JPH0723268B2 - Ceramics-Metal bonding material - Google Patents

Ceramics-Metal bonding material

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Publication number
JPH0723268B2
JPH0723268B2 JP60196512A JP19651285A JPH0723268B2 JP H0723268 B2 JPH0723268 B2 JP H0723268B2 JP 60196512 A JP60196512 A JP 60196512A JP 19651285 A JP19651285 A JP 19651285A JP H0723268 B2 JPH0723268 B2 JP H0723268B2
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JP
Japan
Prior art keywords
metal
ceramics
silicon nitride
particle dispersion
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP60196512A
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Japanese (ja)
Other versions
JPS6256379A (en
Inventor
誠 白兼
昌子 中橋
達雄 山崎
博光 竹田
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Toshiba Corp
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Toshiba Corp
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Priority to JP60196512A priority Critical patent/JPH0723268B2/en
Publication of JPS6256379A publication Critical patent/JPS6256379A/en
Publication of JPH0723268B2 publication Critical patent/JPH0723268B2/en
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Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔発明の技術分野〕 本発明は、セラミックスと金属の接合部材に関する。TECHNICAL FIELD OF THE INVENTION The present invention relates to a joining member of ceramics and metal.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

窒化ケイ素、炭化ケイ素、アルミナ等の各種セラミック
スは、夫々が備えた特異な性質を生かすことにより構造
部材、各種機能部材として広く利用され始じめている。
その多くの場合は、セラミックスそれ自体を単独で利用
するという態様である。こうしたセラミックスに金属を
接合できるとすれば、得られた部材は新たな機能を備え
た部材として一層広い分野での利用が可能になるものと
考えられる。
Various ceramics such as silicon nitride, silicon carbide, and alumina have been widely used as structural members and various functional members by taking advantage of their unique properties.
In many cases, the ceramic itself is used alone. If a metal can be bonded to such ceramics, it is considered that the obtained member can be used in a wider field as a member having a new function.

上述したセラミックス−金属接合部材において、それが
構造部品である場合にはセラミックスと金属の接合強度
は充分に高いことが要求され、一方機能部材である場合
にはセラミックスと金属の接合界面では連続性を有する
ことが要求される。しかしながら、一般にセラミックス
と金属とは各々原子結合状態が相違する材料であり、両
者の反応性などの化学的性質;熱膨張率;電気伝導度な
どの物質的性質が互に異なるため、両者の接合時におい
ては、接合界面での冶金的接合状態が形成され難い。
In the above-mentioned ceramic-metal joint member, when it is a structural component, the joint strength between the ceramic and the metal is required to be sufficiently high, while when it is a functional member, there is continuity at the joint interface between the ceramic and the metal. Required to have. However, in general, ceramics and metals are materials having different atomic bond states, and their chemical properties such as reactivity; thermal expansion coefficient; electrical conductivity and other physical properties are different from each other. At times, it is difficult to form a metallurgical bonding state at the bonding interface.

ところで、従来よりセラミックスと金属とを冶金的に接
合する方法としては、以下に示す種々の方法が知られて
いる。
By the way, conventionally, the following various methods have been known as a method for metallurgically joining ceramics and metal.

セラミックスの金属と接合すべき面にMo−Ti−Wを
主成分とする粉末と有機バインダとの混合物を塗布し、
加湿した雰囲気中で1400〜1700℃に加熱して反応させ、
メタライジングと呼ばれる層を形成し、つづいてこのメ
タライジング層上にNiメッキを施した後、該Niメッキに
金属(例えばCu母材)をPb−Sn系半田などにより接合す
る方法。
Apply a mixture of powder containing Mo-Ti-W as the main component and an organic binder to the surface of the ceramic to be joined to the metal,
In a humid atmosphere, heat to 1400-1700 ° C to react,
A method in which a layer called metallizing is formed, then Ni plating is applied to the metallizing layer, and then a metal (for example, Cu base material) is bonded to the Ni plating by Pb-Sn solder or the like.

セラミックスと金属とをAu,Ptのような貴金属、つ
まり酸素との親和かが小さい金属を主成分とする合金を
用いて接合する方法。
A method of joining ceramics and a metal by using an alloy whose main component is a noble metal such as Au and Pt, that is, a metal having a small affinity for oxygen.

セラミックスと金属との接合部にTi,NbZrなどの活
性金属又は熱処理によって活性金属に転化する活性金属
水素化物を介在させた後、両者を高温、高圧下で接合す
る方法。
A method in which an active metal such as Ti or NbZr or an active metal hydride that is converted into an active metal by heat treatment is interposed at the joint between ceramics and metal, and then the two are joined at high temperature and high pressure.

