JPH0722986Y2 - Lifting structure for wiring storage - Google Patents
Lifting structure for wiring storageInfo
- Publication number
- JPH0722986Y2 JPH0722986Y2 JP1984011103U JP1110384U JPH0722986Y2 JP H0722986 Y2 JPH0722986 Y2 JP H0722986Y2 JP 1984011103 U JP1984011103 U JP 1984011103U JP 1110384 U JP1110384 U JP 1110384U JP H0722986 Y2 JPH0722986 Y2 JP H0722986Y2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- wiring path
- path
- floor
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Floor Finish (AREA)
- Connection Or Junction Boxes (AREA)
- Installation Of Indoor Wiring (AREA)
Description
【考案の詳細な説明】 本考案は、室内の電気配線路を形成するための配線収納
用揚床構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a raised floor structure for storing wiring for forming an electric wiring path in a room.
室内の電気配線路を形成するための床配線の方法として
は、従来床上に転がし配線を行ない、プロテクタと称す
る保護カバーをかぶせる方法か、フロアダクトと呼ばれ
る鋼製の配線路を床内に埋込む方法が行われていた。前
者は歩行中に保護カバーにつまづきやすく安全上問題が
あり、美観上も好ましくなく、後者は収容できる配線量
は多少多いが限度があり、配線の自由度も少いなどの欠
点があり、いずれも近年のOA機器類、電算機類などの普
及に対応することは困難である。またこれらの配線を処
理するために、大型電算機を収容する室に用いられるフ
リーアクセスと称するユニット形の二重床を利用するこ
とが考えられるが、これらは配線の自由度は確保される
もののかなり高価であり、その上20〜40cm程度の高さが
あるので建物の階高が高くなり、これらによってさらに
コスト高を招くなどの問題があり、一般的に活用できる
方法ではない。このほか、最近の状況を反映して、事務
室用の簡易な二重床が製品化されているが、これらにつ
いても手軽に利用できる安価なものは見られないという
欠点を有していた。The floor wiring method for forming the electric wiring path in the room is conventionally performed by rolling the wiring on the floor and covering it with a protective cover called a protector, or by embedding a steel wiring path called a floor duct in the floor. The way was done. The former has a safety problem because it easily trips over the protective cover during walking, which is unfavorable in terms of aesthetics, and the latter has the drawback that it has a limited amount of wiring that can be accommodated, but also has less freedom of wiring. It is difficult for any of them to cope with the recent spread of OA equipment and computers. In addition, in order to process these wirings, it is possible to use a unit type double floor called free access used in a room that houses a large computer, but these have the freedom of wiring. It is quite expensive, and it has a height of 20 to 40 cm, which increases the floor height of the building, which causes a problem of further cost increase, and is not a generally applicable method. In addition, reflecting the recent situation, simple double floors for offices have been commercialized, but they also had the drawback that no cheap ones that could be used easily were found.
本考案はこれらの欠点を除去したものであって、近年の
OA化の急速な普及や新しい情報通信サービスの本格的導
入が進みつつ状況をふまえ、これらに伴う配線量の急激
な増加に対応するため、内部に貫通中空部を有する既製
の板材を利用して、自由にかつ電線類を露出させること
なく配線を行うことができる安価な配線収納用揚床構造
を提供することを目的とするもので、以下図面によって
詳細に説明する。The present invention eliminates these drawbacks, and in recent years
In response to the rapid spread of office automation and the full-scale introduction of new information and communication services, in order to respond to the rapid increase in the amount of wiring that accompanies them, we will use ready-made plate materials with internal hollow parts. The purpose of the present invention is to provide a low-priced floor structure for storing wiring, which allows wiring to be carried out freely and without exposing electric wires, and will be described in detail below with reference to the drawings.
第1図は本考案の実施例の要部説明斜視図である。図に
おいて、1は建物躯体床面であり、2は床面上にセット
したライナーで、この上に内部に貫通中空部4を有する
板材3を敷き並べる。ライナー2は、板材3を敷き並べ
た時、板材間表面に目違いが生じないよう厚みを調節す
るが、床面が平らで板材間表面に目違いが生じない場合
は必ずしも必要としない。5は溝部である。複数個の板
材3を貫通中空部4の端部が見える側が対向するように
一定の間隔を保って敷き並べることにより形成される連
続した溝部5であってこの上部に板材3と表面が同一面
になるように蓋6をかぶせる。7は板材3の端部に設け
た蓋がかり、8は板材3の上部に設けた配線取出口、9
は電気配線である。FIG. 1 is a perspective view showing an essential part of an embodiment of the present invention. In the figure, reference numeral 1 denotes a building skeleton floor surface, 2 denotes a liner set on the floor surface, and a plate material 3 having a through hollow portion 4 therein is laid on the liner. The thickness of the liner 2 is adjusted so that the surface between the plate materials is not misaligned when the plate materials 3 are laid side by side, but it is not always necessary when the floor surface is flat and the surface between the plate materials is not misaligned. 5 is a groove. A continuous groove portion 5 formed by laying out a plurality of plate members 3 at regular intervals such that the sides where the ends of the through holes 4 are visible face each other. Cover 6 so that Reference numeral 7 denotes a cover provided at an end of the plate material 3, 8 denotes a wiring outlet provided at an upper portion of the plate material 3, and 9
Is electrical wiring.
