance with the intervals of the substrate holes 7a to be inserted. At this time, the electronic component 1 is in a vertical posture with the main body 1a in the upper part and the lead wire 1b in the lower part. The extension pin 3 has a diameter that allows it to freely pass through the board hole 7a.
The lower end 3a has a tapered shape for easy insertion, and the upper end has a hole or recess 3b into which the tip of the lead wire can be inserted. The second holding mechanism (chuck) 5 holds the extension pins 3 in a number equal to the number of the lead wires 1b (two in the figure) by vacuum suction of the upper portions of the extension pins 3 so as to be parallel to the lead wires 1b. To do. The chuck mechanism by vacuum suction at this time will be described later with reference to FIG. At this time, the extension pins 3 are held substantially vertically parallel to each other at intervals corresponding to the intervals of the lead wires 1b (substrate holes 7a), and are located below the lead wires 1b of the electronic component 1 and in the substrate holes.
It is moved to a corresponding position on the upper side of 7a and is brought to a position close to the lead wire 1b of the electronic component 1.

Extension pin holding / recovery section (clink with extension pin recovery function) that holds the lead wire 1b and the extension pin 3 in close proximity, and the tip of the extension pin 3 is inserted into the board hole 1b and is on standby below (Part) 8 and further reaches the air ejection port 8a, which will be described later, to lower the electronic component 1 and the extension pin 3 by the chucks 4 and 5.

The lead wire 1b and the extension pin 3 are held by the chucks 4 and 5, respectively, but there is a push rod 6 above the electronic component 1, and the push rod 6, the electronic component body 1a, the lead wire 1b, and the bottom extend from the top. It becomes pin 3 and each is lined up vertically. When descending in this way, the lower end of the extension pin 3 first passes through the substrate hole 7a, and the pin tip reaches the air ejection port 8a of the extension pin holding / collecting unit 8 coexisting in the clinch portion, It goes into the inside (in the drawings of the embodiment, the clinch portion structure for preventing the tip of the lead wire 1b from coming off from the bent substrate 7 is omitted). In this state, the chucks 4 and 5 are adjacent components mounted on the printed circuit board 7.
It is in a position that does not interfere with 1d. At this time, the extension pin 3 receives a force that is lifted upward by ejecting pressure air from the clinch portion 8 side, and the tip of the lead wire 1b comes into contact with the upper end of the extension pin 3 and enters the upper end hole 3b. At this point, the holding of the lead wire 1b and the extension pin 3 is released. Even if the holding is released, it is sandwiched between the push rod 6 and the extension pin 3 which receives the upward force, and the configuration of the push rod 6, the electronic component body 1a, the lead wire 1, and the extension pin 3 at the bottom is arranged from above. Done. At this time, the extension pin 3 is freely movable in the longitudinal direction but is restrained in the direction of the tail, so that the substrate arm 7a and the air ejection port are restrained.
8a works.

In the above state, the pushing force of air blown out from the push rod 6 on the upper side of the electronic component 1 and the clinch portion 8 on the lower side of the substrate supports the electronic component 1 and the extension pin 3, and the pushing rod 6 maintains the supporting state and the electronic component 1 To lower.

After inserting the lead wire 1b into the board hole 7a, the extension pin 3 is recovered by the clinch portion 8. That is, the board hole of the lead wire 1b
The injection of the pressure air is stopped when the insertion into the 7a is performed. Alternatively, in order to quickly remove the pressure and make the recovery of the extension pin 3 smooth, air may be temporarily made a negative pressure to perform the suction action. The extension pin 3 falls below the clinch portion 8 and is collected.

With the above, one cycle of the insertion process of the electronic component with lead wire 1 is completed, but the extension pin is recovered after use, circulated and reused. FIG. 3 shows an example of a circulation path for such an extension pin.

In FIG. 3, a circulation path of the extension pin including a holding / recovering part 8 for the extension pin 3 and a supply part 30 for supplying the recovered extension pin 3 is shown. The support / recovery portion 8 of the extension pin 3 on the back side of the printed circuit board 7 is built in the clinch portion (not shown) of the lead wire as described above, and the extension pin 3 is a recovery case for recovery. At the upper part of 21, there is an air ejection port 8a having a distance corresponding to the distance between the board holes 7a into which the lead wires 1b of the electronic component 1 are inserted. The internal recovery chamber 23 of the recovery case 21 is opened and closed by a lid 22, and is connected to an air control device 25 such as a compressor by a pipe 24. When the lid 22 is closed and closed, the compressed air is supplied from the air controller 25 to the recovery chamber 23, so that the extension pin 3 is pushed upward as described above. Electronic component 1
When the supply of the pressurized air is stopped after the lead wire 1b is inserted into the substrate hole 7a, the extension pin 3 falls downward from the air ejection port 8a and enters the recovery chamber 23. Therefore, the recovery chamber 23 has a size higher than the length of the extension pin 3. When the lid 22 is opened after the extension pin 3 has dropped, the extension pin 3 is discharged as shown by the arrow and is sequentially collected in the collection box 27.

