JPH0724295A - Gas supply device with cylinder - Google Patents
Gas supply device with cylinderInfo
- Publication number
- JPH0724295A JPH0724295A JP16924593A JP16924593A JPH0724295A JP H0724295 A JPH0724295 A JP H0724295A JP 16924593 A JP16924593 A JP 16924593A JP 16924593 A JP16924593 A JP 16924593A JP H0724295 A JPH0724295 A JP H0724295A
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- supply device
- cooling
- gas supply
- jacket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Abstract
(57)【要約】
【目的】 シリンダの表面における結露の防止を通じて
ロードセルの故障を防止できるシリンダ付ガス供給装置
を提供する。
【構成】 シリンダーキャビネットの内部にシリンダ２
を囲繞するジャケット７を収納するとともに、このジャ
ケット７を、冷却水を流通させてシリンダ２を冷却する
冷却層１２と、この冷却層１２の外周に位置する真空断
熱層１５とから二重構造に構成し、室温に比べ低温のジ
ボランを充填したシリンダ２の表面に結露が温度調整の
ため付着するのを防止する。
(57) [Abstract] [Purpose] To provide a gas supply device with a cylinder capable of preventing a failure of a load cell by preventing dew condensation on the surface of the cylinder. [Configuration] Cylinder 2 inside the cylinder cabinet
The jacket 7 that encloses the cooling layer 12 is housed, and the jacket 7 has a double structure including a cooling layer 12 that circulates cooling water to cool the cylinder 2 and a vacuum heat insulating layer 15 located on the outer periphery of the cooling layer 12. This prevents dew condensation from adhering to the surface of the cylinder 2 filled with diborane at a temperature lower than room temperature for temperature adjustment.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、シリンダから材料ガス
を高圧配管領域を介して半導体製造設備に供給するシリ
ンダ付ガス供給装置の改良に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a gas supply device with a cylinder for supplying a material gas from a cylinder to a semiconductor manufacturing facility through a high pressure piping region.
【０００２】[0002]
【従来の技術】従来のシリンダ付ガス供給装置は、図６
に示す如く、シリンダーキャビネット１の内部に単一の
シリンダ２を収納し、このシリンダ２から材料ガスを高
圧配管領域や供給ライン（図示せず）等を介して半導体
製造装置（図示せず）に供給するようにしている。2. Description of the Related Art A conventional gas supply device with a cylinder is shown in FIG.
As shown in FIG. 1, a single cylinder 2 is housed in a cylinder cabinet 1, and a material gas is transferred from the cylinder 2 to a semiconductor manufacturing apparatus (not shown) through a high-pressure piping area, a supply line (not shown), or the like. I am trying to supply it.
【０００３】上記シリンダーキャビネット１は、図６に
示す如く、正面が開口した箱構造に構成され、その開口
部には図示しない扉が開閉可能に框着されるとともに、
この扉が通常時には閉塞されている。シリンダーキャビ
ネット１の内部は常時換気されている。さらに、シリン
ダーキャビネット１の天井の中央部分には、万一、ガス
漏れが生じた場合に備え、常時シリンダーキャビネット
１内の空気を外部に導く単一の排気ダクト６が立設され
ている。As shown in FIG. 6, the cylinder cabinet 1 has a box structure with an open front, and a door (not shown) is openably and closably mounted in the opening.
This door is normally closed. The inside of the cylinder cabinet 1 is constantly ventilated. Further, in the central portion of the ceiling of the cylinder cabinet 1, a single exhaust duct 6 that constantly guides the air in the cylinder cabinet 1 to the outside is provided upright in case of a gas leak.