しかしながら、上記の方法は必要とする行程数が多く
なり、煩雑であるという欠点を有する。上記の方法
は、簡単な工程で接合できるものの、高価な貴金属を使
用するため、経済的メリットは極めて少なく、しかもセ
ラミックスと金属とが十分に接触するように高い圧力を
必要とする。上記の方法は、活性金属の作用により強
固な接合が可能であるが、前記の方法と同様に高い接
合圧力を必要とするため、変形を嫌うような部品等には
適用することが好ましくない。
However, the above method has a drawback that it requires many steps and is complicated. Although the above method can be joined in a simple process, since an expensive precious metal is used, the economical merit is extremely small, and high pressure is required so that the ceramic and the metal come into sufficient contact with each other. Although the above method enables strong bonding due to the action of the active metal, it requires high bonding pressure as in the above method, and therefore is not preferably applied to parts or the like that are not susceptible to deformation.

このような問題を解決するために、米国特許法第2,857,
663号明細書には次のような接合方法が開示されてい
る。この方法は遷移金属とセラミックスの接合部に活性
金属を介在させ、該接合部を遷移金属と活性金属の合金
の融点より高く、遷移金属の融点より低い温度に加熱
し、遷移金属と活性金属の原子を相互に拡散せしめて合
金化し、この合金によって遷移金属とセラミックスとを
接合する方法である。
In order to solve such problems, US Patent No. 2,857,
No. 663 discloses the following joining method. In this method, an active metal is interposed in the joint between the transition metal and the ceramic, the joint is heated to a temperature higher than the melting point of the alloy of the transition metal and the active metal and lower than the melting point of the transition metal, This is a method in which atoms are diffused into each other to form an alloy, and a transition metal and a ceramic are joined by this alloy.

しかしながら、上記方法では得られたセラミックス−金
属接合部材を冷却する過程でセラミックスにクラックが
頻発するという問題がある。これは、セラミックスと金
属との間に発生する熱応力に基づく現象である。例え
ば、セラミックスがアルミナ、窒化ケイ素の場合、夫々
の線熱膨張係数は8.8×10-6/℃,2.5×10-6/℃であ
り、Cu,Ni,Feなどに比べてその値は約1桁小さいもの
で、両者の接合部に発生する熱応力は大きくなる。しか
も、熱応力は接合時の温度と冷却時の温度(室温)との
差が大きければ大きいほど増大する。従って、熱応力を
減ずるためには接合時の温度を低めることが求められ、
そのことは接合時に低融点のろう材の使用が要求される
ことになる。
However, the above method has a problem that cracks frequently occur in the ceramic during the process of cooling the obtained ceramic-metal joint member. This is a phenomenon based on the thermal stress generated between ceramics and metal. For example, if the ceramic is alumina, silicon nitride, linear thermal expansion coefficient of each is 8.8 × 10 -6 /℃,2.5×10 -6 / ℃ , its value than Cu, Ni, etc. Fe is about 1 It is a few orders of magnitude smaller, and the thermal stress generated at the joint between the two becomes larger. Moreover, the thermal stress increases as the difference between the temperature during joining and the temperature during cooling (room temperature) increases. Therefore, in order to reduce the thermal stress, it is required to lower the temperature at the time of joining,
This requires the use of a low melting point brazing material at the time of joining.

上述した問題点に対して特開昭56−163093号の接合方法
の提案や活性金属を含むろう材をセラミックスと金属の
両者に拡散せしめて構成した接合部材の開発がなされて
いる。しかしながら、これらの方法は複雑な工程、長時
間の熱処理が不可避であるため、生産性等の点で問題が
あり、しかもセラミックスと金属間の熱応力の緩和には
必ずしも有効ではない。
In order to solve the above-mentioned problems, Japanese Patent Application Laid-Open No. 56-163093 proposes a joining method and develops a joining member constituted by diffusing a brazing material containing an active metal into both ceramics and metal. However, these methods have problems in terms of productivity and the like because complicated steps and long-time heat treatment are unavoidable, and are not always effective in relaxing thermal stress between ceramics and metal.

