JPH07235207A - Backlight - Google Patents
BacklightInfo
- Publication number
- JPH07235207A JPH07235207A JP6022347A JP2234794A JPH07235207A JP H07235207 A JPH07235207 A JP H07235207A JP 6022347 A JP6022347 A JP 6022347A JP 2234794 A JP2234794 A JP 2234794A JP H07235207 A JPH07235207 A JP H07235207A
- Authority
- JP
- Japan
- Prior art keywords
- light
- face
- backlight
- reflecting
- reflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Liquid Crystal (AREA)
- Securing Globes, Refractors, Reflectors Or The Like (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Planar Illumination Modules (AREA)
- Light Guides In General And Applications Therefor (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、例えば、LED光源を
有する液晶表示部のバックライトに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a backlight of a liquid crystal display section having an LED light source, for example.
【0002】[0002]
【従来の技術】従来より、液晶表示部を照射するのに用
いられるバックライトは数多く提案されている。例え
ば、図10に示すように、バックライト100’は、L
ED素子4と、反射カバー1’と、拡散板12とを備え
るものである。LED素子4は、基板5上にLED素子
4を固定すると共に、LED光Rを反射する反射カバー
1’の一部に固定される。反射カバー1’は、基板5上
に固定される。また、LED素子4は、リード線3を介
してリードフレーム6に電気的に接続されている。LE
D光源4は、COBのLEDアレー、LEDランプ、L
EDチップランプ等が使用される。光源から放たれたL
ED光Rは、拡散板12の反射シート11と拡散面13
との間を反射しながら外部に出射される。このようにし
て、拡散板12は、面光源として機能するのである。ま
た、従来のバックライトの総厚は、拡散板の板厚t’よ
りも大きい構成のバックライトである。2. Description of the Related Art Conventionally, many backlights used for illuminating a liquid crystal display unit have been proposed. For example, as shown in FIG. 10, the backlight 100 ′ is L
The ED element 4, the reflection cover 1 ′, and the diffusion plate 12 are provided. The LED element 4 fixes the LED element 4 on the substrate 5, and also fixes it to a part of the reflection cover 1 ′ that reflects the LED light R. The reflection cover 1 ′ is fixed on the substrate 5. The LED element 4 is electrically connected to the lead frame 6 via the lead wire 3. LE
D light source 4 is a COB LED array, LED lamp, L
An ED chip lamp or the like is used. L emitted from the light source
The ED light R is reflected by the reflection sheet 11 and the diffusion surface 13 of the diffusion plate 12.
It is emitted to the outside while reflecting between the. In this way, the diffuser plate 12 functions as a surface light source. Moreover, the total thickness of the conventional backlight is larger than the plate thickness t ′ of the diffusion plate.
【0003】[0003]
【発明が解決しようとする課題】しかしながら、上記の
ように構成される従来例においては、バックライトとし
ての総厚は、LEDチップやCOBアレー等を使用する
と最小でも1.5mm幅程度が限界値であり、現在要求の多
い総厚0.8mm程度のバックライトをとしては適さないと
いう欠点があった。However, in the conventional example configured as described above, the total thickness of the backlight is limited to a width of at least about 1.5 mm when an LED chip or a COB array is used. However, it has a drawback that it is not suitable as a backlight with a total thickness of about 0.8 mm which is currently required.
【0004】また、従来のバックライトは、発光部反射
カバーの開口幅が広く構成されており、発光部反射カバ
ーの反射端面と拡散板12の端面(出射面18)との間
に隙間が存在せざるをえないものであった。このため、
光の漏れを防止することができずLED発光量に無駄が
生じるという問題があった。従って、本発明のバックラ
イトは、上記の事情に鑑みてなされたものであり、その
目的とするところは、総厚をより薄くして小型化でき、
発光された光の漏れを防止する光伝達効率の高いバック
ライトを提供することである。Further, in the conventional backlight, the opening width of the light emitting portion reflection cover is wide, and there is a gap between the reflection end surface of the light emitting portion reflection cover and the end surface (emission surface 18) of the diffusion plate 12. It had to be forced. For this reason,
There is a problem that the leakage of light cannot be prevented and the amount of light emitted from the LED is wasted. Therefore, the backlight of the present invention has been made in view of the above circumstances, and an object thereof is to make the total thickness thinner and downsize,
An object of the present invention is to provide a backlight having high light transmission efficiency that prevents leakage of emitted light.