When an appropriate amount of extension pin 3 is collected in the collection box 27, the collection box 27
Each of them is conveyed to the supply unit 30 or is charged and replenished by an appropriate belt conveyor into a vibration type supply device 31 having an annular passage 32 as indicated by an arrow. The extension pins 3 are arranged in a line in the passage 32 so that the tapered ends 3a come first. Circular passage 32
The outlet part of is continuous with a guide passage 33 extending in a tangential direction from the vibrating supply device 31, and the guide passage 33 is connected to a separating mechanism 45 of the extension pins 3 that have fallen in a single row posture. Separation mechanism
For 45, first, the air cylinder (lower) 46 is in the passage,
The dropped extension pin 3 is stopped, and the next extension pin 3 is pressed by the air cylinder (upper) 47 and retracted by the air cylinder (lower) 46, so that the extension pin 3 at the lower end is dropped into the supply device 35. Subsequently, the air cylinder (lower) 46 again comes out into the passage and then retracts into the air cylinder (upper) 47, so that the extension pin 3 is synchronized with the rotation of the supply device 35 one after another.
To separate. Vertical grooves 36 are provided around the supply device 35 at predetermined intervals, and an outer guide plate 34 and a support plate 41 fixed to the lower side are attached. The extension pins 3 delivered from the guide passage 33 are separated by the separating mechanism 45 and fall into the grooves 36 one by one. The supply device 35 intermittently rotates in the direction of the arrow, and the extension pin 3 is intermittently sent while being held by the guide plate 34.

There is an air cylinder 37 at a predetermined position below the supply device 35,
While the supply device 35 is stopped, a plurality of (two) extension pins 3 are raised (supplied) in this direction in the arrow direction. Meanwhile, the feeding device
Adjacent to 35 is the chuck index 38, below it
The pin chucks (second holding mechanism) 5 arranged at equal intervals on the circumference of 39 are in a position where the upper part of the extended extension pin 3 can be vacuum chucked. Therefore, when the chuck index 38 descends and is located at the lowest position during the insertion operation, the pin chuck 5 vacuum chucks the extension pin 3 and then ascends. At the uppermost position, the extension pin 3 is removed from the supply device 35 and the index lower portion 39 is rotated to a predetermined component insertion position.

The index upper portion 40 having the lead wire chuck (first holding mechanism) 4 is arranged concentrically with the index lower portion 39, and the lead wire chuck 4 and the pin chuck portion 5 are located at the same radius position on the circumference, Chuck index
It can be raised and lowered individually with respect to 38, it is always in the raised position,
It moves radially and always appears. The electronic component 1 is mechanically clamped to the lead wire chuck 4 at another position (not shown), the lead wire is cut, the mount is cut off, and the electronic component 1 is rotated to a predetermined component insertion position. Two
The lead wire 1b of (book) comes to a position immediately above corresponding to the plurality of (two) extension pins 3. Then, the push rod 6, the first holding mechanism (lead wire chuck) 4 and the second holding mechanism (pin chuck) 5 are lowered, and the extension pin 3 and the electronic component 1 are lowered by the push rod 6 in the arrow direction as described above. , Electronic components 1
The lead wire 1b is inserted into the board hole 7a.

In the above embodiment, the electronic component 1 having the two lead wires 1b is handled, but the electronic component having one or three or more lead wires is handled by the number of lead wires corresponding to the number of lead wires. This is possible by using the extension pin every cycle.

Further, when the pipe or tube made of low-priced plastic or the like is cut into a predetermined length as the extension pin 3, the extension pin 3 need not be collected and reused as described above. Good.