上記手法の適用時における応力緩和を果たすための方法
としては、セラミックスと金属の間に軟質金属層を介在
させ、その塑性変形及び弾性変形によって熱応力を緩和
する方法(特開昭56−41879号)、セラミックスと金属
の間に線膨張率が両者の中間の値を有する材料の層を介
在させる方法(特開昭55−113678号)、セラミックスか
ら金属にかけて線膨張率が小から大へと変化する複数の
層を順次積層して介在させる方法(特開昭55−7544号)
などが開示されている。
As a method for achieving stress relaxation when the above method is applied, a soft metal layer is interposed between ceramics and metal, and thermal stress is relaxed by its plastic deformation and elastic deformation (Japanese Patent Laid-Open No. 56-41879). ), A method of interposing a layer of a material having a coefficient of linear expansion between ceramics and metal (Japanese Patent Laid-Open No. 55-113678), and the coefficient of linear expansion changes from small to large from ceramics to metals. A method of sequentially laminating a plurality of layers and interposing them (Japanese Patent Laid-Open No. 557544)
Etc. are disclosed.

しかしながら、活性金属を含むろう材での上記接合方法
の場合、接合面にかかる圧力によって、しばしば溶融ろ
う材が接合部からはみ出すことがある。このはみ出した
溶融ろう材の量が多くなると、凝固冷却する過程におい
て、セラミックスとろう材の熱膨張係数の差に基づく熱
応力によりセラミックスにクラックが生じることがあ
る。この現象を防止するためには、はみ出しがなく、か
つ接合部全面をろう材がぬらすのに必要な最適なろう材
の量(厚さ)を決めればよいが、用いる接合材料、接合
圧力、接合温度、雰囲気等の条件により、ろう材の最適
量を決めるのは非常に困難である。また、はみ出しを機
械的に防止する方法、例えばろう材とのぬれ性の悪い材
料を用いて接合部外周をシールする方法が考えられる
が、この方法はぬれ性の悪い材料の選定が困難であるば
かりか、接合工程の煩雑化を招くことになり、現実的な
方法とはいい難い。
However, in the case of the above-described joining method using a brazing filler metal containing an active metal, the molten brazing filler metal often protrudes from the joint due to the pressure applied to the joint surface. If the amount of the molten brazing filler metal that has overflowed increases, cracks may occur in the ceramics due to thermal stress due to the difference in thermal expansion coefficient between the ceramics and the brazing filler metal during the process of solidifying and cooling. In order to prevent this phenomenon, it is necessary to determine the optimum amount (thickness) of the brazing filler metal that has no protrusion and is necessary for the brazing filler metal to wet the entire joint area. It is very difficult to determine the optimum amount of brazing filler metal depending on conditions such as temperature and atmosphere. Further, a method of mechanically preventing the protrusion is possible, for example, a method of sealing the outer circumference of the joint with a material having poor wettability with the brazing material, but this method makes it difficult to select a material having poor wettability. Not only that, but it also complicates the joining process, which is difficult to call a realistic method.

〔発明の目的〕[Object of the Invention]

本発明は、高温での接合強度が高く、しかも熱影響によ
るセラミックスのクラック発生を防止したセラミックス
−金属接合部材を提供しようとするものである。
The present invention is intended to provide a ceramic-metal bonding member that has high bonding strength at high temperatures and that prevents cracking of ceramics due to thermal effects.

〔発明の概要〕[Outline of Invention]

本発明者らは、セラミックスと金属との間に応力緩衝部
材を介在せしめて全体をろう材で接合した接合部材につ
いて鋭意研究を重ねた結果、応力緩衝部材として粒子分
散強化型複合層を用いることによって、記述の如く高温
での接合強度が高く、しかも熱影響によるセラミックス
のクラック発生を防止したセラミックス−金属接合部材
を見い出した。
The present inventors have conducted intensive studies on a joining member in which a stress-absorbing member is interposed between ceramics and a metal and are wholly joined with a brazing material, and as a result, use of a particle dispersion strengthened composite layer as the stress-absorbing member. As described above, a ceramic-metal joining member having a high joining strength at high temperature as described above and preventing generation of cracks in the ceramic due to thermal influence was found.

すなわち、本発明に係わるセラミックス−金属接合部材
はセラミックスと金属の接合面に粒子分散強化型複合層
を介在させて接合され、かつ前記複合層は空孔率が1〜
30体積%でマトリックス金属中の粒子分散率が2〜12体
積%であることを特徴とするものである。
That is, the ceramic-metal bonding member according to the present invention is bonded to the bonding surface of the ceramic and the metal with the particle dispersion strengthening type composite layer interposed, and the composite layer has a porosity of 1 to 1.
It is characterized in that the particle dispersion rate in the matrix metal is 2 to 12% by volume at 30% by volume.

上記セラミックスとしては、例えばAl2O3,ZrO2などの
酸化物系セラミックス、SiC,TiCなどの炭化物系セラミ
ックス、Si3N4,AlNなどの窒化物系セラミックス等を挙
げることができる。
Examples of the ceramics include oxide ceramics such as Al 2 O 3 and ZrO 2 , carbide ceramics such as SiC and TiC, and nitride ceramics such as Si 3 N 4 and AlN.