【0005】[0005]
【課題を解決するための手段】上述の課題を解決し、目
的を達成するために、本発明のバックライトは、底面に
反射面を有してなる光拡散板部材の側面縁部から光源の
光を入光させ前記光拡散板部材の反射面と反対側の面か
ら出光させるバックライトであって、前記光源を保持す
る反射カバーと前記側面縁部との間に形成される空間部
の上下面に配設される反射面間の距離を前記光拡散板部
材の板厚に略一致させることを特徴としている。In order to solve the above-mentioned problems and to achieve the object, a backlight of the present invention is provided with a light source from a side edge portion of a light diffusing plate member having a reflecting surface on a bottom surface. A backlight for allowing light to enter and to exit from a surface of the light diffusing plate member opposite to the reflecting surface, which is on a space portion formed between a reflection cover holding the light source and the side edge portion. It is characterized in that the distance between the reflecting surfaces provided on the lower surface is made substantially equal to the plate thickness of the light diffusing plate member.
【0006】また、好ましくは、前記反射カバーは、前
記板厚と略同厚に形成されると共に前記光源からの光を
前記光拡散板部材側へと反射せしめる発光反射部と、前
記空間部の上下面のうち少なくとも一方を覆うつば部と
を備え、前記光拡散板部材の側面縁部に形成された凹部
に嵌合せしめることを特徴としている。Further, preferably, the reflection cover is formed to have substantially the same thickness as the plate thickness, and a light emitting reflection part for reflecting light from the light source to the light diffusion plate member side and a space part. The light diffusing plate member is characterized in that the light diffusing plate member is fitted in a recess formed in a side edge portion of the light diffusing plate member.
【0007】[0007]
【作用】以上のように、この発明に係わるバックライト
は構成されているので、反射カバーの開口幅と拡散板の
端面の厚さとを同等にすることにより、総厚をより薄く
して小型化でき、発光された光の漏れを防止する光伝達
効率の高いバックライトを提供できる。Since the backlight according to the present invention is configured as described above, the total thickness can be made thinner and smaller by making the opening width of the reflection cover and the thickness of the end surface of the diffuser plate equal. It is possible to provide a backlight with high light transmission efficiency that prevents leakage of emitted light.
【0008】[0008]
【実施例】以下に本発明の実施例につき、添付の図面を
参照して詳細に説明する。 図1は、本実施例のバック
ライトの外観図である。また、図2は、図1の組み立て
た状態の平面図。図3は、拡散板と反射シートとの構成
を示す斜視図。図4は、図1の発光部反射カバー1の正
面図。図5は、図4の平面図。図6は、発光部反射カバ
ー1の側面図である。以下、図1から図6を参照して、
本実施例のバックライトの構成を説明する。バックライ
ト100は、図1に示すように、発光部反射カバー1と
拡散板12を嵌合させてその外形が構成される。組み立
てる際には、発光部反射カバー1の両側面部9に延設さ
れた固定用突起部15と、拡散板12に設けられた凹部
16とを嵌合させることによって両者を固定する。ま
た、反射カバー1の上部には、両側に側面部9から突出
したつば部14が形成され、このつば部14によって、
反射カバー1が下方に抜け落ちることのないように、拡
散板12に当接する。また、バックライト100は、反
射シート11(図3参照)と、LED素子4を固定する
発光部反射カバー1と、LED素子4を実装する共に、
リード線3を介して、電気的に接続するリードフレーム
6と、LED光を反射し、拡散する拡散板12とを備え
る(図4参照)。また、バックライト100は、LED
素子4を2つ備えたバックライトである。発光部反射カ
バー1は、反射部端面1aと、側面部9と、LED素子
4及びリードフレーム分岐部8を固定する発光面1b
と、LED素子4から発光された光を通過させるレンズ
