JPH07246564A - Compound abrasive grain grinding wheel - Google Patents
Compound abrasive grain grinding wheelInfo
- Publication number
- JPH07246564A JPH07246564A JP1803793A JP1803793A JPH07246564A JP H07246564 A JPH07246564 A JP H07246564A JP 1803793 A JP1803793 A JP 1803793A JP 1803793 A JP1803793 A JP 1803793A JP H07246564 A JPH07246564 A JP H07246564A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive grain
- grain layer
- grinding
- fine
- coarse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006061 abrasive grain Substances 0.000 title claims abstract description 106
- 150000001875 compounds Chemical class 0.000 title 1
- 238000005520 cutting process Methods 0.000 claims abstract description 11
- 230000002093 peripheral effect Effects 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 10
- 239000011230 binding agent Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 15
- 238000005452 bending Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はセラミックス等の硬脆材
料の精密研削加工に適用する研削砥石に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding wheel applied to precision grinding of hard and brittle materials such as ceramics.
【0002】[0002]
【従来の技術】従来セラミックスや無機化合物等の加工
においては硬くて脆い材料であるところから一般に引っ
掻きに弱いという脆性材料に特有の性質があり,加工表
面は粗の表面(梨地状)となっていた。然しこのような
脆性な材料の加工面を鏡面にするには一般的には所要の
形状に切断するとか研削加工した後被加工物より軟質な
金属材料,例えば錫とか鉛とかをラップ定盤として用い
ラッピング加工するとか,又面精度の確保は困難ではあ
るが,研磨テ−プを用いるとか,更に布状のラップと
か,各種の方法が用いられポリシング工程を経て加工表
面の鏡面を得ていた。2. Description of the Related Art Conventionally, in processing ceramics, inorganic compounds, etc., it is a material that is hard and brittle, and is generally vulnerable to scratching, which is a characteristic of brittle materials. The processed surface is a rough surface (matte surface). It was However, in order to make the machined surface of such a brittle material into a mirror surface, generally, a metal material that is softer than the work piece after being cut into the required shape or ground, such as tin or lead, is used as a lapping plate. Although it is difficult to use lapping or to secure surface accuracy, various methods such as polishing tape, cloth wrap, etc. were used to obtain the mirror surface of the processed surface through the polishing process. .
【0003】本発明は研削加工後,ラッピング加工,ポ
リシング加工等それぞれの加工方法及び加工条件の異な
る複数の加工工程を経ずに研削加工工程のみで,加工に
よる寸法精度並びに加工面の鏡面を得ることを目的とし
た砥石に関する発明であり,本砥石を用いることによ
り,容易に寸法精度の確保,加工表面の鏡面を得ること
が出来る。According to the present invention, after the grinding process, the dimensional accuracy and the mirror surface of the machined surface are obtained by the grinding process only, without passing through the lapping process, the lapping process, the polishing process and the like, and a plurality of processing processes under different processing conditions. This is an invention relating to a grindstone intended for that purpose, and by using this grindstone, it is possible to easily secure dimensional accuracy and obtain a mirror surface of the processed surface.
【0004】以下,従来の技術について図に基づき説明
する。図10,図11, 図12そして図13は従来の技術を示す
図であり, 図10は従来から作られている砥石の斜視図,
図11は, その初期段階での断面図, 図12は図11を使用し
た後の先端形状が変化した時の断面図, そして図13は他
の実施例を示す研削面の幅の広い砥石の断面図である。A conventional technique will be described below with reference to the drawings. 10, 11, 12 and 13 are diagrams showing the conventional technique, and FIG. 10 is a perspective view of a conventional grindstone,
Fig. 11 is a sectional view at the initial stage, Fig. 12 is a sectional view when the tip shape is changed after using Fig. 11, and Fig. 13 shows another embodiment of a grindstone with a wide grinding surface. FIG.
