JPH07201646A - Production of capacitor - Google Patents
Production of capacitorInfo
- Publication number
- JPH07201646A JPH07201646A JP35368793A JP35368793A JPH07201646A JP H07201646 A JPH07201646 A JP H07201646A JP 35368793 A JP35368793 A JP 35368793A JP 35368793 A JP35368793 A JP 35368793A JP H07201646 A JPH07201646 A JP H07201646A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- dielectric film
- insulating material
- manufacturing
- metal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 61
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 36
- 239000011888 foil Substances 0.000 claims abstract description 33
- 239000003094 microcapsule Substances 0.000 claims abstract description 17
- 239000011810 insulating material Substances 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 18
- 238000003825 pressing Methods 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 4
- 238000003475 lamination Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract description 7
- 238000010030 laminating Methods 0.000 description 9
- 238000004804 winding Methods 0.000 description 9
- 239000003921 oil Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- 229910018503 SF6 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- SFZCNBIFKDRMGX-UHFFFAOYSA-N sulfur hexafluoride Chemical compound FS(F)(F)(F)(F)F SFZCNBIFKDRMGX-UHFFFAOYSA-N 0.000 description 1
- 229960000909 sulfur hexafluoride Drugs 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、コンデンサの製造方
法に係り、特に、誘電体フィルムと金属電極箔とを交互
に積層し、或いは積層後に巻回して成るコンデンサ、及
び誘電体フィルムの表面に電極金属を蒸着させた金属化
誘電体フィルムを積層し、或いは積層後に巻回して成る
コンデンサの製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a capacitor, and more particularly to a capacitor formed by alternately laminating a dielectric film and a metal electrode foil, or winding after laminating, and a surface of the dielectric film. The present invention relates to a method for producing a capacitor, which is formed by laminating metallized dielectric films having electrode metals vapor-deposited thereon, or winding after laminating.
【０００２】[0002]
【従来の技術】従来、この種のコンデンサとしては、例
えば、ポリエステルやポリプロピレン等のプラスチック
製誘電体フィルムと、アルミニウム等の金属電極箔とを
交互に積層し、或いは積層後に巻回したものが知られて
いる。または、誘電体フィルムの表面にそれぞれアルミ
ニウム等の電極金属を帯状に蒸着させて金属化誘電体フ
ィルムと成し、これらを積層し、或いは積層後に巻回し
てたものが存在する。2. Description of the Related Art Heretofore, as a capacitor of this type, for example, a capacitor in which a dielectric film made of plastic such as polyester or polypropylene and a metal electrode foil such as aluminum are alternately laminated or wound after lamination is known. Has been. Alternatively, a metallized dielectric film is formed by vapor-depositing an electrode metal such as aluminum on the surface of a dielectric film to form a metallized dielectric film, and these are laminated or wound after lamination.
【０００３】ところで、誘電体フィルムと金属電極箔を
積層し、或いは積層・巻回する際に、誘電体フィルムと
金属電極箔間に空気が残っていると、空気は誘電体フィ
ルムよりも誘電率が低いため、当該空隙箇所が高電界と
なって部分放電が発生し、遂には破壊されてしまう恐れ
がある。このため、誘電体フィルムと金属電極箔とを積
層し、或いは積層・巻回した後に、これにプレスを施し
て内部の空気を排出させることが行われているが、単に
加圧するだけでは、幾重にも積層された誘電体フィルム
と金属電極箔間に存在する空気を完全に排出させること
は困難である。By the way, when air remains between the dielectric film and the metal electrode foil when the dielectric film and the metal electrode foil are laminated or laminated / wound, air has a dielectric constant higher than that of the dielectric film. Is low, a high electric field is generated in the void portion, a partial discharge is generated, and there is a possibility that the void is eventually destroyed. For this reason, the dielectric film and the metal electrode foil are laminated or laminated / wound, and then a press is applied to discharge the internal air. However, it is difficult to completely exhaust the air existing between the laminated dielectric film and the metal electrode foil.
