JPH0724215Y2 - Organizer for semiconductor chips - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a semiconductor chip organizer that is easy to assemble and disassemble and is installed in a manufacturing site or the like.

[Prior Art] Generally, semiconductor chips delivered from a semiconductor manufacturer are packaged in a rectangular cardboard case and stored in an organizing shelf. FIG. 4 shows a conventional example of a semiconductor chip arranging shelf for storing such a cardboard case. Reference numeral 1 is a steel shelf column, and 2 and 3 are a bottom plate and an upper plate which are horizontally stretched between the shelf columns 1. So, these are generally made of wood. Reference numeral 4 denotes a steel partition plate that partitions the bottom plate 2 and the upper plate 3 into a plurality of storage chambers 5 at a required interval in the horizontal direction, and 6 denotes a cardboard case that stores semiconductor chips (not shown). The cardboard case 6 is stored in the storage room 5 according to its size. At the time of storage in the storage chamber 5, the front lid of the cardboard case 6 is cut off and stored in order to facilitate the work of taking out the semiconductor chip. The entire semiconductor chip is packed in a plastic bag and housed in the cardboard case 6.

[Problems to be solved by the invention] By the way, in such a conventional shelf for semiconductor chips, the bottom plate 2 and the upper plate 3 are fixed to the shelf column 1 by fastening means such as bolts, and the partition plate 4 is bolted. Since it is fixed to the bottom plate 2 and the upper plate 3 by fastening means such as
Not only is the assembling and disassembling work troublesome, but there is also a problem that the structure (capacity) of the shelf cannot be easily changed according to the size of the cardboard case 6.

In addition, since the bottom plate 2 and the top plate 3 are made of wood, there is no escape area for static electricity generated when the cardboard case 6 is taken in and out,
There is also a problem that it is charged as it is and causes performance deterioration of the semiconductor chip.

Therefore, the present invention has been made in view of the above-mentioned conventional problems, and the purpose thereof is to use existing shelf stanchions as they are and to install them between them. An object of the present invention is to provide an assembling type semiconductor chip organizing shelf in which the sizes of the shelves and the storage chambers can be arbitrarily changed according to the installation space and the size of the cardboard case to be stored.

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a device according to claim 1, wherein a plurality of partition plates arranged substantially vertically and horizontally and between these partition plates. A plurality of horizontally extending partition shelves and a plurality of adjusting screws respectively provided on the outer left and right partition plates are provided, and each partition plate is composed of a pair of upper and lower partition plate constituent members. The partition plate constituting members are connected to each other by fitting the connecting portions provided at one end thereof, and a plurality of holding grooves capable of holding the partition shelves are formed on both sides of each partition plate constituting member. The front end surface of the partition plate is protected by an end protection cover formed with engaging claws, and the plurality of adjustment screws are arranged outside the left and right partition plates on the outer side, and are provided on the bottom plate and the upper plate. Characterized by pressure contact with the inner surface of a plurality of fixed shelf columns And

According to a second aspect of the present invention, in the first aspect of the invention, the partition plate, the partition shelf, and the end protection cover are made of an aluminum material or a conductive resin.

[Operation] In the present invention, the pair of upper and lower partition plate constituent members form a partition plate. The pair of partition plate constituent members have a plurality of holding grooves, and selectively hold the partition shelves to arbitrarily change the sizes of the shelves and the storage chambers according to the size of the cardboard case. The end protection cover has engaging claws and protects the front end surface of the partition plate. The adjusting screw is pressed against the shelf pillars to bulge the outer partition plate and impart rigidity to the shelf to stabilize all partition plates and partition shelves.

[Embodiment] Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings.

FIG. 1 is a partially broken front view showing an embodiment of a semiconductor chip arranging shelf according to the present invention, FIG. 2 is a partially cutaway plan view of the same arranging shelf, and FIG. 3 is an outer partition plate and an end portion. It is a perspective view of a protection cover. In these drawings, a rearrangement shelf 10 is an existing shelf support 1 composed of four standing uprights in front, back, left and right.
These are installed by using these in between, and a plurality of partition plates 11 are set up vertically at a required interval in the horizontal direction.
And a plurality of partition shelves 12 that are respectively placed between the partition plates 11
It has and.

