JPH0724357B2 - Electronic component mounting device - Google Patents
Electronic component mounting deviceInfo
- Publication number
- JPH0724357B2 JPH0724357B2 JP63191751A JP19175188A JPH0724357B2 JP H0724357 B2 JPH0724357 B2 JP H0724357B2 JP 63191751 A JP63191751 A JP 63191751A JP 19175188 A JP19175188 A JP 19175188A JP H0724357 B2 JPH0724357 B2 JP H0724357B2
- Authority
- JP
- Japan
- Prior art keywords
- suction nozzle
- electronic component
- spring
- guide groove
- bush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は電子部品をプリント基板に実装する電子部品装
着装置に関するものである。Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed circuit board.
従来の技術 従来は第２図から第５図に示すように、装着ヘッド１に
設けられ吸着ノズル２によって電子部品３をパーツカセ
ット４より吸着し、プリント基板５に装着する。そして
電子部品３が装着されたプリント基板５を、搬送部６に
よって所定位置まで運ぶ。吸着ノズル２は、ブッシュ部
７内で上下摺動し、バネ８により上下方向が付勢され
る。又、回り止めピン９によりブッシュ部７内での回転
が拘束され、上下方向に案内溝10を有する。2. Description of the Related Art Conventionally, as shown in FIGS. 2 to 5, the electronic component 3 is sucked from the parts cassette 4 by the suction nozzle 2 provided in the mounting head 1 and mounted on the printed circuit board 5. Then, the printed board 5 on which the electronic component 3 is mounted is carried to a predetermined position by the carrying section 6. The suction nozzle 2 slides up and down in the bush portion 7 and is biased in the vertical direction by a spring 8. Further, rotation within the bush portion 7 is restricted by the rotation stop pin 9, and a guide groove 10 is provided in the vertical direction.
次にノズルを全体的に説明する。ブッシュ部７は本体と
吸着ノズル２の先端との真空経路である。そのブッシュ
部７より空気がもれないようにブッシュ部７上部にＯリ
ング11が取り付けられている。又、ブッシュ部７の先端
には、ブッシュ部７に固定されている回り止めピン９が
抜け落ちないためにチューブ12を有する。ブッシュ部７
の周辺は、圧縮バネ13,ベアリング14,光の反射板である
リフレクター15,このリフレクター15の回転方向を規制
するピン16,光の拡散板であるフランジ17,案内溝10を有
する吸着ノズル２を上下摺動させるバネ８を有する。以
上によりノズルが構成されている。Next, the nozzle will be described as a whole. The bush 7 is a vacuum path between the main body and the tip of the suction nozzle 2. An O-ring 11 is attached to the upper portion of the bush portion 7 so that air does not leak from the bush portion 7. Further, a tube 12 is provided at the tip of the bush portion 7 so that the detent pin 9 fixed to the bush portion 7 does not fall off. Bush part 7
Around the area, there are a compression spring 13, a bearing 14, a reflector 15 which is a light reflection plate, a pin 16 which regulates the rotating direction of the reflector 15, a flange 17 which is a light diffusion plate, and a suction nozzle 2 having a guide groove 10. It has a spring 8 that slides up and down. The nozzle is configured as described above.
発明が解決しようとする課題 しかし従来の構造では、回り止めピン９が吸着ノズル２
の案内溝10内を上下方向に移動するためには、回り止め
ピン９と案内溝10との間にわずかなクリアランスl1,l2
が必要である。例えば、32角QFP（１辺32mmのQuad,Fla
t,Package）の場合、吸着ノズル２の回転方向にl1とl2
が、最大0.02mmずれが生じたとすると、電子部品の装着
位置は周囲で基準位置より、計算上l3……最大0.27mmず
れる。その結果、実際不良率が20％となり（但し、ずれ
が0.1mm以上のもの）装着精度が悪くなる。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the conventional structure, the detent pin 9 is used as the suction nozzle 2.