【０００４】また、図示しない上記高圧配管領域は、ス
テンレス等の細管から構成されシリンダ２に接続された
複数の配管と、この複数の配管の端部にそれぞれ接続さ
れた複数の弁を備え、シリンダーキャビネット１の内部
上方に配管されている。該複数の弁にはパージガス導入
ライン、供給ライン、及び真空排気ライン等がそれぞれ
接続されている。尚、図示しない供給ラインには通常減
圧弁（図示せず）が接続され、この減圧弁が、シリンダ
２内の高圧の材料ガスをガス消費設備で必要とする圧力
まで減圧して供給する機能を有している。The high-pressure pipe region (not shown) is provided with a plurality of pipes made of a thin tube of stainless steel or the like and connected to the cylinder 2, and a plurality of valves respectively connected to the ends of the plurality of pipes. It is arranged above the inside of the cabinet 1. A purge gas introduction line, a supply line, a vacuum exhaust line, and the like are connected to the plurality of valves, respectively. A pressure reducing valve (not shown) is usually connected to the supply line (not shown), and the pressure reducing valve has a function of reducing the pressure of the high-pressure material gas in the cylinder 2 to a pressure required by the gas consuming facility and supplying the gas. Have
【０００５】ところで、半導体産業で用いられる材料ガ
スの一種であるジボラン（化学式Ｂ2 Ｈ6 ）は、非常に
自己分解性の強いガスで、室温で保存されているだけで
容易に分解し、Ｂ9 Ｈ1 0 、Ｂ5 Ｈ9 等の通常高次ボラ
ンと呼ばれているガスに徐々に重合していく特性があ
る。そのため、シリンダーキャビネット１でジボランガ
スを供給する場合でも、ジボランガスの自己分解性を抑
制する目的で、ジボランのシリンダ２を冷却するシステ
ムをシリンダーキャビネット１に整備することが多い。By the way, diborane (chemical formula B 2 H 6 ), which is a kind of material gas used in the semiconductor industry, is a gas having a very strong self-decomposability and easily decomposes even if it is stored at room temperature. It has the property of gradually polymerizing into a gas usually called higher borane such as 9 H 10 and B 5 H 9 . Therefore, even when the diborane gas is supplied from the cylinder cabinet 1, a system for cooling the diborane cylinder 2 is often provided in the cylinder cabinet 1 in order to suppress the self-decomposition property of the diborane gas.
【０００６】また、ジボランの供給上の問題として、自
己分解して生成された高次ボランが供給されるジボラン
中に微量でも混在すると、供給ラインに接続された減圧
弁中で減圧のための断熱膨脹過程で冷却され、折出固化
し、減圧弁の弁と弁座との間に異物となって挟まり、そ
の結果として、通常「出流れ」と呼ばれる減圧弁の調圧
不調トラブルを誘発することが多々見受けられる。この
問題を解決するためには、供給ラインに搬出されるジボ
ラン中に高次ボランを流出させないことである。このた
め、シリンダ２の冷却温度を５゜Ｃ前後にまで冷やすこ
とによって、例えシリンダ２内に高次ボランが存在して
も、供給されるガス中にはシリンダ２内で強制的に固化
させることによって流出させない方法が有効である
（尚、この種の先行技術文献として、特開平１−２３８
８００号及び１−２６６４００号公報参照）。Further, as a problem in supplying diborane, when a small amount of high-order borane produced by self-decomposition is mixed in the supplied diborane, heat insulation for reducing pressure is performed in the pressure reducing valve connected to the supply line. Cooling during the expansion process, solidifying during extrusion, and being trapped as a foreign substance between the valve of the pressure reducing valve and the valve seat, as a result, a pressure regulation malfunction trouble of the pressure reducing valve, which is usually called "outflow", is induced. Can be seen a lot. In order to solve this problem, it is necessary to prevent high-order borane from flowing out during diborane carried out to the supply line. Therefore, by cooling the cooling temperature of the cylinder 2 to about 5 ° C., even if higher-order borane exists in the cylinder 2, the gas to be supplied is forcibly solidified in the cylinder 2. It is effective to prevent it from flowing out (as a prior art document of this type, JP-A-1-238).
No. 800 and No. 1-266400).
【０００７】このように、ジボランのシリンダ２を５゜
Ｃまで冷却すると、その周囲の空気中の水分がシリンダ
２の表面や図示しない冷却ジャケットの表面で結露し、
シリンダーキャビネット１の内部が水浸しになり、半導
体工場で最も嫌われる錆等を発生させるというトラブル
が生じていた。さらに、錆以外にも、残量検知器として
ロードセル（重量センサ）を使用している場合には、結
露した水が電気製品であるロードセルを故障させる要因
となる。As described above, when the cylinder 2 of diborane is cooled to 5 ° C., the moisture in the surrounding air is condensed on the surface of the cylinder 2 or the surface of the cooling jacket (not shown),
The inside of the cylinder cabinet 1 was soaked in water, causing a problem that rust and the like, which are most disliked in semiconductor factories, were generated. Furthermore, in addition to rust, when a load cell (weight sensor) is used as the remaining amount detector, the dew condensation water becomes a factor that causes the load cell, which is an electric product, to fail.