【0005】図10において, 1はホイ−ルベ−スであ
り,アルミ合金等の金属により作られており,2はその
中心に加工されたフランジ取付け孔で砥石フランジを取
付け工作機械のスピンドル軸に固定する。3は砥粒層で
一般的には#180位から#320位までの粒度をもつ
砥粒が用いられる。そして砥粒はメタルボンドとかレジ
ノイドボンド等である。そして砥粒の集中度は一般に1
00以下であり平型形状である。In FIG. 10, reference numeral 1 is a wheel base, which is made of metal such as aluminum alloy, and 2 is a flange mounting hole machined in the center of the wheel base to which a grindstone flange is attached to a spindle shaft of a machine tool. Fix it. 3 is an abrasive grain layer, and generally abrasive grains having a grain size of # 180 to # 320 are used. The abrasive grains are metal bond, resinoid bond, or the like. And the degree of concentration of abrasive grains is generally 1
It is 00 or less and has a flat shape.
【0006】又図11は比較的薄刃の例えば切断用の砥石
の断面図であり,,製造直後においては先端形状4は角
ばっているが使用されるに従い両側面の角ばっていたと
ころはR状となってくることを示している。例えば半導
体等のシリコンウエハ−等の切断研削では1200回か
ら2000回位切断するとR状になってくる。FIG. 11 is a cross-sectional view of a grindstone having a relatively thin blade, for example, for cutting. The tip shape 4 is angular immediately after manufacture, but as it is used, the corners on both sides are rounded. It shows that it will be in a state. For example, in cutting and grinding a silicon wafer such as a semiconductor, when it is cut about 1200 to 2000 times, it becomes R-shaped.
【0007】更に図13においては砥粒層3は一般研削砥
石又は成形研削砥石等で表面を所定の形状(図示せず)
に成形され,その形状に加工する時等に使われる比較的
幅の広い砥石を示す図である。尚,ホイ−ルベ−ス1´
は砥石の幅に応じて厚くなっている。これら砥粒層3に
はダイヤモンド砥粒の他CBN砥粒等も用いられてい
る。そしてそれらの砥粒は同一粒度の砥粒が用いられて
いる。Further, in FIG. 13, the surface of the abrasive grain layer 3 is a predetermined shape (not shown) using a general grinding wheel or a forming grinding wheel.
It is a figure which shows the grindstone with a comparatively wide width which is used at the time of being shape | molded to the shape and processed into the shape. In addition, wheel base 1 '
Is thicker depending on the width of the grindstone. In addition to diamond abrasive grains, CBN abrasive grains and the like are also used in these abrasive grain layers 3. The abrasive grains having the same grain size are used.
【0008】[0008]
【発明が解決しようとする課題】上記のような砥石にお
いては研削切断,又は平面研削,円筒研削等各種の研削
方法において,平面研削盤なり円筒研削盤なり各種の研
削盤が用いられ加工されるが,特に硬脆な材料であるセ
ラミックス,フェライト,無機材料等においては材料の
特性である引っ掻きに弱いことから加工面は梨地状をな
し,鏡面にはならない。その為特に精度を要する加工を
必要とする場合においては研削加工終了後,更に被加工
物を治具に固定したのちラッピング加工,ポリシング加
工等を行い加工表面の鏡面を得るばかりでなく寸法精度
の確保も行っていた。In the above grindstone, various grinding methods such as grinding cutting, surface grinding, and cylindrical grinding are processed by using a surface grinder, a cylindrical grinder, or various grinders. However, particularly in the case of hard and brittle materials such as ceramics, ferrite, and inorganic materials, the machined surface is satin-like and does not become a mirror surface because it is weak against scratching which is a characteristic of the material. Therefore, when machining that requires particularly high precision is required, after finishing the grinding process, the workpiece is further fixed to a jig and then lapping, polishing, etc. are performed to obtain a mirror surface of the machined surface as well as dimensional accuracy. It was also securing.