上記金属としては、例えばFe,Ni,Co,Ti,Mo,W,Nb,Ta,Zr
又はこれらの合金等を挙げることができる。
Examples of the metal include Fe, Ni, Co, Ti, Mo, W, Nb, Ta, Zr.
Or these alloys etc. can be mentioned.

上記粒子分散強化型複合層は、粉末冶金法や内部酸化法
により得ることができる。かかる複合層のマトリックス
金属としては、例えばAl,Cu,Ni,Fe,Co,Ti,Zrなどを挙げ
ることができる。また、分散粒子としては例えばZrO2
CeO2,TiO2,SiO2,ThO2,Al2O3などを挙げることがで
き、かつその粒経は10μm以下が好ましく、小さければ
小さいほど効果的である。
The particle dispersion strengthened composite layer can be obtained by a powder metallurgy method or an internal oxidation method. Examples of the matrix metal of the composite layer include Al, Cu, Ni, Fe, Co, Ti and Zr. As the dispersed particles, for example, ZrO 2 ,
CeO 2 , TiO 2 , SiO 2 , ThO 2 , Al 2 O 3 and the like can be mentioned, and the grain size is preferably 10 μm or less, and the smaller, the more effective.

この際、粒子間距離が小さくなると、耐力が上がり、特
に高温での機械的強度が向上する。
At this time, when the distance between the particles is reduced, the yield strength is increased, and the mechanical strength is improved especially at high temperatures.

上記粒子分散強化型複合層の粒子分散率を限定したの
は、次のような理由によるものである。前記粒子分散率
を2体積%未満にすると、高温でのせん断強度が低下す
る。一方、前記粒子分散率が12体積%を越えると複合層
自体が硬くなり過ぎて応力緩和作用が不十分になる。
The reason why the particle dispersion rate of the particle dispersion strengthened composite layer is limited is as follows. When the particle dispersion rate is less than 2% by volume, the shear strength at high temperature is lowered. On the other hand, if the particle dispersion ratio exceeds 12% by volume, the composite layer itself becomes too hard and the stress relaxation effect becomes insufficient.

上記粒子分散強化型複合層の空孔率を限定したのは、次
のような理由によるものである。前記空孔率を1体積%
未満にすると、応力緩和作用を十分に発揮できなくな
る。一方、前記空孔率が30体積%を越えるとせん断強度
の低下を招く。より好ましい空孔率は、1〜10体積%で
ある。
The reason why the porosity of the particle dispersion strengthened composite layer is limited is as follows. The porosity is 1% by volume
If it is less than the above range, the stress relaxation effect cannot be sufficiently exhibited. On the other hand, when the porosity exceeds 30% by volume, the shear strength is lowered. A more preferable porosity is 1 to 10% by volume.

上記粒子分散強化型複合層(空孔を有するものも含む)
の厚さは、0.3mm以上にすることが望ましい。この理由
は、該複合層の厚さを0.3mm未満にすると、セラミック
スと金属との間に発生する熱応力を有効に吸収すること
が難しくなり、接合部の強度が著しく低下したり、セラ
ミックスにクラックが発生する恐れがある。
The above particle dispersion strengthened composite layer (including those having pores)
The thickness of is preferably 0.3 mm or more. The reason for this is that if the thickness of the composite layer is less than 0.3 mm, it becomes difficult to effectively absorb the thermal stress generated between the ceramic and the metal, and the strength of the joint is significantly reduced, or Cracks may occur.

このような粒子分散強化型複合層において、熱応力の吸
収に大きく寄与するのは、次のような作用によるもので
ある。
In such a particle dispersion-reinforced composite layer, the following effects largely contribute to the absorption of thermal stress.

(イ)マトリックス金属の硬さがHv80以上になる可能性
のあるNi,Fe,Co又はこれらの合金等で構成された粒子分
散強化型複合層中に無数に分散する微細空孔が熱応力を
吸収する。つまり、セラミックスと金属との熱膨張差か
ら生じる熱歪みを空孔部にて吸収する。
(A) Innumerable fine pores dispersed in the particle dispersion strengthened composite layer composed of Ni, Fe, Co or their alloys, which may have a hardness of matrix metal of Hv80 or more, cause thermal stress. Absorb. That is, the thermal strain caused by the difference in thermal expansion between the ceramics and the metal is absorbed by the holes.

(ロ)軟質のマトリックス金属、例えば硬さHv80以下の
Cu,Al等又はこれらの合金の塑性変形又は弾性変形によ
り熱応力を吸収する。
(B) Soft matrix metal, such as hardness Hv80 or less
Thermal stress is absorbed by plastic deformation or elastic deformation of Cu, Al, etc. or their alloys.