本構造による配線路は次のように形成される。板材3の
貫通中空部4を配線路として使用する。板材3を貫通中
空部4が貫通方向に接して並べる場合は、貫通中空部4
が連続に貫通するように配置する。なお、板材3の横ず
れを防止するためには、数箇所おきに建物躯体床面1、
ライナー2、板材3の間を接着剤等により固定しておけ
ばよい。板材3を一定の間隔を保って敷き並べることに
より形成される溝部5は、これを蓋6で蔽い、貫通中空
部4の配線路と直交する主配線路(ヘッダタクト)とし
て用いる。主配線路の有効内法高さは、ライナー2を用
いてる場合は、ライナー2の厚みと板材3の厚みの和か
ら蓋6の厚みを差し引きしたもので、したがってライナ
ー2の厚みを変えることによってこの寸法を調節するこ
とができる。The wiring path according to this structure is formed as follows. The through hollow portion 4 of the plate member 3 is used as a wiring path. When the plate materials 3 are arranged so that the through hollow portions 4 are in contact with each other in the through direction, the through hollow portions 4
Are arranged so that they penetrate continuously. In addition, in order to prevent the lateral displacement of the plate material 3, the building body floor surface 1,
The liner 2 and the plate member 3 may be fixed to each other with an adhesive or the like. The groove portion 5 formed by laying the plate materials 3 at a constant interval is covered with a lid 6 and is used as a main wiring path (header tact) orthogonal to the wiring path of the through hollow portion 4. When the liner 2 is used, the effective inner height of the main wiring path is obtained by subtracting the thickness of the lid 6 from the sum of the thickness of the liner 2 and the thickness of the plate member 3. Therefore, by changing the thickness of the liner 2. This dimension can be adjusted.
この揚床上に設置される各装置類への配線9は、板材3
の上部に設けた配線取出口8から取出し接続する。配線
取出口8は、設置可能位置を表示した定規等の手段を用
いることにより貫通中空部4の上部の適切な位置に設け
ることができる。なお、この種の板材3で市販されてい
るものは石綿系、セメント系などの素材でつくられてお
り、配線取出口8の加工は容易に行うことができる。The wiring 9 to each device installed on this lift is the plate material 3
It is taken out and connected from the wiring outlet 8 provided on the upper part of the. The wiring outlet 8 can be provided at an appropriate position above the through hollow portion 4 by using a means such as a ruler indicating the installable position. The commercially available plate material 3 of this type is made of an asbestos-based material, a cement-based material, or the like, and the wiring outlet 8 can be easily processed.
第2図は、溝部5の主配線路内における配線交叉部の構
造を示す斜視図である。図は主配線路を横断して主配線
路に開口する一方の中空部の配線路から対抗する中空部
の配線路へ配線を行う場合の方法構造を示したものであ
る。第2図(a)において、10は主配線路内の配線9を
持ち上げるための受金物で、直交する方向に横断する電
線類9′を、主配線路内の配線9の下部をくぐらせ通線
する場合に用いる。第2図(b)は、前記と逆に主配線
路内の配線9の上部で、直交する配線9′を横断させる
場合を示したもので、11はこのための受金物である。な
お第1図と同じものは同じ符号付してあり以後も同じで
ある。FIG. 2 is a perspective view showing the structure of the wiring crossing portion in the main wiring path of the groove portion 5. The figure shows a method structure in the case where wiring is performed across the main wiring path from the wiring path of one hollow portion opened to the main wiring path to the wiring path of the hollow portion which opposes. In FIG. 2 (a), reference numeral 10 is a metal receiving object for lifting the wiring 9 in the main wiring path, and the electric wires 9'crossing in the orthogonal direction are passed under the lower portion of the wiring 9 in the main wiring path. Used when making a line. FIG. 2 (b) shows a case where the orthogonal wiring 9'is traversed above the wiring 9 in the main wiring path contrary to the above, and 11 is a metal receiving object for this. The same parts as those in FIG. 1 are designated by the same reference numerals, and the same applies thereafter.