【０００８】[0008]
【発明が解決しようとする課題】従来のシリンダ付ガス
供給装置は以上のように構成され、シリンダ２が室温に
比べ低温で使用されるので、空気中の水分がシリンダ２
の表面に付着して多数の結露となり、この多数の結露が
時間の経過に伴い流下して半導体工場にとって極めて有
害な錆を生じさせたり、電気製品であるロードセルを使
用している場合には故障の原因となることが少なくなか
った。The conventional gas supply device with a cylinder is constructed as described above, and since the cylinder 2 is used at a temperature lower than room temperature, the water content in the air is reduced by the cylinder 2.
A large amount of dew condensation adheres to the surface of the product, and this large amount of dew drops down with the passage of time, causing rust that is extremely harmful to semiconductor factories, or malfunctions when using load cells, which are electrical products. It was not the only cause of.
【０００９】本発明は上記に鑑みなされたもので、シリ
ンダの表面における結露の防止を通じて錆の発生やロー
ドセルの故障を防止することのできるシリンダ付ガス供
給装置を提供することを目的としている。The present invention has been made in view of the above, and an object of the present invention is to provide a gas supply device with a cylinder capable of preventing the formation of rust and the failure of the load cell by preventing the dew condensation on the surface of the cylinder.
【００１０】[0010]
【課題を解決するための手段】本発明においては上述の
目的を達成するため、シリンダーキャビネットにシリン
ダを収納し、このシリンダから材料ガスを配管を介して
外部に供給するものにおいて、上記シリンダーキャビネ
ットにシリンダを囲むジャケットを収納するとともに、
このジャケットを、冷却媒体でシリンダを冷却する冷却
層と、この冷却層の外周に位置する真空断熱層とから構
成し、該材料ガスと室温との温度差に伴うシリンダ表面
の結露を防止するようにしている。In order to achieve the above object in the present invention, a cylinder is housed in a cylinder cabinet, and a material gas is supplied from the cylinder to the outside through a pipe. While accommodating the jacket surrounding the cylinder,
This jacket is composed of a cooling layer that cools the cylinder with a cooling medium and a vacuum heat insulating layer located on the outer periphery of this cooling layer to prevent dew condensation on the cylinder surface due to the temperature difference between the material gas and room temperature. I have to.
【００１１】[0011]
【作用】上記構成を有する本発明によれば、冷却層が冷
却媒体でシリンダを常時冷却し、しかも、真空断熱層が
熱伝導を遮断するので、空気中の水分がシリンダの表面
に付着して多数の結露となるのを防止することができ
る。According to the present invention having the above structure, the cooling layer constantly cools the cylinder with the cooling medium, and the vacuum heat insulating layer blocks the heat conduction, so that the moisture in the air adheres to the surface of the cylinder. It is possible to prevent a large amount of dew condensation.
【００１２】[0012]
【実施例】以下、図１乃至図４に示す一実施例に基づき
本発明を詳説する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to an embodiment shown in FIGS.
【００１３】本発明に係るシリンダ付ガス供給装置は、
シリンダーキャビネット１の内部にシリンダ２を囲繞す
るジャケット７を収納し、このジャケット７の冷却層１
２と真空断熱層１５とでシリンダ２の表面における結露
を防止するようにしている。A gas supply device with a cylinder according to the present invention comprises:
A jacket 7 surrounding the cylinder 2 is housed inside the cylinder cabinet 1, and the cooling layer 1 of the jacket 7 is housed.
2 and the vacuum heat insulating layer 15 prevent dew condensation on the surface of the cylinder 2.
【００１４】上記ジャケット７は、図１に示す如く、平
面ほぼＣ字形で縦長の一対の本体７ａ・７ｂを備え、こ
の一対の本体７ａ・７ｂがシリンダ２と接する面の上端
及び下端にゴムスペーサ８を介してシリンダ２を着脱自
在に挟持した状態で囲繞するようになっている。尚、こ
のゴムスペーサ８は、上端や下端以外の中間にも設ける
ことができる。これら複数のゴムスペーサ８は、図１や
図３に示す如く、ほぼリング形に構成され、シリンダ２
の上部と下部とにそれぞれ嵌合されている。また、一対
の本体７ａ・７ｂは、その一の本体７ａの内周側上部に
外部から冷却層１２に冷却水（冷却媒体）を導く縮径の
導入管９が立設され、他の本体７ｂの内周側上部には冷
却した冷却水を冷却層１２から外部に排出する縮径の排
出管１０が立設されており、湾曲した縮径の連通管１１
で相互に連通されている。As shown in FIG. 1, the jacket 7 is provided with a pair of vertically elongated main bodies 7a and 7b having a substantially C shape in a plane, and rubber spacers are provided at the upper and lower ends of the surfaces where the pair of main bodies 7a and 7b contact the cylinder 2. The cylinder 2 is surrounded by 8 and is detachably held. The rubber spacer 8 can be provided in the middle other than the upper end and the lower end. The plurality of rubber spacers 8 are formed in a substantially ring shape as shown in FIG. 1 and FIG.