上記(イ)の空孔率が大きい場合、粒子分散強化型複合
層の強度が低下するため、強度低下を防ぐ目的で粒子分
散量を増大させ、一方空孔率が小さい場合、粒子分散量
を減少させるなどを行なって最も熱応力を緩和し、かつ
強度が向上する空孔率と粒子分散量を選択する。
When the porosity of the above (a) is large, the strength of the particle dispersion-reinforced composite layer decreases, so the particle dispersion amount is increased for the purpose of preventing the strength decrease, while when the porosity is small, the particle dispersion amount is The porosity and the amount of dispersed particles are selected so as to reduce the thermal stress most and to improve the strength by reducing the amount.

〔発明の実施例〕Example of Invention

以下、本発明の実施例を説明する。 Examples of the present invention will be described below.

実施例1 まず、直径13mm、厚さ5mmの窒化ケイ素円柱体、直径13m
m、厚さ5mmの構造用炭素鋼(JIS,S45C)の円板を用意し
た。また、直径15mm、厚さ0.8mmのNi−3重量%Al2O3
粒子分散強化型複合板(密度92〜93%、Al2O3の粒径0.0
5μm)を用意した。
Example 1 First, a silicon nitride cylinder having a diameter of 13 mm and a thickness of 5 mm, a diameter of 13 m
A disk of structural carbon steel (JIS, S45C) having a thickness of 5 mm and a thickness of 5 mm was prepared. Also, a particle dispersion strengthened composite plate of Ni-3 wt% Al 2 O 3 having a diameter of 15 mm and a thickness of 0.8 mm (density 92 to 93%, particle size of Al 2 O 3 0.0
5 μm) was prepared.

次いで、前記窒化ケイ素円柱体と炭素鋼円板の間に前記
複合板を介在させ、該窒化ケイ素円柱体と複合板の間及
び複合板と炭素鋼円板の間に夫々厚さ3μmのTi箔とCu
箔を挾んで重ね合せた後、10kg/cm2の圧力を加えながら
5×10-5Torr、950℃×4分間の条件で保持し、ひきつ
づきアルゴンガス中で冷却して窒化ケイ素−炭素鋼接合
部材を得た。
Then, the composite plate is interposed between the silicon nitride cylinder and the carbon steel disc, and a Ti foil and Cu having a thickness of 3 μm are respectively provided between the silicon nitride cylinder and the composite plate and between the composite plate and the carbon steel disc.
After sandwiching the foils and stacking them, hold them under the conditions of 5 × 10 -5 Torr and 950 ° C × 4 minutes while applying a pressure of 10 kg / cm 2 , and subsequently cool them in argon gas to bond silicon nitride-carbon steel. The member was obtained.

得られた接合部材について、接合面にせん断応力を加
え、室温から600℃までのせん断強さを測定した。ま
た、比較例1として粒子分散強化型複合板の代りに厚さ
0.8mmの純Ni板を用いた以外、実施例1と同条件で接合
した窒化ケイ素−炭素鋼接合部材を造り、同様にせん断
強さを測定した。これらの結果を図に示した。なお、図
中のA,Bは本実施例1,比較例1の接合部材の特性線を夫
々示す。
Shear stress was applied to the joint surface of the obtained joint member, and the shear strength from room temperature to 600 ° C. was measured. In addition, as Comparative Example 1, the thickness was used instead of the particle dispersion-reinforced composite plate.
A silicon nitride-carbon steel joint member was produced under the same conditions as in Example 1, except that a 0.8 mm pure Ni plate was used, and the shear strength was similarly measured. The results are shown in the figure. In addition, A and B in the figure show the characteristic lines of the joining members of the present Example 1 and Comparative Example 1, respectively.

図から明らかなように、本実施例1における接合部材
は、せん断強さが室温から600℃においていずれも11kg/
mm2以上であって、窒化ケイ素と炭素鋼の熱応力を充分
に緩和されていることが推定される。これに対し、比較
例1の場合は、室温から200℃において1〜2kg/mm2のせ
ん断強さが認められたが、接合部材の窒化ケイ素には既
にクラックが生じており、純Ni板では熱応力の緩和が充
分になされていないことがわかる。なお、300℃以上に
おいては、測定そのものができなかった。
As is clear from the figure, the joining members in Example 1 each have a shear strength of 11 kg / s from room temperature to 600 ° C.
It is presumed that the thermal stress of silicon nitride and carbon steel is sufficiently relaxed because it is at least mm 2 . On the other hand, in the case of Comparative Example 1, a shear strength of 1 to 2 kg / mm 2 was recognized at room temperature to 200 ° C., but cracks had already occurred in the silicon nitride of the joining member, and in the pure Ni plate It can be seen that the thermal stress is not relaxed sufficiently. The measurement itself could not be performed at 300 ° C or higher.