【0009】[0009]
【課題を解決するための手段】本発明は砥粒層に異なっ
た2種類の砥粒を用い中心部に粗目,外周部に細目の砥
粒を固着した砥石により加工するようにしたものであ
る。このようにすることにより,粗目の砥粒層で切込
み,更に細目の砥粒層で加工されるため,作業能率が良
く,かつ微小な細目の砥粒により加工されるため加工表
面は微小な引っ掻き痕即ち,微小な引っ掻き痕の集積と
なり鏡面状態を得ることが出来る。According to the present invention, two different kinds of abrasive grains are used in the abrasive grain layer, and processing is performed by a grindstone having a coarse grain at the center and a fine grain at the outer periphery. . By doing so, cutting is performed with a coarse abrasive grain layer and processing is performed with a finer abrasive grain layer, so work efficiency is good and processing is performed with fine fine abrasive grains, so that the processed surface is finely scratched. Traces, that is, minute scratches are accumulated and a mirror surface state can be obtained.
【0010】[0010]
【実施例】以下,本発明の実施例につき図面に基づいて
詳細に説明する。図1は本発明による砥石の斜視図,図
2はその断面図,図3は第2の実施例を示す一部拡大正
面図,図4は第2の実施例の切欠部を示す拡大図,図5
は第3の実施例を示す一部拡大正面図,図6は第3の実
施例の切欠部を示す拡大図である。そして図7及び図8
は第2及び第3の実施例即ち図3及び図4の一部拡大正
面図のA−A´断面図及びB−B´断面図を示したもの
である。又,図9は砥粒層の幅の広い砥石の場合を示す
断面図を示している。Embodiments of the present invention will now be described in detail with reference to the drawings. 1 is a perspective view of a grindstone according to the present invention, FIG. 2 is a sectional view thereof, FIG. 3 is a partially enlarged front view showing a second embodiment, and FIG. 4 is an enlarged view showing a notch portion of the second embodiment. Figure 5
Is a partially enlarged front view showing a third embodiment, and FIG. 6 is an enlarged view showing a notch portion of the third embodiment. 7 and 8
FIGS. 6A and 6B are sectional views taken along the lines AA ′ and BB ′ of the partially enlarged front views of the second and third embodiments, that is, FIGS. Further, FIG. 9 is a sectional view showing a case of a grindstone having a wide abrasive grain layer.
【0011】図1において1はホイ−ルベ−スでアルミ
合金が主として用いられている。2はフランジ取付孔で
ある。3は砥粒層であり,その砥粒層は6の粗目の砥粒
層と7の細目の砥粒層で出来ている。即ち本願では#2
20以下のメッシュを持った砥粒層を粗目の砥粒層と
し,又,#250以上のメッシュを持った砥粒層を細目
の砥粒層としている。In FIG. 1, reference numeral 1 denotes a wheel base, which is mainly made of an aluminum alloy. 2 is a flange mounting hole. 3 is an abrasive grain layer, and the abrasive grain layer is composed of 6 coarse abrasive grain layers and 7 fine abrasive grain layers. That is, in the present application, # 2
An abrasive grain layer having a mesh of 20 or less is used as a coarse abrasive grain layer, and an abrasive grain layer having a mesh of # 250 or more is used as a fine abrasive grain layer.
【0012】即ち,図1において3の砥粒層は粗目の砥
粒層6の両側面に細目の砥粒層があり,更にその砥粒層
3の先端部(最外周部)はθの角度(図2参照)でもっ
て形成されその両側部の細目の砥粒層に達する構造にな
っている。That is, in FIG. 1, the abrasive grain layer 3 has fine abrasive grain layers on both sides of the coarse abrasive grain layer 6, and the tip portion (outermost peripheral portion) of the abrasive grain layer 3 has an angle of θ. (See FIG. 2) The structure is such that it reaches the fine abrasive grain layers on both sides thereof.
【0013】尚,Jisでは一般的な粗目と細目を分類
するメッシュは#220位である。(それより粗いもの
を粗目,それより細かいものを細目,更に#600以上
を極細目と称している。)そして結合剤としてはメタル
ボンド砥石とかレジノイド砥石とか各種の結合剤を用い
ることが可能である。Incidentally, in Jis, a general mesh for classifying coarse and fine is # 220. (A coarser one is called coarse, a finer one is called fine, and more than # 600 is called extra fine.) And, as a binder, a metal bond grindstone, a resinoid grindstone, or various kinds of binders can be used. is there.