2とにより構成されている。レンズ2は、LED素子4
に対して凹状なレンズである。発光部反射カバー1は、
ガラス素材が混入されたPBTで製造されている。ま
た、反射カバー1は、LED光を反射端面1aと発光面
1bで反射できるように構成されている。また、発光部
反射カバー1と反射シート11との間には、リードフレ
ーム6が介在しており、LED素子4を固定するリード
フレームと、リード線3を介して発光素子4を電気的に
接続するリードフレームが夫々外部の基板5に対してハ
ンダ付けされて(図7、図8参照)、接続されている。
リードフレーム6は、好ましくは、フレキシブルな素材
で構成されており、後述するように折曲げられるように
設けられている。反射シート11の上面に取付けられて
いて、発光部反射カバー1の開口部に対向する部位には
拡散板12が設けられている。図3に示すように、拡散
板12は、LED光が入光する側面縁部14と、上面部
に出射面17を備え、底面部に反射シート11が取り付
けられている。また、拡散板12は、ある程度の厚さt
を有し、出射面18と反射シート11との間で導光路を
形成することでLED光を有効に拡散させ、反射出光さ
せるように構成されている。拡散板12の底面部の拡散
面13は、多数の凸部がLED素子4に近い側から遠ざ
かるに従って密になるように形成されており、凸部によ
る所謂グラディエーションパターンが形成され、LED
光の拡散及び反射を効率的に行なうようになされてい
る。また、反射シート11は、可撓性を有する材料であ
り、拡散板12と同面積に形成されている。そして、反
射シート11は、図1に示すように、反射カバー1が拡
散板12に固定された後に、拡散板12の裏面に接着剤
Cで接着固定される。尚、反射シート11の一方の面S
が、高反射率を有する反射面を形成している。Embodiments of the present invention will now be described in detail with reference to the accompanying drawings. FIG. 1 is an external view of the backlight of this embodiment. 2 is a plan view of the assembled state of FIG. FIG. 3 is a perspective view showing a configuration of a diffusion plate and a reflection sheet. FIG. 4 is a front view of the light emitting unit reflection cover 1 of FIG. 1. FIG. 5 is a plan view of FIG. 4. FIG. 6 is a side view of the light emitting unit reflection cover 1. Hereinafter, referring to FIGS. 1 to 6,
The structure of the backlight of this embodiment will be described. As shown in FIG. 1, the backlight 100 has an outer shape configured by fitting the light emitting unit reflection cover 1 and the diffusion plate 12 together. At the time of assembling, the fixing projections 15 extending on both side surfaces 9 of the light emitting section reflection cover 1 and the recesses 16 provided on the diffusion plate 12 are fitted to each other to fix them. Further, on the upper part of the reflection cover 1, a collar portion 14 protruding from the side surface portion 9 is formed on both sides, and by this collar portion 14,
The reflective cover 1 is in contact with the diffuser plate 12 so that the reflective cover 1 does not fall downward. Further, the backlight 100 mounts the reflection sheet 11 (see FIG. 3), the light emitting section reflection cover 1 for fixing the LED element 4, and the LED element 4,
A lead frame 6 that is electrically connected via the lead wire 3 and a diffuser plate 12 that reflects and diffuses LED light are provided (see FIG. 4). In addition, the backlight 100 is an LED
It is a backlight provided with two elements 4. The light emitting section reflection cover 1 has a light emitting surface 1b for fixing the reflection section end face 1a, the side surface section 9, the LED element 4 and the lead frame branch section 8.