実施例2 実施例1と同様な窒化ケイ素円柱体と炭素鋼円板の間に
下記第1表に示す厚さ、密度の異なる直径15mmのCu−3
重量%Al2O3の粒子分散強化型複合板(Al2O3の粒径0.05
μm)を夫々介在させ、該窒化ケイ素円柱体と複合板の
間及び複合板と炭素鋼円板の間に厚さ10μmのAg箔、3
μmのTi箔を挾んで重ね合せた後、1kg/cm2の圧力を加
えながら5×10-5Torr,850℃×6分間の条件で保持し、
ひきつづきアルゴンガス中で冷却して6種の窒化ケイ素
−炭素鋼接合部材を得た。
Example 2 Between the same silicon nitride cylinder and carbon steel disc as in Example 1, Cu-3 having a diameter and a diameter of 15 mm shown in Table 1 below having different thicknesses and densities was used.
Weight% Al 2 O 3 particle dispersion strengthened composite plate (Al 2 O 3 particle size 0.05
10 μm thick Ag foil between the silicon nitride columnar body and the composite plate and between the composite plate and the carbon steel disc.
After sandwiching the Ti foil with a thickness of μm and stacking them, hold them under the conditions of 5 × 10 −5 Torr, 850 ° C. × 6 minutes while applying a pressure of 1 kg / cm 2 .
Subsequently, it was cooled in argon gas to obtain 6 kinds of silicon nitride-carbon steel joint members.

しかして、本実施例2〜7の接合部材について、接合面
に600℃でせん断応力を加え、高温せん断強さを測定し
た。その結果を同第1表に併記した。なお、第1表中に
は粒子分散強化型複合板の代りに厚さの異なる無酸素銅
板を用いて実施例2と同様な方法により得た4種の窒化
ケイ素−炭素鋼接合部材の高温せん断強さを比較例2〜
5として併記した。
Then, with respect to the joint members of Examples 2 to 7, shear stress was applied to the joint surfaces at 600 ° C., and the high temperature shear strength was measured. The results are also shown in Table 1 above. In Table 1, high temperature shearing of four kinds of silicon nitride-carbon steel joint members obtained by the same method as in Example 2 using oxygen-free copper plates having different thicknesses instead of the particle dispersion strengthened composite plate. Comparative strength 2 to strength
It was also written as 5.

上記第1表より明らかな如く、本実施例の接合部材のせ
ん断強さは粒子分散強化型複合板の厚さが0.1mmでは0.2
kg/mm2と極めて低く、熱応力の緩和がほとんどなされて
いない。同複合板の厚さが0.3mmとなると、熱応力の緩
和が進み、約3.6kg/mm2の強さが得られる。更に厚さが
増加し、0.8mmになると、せん断強さは約85kg/mm2に達
する。但し、厚さ0.8mmでも複合板の密度が低くなると
(実施例7;密度78.8%)、せん断強さが低下する。しか
し、この値は約5.9kg/mm2で、比較例に対し、高い値に
なっている。比較例2〜5でのせん断強さは最大で約3.
7kg/mm2であり、実施例の約44%しか得られない。
As is clear from Table 1 above, the shear strength of the joining member of this example is 0.2 when the thickness of the particle dispersion-reinforced composite plate is 0.1 mm.
It is extremely low at kg / mm 2, and thermal stress is hardly relaxed. When the thickness of the composite plate becomes 0.3 mm, the relaxation of thermal stress progresses and a strength of about 3.6 kg / mm 2 is obtained. When the thickness is further increased to 0.8 mm, the shear strength reaches about 85 kg / mm 2 . However, even if the thickness is 0.8 mm, when the density of the composite plate becomes low (Example 7; density 78.8%), the shear strength becomes low. However, this value is about 5.9 kg / mm 2 , which is higher than that of the comparative example. The maximum shear strength in Comparative Examples 2 to 5 is about 3.
It is 7 kg / mm 2 , and only about 44% of the examples can be obtained.