Each partition plate 11 is assembled by a pair of upper and lower partition plate constituent members 13A and 13B. Each partition plate constituent member 13A, 13B is formed in the same shape by extrusion molding of aluminum, aluminum alloy, or the like, or conductive resin, and the connecting portion 14 integrally provided at one end thereof is detachably coupled by mutual fitting. By doing so, they are integrally connected. The connecting portion 14 is composed of a long side portion 14A, which is opposed to the left and right at a distance substantially equal to the plate thickness of the partition plate constituent member, and a short side portion 14B (Fig. 3), and the long side portion 14A is the other side partition. The long side portion 14A and the short side portion 14 of the plate constituent member
The upper and lower partition plate constituting members 13A and 13B are connected to each other by being fitted and inserted between B.

In this case, when connecting the partition plate constituent members 13A, 13B,
The lower partition plate constituent member 13B is erected upright with its connecting portion 14 facing upward, and the upper partition plate constituent member 13A is vertically inverted so that the connecting portion 14 faces downward, and is reversed back and forth, That is, the long side portion 1 of the connecting portion 14 of the upper partition plate constituent member 13A
The positional relationship between 4A and the short side portion 14B is left-right opposite to the positional relationship between the long side portion 14A and the short side portion 14B of the connecting portion 14 of the lower partition plate constituent member 13B, and the long side portion 14A is arranged from above. , The long side portion 14A of the connecting portion 14 of the lower partition plate constituent member 13B between the connecting portion 14A and the short side portion 14B of the lower partition plate constituent member 13B
The long side portion 14A and the short side portion 14B of the connecting portion of A are fitted and fitted to each other.

On both side surfaces of each of the partition plate constituent members 13A and 13B, a plurality of pairs, for example, four pairs of protrusions 15A and 15B, which face each other vertically and extend the entire length in the depth direction, are arranged in the height direction. The projections 15A and 1A are integrally projected at a required interval.
The groove between 5B forms a holding groove 16 for holding the end of the partition shelf 12.

An end protection cover 17 is fitted and fixed to the front end surface of each partition plate 11 from the front. The end protection cover 17 is made of an extrusion mold material such as aluminum or a conductive resin in a U-shape in a plan view, and an engaging claw 18 having a substantially triangular cross section is formed on the inner surface of the tip portion of one side wall of the cover 17. It is integrated over the entire length in the height direction. The engaging claw 18 engages with a substantially triangular engaging concave portion 20 which is formed by cutting out at the front end portions of the projecting bodies 15A and 15B of the partition plate constituting members 13A and 13B, whereby the end protection cover 17 is formed. Is detachably attached to the front end surface of the partition plate 11.

In this case, the upper and lower partition plate constituent members 13A and 13B as described above.
When the two are joined, one of them is turned upside down and turned back and forth, so that the engaging recess 2 of the upper partition plate constituting member 13A is joined.
0 and the engaging recess 20 of the lower partition plate constituting member 13B are formed so as to be vertically overlapped in series as shown in FIG. 3 when the both partition plate constituting members 13A and 13B are integrally coupled. ing. Therefore, the shapes of the partition plate constituting members 13A and 13B are different in that the formation positions of the engaging recesses 20 are different, but since such engaging recesses 20 are formed by post-processing, the partition plate constituting members 13A and 13B are formed. The same extrusion mold can be used to manufacture itself.

Furthermore, among the partition plates 11, the partition plates 11 located at the left end and the right end of the organizing shelves have a total of eight adjusting screws 22 at the front end and the rear end respectively corresponding to the shelf post 1. Installed.

The partition shelf 12, like the partition plate constituting members 13A, 13B and the end protection cover 17, is formed in a flat plate shape by an extruded aluminum material or a conductive resin, and both ends of the partition plate 11 located on both sides. It is inserted and held in the holding groove 16.

The organizing shelf 10 having such a configuration is installed on the bottom plate 2 which is horizontally stretched between the shelf columns 1 and has two partition plates on both sides.
It is fixed to the shelf column 1 by 11 adjusting screws 22. That is, each adjusting screw 22 is rotationally adjusted from the inside of the organizing shelf 10 by an appropriate tool 23 such as a screwdriver, and its tip is pressed against the inner side surface of the shelf strut 1, so that the partition plates 11 on both sides are moved inward. Move it and stretch it, this will organize
10 has rigidity and the partition plate 11 is stabilized. Further, when the partition plates 11 on both sides are moved inward, the respective partition shelves 12 are clamped by the holding grooves 16 of the partition plates 11 on both sides, and movement in the left-right front-back direction is restricted.