And a lens 2 that allows the light emitted from the LED element 4 to pass therethrough. The lens 2 is the LED element 4
Is a concave lens. The light emitting part reflection cover 1 is
It is made of PBT mixed with glass material. Further, the reflection cover 1 is configured so that the LED light can be reflected by the reflection end surface 1a and the light emitting surface 1b. Further, a lead frame 6 is interposed between the light emitting unit reflection cover 1 and the reflection sheet 11, and the lead frame for fixing the LED element 4 and the light emitting element 4 are electrically connected via the lead wire 3. The respective lead frames are soldered to the external substrate 5 (see FIGS. 7 and 8) and connected.
The lead frame 6 is preferably made of a flexible material, and is provided so as to be bendable as described later. A diffusion plate 12 is attached to the upper surface of the reflection sheet 11 and faces the opening of the light-emitting reflection cover 1. As shown in FIG. 3, the diffuser plate 12 is provided with a side surface edge portion 14 through which LED light enters, an emission surface 17 on the upper surface portion, and the reflection sheet 11 is attached to the bottom surface portion. The diffusion plate 12 has a certain thickness t.
The light guide path is formed between the emission surface 18 and the reflection sheet 11 so that the LED light is effectively diffused and reflected and emitted. The diffusion surface 13 on the bottom surface of the diffusion plate 12 is formed such that a large number of convex portions become denser as the distance from the side closer to the LED element 4 increases, and a so-called gradation pattern is formed by the convex portions.
It is designed to efficiently diffuse and reflect light. The reflection sheet 11 is made of a flexible material and has the same area as the diffusion plate 12. Then, as shown in FIG. 1, the reflection sheet 11 is fixed to the back surface of the diffusion plate 12 with an adhesive C after the reflection cover 1 is fixed to the diffusion plate 12. Incidentally, one surface S of the reflection sheet 11
Form a reflective surface having a high reflectance.
【0009】また、後述する図9に示すように、発光部
反射カバー1の開口部(反射部端面1aと反射シート1
1との間の部分)の幅Xと拡散板12の厚さtとは同等
になるように設定されている。図5において、2つのL
ED素子4との間には、反射カバー1から延設された延
設部10が設けられ、反射カバー1を補強すると共に、
2つのLED素子4からのLED光がレンズ2を通過し
た後に導光板12の側面端部17方向に反射して効率よ
く出光するように設けられている。以上が本実施例のバ
ックライトの全体構成である。Further, as shown in FIG. 9 which will be described later, the opening of the light emitting part reflection cover 1 (the reflection part end face 1a and the reflection sheet 1).
The width X (the portion between 1) and the thickness t of the diffusion plate 12 are set to be equal. In FIG. 5, two L's
An extension portion 10 extending from the reflection cover 1 is provided between the ED element 4 and the ED element 4 to reinforce the reflection cover 1 and
It is provided so that the LED light from the two LED elements 4 passes through the lens 2 and then is reflected in the direction of the side surface end portion 17 of the light guide plate 12 to efficiently emit light. The above is the overall configuration of the backlight of this embodiment.
【0010】次に、図4から図6を参照して、本実施例
のバックライトの組立工程について説明する。図4から
図6において、図4に示すリードフレーム6は、リード
フレーム本体(不図示)から4本に分岐するリードフレ
ーム分岐部8を備えている。リードフレーム分岐部8の
端部には、LED素子4がリード線3と共に実装される
実装部と、端部から更に延長された延長部とが設けられ
ている。このリードフレーム分岐部8を含めるように、
前述したガラスが混入されたPCB樹脂で発光部反射カ
バーを成形する(インサート成形工程)。Next, with reference to FIGS. 4 to 6, an assembling process of the backlight of this embodiment will be described. 4 to 6, the lead frame 6 shown in FIG. 4 includes a lead frame branching portion 8 that branches from a lead frame body (not shown) into four. At the end portion of the lead frame branch portion 8, a mounting portion on which the LED element 4 is mounted together with the lead wire 3 and an extension portion further extended from the end portion are provided. To include this lead frame branching section 8,
The light emitting portion reflection cover is molded with the PCB resin mixed with the glass described above (insert molding step).