実施例8 まず、下記第2表に示す寸法の正方形で厚さ2mmの窒化
ケイ素板、同第2表に示す寸法の正方形で厚さ10mmの構
造用炭素鋼板を用意した。各々窒化ケイ素板と同寸法で
厚さ1.0mmのNi−3重量%Al2O3の粒子分散強化型複合板
(密度92〜93%、Al2O3粒径0.05μm)を用意した。
Example 8 First, a square silicon nitride plate having a size shown in Table 2 below and a thickness of 2 mm, and a square carbon steel plate having a size shown in Table 2 and a thickness of 10 mm were prepared. A particle dispersion strengthened composite plate of Ni-3 wt% Al 2 O 3 (density 92 to 93%, Al 2 O 3 particle size 0.05 μm) having the same dimensions as the silicon nitride plate and a thickness of 1.0 mm was prepared.

次いで、前記各窒化ケイ素板と各炭素鋼板の間に前記複
合板を夫々の窒化ケイ素板の寸法に対応して介在させ、
これら窒化ケイ素板と複合板の間及び複合板と炭素鋼板
の間に厚さ3μmのTi箔とCu箔を挾んで重ね合せた後、
実施例1と同様な条件で処理して10種の窒化ケイ素−炭
素鋼接合部材を得た。
Then, the composite plate is interposed between each of the silicon nitride plates and each of the carbon steel plates according to the dimensions of the respective silicon nitride plates,
After sandwiching Ti foil and Cu foil with a thickness of 3 μm between the silicon nitride plate and the composite plate and between the composite plate and the carbon steel plate,
By treating under the same conditions as in Example 1, ten kinds of silicon nitride-carbon steel joining members were obtained.

得られた接合部材の外観(窒化ケイ素のクラック発生の
有無)を観察した。その結果を、同第2表に併記した。
なお、第2表中には複合板の代りにそれら複合板と同一
寸法の純Ni板を用いた以外、実施例8と同様な方法で得
た窒化ケイ素−炭素鋼接合部材の外観観察結果を比較例
6として併記した。
The appearance (presence or absence of cracking of silicon nitride) of the obtained joint member was observed. The results are also shown in Table 2 above.
In Table 2, the appearance observation results of the silicon nitride-carbon steel joint member obtained by the same method as in Example 8 were used except that pure Ni plates having the same dimensions as the composite plates were used instead of the composite plates. It was also described as Comparative Example 6.

上記第2表より明らかな如く、本実施例8において窒化
ケイ素板の接合面が80mmまでクラックが生じず、粒子
分散強化型複合板による高い熱応力緩和効果が認められ
る。これに対し、比較例6の場合、窒化ケイ素板の接合
面が10mmのみでクラックが生じないが、それ以上の大
面積になるとクラックが発生し、純Ni板による熱応力緩
和効果が十分でないことがわかる。
As is clear from the above Table 2, in the present embodiment 8 bonding surface of the silicon nitride plates no cracks occur until 80 mm, is observed a high thermal stress relaxation effect of particle dispersion strengthened composite plate. On the other hand, in the case of Comparative Example 6, cracks did not occur when the bonding surface of the silicon nitride plate was only 10 mm, but cracks occurred when the area was larger than that, and the thermal stress relaxation effect of the pure Ni plate was not sufficient. I understand.

実施例9 まず、下記第3表に示す寸法の正方形で厚さ2mmの窒化
ケイ素板、同第3表に示す寸法の正方形で厚さ10mmの構
造用炭素鋼板を用意した。各々窒化ケイ素板と同寸法で
厚さ1.0mmのCu−3重量%Al2O3の粒子分散強化型複合板
(密度99.0%、Al2O3粒径0.05μm)を用意した。
Example 9 First, a square silicon nitride plate having a size shown in Table 3 below and a thickness of 2 mm, and a square carbon steel plate having a size shown in Table 3 and a thickness of 10 mm were prepared. Particle-dispersion-strengthened composite plates of Cu-3 wt% Al 2 O 3 (density 99.0%, Al 2 O 3 particle size 0.05 μm) each having the same dimensions as the silicon nitride plate and a thickness of 1.0 mm were prepared.

次いで、前記各窒化ケイ素板と各炭素鋼板の間に前記複
合板を夫々の窒化ケイ素板の寸法に対応して介在させ、
これら窒化ケイ素板と複合板の間及び複合板と炭素鋼板
の間に厚さ10μmのAg箔と3μmのTi箔を挾んで重ね合
せた後、実施例2と同様な条件で処理して9種の窒化ケ
イ素−炭素鋼接合部材を得た。
Then, the composite plate is interposed between each of the silicon nitride plates and each of the carbon steel plates according to the dimensions of the respective silicon nitride plates,
After sandwiching a 10 μm-thick Ag foil and a 3 μm-thick Ti foil between the silicon nitride plate and the composite plate and between the composite plate and the carbon steel plate and superposing them, the same treatment as in Example 2 was performed to obtain 9 types of nitriding. A silicon-carbon steel joining member was obtained.