【０００４】そこで、上記プレスを行った後に、所定の
絶縁油を両端部から含浸させて誘電体フィルムと金属電
極箔間に存在する空気を外部に排斥することが行われて
いる。また、その際に含浸不良が生じることを防止する
ために、予め金属電極箔の表面に厚さ２００〜５０００
オングストロームの金属酸化物層を形成しておく技術も
提案されている（特公平５−２１３２８号）。これは、
金属電極箔の表面に金属酸化物層を形成することによ
り、金属電極箔表面の絶縁油に対するぬれ性（接触角）
を向上させ、金属電極箔と誘電体フィルム界面の油の流
通を円滑化することを企図している。Therefore, after performing the above-mentioned pressing, a predetermined insulating oil is impregnated from both ends to exhaust air existing between the dielectric film and the metal electrode foil to the outside. Moreover, in order to prevent impregnation failure at that time, a thickness of 200 to 5000 is previously formed on the surface of the metal electrode foil.
A technique for forming an angstrom metal oxide layer has also been proposed (Japanese Patent Publication No. 5-21328). this is,
By forming a metal oxide layer on the surface of the metal electrode foil, the wettability of the metal electrode foil surface to insulating oil (contact angle)
It is intended to improve the oil flow and smooth the oil flow at the interface between the metal electrode foil and the dielectric film.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、いかに
電極箔と誘電体フィルム界面の油の流通を円滑化しよう
とも、所詮「含浸」である以上、緻密に積層された電極
箔と誘電体フィルムとの間に外部から絶縁油を染み込ま
せることに変わりはなく、確実に空隙を排除することは
期待できないものであった。なお、以上に述べた事情
は、そのまま金属化誘電体フィルムを積層・巻回して形
成するコンデンサについても当てはまるものである。However, no matter how smooth the oil flow at the interface between the electrode foil and the dielectric film, since it is "impregnation" after all, since the electrode foil and the dielectric film are densely laminated, There was no change in allowing the insulating oil to soak in from the outside, and it was impossible to expect to reliably eliminate the voids. The above-mentioned circumstances also apply to a capacitor formed by laminating and winding metallized dielectric films as they are.
【０００６】本発明は、上記した従来の問題点に鑑みて
なされたものであり、その目的とするところは、誘電体
フィルムと金属電極箔との間に、或いは金属化誘電体フ
ィルム間に空隙が残ることを確実に防止できるコンデン
サの製造方法を実現することにある。The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a space between a dielectric film and a metal electrode foil or between metallized dielectric films. The purpose of the present invention is to realize a method for manufacturing a capacitor, which can surely prevent the remaining.
【０００７】[0007]
【課題を解決するための手段】上記の目的を達成するた
めに、本発明に係るコンデンサの製造方法は、誘電体フ
ィルムと金属電極箔とを交互に積層し、或いは積層後に
巻回してコンデンサ素子を形成すると共に、該コンデン
サ素子にプレスを施して整形するコンデンサの製造方法
において、上記誘電体フィルムと金属電極箔とを積層す
る際に、両者の間に絶縁物質を介在させておき、上記プ
レスによって該絶縁物質を層間に拡散させるよう構成し
た。In order to achieve the above object, a method of manufacturing a capacitor according to the present invention is a capacitor device in which dielectric films and metal electrode foils are alternately laminated or wound after lamination. In the method for manufacturing a capacitor in which the dielectric film and the metal electrode foil are laminated, an insulating substance is interposed between the dielectric film and the metal electrode foil, and Is configured to diffuse the insulating material between layers.
【０００８】また、本発明に係る他のコンデンサの製造
方法は、誘電体フィルムの表面に電極金属を蒸着させて
電極層を形成して成る複数の金属化誘電体フィルムを積
層し、或いは積層後に巻回してコンデンサ素子を形成す
ると共に、該コンデンサ素子にプレスを施して整形する
コンデンサの製造方法において、上記金属化誘電体フィ
ルムを積層する際に、両者の間に絶縁物質を介在させて
おき、上記プレスによって該絶縁物質を層間に拡散させ
るよう構成した。Another method of manufacturing a capacitor according to the present invention is to stack a plurality of metallized dielectric films formed by depositing an electrode metal on the surface of a dielectric film to form an electrode layer, or after stacking. In a method of manufacturing a capacitor in which a capacitor element is wound to form a capacitor element, and the capacitor element is pressed to shape the capacitor element, an insulating material is interposed between the metallized dielectric film and the metallized dielectric film when laminated. The press was configured to diffuse the insulating material between the layers.