【0014】図2は,その状態を示した図1の断面図
で,ホイ−ルベ−ス1の先端外周部に粗目の砥粒層6が
固定されており更に,その表面部分は細目の砥粒層7で
ある。そして所定の幅w+αになるように焼き固めた後
最外周部の面に対し所定の角度,例えば45°で両面か
ら面取り加工し粗目の部分が先端内に現れ,側面部の微
細な砥粒部分にかかるようにドレッシング10を行い,更
に両側面を所定寸法Wになるまでα寸法除去加工するこ
とにより砥石が出来上がる。但しこのときの最先端の尖
った部分は砥石の幅wに対し,(w+α)/2の位置で
ある。尚,αは所定寸法に対しドレッシング加工をする
厚さ相当分だけ幅広く作られており,ドレッシングによ
り除去し所定寸法幅Wにすると同時に目立ても行うもの
である。又この時尖った先端部には,粗目の砥粒だけに
なるようにすることが必要である。FIG. 2 is a sectional view of FIG. 1 showing this state, in which a coarse abrasive grain layer 6 is fixed to the outer periphery of the tip of the wheel base 1 and the surface portion thereof is finely abrasive. It is the grain layer 7. Then, after being hardened so as to have a predetermined width w + α, chamfering is performed from both sides at a predetermined angle with respect to the surface of the outermost peripheral portion, for example, 45 °, and a rough portion appears in the tip, and fine abrasive grains on the side surface portion The dressing 10 is applied as described above, and the both sides are further processed to remove the α dimension until the predetermined dimension W is obtained, whereby the grindstone is completed. However, the pointed tip at this time is at a position of (w + α) / 2 with respect to the width w of the grindstone. It should be noted that α is made wider than the predetermined size by the thickness corresponding to the dressing process, and is removed by dressing to have the predetermined width W and simultaneously set. At this time, it is necessary to make only the coarse abrasive grains on the sharp tip.
【0015】図3及び図5は粗目の砥粒層を作成する時
に切欠部を設けたもので図3は第2の実施例を示すもの
で,砥石外周部に対し図4の切欠きの形状8も内周に向
かって広くなっているものであり,図6は図示するよう
にカギ穴状になっている。即ち粗目の砥粒層の外周部の
所定の間隔で複数ケの切欠部8,9があり,この部分を
通って粗目の砥粒層の両面に固着される。このように切
欠部8及び9の部分を作ることにより,高速で回転する
場合,粗目の砥粒層6の両側に細目の砥粒層7を固定し
てあるため細目の砥粒層が剥離脱落することはない。FIGS. 3 and 5 show a notch portion provided when a coarse abrasive grain layer is formed. FIG. 3 shows a second embodiment. The notch shape of FIG. Reference numeral 8 also widens toward the inner circumference, and as shown in FIG. 6, it has a keyhole shape. That is, a plurality of notches 8 and 9 are provided at a predetermined interval on the outer peripheral portion of the coarse abrasive grain layer, and the notches 8 and 9 are fixed to both surfaces of the coarse abrasive grain layer through these portions. By making the cutouts 8 and 9 in this way, when rotating at high speed, the fine abrasive grain layers 7 are fixed on both sides of the coarse abrasive grain layer 6 so that the fine abrasive grain layers peel off and fall off. There is nothing to do.
【0016】更に図7,図8はこの場合の砥石の断面形
状を示したものであり,図7のA−A´断面では切欠部
がないため粗目の砥粒が先端まであるのに対しB−B´
断面図8では細目の砥粒が先端の尖った部分まで形成し
ている。このため図7及び図8においては,最外周の尖
った部分は粗目の砥粒層6と細目の砥粒層8も交互に現
れることになる。次に図9は砥石幅wの広い砥石の断面
形状を示す他の実施例で,先端部をθの角度で面取り加
工しても先端を尖らせることは不可能な状態を示してい
る。この面取り部分11が大きくとれないため先端部は粗
目の砥粒層による平坦な部分が出来る。Further, FIGS. 7 and 8 show the sectional shape of the grindstone in this case. In the section AA 'of FIG. -B '
In the sectional view 8, fine abrasive grains are formed up to a pointed portion. For this reason, in FIGS. 7 and 8, the outermost pointed portion also has the coarse abrasive grain layers 6 and the fine abrasive grain layers 8 alternately appearing. Next, FIG. 9 shows another embodiment showing a sectional shape of a grindstone having a wide grindstone width w, and shows a state in which the tip cannot be sharpened even if the tip is chamfered at an angle of θ. Since the chamfered portion 11 cannot be made large, the tip portion has a flat portion due to the coarse abrasive grain layer.