得られた各接合部材の外観(窒化ケイ素板のクラック発
生の有無)を観察した。その結果を、同第3表に併記し
た。なお、第3表中には複合板の代りにそれら複合板と
同一寸法のリン脱酸銅(JIC C1221P)板を用いた以外、
実施例9と同様な方法で得た窒化ケイ素−炭素鋼接合部
材の外観観察結果を比較例7として併記した。
The appearance (presence or absence of cracks in the silicon nitride plate) of each of the obtained joint members was observed. The results are also shown in Table 3 above. In addition, in Table 3, except that instead of the composite plate, a phosphorus deoxidized copper (JIC C1221P) plate having the same dimensions as those composite plates was used,
The appearance observation result of the silicon nitride-carbon steel joint member obtained by the same method as in Example 9 is also shown as Comparative Example 7.

上記第3表より明らかな如く、本実施例9において窒化
ケイ素板の接合面が130mmと大面積になってもクラッ
ク発生は起きず、粒子分散強化型複合板(Cu−3重量%
Al2O3)による高い熱応力緩和効果が認められる。これ
に対し、比較例7の場合、窒化ケイ素板の接合面が20
mmまでのみクラックが生じないが、それ以上の大面積に
なるとクラックが発生する。
As is clear from Table 3 above, even if the bonding surface of the silicon nitride plate in Example 9 has a large area of 130 mm, cracking does not occur, and the particle dispersion strengthened composite plate (Cu-3% by weight) is used.
A high thermal stress relaxation effect due to Al 2 O 3 ) is observed. On the other hand, in the case of Comparative Example 7, the bonding surface of the silicon nitride plate was 20.
Cracks do not occur only up to mm, but cracks occur at larger areas.

〔発明の効果〕〔The invention's effect〕

以上詳述した如く、本発明によれば高温での接合強度が
高く、しかも熱影響によるセラミックスのクラック発生
(特に大面積の接合面でのクラック発生)を防止でき、
ひいては各種の構造部材、機能部材として有用な高信頼
性のセラミックス−金属接合部材を提供できる。
As described in detail above, according to the present invention, the bonding strength at high temperature is high, and the cracking of ceramics due to the heat effect (particularly the cracking on the bonding surface of a large area) can be prevented.
As a result, a highly reliable ceramic-metal joining member useful as various structural members and functional members can be provided.

【図面の簡単な説明】[Brief description of drawings]

図面は、本実施例1及び比較例1の窒化ケイ素−炭素鋼
接合部材の接合面に温度を加えてせん断強さを測定する
ことにより得た特性図である。
The drawings are characteristic diagrams obtained by measuring the shear strength by applying temperature to the joint surfaces of the silicon nitride-carbon steel joint members of Example 1 and Comparative Example 1.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 竹田 博光 神奈川県川崎市幸区小向東芝町1番地 株 式会社東芝総合研究所内 (56)参考文献 特開 昭60−65773(JP,A) 特開 昭60−246279(JP,A) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hiromitsu Takeda, 1 Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi, Kanagawa Incorporated Toshiba Research Laboratories (56) References JP-A-60-65773 (JP, A) Kaisho 60-246279 (JP, A)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】セラミックスと金属の接合面に粒子分散強
化型複合層を介在させて接合され、かつ前記複合層は空
孔率が1〜30体積%でマトリックス金属中の粒子分散率
が2〜12体積%であることを特徴とするセラミックス−
金属接合部材。
1. A ceramics-metal bonding surface is bonded with a particle dispersion strengthening type composite layer interposed, and the composite layer has a porosity of 1 to 30% by volume and a particle dispersion rate of 2 to 2 in a matrix metal. Ceramics characterized by being 12% by volume
Metal joining member.
JP60196512A 1985-09-05 1985-09-05 Ceramics-Metal bonding material Expired - Lifetime JPH0723268B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60196512A JPH0723268B2 (en) 1985-09-05 1985-09-05 Ceramics-Metal bonding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60196512A JPH0723268B2 (en) 1985-09-05 1985-09-05 Ceramics-Metal bonding material

Publications (2)

Publication Number Publication Date
JPS6256379A JPS6256379A (en) 1987-03-12
JPH0723268B2 true JPH0723268B2 (en) 1995-03-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
JP (1) JPH0723268B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120097746A (en) * 2020-10-07 2025-06-06 株式会社东芝 Joint body, ceramic circuit substrate and semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60246279A (en) * 1984-05-21 1985-12-05 株式会社日本自動車部品総合研究所 Bonded structure of ceramic body and metal body

Also Published As

Publication number Publication date
JPS6256379A (en) 1987-03-12

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