In order to move the guide groove 10 in the vertical direction, a slight clearance l 1 , l 2 is provided between the detent pin 9 and the guide groove 10.
is necessary. For example, a 32-sided QFP (Quad, Fla with 32 mm on each side)
t, Package), l 1 and l 2 in the rotation direction of the suction nozzle 2
But, if the maximum 0.02mm displacement occurs, the mounting position of the electronic component from the reference position at ambient computationally l 3 ...... maximum 0.27mm shifted. As a result, the actual defective rate becomes 20% (however, the deviation is 0.1 mm or more) and the mounting accuracy becomes poor.
そこで本発明は、バネ８をねじって固定することによ
り、戻ろうとする力を利用して吸着ノズル２の上下方向
及び回転方向を付勢し、回り止めピン９を案内溝10の一
方の壁面に当接させる。その結果、吸着ノズル２の回転
方向のずれを防止することによって、より装着精度の向
上を図ろうとすることを目的とする。Therefore, in the present invention, by fixing the spring 8 by twisting it, the force to return is urged in the vertical direction and the rotation direction of the suction nozzle 2, and the detent pin 9 is attached to one wall surface of the guide groove 10. Abut. As a result, it is an object of the present invention to improve the mounting accuracy by preventing the suction nozzle 2 from being displaced in the rotational direction.
課題を解決するための手段 上記問題点を解決するために本発明の電子部品装着装置
の装着ヘッドは、電子部品を吸着可能に、かつ外面に軸
方向の案内溝を有し、かつ上下動可能な吸着ノズルと、
内面に吸着ノズルを嵌挿し、この吸着ノズルを上下摺動
可能に構成したブッシュ部と、吸着ノズルの上下方向と
回転方向を付勢するバネと、ブッシュ部に固定し、先端
部が吸着ノズルの案内溝に嵌挿可能に構成され、かつ前
記案内溝の一方の壁面に当接付勢された回り止めピンを
備えたものである。Means for Solving the Problems In order to solve the above problems, a mounting head of an electronic component mounting apparatus of the present invention is capable of adsorbing electronic components, has an external guide groove in an axial direction, and is vertically movable. Suction nozzle,
A suction nozzle is inserted into the inner surface of the suction nozzle, and the bush is configured so that the suction nozzle can slide up and down, a spring that urges the suction nozzle in the vertical and rotational directions, and the bush is fixed to the tip of the suction nozzle. A detent pin, which is configured to be inserted into the guide groove and biased to abut one wall surface of the guide groove, is provided.
作 用 本発明は上記した構成によって、吸着ノズルにより電子
部品が吸着される時、吸着ノズルが上下移動しても回転
方向にずれを生じることがない。又、電子部品を吸着し
て認識された位置と、電子部品が装着されなければなら
ない位置にも、移動中にずれが生じることなく同じ位置
となる。すなわちバネによって吸着ノズルの回転方向が
規正されているためである。その結果、装着精度が良く
なる。Operation The present invention has the above-described configuration, and when the suction nozzle sucks the electronic component, the suction nozzle does not shift in the rotational direction even if the suction nozzle moves up and down. Further, the position where the electronic component is sucked and recognized and the position where the electronic component has to be mounted are the same position without any displacement during the movement. That is, the rotation direction of the suction nozzle is regulated by the spring. As a result, the mounting accuracy is improved.