【0017】これらの実施例のように研削切断用の薄い
砥石においては,最外周部分を尖らせることは可能であ
るが,図9のように成形研削とか平面研削若しくは円筒
研削等に用いられる砥石では砥石幅wが大きいため部分
的な面取り11しか出来ない。又,これらの面取り11はホ
イ−ルベ−スも厚く,又砥石層の厚い,幅の広いもので
あっても,又砥石層の薄い幅の狭いものであっても砥石
外周部に所定の角度θで面取りすることは有効である。In the thin grindstone for grinding and cutting as in these examples, it is possible to make the outermost peripheral portion sharp, but as shown in FIG. 9, a grindstone used for forming grinding, surface grinding, cylindrical grinding, or the like. In this case, since the whetstone width w is large, only partial chamfering 11 is possible. In addition, these chamfers 11 have a large wheel base, a thick and wide grindstone layer, and a thin and narrow grindstone layer. Chamfering at θ is effective.
【0018】更に粗目の砥粒層の砥粒の集中度は一般的
に100以下が普通であるが,同一のメタルボンド砥石
の結合剤の場合,細目は粗目の砥粒の集中度と同等か若
しくは集中度を100以上と高くすることが望ましい
が。これは見かけ上砥石の硬度を向上させることにな
る。これにより砥粒1ケ当りにかかる研削抵抗を少なく
することが出来,又一般的な研削加工時の周速最大18
00 m/min〜2000 m/minであるのに対し2500 m
/min〜3000 m/minと高速回転することにより,より
精度の高い鏡面を得ることができる。Generally, the concentration of abrasive grains in the coarse abrasive grain layer is generally 100 or less, but in the case of the same metal bond grindstone binder, is the fineness equal to the concentration of coarse abrasive grains? Alternatively, it is desirable to increase the concentration to 100 or more. This apparently improves the hardness of the grindstone. As a result, the grinding resistance per abrasive grain can be reduced, and the maximum peripheral speed during general grinding is 18
2500 m, while it is between 00 m / min and 2000 m / min
By rotating at a high speed of / min to 3000 m / min, a more precise mirror surface can be obtained.
【0019】次に図4及び図6に示すように砥石外周部
に所定のピッチで切欠部を作り,かつ両側面の粗目の砥
粒層の上に細目の砥粒層を設けることにより,切欠部に
も細目の砥粒層が出来,細目の砥粒層が脱落又は剥離す
ることがないため信頼性の向上につながる。又,電解研
削加工を考慮した場合にはメタルボンドの方が好ましい
が,只単に鏡面仕上げについて言えば,粗目の砥石層の
結合剤としてメタルボンドで作成し,更に表面部の細目
の砥粒層にはレジノイドボンドで作成することにより,
加工表面を鏡面にし易くなる。又この場合には複合の結
合剤による砥石でかつ複合の砥粒による砥石とすること
が出来る。Next, as shown in FIGS. 4 and 6, by forming notches at a predetermined pitch on the outer peripheral portion of the grindstone, and by providing fine abrasive grain layers on the coarse abrasive grain layers on both sides, the notches are formed. A fine abrasive grain layer is also formed on the portion, and the fine abrasive grain layer does not fall off or peel off, which leads to improvement in reliability. Further, when considering electrolytic grinding, metal bond is preferable, but for mirror finishing, metal bond is used as the binder for the coarse grindstone layer, and the finer grain layer on the surface is used. By making with Resinoid Bond,
It is easy to make the processed surface a mirror surface. In this case, a grindstone made of a composite binder and a grindstone made of composite abrasive grains can be used.