【０００９】上記絶縁物質を、誘電体フィルムに形成し
た透孔や凹部内に充填せしめるよう構成してもよい。ま
たは、上記絶縁物質を、誘電体フィルムや金属電極箔の
表面、或いは金属化誘電体フィルムの電極層の表面に被
着せしめるよう構成してもよい。さらには、予めマイク
ロカプセルに格納された絶縁物質を用いてもよい。The insulating material may be filled in the through holes or recesses formed in the dielectric film. Alternatively, the insulating material may be applied to the surface of the dielectric film or the metal electrode foil, or the surface of the electrode layer of the metallized dielectric film. Furthermore, an insulating material previously stored in microcapsules may be used.
【００１０】[0010]
【作用】絶縁物質を予めコンデンサ素子内に仕込んでお
き、素子整形用のプレス工程において絶縁物質を拡散さ
せるよう構成したため、誘電体フィルムと金属電極箔間
に存在する空気、或いは金属化誘電体フィルム間に存在
する空気は確実に外部に排出される。Since the insulating material is preliminarily charged in the capacitor element and the insulating material is diffused in the pressing process for shaping the element, the air existing between the dielectric film and the metal electrode foil or the metallized dielectric film is formed. Air existing between them is surely discharged to the outside.
【００１１】[0011]
【実施例】以下に本発明を、図示の実施例に基づいて説
明する。図１はテープ状の誘電体フィルム10の一部を示
す平面図であり、図２はその拡大断面図である。この誘
電体フィルム10は、ポリエチレンテレフタレート、ポリ
プロピレン或いはポリアミド等の合成樹脂よりなり、そ
の表面から裏面にまで貫通する無数の透孔12が一面に穿
設されている。この透孔12は、その孔径が各１mm程度
で、分布密度が数１０万〜数１００万個／ｍ2程度とな
るように形成する。具体的には、加熱した多数の微細な
針を誘電体フィルム10に押し当てることにより、或いは
プレス加工等により形成される。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the illustrated embodiments. FIG. 1 is a plan view showing a part of a tape-shaped dielectric film 10, and FIG. 2 is an enlarged sectional view thereof. This dielectric film 10 is made of a synthetic resin such as polyethylene terephthalate, polypropylene or polyamide, and has a large number of through holes 12 penetrating from its front surface to its back surface. The through holes 12 are formed so that each hole diameter is about 1 mm and the distribution density is about several hundred thousand to several million pieces / m 2 . Specifically, it is formed by pressing a large number of heated fine needles against the dielectric film 10 or by pressing.
【００１２】つぎに、図３に示すように、マイクロカプ
セル14を、適当なバインダ等を介して各透孔12に充填さ
せる。このマイクロカプセル14内には、所定の絶縁物質
が格納されている。この絶縁物質としては、シリコン油
等の液体状絶縁物質や、六弗化硫黄等の気体状の絶縁物
質が該当する。Next, as shown in FIG. 3, the microcapsules 14 are filled in the respective through holes 12 through an appropriate binder or the like. A predetermined insulating material is stored in the microcapsule 14. As the insulating substance, a liquid insulating substance such as silicon oil or a gaseous insulating substance such as sulfur hexafluoride is applicable.
【００１３】つぎに、図４に示すように、マイクロカプ
セル14を充填させた一対の誘電体フィルム10と、該誘電
体フィルム10よりも若干幅の狭い一対の金属電極箔16と
を、両誘電体フィルム10の異なる端部にそれぞれマージ
ン部18が形成されるように交互に積層し、図示しない巻
取機によって巻回し、巻回終端部を止着してコンデンサ
素子20を形成する。Next, as shown in FIG. 4, a pair of dielectric films 10 filled with microcapsules 14 and a pair of metal electrode foils 16 having a width slightly narrower than the dielectric film 10 are connected to each other. The capacitor films 20 are formed by alternately laminating the body films 10 so that the margin portions 18 are formed at different end portions thereof, winding them by a winder (not shown), and fixing the winding end portions.