A name plate 24 is attached to the upper end of the front surface of the organizing shelves 10 installed between the shelf columns 1 to indicate the types of semiconductor chips corresponding to the storage chambers partitioned by the partition plates 11. There is.

Thus, in such an arrangement shelf 10, the partition plate 11 and the partition shelf 12 can be assembled without using any fastening means such as bolts, so that they can be easily and easily assembled at the installation site. Easy to disassemble. Further, the attachment work to the existing shelf column 1 is simple and easy because it is only necessary to push the two partition plates 11 on both sides by the adjusting screw 22. Further, if the width of the partition shelf 12 is changed, the width dimension of the organizer shelf 10 can be freely changed, and the space between the shelf columns 1 can be dealt with. Also, partition shelves 12
Can be rearranged freely with respect to the holding groove 16 and can be stored in a small amount by being inserted into the holding groove 16 according to the height dimension of the cardboard case 6. Also, the end protection cover 17
Is fitted to the front end of the partition plate 11, so that when the semiconductor chip is taken out from the cardboard case 6, the vinyl bag for packaging the semiconductor chip is caught on the front end of the partition plate 11 and is torn or broken. Accidents such as chip damage can be prevented in advance. Furthermore, since the partition plate 11, the partition shelf 12, and the end protection cover 17 are made of a conductive material and allow static electricity to escape through the shelf column 1, it is possible to prevent performance deterioration of the semiconductor chip due to static electricity.

The present invention can be modified and changed in various ways without being limited to the structure of the above-described embodiment.
The adjusting screw 22 is attached to only one of the 11 and the other is pressed against the inner surface of the shelf support 1, or the partition plate 11 is not composed of the two partition plate constituent members 13A and 13B. Of course, it may be configured by one plate.

[Advantages of the Invention] As described above, the semiconductor chip organizing shelf according to the present invention is composed of a plurality of partition plates and partition shelves that are horizontally bridged with both ends held between these partition plates. Since the adjusting screw attached to the partition plate is pressed against the shelf column to make the partition plate stretched, it is possible to stably support the partition plate and partition shelf with sufficient rigidity, and to fasten bolts, etc. Since no means is used, the work of assembling and disassembling the partition plate and the partition shelf is simple and easy. Moreover, since the partition shelf can be made to have an arbitrary width and the holding groove for holding a plurality of partition shelves is provided on the partition plate, the size of the storage chamber can be arbitrarily changed. Further, when the partition plate and the partition shelf are made of a conductive material, static electricity generated during the arrangement and storage of the semiconductor chips can be grounded, so that the performance deterioration of the semiconductor chips due to the static electricity can be prevented.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view showing an embodiment of a semiconductor chip arranging shelf according to the present invention, FIG. 2 is a partially cutaway plan view of the same arranging shelf, and FIG. 3 is an outer partition plate and an end portion. FIG. 4 is a perspective view of a protective cover, and FIG. 4 is a perspective view showing a conventional example of a cabinet. 1 ... Shelf column, 2 ... Bottom plate, 3 ... Top plate, 4 ... Partition plate, 5 ... Storage room, 6 ... Cardboard case, 10 ... Organizer, 11 ... Partition plate, 12 ... Partition shelves, 13A, 13B ... Partition plate components, 14 ... Couplings, 16 ... Holding grooves, 17 ... End protection cover, 22 ... Adjusting screws.

Claims (2)

[Scope of utility model registration request] 1. A plurality of partition plates arranged substantially vertically and in a horizontal direction, a plurality of partition shelves extending horizontally between the partition plates, and a plurality of partition plates provided on the left and right outer partition plates, respectively. With each adjusting screw, each of the partition plates is composed of a pair of upper and lower partition plate constituent members, the pair of partition plate constituent members are connected to each other by the fitting of the connecting portions provided at one end thereof, or A plurality of holding grooves capable of holding the partition shelf are formed on both sides of each partition plate constituent member, and the front end surface of the partition plate is protected by an end protection cover formed with engaging claws. The semiconductor chip is characterized in that the plurality of adjusting screws are arranged outside the left and right partition plates on the outer side and are in pressure contact with inner surfaces of a plurality of shelf columns fixed to a bottom plate and an upper plate. Organizer for. 2. The semiconductor chip organizer according to claim 1, wherein the partition plate, the partition shelf and the end protection cover are made of an aluminum material or a conductive resin.