【0011】次に、リードフレーム分岐部8の延長部6
を、図6に示す如く、矢視Yの方向に折曲げ、反射端面
1aに平行で反射カバー1の背面(拡散板12とは反対
の部位)に突出するように折曲げる(端子部折曲げ工
程)。この状態で、4本のリードフレーム分岐部8のな
かで、2本の分岐部の端部にLEDチップ4を夫々ボン
ディングし、他の2本の端部にリード線3をボンディン
グする(ボンディング工程)。Next, the extension portion 6 of the lead frame branch portion 8
6 is bent in the direction of the arrow Y, as shown in FIG. Process). In this state, among the four lead frame branch portions 8, the LED chips 4 are respectively bonded to the ends of the two branch portions, and the lead wires 3 are bonded to the other two ends (bonding step). ).
【0012】その後、LEDチップ4とリード線3とを
保護するためにポッテングして、硬化させる(ポッティ
ング工程)。最後に、リードフレーム分岐部8の不要な
部分を切り落とした後、製品検査を行なって本実施例の
反射カバー1の完成となる(リードフレーム切り落とし
工程及び検査工程)。After that, the LED chip 4 and the lead wire 3 are potted to protect them and hardened (potting step). Finally, after cutting off unnecessary portions of the lead frame branching portion 8, product inspection is performed to complete the reflection cover 1 of this embodiment (lead frame cutting step and inspection step).
【0013】以上のような工程を経て、本実施例のバッ
クライトは製造される。また、反射カバー1と拡散板1
2とが固定された後、端子部折曲げ工程で後方に突出し
たリードフレーム6は、図7に示すように、実装基板5
上にハンダ付けされるか、図8に示すように基板に開け
られた穴に挿入してからハンダ付けされ、電気的に接続
される。The backlight of this embodiment is manufactured through the above steps. In addition, the reflection cover 1 and the diffusion plate 1
As shown in FIG. 7, the lead frame 6 protruding rearward in the step of bending the terminal portion after fixing
It is soldered on or inserted into a hole formed in the substrate as shown in FIG. 8 and then soldered and electrically connected.
【0014】次に、本実施例のバックライトによる光学
的な動作について説明する。図9は、本実施例のバック
ライトの模式的側面図である。図9において、LED素
子4から発光されたLED光Rは、そのまま直進して拡
散板12に入射するか、反射シート11又は反射端面1
aで夫々反射した後、拡散板12に入射される。反射シ
ート11のLED光Rが反射する面は、前述したよう
に、高反射率を有する反射面である。ここで、拡散板1
2に入射されたLED光Rは、拡散板12の出射面18
の内面と拡散板13又は反射シート11との間で反射を
繰り返して拡散板12内をLED素子4と反対側の方向
へと導かれる。その途中で、出射面18に臨界角以上で
到達した光は、出射面18から外部へと出射される。そ
の過程において、拡散面13に設けられた凸部からなる
乱反射部に到達した光は、そこで出射面18側へと乱反
射される。従って、この凸部は、LED素子4と反対側
に遠ざかるほど密にされているので、LED素子の近く
の部分だけ明るくなることなく、出射面18側までLE
D光が均一になるように形成されている。Next, the optical operation of the backlight of this embodiment will be described. FIG. 9 is a schematic side view of the backlight of this embodiment. In FIG. 9, the LED light R emitted from the LED element 4 goes straight on and enters the diffusion plate 12, or the reflection sheet 11 or the reflection end surface 1
After being reflected by a, they are incident on the diffusion plate 12. The surface of the reflective sheet 11 on which the LED light R is reflected is a reflective surface having a high reflectance as described above. Here, the diffusion plate 1
The LED light R incident on the light source 2 is emitted from the emission surface 18 of the diffusion plate 12.