FIG. 4 is a detailed perspective view of the second holding mechanism (pin chuck) 5. The number of extension pin positioning / guide grooves 51 (only one is shown) equal to the number of lead wires of electronic parts are provided parallel to the lead wires, and the upper portions of the extension pins 3 are vacuum-sucked in the respective groove 51. There is a suction hole 52 connected to a vacuum pump (not shown) for holding. Therefore, when the vacuum pump is moved, the extension pin 3 is sucked into the suction hole 52 and the guide groove 51
Held in. In this way, by making the mechanism of the chuck holding the extension pin 3 by vacuum suction, the chuck structure can be simplified, the extension pin 3 can be easily supplied, and the extension pin 3 can be supplied to some extent in the longitudinal direction. By moving when force is exceeded, the position of the tip of the lead wire 1b may be adjusted even if the position of the tip varies a little, or while the extension pin 3 is held by the chuck 5, the pressure air from the air ejection port 8a is used as described above. The extension pin 3 can be pushed up from below to contact the lead wire 1b, or the upper end hole 3b of the extension pin 3 can be inserted into the tip of the lead wire 1b.

FIG. 5 is a front view of another embodiment of the extension pin holding / recovering section 8, and FIG. 6 is a side view of the same embodiment when jetting pressure air.
FIG. 7 is a side view of the same embodiment when the pins are dropped. Upper end
61 is detachable from the main body 60 of the extension pin holding / collecting section 8 by a bolt 62, and the upper end portion 61 has a number of air jets equal to the number of lead wires of electronic parts (three in this embodiment). The outlets 8a are provided vertically and in parallel at intervals corresponding to the lead wires, that is, the substrate holes to be inserted. If the number or spacing of the lead wires is different, only the upper end 61 should be replaced with a suitable one. The main body 60 has an air outlet at the upper end 61.
There is a vertical hole 63 communicating with 8a and opening at a recovery port 64 at the lower end. A pipe 65 for supplying pressurized air or exerting a negative pressure to the air ejection port 8a is connected to an intermediate portion of the vertical hole 63, and the pipe 6 is connected to an air compressor or a vacuum pump via a valve chamber (not shown). Etc. is connected to a pneumatic control device (not shown). Near the lower portion of the vertical hole 63, there is an opening / closing piston 67 which is provided across the vertical hole 63 at a right angle and can reciprocate in a passage 66. This open / close piston 67
Has a hole 68 with a diameter almost the same as the inner diameter of the vertical hole 63.
As shown in the figure, the opening / closing piston 67 is pushed to the left by the spring 69 so that the hole 68 of the opening / closing piston 67 is at the same position as the vertical hole 63, and the vertical hole 63 is open.

The opening / closing piston 67 is connected to the cylinder 71 via the piston rod 70.
Is connected to a drive piston (not shown) in the
As shown in the figure, by supplying compressed air into the cylinder 71 from the pipe 72 on the left side of the cylinder 71,
Drive the drive piston (not shown) in 71 to the right and
The vertical piston 63 is closed by moving the opening / closing piston 67 rightward against 69. At this time, the vertical hole 63 is in a substantially sealed state except for the air ejection port 8a. The position of the opening / closing piston 67 in this closed position can be adjusted by the stopper 74. In this state, pressurize air from the pipe 65 to the vertical hole 63.
When supplied inside, the pressure air is ejected from the air ejection port 8a and holds the extension pin while exerting an upward force as described above.

After the lead wire of the electronic component is inserted into the board hole, the supply of pressure air to the left side pipe 72 is stopped, or as shown in FIG. 7, the pressure air is supplied from the right side pipe 73 into the cylinder 71. By doing so, the opening / closing piston 67 is moved leftward together with the action of the spring 69, and the hole 68 of the opening / closing pin 67 is moved.
Move to the same position as the vertical hole 63 to open the vertical hole 63. As a result, the pressure air in the vertical hole 63 escapes from the lower recovery port 64 and is naturally exhausted, and the upward pressing force against the extension pin disappears, and the extension pin falls down the vertical hole 63 by its own weight and drops from the recovery port 64. And is stored in a suitable collection box or belt conveyor (not shown). In this case, if necessary, the pipe 65 is connected to a negative pressure source as shown in FIG. 7 to forcibly eliminate the pressure air in the vertical hole 63 by forced exhaust and to apply a negative pressure suction force. It is convenient to promote the fall of the extension pin.

By repeating the above operation with good timing, the injection of pressure air and the recovery of the extension pin are efficiently performed.

〔The invention's effect〕

(1) As a first effect, since the extension pin is structured to be held by the air ejection port, the extension pin support mechanism is simplified. That is, the extension pin can be held or released / dropped only by controlling the air, so that the structure for holding / recovering the extension pin is simple and the operation is easy.

(2) As a second effect, in the relationship between the lead wire of the electronic component and the extension pin, even if there is some variation in the tip of the lead-cut electronic component lead, the extension pin maintains a constant pressure air from the downward direction. Since it is pushed up by the pressure of, the variation can be absorbed on the extension pin side.
Similarly, other parts such as the push rod 6 and the chucks 4,
Even if there are subtle timing errors in 5, they can be absorbed.