Are fitted to the upper part and the lower part, respectively. Further, in the pair of main bodies 7a and 7b, an introduction pipe 9 having a reduced diameter that guides cooling water (cooling medium) from the outside to the cooling layer 12 is provided upright on the inner peripheral side upper part of the main body 7a, and the other main body 7b. A discharge pipe 10 having a reduced diameter for discharging the cooled cooling water from the cooling layer 12 to the outside is erected on the upper portion on the inner peripheral side of the pipe.
Are communicated with each other.
【００１５】また、上記した冷却層１２は、図１乃至図
３に示す如く、ジャケット７を構成する一対の本体７ａ
・７ｂの内部内周側に偏位して形成され、その空間の上
部には複数の上部案内板１３が所定の間隔で垂下して吊
着されており、空間の下部には複数の下部案内板１４が
所定の間隔で垂直に立設されている。そして、これら複
数の上部案内板１３と下部案内板１４とは、図４に示す
如く、隙間を介して相互に噛み合うようほぼ千鳥状の配
列に配設され、冷却水（同図の矢印参照）の流路を伸長
するとともに、導入管９から導入された冷却水を上下方
向に蛇行させつつ案内し、シリンダ２を冷却した冷却水
を排出管１０に案内する作用を有している。尚、一対の
本体７ａ・７ｂの冷却層１２は上記した連通管１１で相
互に連通され、冷却水が上下方向に蛇行しながらシリン
ダ２の周囲を流通するようになっている。Further, the cooling layer 12 described above, as shown in FIGS. 1 to 3, comprises a pair of main bodies 7a constituting the jacket 7.
7b is formed so as to be displaced toward the inner peripheral side of the inside, and a plurality of upper guide plates 13 are hung and suspended at a predetermined interval above the space, and a plurality of lower guides are provided below the space. Plates 14 are erected vertically at predetermined intervals. As shown in FIG. 4, the plurality of upper guide plates 13 and the lower guide plates 14 are arranged in a substantially staggered arrangement so as to mesh with each other through a gap, and the cooling water (see the arrow in the figure). And has a function of guiding the cooling water introduced from the introduction pipe 9 while meandering in the vertical direction, and guiding the cooling water that has cooled the cylinder 2 to the discharge pipe 10. The cooling layers 12 of the pair of main bodies 7a and 7b are communicated with each other by the above-mentioned communication pipes 11, and the cooling water circulates around the cylinder 2 while meandering in the vertical direction.
【００１６】さらに、上記真空断熱層１５は、図１や図
２に示す如く、ジャケット７を構成する一対の本体７ａ
・７ｂの内部外周側に偏位した空間として形成され、冷
却層１２の外側に隣接して位置しており、熱伝導を遮断
する断熱機能を有している。Further, the vacuum heat insulating layer 15 has a pair of main bodies 7a constituting the jacket 7, as shown in FIGS.
It is formed as a space deviated to the inner peripheral side of 7b, is located adjacent to the outer side of the cooling layer 12, and has a heat insulating function of blocking heat conduction.
【００１７】その他の部分については従来例と同様であ
る。Other parts are the same as in the conventional example.
【００１８】上記構成によれば、冷却層１２が上部案内
板１３と下部案内板１４とで冷却水を上下方向に蛇行さ
せつつ案内してシリンダ２を冷却し、しかも、真空断熱
層１５が熱の伝導作用を防止するので、詳言すれば、冷
却されたシリンダ２の表面が直接外気と触れず、外気と
触れるジャケット７の表面が真空断熱効果で冷却されな
いので、ジボランからなる材料ガスを使用するにも拘ら
ず、空気中の水分が温度調整のためシリンダ２の表面に
付着して多数の結露となるのを防止することができる。According to the above-mentioned structure, the cooling layer 12 guides the cooling water in the vertical direction by the upper guide plate 13 and the lower guide plate 14 to guide the cooling water to cool the cylinder 2, and the vacuum heat insulating layer 15 heats the cooling water. In detail, since the surface of the cooled cylinder 2 does not directly contact the outside air and the surface of the jacket 7 that comes into contact with the outside air is not cooled by the vacuum heat insulation effect, a material gas composed of diborane is used. Nevertheless, it is possible to prevent the moisture in the air from adhering to the surface of the cylinder 2 to form a large amount of dew condensation due to the temperature adjustment.