【００１４】つぎに、このコンデンサ素子20に、所定の
圧力でプレスを施し、これを偏平化させる。この際、誘
電体フィルム10の透孔12内に充填された上記マイクロカ
プセル14が破砕され、図５に示すように、内部に格納さ
れた絶縁物質22が、透孔12内はもとより、誘電体フィル
ム10の表裏両面に均一に広がり、絶縁層24を形成する。
しかも、この絶縁物質22の拡散過程において、誘電体フ
ィルム10と金属電極箔16間に介在していた空気は、当然
にコンデンサ素子20の両端部から外部へ排出される。こ
のプレス工程自体は、コンデンサの製造工程の一つとし
て一般的であるが、本発明においては絶縁物質22の拡散
工程としても機能するのである。Next, the capacitor element 20 is pressed with a predetermined pressure to flatten it. At this time, the microcapsules 14 filled in the through holes 12 of the dielectric film 10 are crushed, and as shown in FIG. The insulating layer 24 is formed by uniformly spreading on both front and back surfaces of the film 10.
Moreover, in the diffusion process of the insulating material 22, the air present between the dielectric film 10 and the metal electrode foil 16 is naturally discharged to the outside from both ends of the capacitor element 20. This pressing process itself is a general manufacturing process of capacitors, but in the present invention, it also functions as a diffusion process of the insulating material 22.
【００１５】最後に、図６に示すように、コンデンサ素
子20の両端面に、鉛、錫、亜鉛等の電極材料を溶射して
取り出し用の外部電極26を形成し、該外部電極26にハン
ダ28を介してリード端子30を接続することにより、コン
デンサ32が完成する。なお、図示は省略したが、該コン
デンサ32に樹脂モールド等の適当な絶縁外装を施すこと
が望ましい。Finally, as shown in FIG. 6, external electrodes 26 for extraction are formed by spraying an electrode material such as lead, tin, or zinc on both end faces of the capacitor element 20, and the external electrodes 26 are soldered to the external electrodes 26. By connecting the lead terminal 30 via 28, the capacitor 32 is completed. Although not shown in the drawing, it is desirable that the capacitor 32 be provided with a suitable insulating exterior such as a resin mold.
【００１６】上記においては、誘電体フィルム10と金属
電極箔16を積層・巻回してコンデンサ32を製造する場合
について説明したが、本発明は、誘電体フィルム10の表
面に電極金属を蒸着させた金属化誘電体フィルムを積層
・巻回してコンデンサを製造する場合にも適用できる。
すなわち、図７及び図８に示すように、金属化誘電体フ
ィルム34の非金属化面36（電極層38が形成されていない
面）に無数の凹部40をプレス加工等によって形成すると
共に、該凹部40内に絶縁物質を格納したマイクロカプセ
ル14を充填させる。Although the case where the dielectric film 10 and the metal electrode foil 16 are laminated and wound to manufacture the capacitor 32 has been described above, in the present invention, the electrode metal is vapor-deposited on the surface of the dielectric film 10. It can also be applied to the production of capacitors by laminating and winding metallized dielectric films.
That is, as shown in FIGS. 7 and 8, innumerable recesses 40 are formed on the non-metallized surface 36 (the surface on which the electrode layer 38 is not formed) of the metallized dielectric film 34 by pressing or the like. The recesses 40 are filled with microcapsules 14 containing an insulating material.
【００１７】つぎに、図示は省略するが、上記マイクロ
カプセル14を充填させた一対の金属化誘電体フィルム34
を積層・巻回してコンデンサ素子を形成し、これにプレ
スを施してマイクロカプセル14を破砕させれば、上記と
同様に、内部に格納された絶縁物質が凹部40内及び金属
化誘電体フィルム34間に均一に広がり、金属化誘電体フ
ィルム34間に介在していた空気をコンデンサ素子の両端
部から外部へ排出させることができる。その後、コンデ
ンサ素子の両端面に電極材料を溶射して取り出し用の外
部電極を形成し、該外部電極にリード端子を接続すると
共に、適当な絶縁外装を施すことによってコンデンサが
完成する。Next, although not shown, a pair of metallized dielectric films 34 filled with the microcapsules 14 described above.