(3) As a third effect, since the electronic component to be inserted and the extension pin are supported by the push rod and the air pressure from below in the up-down direction, the extension pin itself is not stressed more than necessary. Therefore, the life of the extension pin can be extended.

[Brief description of drawings]

FIG. 1 is a schematic view showing a method of inserting an electronic component with a lead wire according to an embodiment of the present invention in the order of steps, FIG. 2 is a view for explaining its operation timing, and FIG. 3 is an extension pin in the device of the present invention. 4 is a perspective view showing a circulation path of the extension pin, FIG. 4 is a detailed perspective view of the second holding mechanism (pin chuck), and FIG. 5 is a front view of another embodiment of the extension pin holding / recovering portion, FIGS. FIG. 6 is a side view of the embodiment of FIG. 5, FIG. 6 shows a state in which pressure air is ejected to hold the extension pin, and FIG. 7 shows a state in which the extension pin is dropped. 1 ... Electronic parts, 4 ... First holding mechanism (lead chuck), 1a ... Main body, 5 ... Second holding mechanism (pin chuck), 1b ... Lead wire, 6 ... Pressing mechanism (push rod), 1c ...
… Tape mount, 7… Printed circuit board, 1d… Adjacent parts,
7a …… Board hole, 2 …… Cutter, 8 …… Holding extension pin
Collection part (clinch part), 3 ... extension pin, 8a ... air jet, 3a ... tapered part, 3b ... hole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshihiro Onoseki 1-13-1, Nihonbashi, Chuo-ku, Tokyo TDC Corporation (56) References JP-A-55-30858 (JP, A) JP-A-SHO 59-181691 (JP, A)

Claims (5)

[Claims] 1. An electronic component for connecting an extension pin (3) to a lead wire (1b) of an electronic component (1) and inserting the lead wire into the hole (7a) of a printed circuit board (7) while guiding the lead pin to the extension pin. In the insertion method, the extension pin (3) provided in the clinch portion (8) on the lower side of the printed circuit board is movable in the longitudinal direction but can be inserted and passed so as to be constrained in the direction of the air blow (8a ), Pressure air is jetted from below to exert an upward pushing force on the extension pin (3) that has entered the jet port, and the push rod (6) above the electronic component (1) is exerted.
Holds the electronic component between the extension pin (3) and
The electronic component (1) and the extension pin (3) are supported by the lifting force of the jet air, and the electronic component (1) and the extension pin (3) are lowered by the push rod (6) while maintaining the supporting state, and the lead wire is A method of inserting an electronic component, wherein after the insertion into the substrate hole, the ejection of the pressure air to the air ejection port is blocked or a negative pressure suction force is exerted to recover the extension pin downward through the hole (8a). 2. An extension pin (3) is joined to a lead wire (1b) of an electronic component (1) in a straight line, and the lead wire is guided by the extension pin and inserted into a hole (7a) of a printed circuit board (7). In the electronic component inserting device, which can hold and open the lead wire on the upper side of the printed circuit board and move the electronic component.
A holding mechanism (4), a second holding mechanism (5) capable of holding and releasing the extension pin and moving, and a push rod (6) for pressing the electronic component (1) from above are arranged, and the lower side of the printed circuit board is arranged. The extension pin (3) is free to move in its longitudinal direction but has a clinch part (8) having an air jet port (8a) through which the extension pin (3) can be inserted and passed so as to be constrained in the direction of the tail, and an air jet port (8a). An electronic component insertion mechanism, characterized in that a means (25) for supplying pressurized air to the inside and a recovery port (64) for the extension pin are provided. 3. The electronic component inserting mechanism according to claim 2, wherein a plurality of air ejection ports (8a) are arranged in parallel corresponding to the number of lead wires (1b) of the electronic component (1). 4. A clinch portion (8) is provided with the air ejection port (8).
a) has a vertical hole (63) communicating with a), and means (67, 68) for opening and closing the vertical hole (63) are provided, and the vertical hole (63) is provided with the air when the opening and closing means is closed. The air pressure control means is connected to the portion of the vertical hole (63) between the air ejection port (8a) and the opening / closing means (67, 68), which is substantially sealed except for the ejection port (8a). The electronic component insertion mechanism described in. 5. The electronic component insertion mechanism according to claim 4, wherein the air pressure control means is capable of supplying pressure air to the air ejection port (8a) and / or applying a negative pressure suction force.