【0020】次に砥石先端外周部を粗目の砥粒でかつ尖
って作ったのは,例えばホイ−ルベ−スが薄く工作機械
による振動,ホイ−ルの振れ,又は砥石部に供給する研
削液のアンバランス,そして研削時の切込みスピ−ドが
非常に早い時にはホイ−ルの変形となり,直線状に研削
出来ないことがある。この為粗の砥粒の先端部を尖らせ
ることにより,上記ホイ−ルの変形を防止し,粗の砥粒
を用いることにより研削抵抗を軽減し加工性を向上させ
るようにしたものである。この場合の研削面の形状は梨
地状であり,従来の実施例と同じであるが,粗目の砥粒
により発生した加工表面の凹凸を細目の砥粒で切込んで
行くため微小な引っ掻き傷は残るが次工程に影響を与え
ない程度の鏡面が得られる。尚,加工に寄与する細目の
砥粒層の加工に寄与する幅L(図7参照)は,0.3m
m以上(望ましくは0.5mm以上)にすることにより
加工表面の面粗度を小さくすることが出来,又微小砥粒
即ち細目の砥粒による加工の為深いスクラッチも入りに
くくなる。Next, the outer peripheral portion of the grindstone is made by using coarse abrasive grains and is sharpened, for example, because the wheel base is thin, vibration by a machine tool, runout of the wheel, or grinding liquid supplied to the grindstone portion. When the cutting speed is unbalanced and the cutting speed during grinding is very fast, the wheel may be deformed and the grinding may not be straight. Therefore, by sharpening the tip of the coarse abrasive grains, the deformation of the wheel is prevented, and by using the coarse abrasive grains, the grinding resistance is reduced and the workability is improved. The shape of the ground surface in this case is satin-like, which is the same as that of the conventional example, but fine scratches are generated because the irregularities of the processed surface generated by the coarse abrasive grains are cut with the fine abrasive grains. A mirror surface is obtained which remains but does not affect the next process. The width L (see FIG. 7) that contributes to the processing of the fine abrasive grain layer that contributes to the processing is 0.3 m.
By setting m or more (preferably 0.5 mm or more), the surface roughness of the processed surface can be reduced, and deep scratches are less likely to enter because of processing with fine abrasive grains, that is, fine abrasive grains.
【0021】[0021]
【発明の効果】粗目の砥粒層の上部に細目の砥粒層を設
けることにより,切込み段階では粗目の砥粒層であるた
め研削加工における加工性は良く,かつその両側面は細
目の砥粒により加工するため表面は微小な引っ掻き傷の
集積となり鏡面が得られる。EFFECTS OF THE INVENTION By providing a fine abrasive grain layer on top of a coarse abrasive grain layer, workability in grinding is good because it is a coarse abrasive grain layer at the cutting step, and both side surfaces thereof have fine abrasive grains. Since it is processed with grains, the surface becomes a collection of minute scratches and a mirror surface is obtained.
【図1】本発明に係る砥石の斜視図。FIG. 1 is a perspective view of a grindstone according to the present invention.
【図2】図1に示す砥石の断面図。FIG. 2 is a sectional view of the grindstone shown in FIG.
【図3】第2の実施例の一部拡大正面図。FIG. 3 is a partially enlarged front view of the second embodiment.
【図4】第2の実施例の切欠部拡大図。FIG. 4 is an enlarged view of a notch portion of the second embodiment.
【図5】第3の実施例の一部拡大正面図。FIG. 5 is a partially enlarged front view of the third embodiment.
【図6】第3の実施例の切欠部拡大部。FIG. 6 is a notched portion enlarged portion of the third embodiment.
【図7】第2の実施例(図3)及び第3の実施例(図
5)のA−A´断面図。FIG. 7 is a sectional view taken along the line AA ′ of the second embodiment (FIG. 3) and the third embodiment (FIG. 5).