Are laminated and wound to form a capacitor element, which is then pressed to crush the microcapsules 14, the insulating material stored inside the recess 40 and the metallized dielectric film 34, as described above. The air that spreads evenly between the metallized dielectric films 34 can be discharged to the outside from both ends of the capacitor element. After that, an electrode material is sprayed on both end faces of the capacitor element to form an external electrode for extraction, a lead terminal is connected to the external electrode, and an appropriate insulating exterior is provided to complete the capacitor.
【００１８】本発明は上記実施例に限定されるものでは
なく、その趣旨を逸脱しない範囲で適宜変更可能であ
る。例えば、上記においては積層・巻回型のコンデンサ
を例示したが、巻回工程を経ない積層型のコンデンサで
あっても、プレス工程を伴うものであれば適用可能であ
る。The present invention is not limited to the above embodiments, but can be modified as appropriate without departing from the spirit of the invention. For example, in the above description, a laminated / wound type capacitor is illustrated, but a laminated type capacitor that does not go through the winding process can be applied as long as it involves a pressing process.
【００１９】また、上記においては、絶縁物質をマイク
ロカプセル14に格納し、これを誘電体フィルム10や金属
化誘電体フィルム34に予め形成した透孔12や凹部40内に
充填させるよう構成したが、本発明はこれに限定される
ものではない。例えば、透孔12や凹部40が形成されてい
ない平坦な誘電体フィルムの表面や金属電極箔の表面、
或いは金属化誘電体フィルムの電極層の表面に、絶縁物
質を格納したマイクロカプセルを適当なバインダ等を介
して被着させ、この誘電体フィルム等を積層し、或いは
積層・巻回してプレスするよう構成してもよい。Further, in the above, the insulating material is stored in the microcapsules 14 and is filled in the through holes 12 or the recesses 40 formed in the dielectric film 10 or the metallized dielectric film 34 in advance. However, the present invention is not limited to this. For example, the surface of the flat dielectric film or the surface of the metal electrode foil in which the through holes 12 and the recesses 40 are not formed,
Alternatively, the surface of the electrode layer of the metallized dielectric film may be coated with microcapsules containing an insulating material through a suitable binder, etc., and the dielectric films may be laminated or laminated / wound and pressed. You may comprise.
【００２０】さらには、絶縁物質をマイクロカプセルに
格納することなく、直接誘電体フィルムの表面や金属電
極箔の表面、或いは金属化誘電体フィルムの電極層の表
面にに被着させるよう構成してもよい。この場合、プレ
ス工程において、被着させた絶縁物質が誘電体フィルム
等の表面に均一に広がり、層間の空隙を確実に排除でき
るように、絶縁物質の材質や量、被着方法等を吟味する
必要がある。例えば、特殊なワックス等、常温下におい
ては比較的に高い粘性を有すると共に、加熱されると容
易に流動化する物質を、誘電体フィルム等の表面に適当
な厚さで印刷しておき、積層或いは積層・巻回後に熱プ
レスを施す方法が挙げられる。Further, the insulating material is not stored in the microcapsules but is directly applied to the surface of the dielectric film, the surface of the metal electrode foil, or the surface of the electrode layer of the metallized dielectric film. Good. In this case, in the pressing process, the material and amount of the insulating material, the method of deposition, etc. are examined so that the deposited insulating material spreads evenly on the surface of the dielectric film etc. and voids between layers can be surely eliminated. There is a need. For example, a substance such as a special wax that has a relatively high viscosity at room temperature and that easily fluidizes when heated is printed on the surface of a dielectric film or the like with an appropriate thickness and laminated. Alternatively, a method of applying hot pressing after laminating and winding may be used.