実 施 例 以下本発明の一実施例について、第１図，第３図を用い
て説明する。18はバネであり、このバネ18はらせん状に
形成され、先端部18a,18bは約90度に折り曲げられてい
る。19はブッシュ部であり、このブッシュ部19にはバネ
18の先端部18aを固定する固定穴19a,吸着ノズル20には
バネ18の先端部18bを固定する固定穴20aが設けられてい
る。そのとき固定穴19a,20aはバネ18の先端部18a,18bが
抜けない程度の大きさである。バネ18を回転方向の一方
向に一度ねじり、バネ18の先端部18aを固定穴19aにはめ
込み、同じようにバネ18の先端部18bを固定穴20aにはめ
込む。このバネ18はねじった方向とは逆に戻ろうとする
力が働くことによって、回り止めピン９を案内溝10の一
方の壁面に当接可能にする構成になっている。Example An example of the present invention will be described below with reference to FIGS. 1 and 3. Reference numeral 18 is a spring, and this spring 18 is formed in a spiral shape, and tip portions 18a and 18b are bent at about 90 degrees. 19 is a bush part, and this bush part 19 has a spring
A fixing hole 19a for fixing the tip portion 18a of the spring 18 and a fixing hole 20a for fixing the tip portion 18b of the spring 18 are provided in the suction nozzle 20. At that time, the fixing holes 19a and 20a are large enough to prevent the tip portions 18a and 18b of the spring 18 from coming off. The spring 18 is once twisted in one direction of the rotation direction, the tip portion 18a of the spring 18 is fitted into the fixing hole 19a, and the tip portion 18b of the spring 18 is fitted into the fixing hole 20a in the same manner. The spring 18 is structured so that the detent pin 9 can be brought into contact with one wall surface of the guide groove 10 by a force that tries to return in the direction opposite to the twisting direction.
次にこの構成により動作を説明する。吸着ノズル20が電
子部品３を吸着する所定位置に移動し、吸着ノズル20を
降下させて電子部品３を吸着する。その際、部品の厚さ
を吸着するために吸着ノズル20がバネ18によって付勢さ
れている。その後吸着ノズル20は上昇し、認識の所定位
置まで移動する。15はリフレクターであり、このリフレ
クター15に当たった光は、乳白色のフランジ17によって
拡散される。これにより下方からカメラで撮影するとフ
ランジ17が白く光り、吸着ノズル20に吸着された電子部
品３は黒い影として認識可能になる。認識とは電子部品
３が吸着ノズル20に吸着されている座標を算出するもの
である。認識が終了すると、電子部品が装着されなけれ
ばならない座標位置に移動し、吸着ノズル20を降下させ
て電子部品３を装着する。その際、吸着ノズル20が電子
部品３を吸着して認識した座標と、電子部品が装着され
なければならない座標位置とは同じである。すなわち、
バネ18により、回り止めピン９を案内溝10の一方の壁面
に当接可能な構成であるため、吸着ノズル20の回転方向
がバネ18によって規正される。そのため、回転方向にず
れが生じることがない。尚、実施例では実施していない
が、吸着ノズル20の材質を耐摩耗性のものを使用しても
よい。Next, the operation of this configuration will be described. The suction nozzle 20 moves to a predetermined position where the electronic component 3 is sucked, and the suction nozzle 20 is lowered to suck the electronic component 3. At that time, the suction nozzle 20 is biased by the spring 18 in order to suck the thickness of the component. After that, the suction nozzle 20 moves up and moves to a predetermined position for recognition. Reference numeral 15 is a reflector, and light that strikes the reflector 15 is diffused by the milky white flange 17. As a result, when the camera is photographed from below, the flange 17 glows white, and the electronic component 3 sucked by the suction nozzle 20 can be recognized as a black shadow. The recognition is to calculate the coordinates where the electronic component 3 is sucked by the suction nozzle 20. When the recognition is completed, the electronic component 3 is mounted by moving to the coordinate position where the electronic component should be mounted and lowering the suction nozzle 20. At that time, the coordinates at which the suction nozzle 20 has sucked and recognized the electronic component 3 are the same as the coordinate position at which the electronic component should be mounted. That is,
Since the detent pin 9 can be brought into contact with one wall surface of the guide groove 10 by the spring 18, the rotation direction of the suction nozzle 20 is regulated by the spring 18. Therefore, no deviation occurs in the rotation direction. Although not carried out in the embodiment, the suction nozzle 20 may be made of wear-resistant material.