【図8】第2の実施例(図3)及び第3の実施例(図
5)のB−B´断面図。FIG. 8 is a sectional view taken along line BB ′ of the second embodiment (FIG. 3) and the third embodiment (FIG. 5).
【図9】砥粒層の幅の広い砥石の場合の断面図。FIG. 9 is a cross-sectional view of a grindstone having a wide abrasive grain layer.
【図10】従来の砥石を示す斜視図。FIG. 10 is a perspective view showing a conventional grindstone.
【図11】従来の砥石の使用初期段階の断面図。FIG. 11 is a sectional view of a conventional grindstone at an initial stage of use.
【図12】従来の砥石の使用後の断面図。FIG. 12 is a cross-sectional view after using a conventional grindstone.
【図13】従来の研削面の幅の広い砥石の断面図である。FIG. 13 is a cross-sectional view of a conventional grindstone having a wide ground surface.
1 ホイ−ルベ−ス 1´ 砥石幅の広い場合のホイ−ルベ−ス 2 フランジ取付孔 3 砥粒層 4 砥石の先端形状(使用前) 5 砥石の先端形状(使用後) 6 粗目の砥粒層 7,9 切欠部の形状例 10, 11 ドレッシング角度 1 Wheel base 1'Wheel base for wide grinding wheel 2 Flange mounting hole 3 Abrasive grain layer 4 Tip shape of grindstone (before use) 5 Tip shape of grindstone (after use) 6 Coarse grain Layer 7, 9 Example of notch shape 10, 11 Dressing angle
Claims (6)
石であって,2種以上の異なった粒度の砥粒を,それぞ
れ層状となし,かつ,ホイ−ルベ−スの周辺に粒度の粗
目の砥粒層を内側に,その両側面に粒度の細目の砥粒層
を設け,かつ砥石最外周部をV字状又は逆台形状とする
ことにより,研削加工時は被加工物に対する切込みの初
期においては粗目の砥粒層が作用し,切込みの進行に伴
い最終的に両側面の細目の砥粒層により加工するように
したことを特徴とする複合砥粒研削砥石。1. A grinding wheel for grinding such as forming, grinding and cutting, wherein two or more kinds of abrasive particles having different particle sizes are formed in layers, and the particle size is around the wheel base. A rough abrasive grain layer is provided on the inner side, fine grained abrasive grain layers are provided on both sides, and the outermost peripheral portion of the grindstone is V-shaped or inverted trapezoidal so that a cut is made in the workpiece during grinding. A composite abrasive grain grinding wheel characterized in that a coarse abrasive grain layer acts in the initial stage of, and as the cutting progresses, it is finally processed by the fine abrasive grain layers on both sides.
度による砥粒層を設け,更にその砥粒層の外周面部及び
両側面部上に同時に細目の砥粒による砥粒層を設けかつ
ホイ−ルベ−ス上の細目の砥粒層の幅は所定の研削幅と
し,かつホイ−ルベ−スの最外周部の砥粒層部をV字形
状又は逆台形状とした時両側面部に細目の砥粒層が又最
外周部先端には粗目の砥粒層が現れる迄最外周部をドレ
ッシングしたことを特徴とする複合砥粒研削砥石。2. An abrasive grain layer having a coarse abrasive grain size is provided on an outer peripheral portion of a wheel base, and further an abrasive grain layer having fine abrasive grains is simultaneously provided on an outer peripheral surface portion and both side surface portions of the abrasive grain layer. In addition, the width of the fine abrasive grain layer on the wheel base is set to a predetermined grinding width, and when the outermost peripheral abrasive grain layer portion of the wheel base is V-shaped or inverted trapezoidal, both sides A composite abrasive grain grinding wheel characterized in that the outermost peripheral portion is dressed until a fine abrasive grain layer appears at the tip of the outermost peripheral portion and a coarse abrasive grain layer appears at the tip of the outermost peripheral portion.