【００２１】[0021]
【発明の効果】本発明に係るコンデンサの製造方法によ
れば、絶縁物質を予めコンデンサ素子内に仕込んでお
き、プレス工程において絶縁物質を拡散させるよう構成
したため、誘電体フィルムと金属電極箔間に存在する空
気、或いは金属化誘電体フィルム間に存在する空気は確
実に外部に排出され、その結果として高耐電圧のコンデ
ンサを得ることができる。しかも、この絶縁物質の拡散
は、従来から行われているコンデンサ素子のプレスによ
って実現されるものであり、製造工程の有効活用が図れ
る利点がある。According to the method of manufacturing a capacitor in accordance with the present invention, the insulating material is preliminarily charged in the capacitor element, and the insulating material is diffused in the pressing step. Therefore, the insulating film is interposed between the dielectric film and the metal electrode foil. The existing air or the air existing between the metallized dielectric films is surely discharged to the outside, and as a result, a capacitor having a high withstand voltage can be obtained. Moreover, the diffusion of the insulating material is realized by the conventional pressing of the capacitor element, which has an advantage that the manufacturing process can be effectively utilized.
【図１】透孔部を穿設した誘電体フィルムの一部を示す
平面図である。FIG. 1 is a plan view showing a part of a dielectric film having a through hole formed therein.
【図２】上記誘電体フィルムの拡大断面図である。FIG. 2 is an enlarged cross-sectional view of the dielectric film.
【図３】上記誘電体フィルムの透孔部内にマイクロカプ
セルを充填させた状態を示す拡大部分断面図である。FIG. 3 is an enlarged partial sectional view showing a state in which microcapsules are filled in the through holes of the dielectric film.
【図４】誘電体フィルムと金属電極箔を積層巻回してコ
ンデンサ素子を形成する過程を示す斜視図である。FIG. 4 is a perspective view showing a process of forming a capacitor element by laminating and winding a dielectric film and a metal electrode foil.
【図５】プレス後のコンデンサ素子の内部状態の一部を
示す断面図である。FIG. 5 is a cross-sectional view showing a part of the internal state of the capacitor element after pressing.
【図６】上記コンデンサ素子を用いてコンデンサを完成
させる状態を示す斜視図である。FIG. 6 is a perspective view showing a state in which a capacitor is completed using the capacitor element.
【図７】金属化誘電体フィルムの拡大断面図である。FIG. 7 is an enlarged cross-sectional view of a metallized dielectric film.
【図８】上記金属化誘電体フィルムの凹部内にマイクロ
カプセルを充填させた状態を示す拡大部分断面図であ
る。FIG. 8 is an enlarged partial cross-sectional view showing a state where microcapsules are filled in the recesses of the metallized dielectric film.
10 誘電体フィルム 12 透孔 14 マイクロカプセル 16 金属電極箔 20 コンデンサ素子 22 絶縁物質 32 コンデンサ 34 金属化誘電体フィルム 38 電極層 40 凹部 10 Dielectric film 12 Through hole 14 Microcapsule 16 Metal electrode foil 20 Capacitor element 22 Insulating material 32 Capacitor 34 Metallized dielectric film 38 Electrode layer 40 Recess
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年８月８日[Submission date] August 8, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】図面[Document name to be corrected] Drawing
【補正対象項目名】全図[Correction target item name] All drawings
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図１】 [Figure 1]
【図２】 [Fig. 2]
【図３】 [Figure 3]
【図７】 [Figure 7]
【図８】 [Figure 8]
【図５】 [Figure 5]
【図４】 [Figure 4]
【図６】 [Figure 6]
Claims (8)
積層し、或いは積層後に巻回してコンデンサ素子を形成
すると共に、該コンデンサ素子にプレスを施して整形す
るコンデンサの製造方法において、上記誘電体フィルム
と金属電極箔とを積層する際に、両者の間に絶縁物質を
介在させておき、上記プレスによって該絶縁物質を層間
に拡散させることを特徴とするコンデンサの製造方法。1. A method of manufacturing a capacitor, wherein dielectric films and metal electrode foils are alternately laminated or wound after lamination to form a capacitor element, and the capacitor element is pressed to shape the capacitor element. A method for manufacturing a capacitor, characterized in that, when the body film and the metal electrode foil are laminated, an insulating material is interposed between them and the insulating material is diffused between the layers by the pressing.