The light is repeatedly guided between the inner surface of the diffusion plate 13 and the reflection sheet 11 and is guided in the diffusion plate 12 in the direction opposite to the LED element 4. On the way, the light reaching the emitting surface 18 at a critical angle or more is emitted from the emitting surface 18 to the outside. In the process, the light that reaches the irregular reflection portion formed of the convex portion provided on the diffusion surface 13 is irregularly reflected toward the emission surface 18 side there. Therefore, the protrusions are so dense as to move away from the LED element 4, so that only the portion near the LED element does not become bright, and the LE up to the emission surface 18 side.
The D light is formed to be uniform.
【0015】(実施例の効果)以上のように、反射カバ
ー1の開口部の幅Xを、拡散板12の板厚tと同等に加
工し、反射シート11を基部として組み立てることによ
って、拡散板12と発光部反射カバー1との間に生じる
隙間を無くし、LED光Rの外部へのもれを防止できる
のである。(Effects of the Embodiment) As described above, the width X of the opening of the reflection cover 1 is processed to be equal to the plate thickness t of the diffusion plate 12, and the reflection sheet 11 is assembled as a base portion to form the diffusion plate. It is possible to prevent the LED light R from leaking to the outside by eliminating the gap generated between 12 and the light emitting section reflection cover 1.
【0016】また、漏れを防止できることから、出射面
18から出射される光の輝度のバラツキを防止できるの
である。また、反射カバーの下部フレーム部を取り去
り、反射シート11に直接固定して、開口部の幅と拡散
板の板厚とを同じにすることから、バックライトの小型
化が実現できるのである。Further, since the leakage can be prevented, it is possible to prevent the variation in the brightness of the light emitted from the emission surface 18. Further, the lower frame portion of the reflection cover is removed and directly fixed to the reflection sheet 11 so that the width of the opening and the thickness of the diffusion plate are the same, so that the backlight can be downsized.
【0017】また、樹脂インサート成形によって製造さ
れるので、量産する際の加工精度のバラツキを最小に抑
えることができる。尚、本発明は、その趣旨を逸脱しな
い範囲で上記実施例を修正又は変形したものに適用可能
である。例えば、本実施例の用途として、ハンディター
ミナルやページャ等の小型機器に用いられる液晶ディス
プレイのバックライトの構成を説明したが、もちろんそ
れに限られるものはない。また、拡散面の粗面化は、一
体成形による突起のグラディエーションパターンに限定
されるものでなく、白インキのドットパターンを印刷す
るグラジェーションパターンや、ヘアライン加工による
粗面化でも良いことは言うまでもない。Further, since it is manufactured by resin insert molding, it is possible to minimize variations in processing accuracy in mass production. The present invention can be applied to the modified or modified embodiment described above without departing from the spirit of the invention. For example, although the configuration of the backlight of the liquid crystal display used for a small device such as a handy terminal or a pager has been described as the application of the present embodiment, it is not limited to this. Further, the roughening of the diffusion surface is not limited to the projection gradation pattern formed by integral molding, and it is also possible to use a gradation pattern for printing a white ink dot pattern or roughening by hairline processing. Needless to say.
【0018】[0018]
【発明の効果】以上説明のように、本発明のバックライ
トによれば、発光部反射カバーの開口幅と拡散板の端面
の厚さとを同等にすることにより、総厚をより薄くして
小型化でき、発光された光の漏れを防止する光伝達効率
の高いバックライトを提供できる効果がある。As described above, according to the backlight of the present invention, by making the opening width of the light emitting section reflection cover and the thickness of the end surface of the diffusion plate equal, the total thickness can be made thinner and the size can be reduced. Therefore, there is an effect that it is possible to provide a backlight having high light transmission efficiency that prevents leakage of emitted light.
【図1】本実施例のバックライトの概略を示す斜視図で
ある。FIG. 1 is a perspective view showing an outline of a backlight of this embodiment.