【００１９】従って、多数の結露が時間の経過に伴い流
下してシリンダーキャビネット１の内部に錆を発生させ
たり、電気製品であるロードセルを水浸しにし、ロード
セルの故障等に伴うトラブルの発生を未然に防止するこ
とが可能となる。Accordingly, a large amount of dew condensation flows down with the passage of time to generate rust inside the cylinder cabinet 1 or to submerge the load cell, which is an electric product, in order to prevent troubles due to a failure of the load cell. It becomes possible to prevent it.
【００２０】尚、上記実施例ではジャケット７を構成す
る一対の本体７ａ・７ｂにシリンダ２を囲繞させたもの
を示したが、図５に示す如く、ジャケット７の周囲を、
断熱材１６を内部に備えた一対の筐体１７に囲繞させて
断熱作用をさらに向上させるようにしても良い。さら
に、上記実施例ではジボランからなる材料ガスを使用し
たものを示したが、室温に比べ低温で使用されるガスで
あれば、ジボラン以外の材料ガスでも良いのは言うまで
もない。In the above embodiment, the cylinder 2 is surrounded by the pair of main bodies 7a and 7b forming the jacket 7. However, as shown in FIG.
The heat insulating material 16 may be surrounded by a pair of housings 17 provided inside to further improve the heat insulating function. Further, in the above-mentioned embodiment, the material gas made of diborane is used, but it goes without saying that a material gas other than diborane may be used as long as the gas is used at a temperature lower than room temperature.
【００２１】[0021]
【発明の効果】以上のように本発明によれば、温度調整
のため空気中の水分がシリンダの表面に付着して多数の
結露となるのを確実に防止することができ、しかも、こ
れを通じて、半導体工場で最も嫌われる錆の発生や多数
の結露の流下に伴いロードセルが故障してトラブルが発
生する虞れを未然に除去することが可能になるという顕
著な効果がある。As described above, according to the present invention, it is possible to surely prevent moisture in the air from adhering to the surface of the cylinder to form a large amount of dew condensation due to the temperature adjustment, and through this, There is a remarkable effect that it is possible to eliminate the risk of troubles due to load cell failure due to the generation of rust, which is most disliked in semiconductor factories, and the flow of a large amount of dew condensation.
【図１】本発明に係るシリンダ付ガス供給装置の一実施
例を示す一部切り欠き斜視図である。FIG. 1 is a partially cutaway perspective view showing an embodiment of a gas supply device with a cylinder according to the present invention.
【図２】本発明に係るシリンダ付ガス供給装置の一実施
例を示す平面図である。FIG. 2 is a plan view showing an embodiment of a gas supply device with a cylinder according to the present invention.
【図３】本発明に係るシリンダ付ガス供給装置の一実施
例を示す断面側面図である。FIG. 3 is a sectional side view showing an embodiment of a gas supply device with a cylinder according to the present invention.
【図４】本発明に係るシリンダ付ガス供給装置の冷却層
を示す展開説明図である。FIG. 4 is a development explanatory view showing a cooling layer of the gas supply device with a cylinder according to the present invention.
【図５】本発明に係るシリンダ付ガス供給装置の他の実
施例を示す平面図である。FIG. 5 is a plan view showing another embodiment of the gas supply device with a cylinder according to the present invention.
【図６】従来のシリンダ付ガス供給装置の使用状態を示
す説明図である。FIG. 6 is an explanatory diagram showing a usage state of a conventional gas supply device with a cylinder.
１…シリンダーキャビネット、２…シリンダ、７…ジャ
ケット、１２…冷却層、１５…真空断熱層。1 ... Cylinder cabinet, 2 ... Cylinder, 7 ... Jacket, 12 ... Cooling layer, 15 ... Vacuum heat insulation layer.