発明の効果 以上のように本発明は、バネをねじって固定することに
より、戻ろうとする力を利用して吸着ノズルの上下方向
及び回転方向を付勢し、回り止めピンを案内溝の一方の
壁面に当接可能にする。その結果、吸着ノズルの回転方
向のずれを防止することによって、より装着精度の向上
を図ることができる。EFFECTS OF THE INVENTION As described above, according to the present invention, by fixing the spring by twisting, the force to return is urged in the up-down direction and the rotation direction of the suction nozzle, and the detent pin is provided in one of the guide grooves. Allows contact with the wall. As a result, it is possible to further improve the mounting accuracy by preventing the suction nozzle from shifting in the rotation direction.
第１図は本発明の一実施例における電子部品装着装置の
吸着ノズルの要部拡大縦断面図、第２図は電子部品装着
機の斜視図、第３図ａは従来の吸着ノズルの斜視図、ｂ
は吸着ノズルの分解斜視図、第４図は従来の吸着ノズル
の要部拡大平面図、第５図は電子部品の位置ずれを示し
た説明図である。 ３……電子部品、９……回り止めピン、10……案内溝、
18……バネ、19……ブッシュ部、20……吸着ノズル。FIG. 1 is an enlarged vertical sectional view of an essential part of a suction nozzle of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of an electronic component mounting machine, and FIG. 3a is a perspective view of a conventional suction nozzle. , B
FIG. 4 is an exploded perspective view of the suction nozzle, FIG. 4 is an enlarged plan view of a main part of a conventional suction nozzle, and FIG. 5 is an explanatory view showing a positional shift of electronic parts. 3 ... Electronic parts, 9 ... Rotating pin, 10 ... Guide groove,
18 …… Spring, 19 …… Bush part, 20 …… Suction nozzle.
Claims (1)
かつ基板上に前記電子部品を実装可能な装着ヘッドを有
した電子部品装着装置であって、前記装着ヘッドは、電
子部品を吸着可能で、かつ外面に軸方向の案内溝を有し
た上下動可能な吸着ノズルと、内面に前記吸着ノズルを
嵌挿し、この吸着ノズルを上下摺動可能に構成したブッ
シュと、吸着ノズルの上下方向と回転方向を付勢するバ
ネと、ブッシュ部に固定し、かつ先端部が吸着ノズルの
案内溝に嵌挿可能に構成され、かつ前記案内溝の一方の
壁面に当接付勢された回り止めピンを備えたことを特徴
とする電子部品装着装置。1. An electronic component is sucked and moved to a predetermined position,
An electronic component mounting apparatus having a mounting head capable of mounting the electronic component on a substrate, wherein the mounting head can adsorb the electronic component and can move up and down having an axial guide groove on the outer surface. A suction nozzle, a bush in which the suction nozzle is fitted on the inner surface, and the suction nozzle is configured to be slidable up and down, a spring for urging the suction nozzle in the vertical direction and the rotation direction, and fixed to the bush portion, and An electronic component mounting apparatus, characterized in that a tip end portion is configured to be insertable into a guide groove of a suction nozzle, and provided with a detent pin that is biased to abut one wall surface of the guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63191751A JPH0724357B2 (en) | 1988-07-29 | 1988-07-29 | Electronic component mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63191751A JPH0724357B2 (en) | 1988-07-29 | 1988-07-29 | Electronic component mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0240998A JPH0240998A (en) | 1990-02-09 |
| JPH0724357B2 true JPH0724357B2 (en) | 1995-03-15 |
Family
ID=16279898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63191751A Expired - Lifetime JPH0724357B2 (en) | 1988-07-29 | 1988-07-29 | Electronic component mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0724357B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100363901B1 (en) * | 2000-10-27 | 2002-12-11 | 미래산업 주식회사 | Nozzle Apparatus of Preventing Holder from Rotating in Surface Mount Device |
| KR100454894B1 (en) * | 2002-01-11 | 2004-11-06 | 미래산업 주식회사 | Head Nozzle of Surface Mounting Device |
-
1988
- 1988-07-29 JP JP63191751A patent/JPH0724357B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0240998A (en) | 1990-02-09 |
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