第3図(a),(b)は本考案のほかの実施例の要部を
示す側面図とそのX−X断面図である。第3図(b)で
は配線9を省略してある。図に示すように主配線路の蓋
6の代りに、板材3と同じ材料を一部加工して蓋12を用
いている。蓋12は板材3の下面を貫通中空部4が露出す
る位置まで削りとったもので、これを蓋12として用いる
ことにより、主配線路からの配線9の分岐、蓋12の開閉
を自由に行うことができる。また図の示すように蓋12の
四隅の部分12′のみ板材を切りとらずに残し、板材3と
ともにライナー2の上に設置すれば、表面を同一面にそ
ろえることができる。FIGS. 3 (a) and 3 (b) are a side view and an XX sectional view of the essential part of another embodiment of the present invention. The wiring 9 is omitted in FIG. 3 (b). As shown in the figure, instead of the lid 6 of the main wiring path, the lid 12 is used by partially processing the same material as the plate material 3. The lid 12 is formed by cutting the lower surface of the plate material 3 to a position where the through hollow portion 4 is exposed. By using this as the lid 12, the wiring 9 can be branched from the main wiring path and the lid 12 can be freely opened and closed. be able to. Further, as shown in the figure, if only the four corners 12 'of the lid 12 are left uncut and placed on the liner 2 together with the plate 3, the surfaces can be flush with each other.
第4図は本考案のさらに他の実施例の要部を示す側面図
であり、本考案を既設建物に適用する場合の応用を示し
ている。建物の床は一般にコンクリート躯体床上に2〜
3cmの厚さのモルタルを塗り、この上にビニールタイル
等を貼って仕上げてある。図において13はモルタルであ
る。板材3を床上に直接敷き並べ、主配線路の部分の溝
部5は図に示すようにモルタルを撤去することにより主
配線の有効内法高を確保することができる。この方法、
構造によれば揚床の厚みをさらに薄くすることができ、
既存建物の事務室等に設置する場合にも、天井高の減少
を最小限におさえることができる。FIG. 4 is a side view showing a main part of still another embodiment of the present invention, showing an application of the present invention when applied to an existing building. Building floors are generally 2 to 2 above the concrete skeleton floor.
Mortar with a thickness of 3 cm is applied, and vinyl tiles etc. are pasted on top of this. In the figure, 13 is a mortar. By laying the plate materials 3 directly on the floor and removing the mortar from the groove portion 5 in the main wiring path, the effective inner height of the main wiring can be secured. This way,
According to the structure, the thickness of the raised bed can be further reduced,
Even when installed in an office of an existing building, the reduction in ceiling height can be minimized.
以上のように本考案は、既製の比較的安価な材料である
板材3を用い、主配線路からの配線の分岐、主配線路の
配線の交叉、室内の任意の位置への配線のとり出しを自
由に行うことができる揚床構造としたので経済的で手軽
な電気配線路を設けることができる。主配線路は必要な
位置に適且設けることができるので、機器配線量に見合
う配線収納空間を容易に形成することができる。また主
配線路を蔽う蓋は、自由に着脱できるので、配線作業を
容易に行うことができる。さらに、以上のような揚床構
造としたので、揚床全体の厚みを従来のフリーアクセス
などによる二重床方式にくらべてはるかに薄い例えば、
7〜8cm程度とすることができる。INDUSTRIAL APPLICABILITY As described above, the present invention uses the plate material 3 which is a ready-made relatively inexpensive material, and branches the wiring from the main wiring path, intersects the wiring of the main wiring path, and takes out the wiring to any position in the room. It is possible to provide an economical and convenient electric wiring path because it has a raised floor structure that can be freely performed. Since the main wiring path can be appropriately provided at a required position, it is possible to easily form a wiring storage space corresponding to the wiring amount of the device. Further, since the lid covering the main wiring path can be freely attached and detached, the wiring work can be easily performed. Furthermore, because of the lifting structure as described above, the thickness of the entire lifting bed is much thinner than the conventional double-bed system with free access, for example,
It can be about 7-8 cm.