Claims (1)
納し、このシリンダから材料ガスを配管を介して外部に
供給するシリンダ付ガス供給装置において、上記シリン
ダーキャビネットにシリンダを囲むジャケットを収納す
るとともに、このジャケットを、冷却媒体でシリンダを
冷却する冷却層と、この冷却層の外周に位置する真空断
熱層とから構成し、該材料ガスと室温との温度差に伴う
シリンダ表面の結露を防止することを特徴とするシリン
ダ付ガス供給装置。1. In a gas supply device with a cylinder, wherein the cylinder is housed in a cylinder cabinet and the material gas is supplied from the cylinder to the outside through a pipe, a jacket surrounding the cylinder is housed in the cylinder cabinet, and the jacket is A cooling layer that cools the cylinder with a cooling medium and a vacuum heat insulating layer located on the outer periphery of the cooling layer to prevent dew condensation on the cylinder surface due to the temperature difference between the material gas and room temperature. Gas supply device with a cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16924593A JP3375178B2 (en) | 1993-07-08 | 1993-07-08 | Gas supply device with cylinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16924593A JP3375178B2 (en) | 1993-07-08 | 1993-07-08 | Gas supply device with cylinder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0724295A true JPH0724295A (en) | 1995-01-27 |
| JP3375178B2 JP3375178B2 (en) | 2003-02-10 |
Family
ID=15882937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16924593A Expired - Fee Related JP3375178B2 (en) | 1993-07-08 | 1993-07-08 | Gas supply device with cylinder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3375178B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001003169A1 (en) * | 1999-07-02 | 2001-01-11 | Tokyo Electron Limited | Semiconductor manufacture equipment, and method and apparatus for semiconductor manufacture |
| WO2001003168A1 (en) * | 1999-07-02 | 2001-01-11 | Tokyo Electron Limited | Semiconductor manufacture equipment |
| JP2007506058A (en) * | 2003-09-22 | 2007-03-15 | デーナ、コーポレイション | Pressure vessel assembly for an integrated pressurized fluid system |
| KR100877512B1 (en) * | 2008-08-22 | 2009-01-07 | 김경훈 | Explosion Proof and Cooling Air Tank Charging Cradle |
| JP2017067470A (en) * | 2015-09-28 | 2017-04-06 | 株式会社タツノ | Calibration device |
| JP2021115509A (en) * | 2020-01-24 | 2021-08-10 | パナソニックＩｐマネジメント株式会社 | Apparatus for feeding liquid material |
| KR20220162908A (en) * | 2021-06-01 | 2022-12-09 | 에스지엔 주식회사 | Cooling jacket for gas-cylinder to be filled in semiconductor processing gas |
-
1993
- 1993-07-08 JP JP16924593A patent/JP3375178B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001003169A1 (en) * | 1999-07-02 | 2001-01-11 | Tokyo Electron Limited | Semiconductor manufacture equipment, and method and apparatus for semiconductor manufacture |
| WO2001003168A1 (en) * | 1999-07-02 | 2001-01-11 | Tokyo Electron Limited | Semiconductor manufacture equipment |
| US6370897B1 (en) | 1999-07-02 | 2002-04-16 | Tokyo Electron Limited | Semiconductor manufacturing facility |
| US6427462B1 (en) | 1999-07-02 | 2002-08-06 | Tokyo Electron Limited | Semiconductor manufacturing facility, semiconductor manufacturing apparatus and semiconductor manufacturing method |
| JP2007506058A (en) * | 2003-09-22 | 2007-03-15 | デーナ、コーポレイション | Pressure vessel assembly for an integrated pressurized fluid system |
| US8079408B2 (en) | 2003-09-22 | 2011-12-20 | Bosch Rexroth Corporation | Pressure vessel assembly for integrated pressurized fluid system |
| US8726977B2 (en) | 2003-09-22 | 2014-05-20 | Bosch Rexroth Corporation | Pressure vessel assembly for integrated pressurized fluid system |
| KR100877512B1 (en) * | 2008-08-22 | 2009-01-07 | 김경훈 | Explosion Proof and Cooling Air Tank Charging Cradle |
| JP2017067470A (en) * | 2015-09-28 | 2017-04-06 | 株式会社タツノ | Calibration device |
| JP2021115509A (en) * | 2020-01-24 | 2021-08-10 | パナソニックＩｐマネジメント株式会社 | Apparatus for feeding liquid material |
| KR20220162908A (en) * | 2021-06-01 | 2022-12-09 | 에스지엔 주식회사 | Cooling jacket for gas-cylinder to be filled in semiconductor processing gas |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3375178B2 (en) | 2003-02-10 |
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