JPH0724770A - Suction sandwiching mechanism and temperature test device using it - Google Patents

Abstract

PURPOSE:To provide a suction sandwiching mechanism which can hold chip parts securely and reduce installation area and a temperature test device which uses this mechanism. CONSTITUTION:A suction sandwiching mechanism has a suction sandwiching means 4 which vacuum-sucks a chip part 1 and sandwiches it in conjunction with reciprocal movement of a slide shaft. Since the suction sandwiching means 4 vacuum-sucks the chip part 1 and sandwiches it, it is possible to hold the chip part 1 even when a vacuum source is cut off.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a suction / holding mechanism suitable for a temperature test of a chip component such as an IC and a temperature test device using the same.

[0002]

2. Description of the Related Art This type of temperature tester moves the chip parts sequentially supplied into a temperature-controlled room and applies a temperature load, for example, -55 to 150 ° C. to the chip parts to perform a temperature test of the chip parts. Is.

In the conventional temperature testing apparatus, the chip components are moved into the temperature-controlled room by adsorbing the chip components or by mounting the chip components on a plate or block such as a turntable and horizontally transporting them.

[0004]

However, in the conventional temperature test apparatus, there is a problem that the chip component drops when the vacuum source is cut off by the adsorption, and
When mounting the chip component on the plate or block, it is necessary to change the plate or block according to the size of the chip component. Further, there is a problem that the chip parts are blown off by the wind of the fan circulating in the temperature-controlled room.

Further, since a large number of chip parts are moved horizontally in a temperature-controlled room, there is a problem that a large installation area for the device is required and space efficiency is poor.

Therefore, the present invention has been made in view of the above circumstances, and provides a suction holding mechanism capable of reliably holding chip components and reducing the installation area, and a temperature test apparatus using the suction holding mechanism. The purpose is to do.

[0007]

In order to achieve the above object, the suction holding mechanism according to claim 1 is provided with a slide shaft supported so as to be reciprocally movable, and provided at the tip of this slide shaft.
It is characterized by having a suction port for vacuum-sucking a chip component and a chuck for pinching or releasing the chip component in conjunction with the reciprocating movement of the slide shaft.

Further, in the temperature test apparatus according to the second aspect of the present invention, the chip components that are sequentially supplied are moved into a temperature-controlled room to apply a temperature load to the chip components. It is characterized in that it has suction holding means for holding the parts.

According to a third aspect of the present invention, in the temperature test apparatus, the suction / holding means has a suction port for vacuum-sucking the chip component, and a plurality of suction / holding units for sandwiching the chip component sucked in the suction port. The present invention is characterized in that it has a mechanism, and has a rotating mechanism that holds the plurality of suction holding mechanisms rotatably in a vertical plane.

According to a fourth aspect of the present invention, in the temperature test device, the suction holding mechanism includes a slide shaft supported so as to be capable of reciprocating movement, and a suction port provided at the tip of the slide shaft for vacuum suction of a chip component. And a chuck that holds or releases the chip component in conjunction with the reciprocating movement of the slide shaft.

[0011]

According to the suction holding mechanism of the first aspect, since the chip parts are held or released in association with the reciprocating movement of the slide shaft, the mechanism can be made compact and simple.

According to the temperature test apparatus of the second aspect, since the suction holding means vacuum sucks the chip component and clamps the chip component, the chip component can be held even when the vacuum source is cut off. Even if the parts are different in size, it is possible to perform suction and clamping without changing the setup.

According to the temperature test apparatus of the third aspect, the rotating mechanism holds the plurality of suction holding mechanisms so as to be rotatable in the vertical plane, so that the installation area can be reduced.

According to the temperature testing device of the fourth aspect, the chip component is clamped or released in association with the reciprocating movement of the slide shaft, so that the suction and clamping mechanism can be downsized and simplified.

[0015]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is an external perspective view showing an embodiment of the temperature test apparatus of the present invention, and FIG. 2 is a front view showing its schematic structure.

As shown in FIG. 1, the apparatus of this embodiment has a box-shaped temperature-controlled room 3 arranged on a supply line 2 for a chip component 1, and inside this temperature-controlled room 3, as shown in FIG. , A plurality of suction holding mechanisms 5 for holding the chip components 1, a rotation mechanism 6 for holding the plurality of suction holding mechanisms 5 rotatably in a vertical plane, and a drive mechanism 7 described later for driving the suction holding mechanisms 5.
And are arranged.