以上説明したように、本考案の揚床構造は相当量の電気
配線の収容が可能で、配線の自由度が大きく、配線作業
が容易である。またこの揚床構造は、安価に市販されて
いる壁用あるいは床用の材料を活用して構成するので、
同程度の性能を有する他製品にくらべてはるかに経済的
である。また全体の厚みを薄くすることができるので建
物の階高におよぼす影響が少く、既存建物にも容易に適
用し得る利点も備えている。以上のように本考案は、最
近の情報通信サービスの高度化、多様化、OAの急速な一
般化による一般事務室への小形電算機、OA機器、各種端
末機器類の導入に対応できる有効かつ手軽な配線収納手
段として広く活用が期待できるという効果がある。As described above, the raised floor structure of the present invention can accommodate a considerable amount of electric wiring, has a high degree of freedom in wiring, and facilitates wiring work. Moreover, since this lifting structure is constructed by utilizing the materials for walls or floors that are commercially available at low cost,
It is much more economical than other products with similar performance. In addition, since the overall thickness can be reduced, there is little effect on the floor height of the building, and it has the advantage that it can be easily applied to existing buildings. As described above, the present invention is effective and adaptable to the introduction of small computers, OA equipment, and various terminal equipment into general offices due to the recent sophistication and diversification of information and communication services and the rapid generalization of OA. There is an effect that it can be widely used as a convenient means for storing wiring.
第1図は本考案の実施例の要部説明斜視図である。第2
図は溝部5の主配線路内における配線交叉部の構造を示
す斜視図である。第3図は本考案の他の実施例の要部を
示す側面図とそのX−X断面図である。第4図は本考案
のさらに他の実施例の要部を示す側面図である。 1……建物躯体床面、2……ライナー、3……板材、4
……貫通中空部、5……溝部、6,12……蓋、8……配線
取出口、9,9′……電気配線、13……モルタル。FIG. 1 is a perspective view showing an essential part of an embodiment of the present invention. Second
The figure is a perspective view showing the structure of the wiring crossing portion in the main wiring path of the groove portion 5. FIG. 3 is a side view showing an essential part of another embodiment of the present invention and a sectional view taken along line XX thereof. FIG. 4 is a side view showing an essential part of still another embodiment of the present invention. 1 …… Building body floor surface, 2 …… liner, 3 …… plate material, 4
... Hollow-through part, 5 ... Groove part, 6,12 ... Lid, 8 ... Wiring outlet, 9,9 '... Electric wiring, 13 ... Mortar.
───────────────────────────────────────────────────── フロントページの続き (72)考案者 水野 健五郎 東京都千代田区内幸町1丁目1番6号 日 本電信電話公社内 (72)考案者 松下 一郎 東京都港区虎ノ門1丁目21番8号 秀和第 3虎ノ門ビル 協同機材株式会社内 (56)参考文献 特開 昭54−113894(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Kengoro Mizuno 1-6, Uchisaiwaicho, Chiyoda-ku, Tokyo Japan Telegraph and Telephone Public Corporation (72) Ichiro Matsushita 1-21 Toranomon, Minato-ku, Tokyo Hidekazu No. 3 Toranomon Building Cooperative Equipment Co., Ltd. (56) Reference JP-A-54-113894 (JP, A)
Claims (1)
おいて、内部に配線路を形成する貫通中空部を設けた板
材の前記貫通中空部の開口端部を一定の間隔を保ち対向
させ、前記対向方向と直交する方向に複数の前記板材を
敷きならべ主配線路を設ける溝部を形成するとともに、
前記溝部の上面に装着自在の蓋を設けかつ前記板材の上
面の任意の位置に配線取り出し口を設けてなることを特
徴とする配線収納用揚床構造。1. In a floor structure of a building having an indoor electric wiring path, the open ends of the through hollow portions of a plate material having a through hollow portion for forming a wiring path are made to face each other with a constant interval, While laying a plurality of the plate members in a direction orthogonal to the facing direction to form a groove portion for providing a main wiring path,
A lifted floor structure for storing wiring, wherein a freely attachable lid is provided on an upper surface of the groove portion, and a wiring outlet is provided at an arbitrary position on the upper surface of the plate member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984011103U JPH0722986Y2 (en) | 1984-01-31 | 1984-01-31 | Lifting structure for wiring storage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984011103U JPH0722986Y2 (en) | 1984-01-31 | 1984-01-31 | Lifting structure for wiring storage |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60132132U JPS60132132U (en) | 1985-09-04 |
| JPH0722986Y2 true JPH0722986Y2 (en) | 1995-05-24 |
Family
ID=30492907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984011103U Expired - Lifetime JPH0722986Y2 (en) | 1984-01-31 | 1984-01-31 | Lifting structure for wiring storage |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722986Y2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62284854A (en) * | 1986-05-30 | 1987-12-10 | 共同カイテック株式会社 | Floor panel apparatus |
| JPH0543154Y2 (en) * | 1987-07-14 | 1993-10-29 | ||
| JPH0785617B2 (en) * | 1989-06-30 | 1995-09-13 | 株式会社日本ピット | Floor wiring equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4194332A (en) * | 1978-02-02 | 1980-03-25 | H. H. Robertson Company | Electrical wiring distribution system |
-
1984
- 1984-01-31 JP JP1984011103U patent/JPH0722986Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60132132U (en) | 1985-09-04 |
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