させて電極層を形成して成る複数の金属化誘電体フィル
ムを積層し、或いは積層後に巻回してコンデンサ素子を
形成すると共に、該コンデンサ素子にプレスを施して整
形するコンデンサの製造方法において、上記金属化誘電
体フィルムを積層する際に、両者の間に絶縁物質を介在
させておき、上記プレスによって該絶縁物質を層間に拡
散させることを特徴とするコンデンサの製造方法。2. A plurality of metallized dielectric films formed by depositing an electrode metal on the surface of a dielectric film to form an electrode layer, or laminated and wound to form a capacitor element, and the capacitor. In a method for manufacturing a capacitor in which an element is pressed and shaped, an insulating material is interposed between the metallized dielectric films when they are laminated, and the insulating material is diffused between layers by the pressing. And a method for manufacturing a capacitor.
した透孔内に充填せしめることを特徴とする請求項１ま
たは２に記載のコンデンサの製造方法。3. The method of manufacturing a capacitor according to claim 1, wherein the insulating material is filled in the through holes formed in the dielectric film.
した凹部内に充填せしめることを特徴とする請求項１ま
たは２に記載のコンデンサの製造方法。4. The method of manufacturing a capacitor according to claim 1, wherein the insulating material is filled in the recess formed in the dielectric film.
に被着せしめることを特徴とする請求項１または２に記
載のコンデンサの製造方法。5. The method of manufacturing a capacitor according to claim 1, wherein the surface of the dielectric film is coated with the insulating material.
着せしめることを特徴とする請求項１に記載のコンデン
サの製造方法。6. The method of manufacturing a capacitor according to claim 1, wherein the insulating material is applied to the surface of the metal electrode foil.
しめることを特徴とする請求項２に記載のコンデンサの
製造方法。7. The method of manufacturing a capacitor according to claim 2, wherein the insulating material is applied to the surface of the electrode layer.
されていることを特徴とする請求項１乃至７の何れかに
記載のコンデンサの製造方法。8. The method of manufacturing a capacitor according to claim 1, wherein the insulating material is contained in microcapsules.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5353687A JP2893568B2 (en) | 1993-12-30 | 1993-12-30 | Manufacturing method of capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5353687A JP2893568B2 (en) | 1993-12-30 | 1993-12-30 | Manufacturing method of capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07201646A true JPH07201646A (en) | 1995-08-04 |
| JP2893568B2 JP2893568B2 (en) | 1999-05-24 |
Family
ID=18432541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5353687A Expired - Fee Related JP2893568B2 (en) | 1993-12-30 | 1993-12-30 | Manufacturing method of capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2893568B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114868215A (en) * | 2019-12-20 | 2022-08-05 | 京瓷株式会社 | Thin film capacitor element and thin film capacitor |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181112A (en) * | 1981-04-30 | 1982-11-08 | Kanan Hakukakou Kk | Insulator for condenser |
| JPS5963714A (en) * | 1982-10-04 | 1984-04-11 | ニツセイ電機株式会社 | Method of producing film condenser |
| JPS61125117A (en) * | 1984-11-22 | 1986-06-12 | マルコン電子株式会社 | Manufacture of capacitor |
| JPS62235716A (en) * | 1986-04-04 | 1987-10-15 | 日新電機株式会社 | Capacitor |
-
1993
- 1993-12-30 JP JP5353687A patent/JP2893568B2/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57181112A (en) * | 1981-04-30 | 1982-11-08 | Kanan Hakukakou Kk | Insulator for condenser |
| JPS5963714A (en) * | 1982-10-04 | 1984-04-11 | ニツセイ電機株式会社 | Method of producing film condenser |
| JPS61125117A (en) * | 1984-11-22 | 1986-06-12 | マルコン電子株式会社 | Manufacture of capacitor |
| JPS62235716A (en) * | 1986-04-04 | 1987-10-15 | 日新電機株式会社 | Capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114868215A (en) * | 2019-12-20 | 2022-08-05 | 京瓷株式会社 | Thin film capacitor element and thin film capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2893568B2 (en) | 1999-05-24 |
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