【図2】本実施例のバックライトの平面図である。FIG. 2 is a plan view of a backlight of this embodiment.
【図3】拡散板と反射シートとの構成を示す斜視図であ
る。FIG. 3 is a perspective view showing a configuration of a diffusion plate and a reflection sheet.
【図4】発光部反射カバーの正面図である。FIG. 4 is a front view of a light emitting unit reflection cover.
【図5】図4の平面図である。FIG. 5 is a plan view of FIG.
【図6】図5の側面図である。FIG. 6 is a side view of FIG.
【図7】本実施例のバックライトを基板に実装するとき
の実装形態の一例を示す図である。FIG. 7 is a diagram showing an example of a mounting form when mounting the backlight of the present embodiment on a substrate.
【図8】本実施例のバックライトを基板に実装するとき
の実装形態の一例を示す図である。FIG. 8 is a diagram showing an example of a mounting form when mounting the backlight of the present embodiment on a substrate.
【図9】本実施例ののバックライトの概略と光の動作原
理を示す側面図である。FIG. 9 is a side view showing the outline of the backlight and the operating principle of light according to the present embodiment.
【図10】従来のバックライトの概略と光の動作原理を
示す側面図である。FIG. 10 is a side view showing the outline of a conventional backlight and the operating principle of light.
1 発光部反射カバー 1a 反射端面 1b 反射側面 2 レンズ 3 リード線 4 LED素子 5 実装基板 6 リードフレーム 8 リードフレーム分岐部 9 反射カバー側面部 10 反射カバー延設部 11 反射シート 12 拡散板 13 拡散面 t 拡散板厚さ R 光源からの光 DESCRIPTION OF SYMBOLS 1 Light emitting part reflective cover 1a Reflective end face 1b Reflective side face 2 Lens 3 Lead wire 4 LED element 5 Mounting board 6 Lead frame 8 Lead frame branching part 9 Reflective cover side part 10 Reflective cover extension part 11 Reflective sheet 12 Diffuser 13 Diffuse surface t Diffuser thickness R Light from light source
Claims (2)
の側面縁部から光源の光を入光させ前記光拡散板部材の
反射面と反対側の面から出光させるバックライトであっ
て、 前記光源を保持する反射カバーと前記側面縁部との間に
形成される空間部の上下面に配設される反射面間の距離
を前記光拡散板部材の板厚に略一致させることを特徴と
するバックライト。1. A backlight for allowing light of a light source to enter from a side edge portion of a light diffusing plate member having a reflecting surface on a bottom surface and to emit light from a surface opposite to the reflecting surface of the light diffusing plate member. And making the distance between the reflection surfaces arranged on the upper and lower surfaces of the space formed between the reflection cover holding the light source and the side edge substantially equal to the plate thickness of the light diffusion plate member. Backlight characterized by.
形成されると共に前記光源からの光を前記光拡散板部材
側へと反射せしめる発光反射部と、 前記空間部の上下面のうち少なくとも一方を覆うつば部
とを備え、 前記光拡散板部材の側面縁部に形成された凹部に嵌合せ
しめることを特徴とする請求項1に記載のバックライ
ト。2. The reflection cover is formed to have substantially the same thickness as the plate thickness, and a light emitting reflection part for reflecting light from the light source to the light diffusion plate member side; and upper and lower surfaces of the space part. The backlight according to claim 1, further comprising a flange portion that covers at least one of the flange portions, the flange portion being fitted in a concave portion formed in a side edge portion of the light diffusion plate member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6022347A JPH07235207A (en) | 1994-02-21 | 1994-02-21 | Backlight |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6022347A JPH07235207A (en) | 1994-02-21 | 1994-02-21 | Backlight |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07235207A true JPH07235207A (en) | 1995-09-05 |
Family
ID=12080144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6022347A Withdrawn JPH07235207A (en) | 1994-02-21 | 1994-02-21 | Backlight |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07235207A (en) |
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