目の砥粒の砥粒層の所定の外周上でかつ等間隔の位置の
部分にU字状又はカギ穴状等の切込み溝を有し,細目の
砥粒層がその溝を通り,粗目の砥粒層の両側面上に固定
され,かつホイ−ルベ−スの最外周部の砥粒層部をV字
形状又は逆台形状としたことを特徴とする複合砥粒研削
砥石。3. A notch groove such as a U-shape or a keyhole-like shape at predetermined intervals on the outer periphery of a coarse abrasive grain adhered to the outer periphery of a wheel base at predetermined intervals. A fine abrasive grain layer passes through the groove and is fixed on both side surfaces of the coarse abrasive grain layer, and the outermost abrasive grain layer portion of the wheel base is V-shaped or inverted. A composite abrasive grain grinding wheel characterized by being shaped.
砥粒層よりなり粗目の砥粒層の間に所定の間隔で細目の
砥粒層があり,砥石外周部分が粗目と細目の砥粒層によ
り交互に形成されていることを特徴とする第3項記載の
複合砥粒研削砥石。4. The outermost peripheral portion of the grindstone is composed of a coarse abrasive grain layer and a fine abrasive grain layer, and there are fine abrasive grain layers at a predetermined interval between the coarse abrasive grain layers, and the outer peripheral portion of the grindstone is coarse and fine. The composite abrasive grain grinding wheel according to claim 3, wherein the abrasive grain layers are alternately formed.
砥粒層より細目の砥粒による砥粒層の砥粒率が下記の関
係にある。 粗目の砥粒層≦細目の砥粒層 ことを特徴とする第1項,第2項及び第3項記載のの複
合砥粒研削砥石。5. An abrasive grain ratio of an abrasive grain layer of finer abrasive grains than an abrasive grain layer of coarse abrasive grains of a composite abrasive grain grinding wheel has the following relationship. Coarse abrasive grain layer ≦ fine abrasive grain layer The composite abrasive grain grinding wheel according to the first, second and third aspects, wherein:
層と細目の砥粒層にそれぞれ異なった結合剤を用いたこ
とを特徴とする,第1項,第2項,第3項記載の複合砥
粒研削砥石。6. The composite abrasive grain grinding wheel, wherein different binders are used for the coarse abrasive grain layer and the fine abrasive grain layer, respectively. Composite abrasive grain grinding wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1803793A JPH07246564A (en) | 1993-01-07 | 1993-01-07 | Compound abrasive grain grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1803793A JPH07246564A (en) | 1993-01-07 | 1993-01-07 | Compound abrasive grain grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07246564A true JPH07246564A (en) | 1995-09-26 |
Family
ID=11960483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1803793A Pending JPH07246564A (en) | 1993-01-07 | 1993-01-07 | Compound abrasive grain grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07246564A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016168769A (en) * | 2015-03-13 | 2016-09-23 | 日本碍子株式会社 | Honeycomb structure manufacturing method and grinding wheel |
| CN106271942A (en) * | 2015-05-20 | 2017-01-04 | 蓝思科技股份有限公司 | The contour processing method of sapphire substrate and the emery wheel containing boart boart |
| JP2021194720A (en) * | 2020-06-10 | 2021-12-27 | 株式会社東京精密 | Cutting blade and method for manufacturing cutting blade |
-
1993
- 1993-01-07 JP JP1803793A patent/JPH07246564A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016168769A (en) * | 2015-03-13 | 2016-09-23 | 日本碍子株式会社 | Honeycomb structure manufacturing method and grinding wheel |
| US10576609B2 (en) | 2015-03-13 | 2020-03-03 | Ngk Insulators, Ltd. | Manufacturing method of honeycomb structure, and grinding wheel |
| EP3067194B1 (en) * | 2015-03-13 | 2023-07-12 | NGK Insulators, Ltd. | Manufacturing method of honeycomb structure, and grinding wheel |
| CN106271942A (en) * | 2015-05-20 | 2017-01-04 | 蓝思科技股份有限公司 | The contour processing method of sapphire substrate and the emery wheel containing boart boart |
| JP2021194720A (en) * | 2020-06-10 | 2021-12-27 | 株式会社東京精密 | Cutting blade and method for manufacturing cutting blade |
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