FIG. 3 is a side view showing the suction holding mechanism 5, the rotating mechanism 6 and the driving mechanism 7, and FIGS. 4 and 5 are the suction holding mechanism 5.
5 is a side view showing the details of FIG. 4, FIG.
Indicates after operation.

The suction / holding mechanism 5 has a plate 50 fixed to a rotary plate 61 side of a rotary mechanism 6 which will be described later, and a vacuum shaft (movable vertically) which is inserted through a hole 50a provided in the plate 50. Slide shaft) 51, a holding member 53 that holds the vacuum shaft 51,
A first spring 52 that urges the vacuum shaft 51 upward, a slide rail 54 that guides the movement of the vacuum shaft 51 together with the holding member 53, and pinch the chip component 1 in conjunction with the reciprocating motion of the vacuum shaft 51. The link mechanism 55 for releasing is provided, and the whole is preassembled as one unit and can be replaced in units of this unit.

The link mechanism 55 includes a pair of links 550 rotatably connected to the plate 50, a pair of chucks 551 rotatably connected to the tip ends of the pair of links 550, and a pair of links 550. A connecting link 552 that connects the rear ends of the chuck 551 to each other, and a second spring 553 that urges the connecting link 552 downward.
And a pair of stoppers 554 that prevent the chuck 551 from opening too much.

The vacuum shaft 51 is provided at its tip end side with a flat contact surface 51a with which the chip component 1 comes into contact, so that the chip component 1 can be clamped securely and heat can be easily transferred to the chip component 1. ing. In addition, at the center of the vacuum shaft 51, the intake hole 51 is provided along the axial direction.
b is formed so that the chip component 1 can be sucked through the intake hole 51b. Further, a bellows (suction port) 56 is provided on the tip end side of the air intake hole 51b to ensure that the chip component 1 can be suctioned.

In the suction holding mechanism 5 before the operation, as shown in FIG. 4, the spring force of the first spring 52 overcomes the spring force of the second spring 553, so that the first spring 52 extends and the first spring 52 extends. The second spring 553 is compressed and the pair of chucks 551 are in a closed state. In the suction holding mechanism 5 after the operation, as shown in FIG. 5, the support member 71 of the drive mechanism 7 described later pushes down the vacuum shaft 51, the first spring 52 is compressed, and the second spring 553 is When extended, the pair of chucks 551 are in an open state.

The rotating mechanism 6 includes a fixed plate 60 fixed to the floor, a rotary plate 61 rotatably supported by a rotary shaft 63 on the fixed plate 60, and a stepping motor for rotating the rotary plate 61. First motor such as (see Figure 6)
And 62. In the rotating mechanism 6, when the rotating plate 61 is rotated by the first motor 62, the plurality of suction holding mechanisms 5, the rotating plate 61, and the rotating shaft 63 are all rotated together.

The drive mechanism 7 is a thermostatic chamber 3 in FIG.
As shown in FIG. 3, the fixing plate 60 is disposed at the lower center of the fixing plate 60.
A slide rail 70 fixed to the slide rail 70, and a support member 71 supported by the slide rail 70 so as to be vertically movable,
A second motor (see FIG. 6) 72 such as a stepping motor for holding the chip component 1 by vertically moving the support member 71, and a rotational driving force of the second motor 72 are converted into a linear direction. And a rack and pinion mechanism (not shown) for transmitting to the slide rail 70.
By the control described above, the suction holding mechanism 5 moved to the position opposite to the drive mechanism 7 is driven. An intake hole 71a to which a pipe (not shown) is connected from the vacuum pump 9 is provided on the tip side of the support member 71.
An elastic member 73 such as an O-ring or a bellows is provided on the tip side of a, and the vacuum shaft 51 is used during the suction operation.
The upper end surface 51c of the above can be closely attached.

FIG. 6 is a block diagram showing the control system of this embodiment.

This apparatus comprises a constant temperature section 8 for keeping the constant temperature room 3 at a constant temperature, a vacuum pump 9 for performing an intake operation, a pump drive section 10 for driving the vacuum pump 9, and the first and second motors. A motor drive unit 11 for driving 62, 72;
The control unit 12 controls each unit of the apparatus.
The suction / holding mechanism 5, the drive mechanism 7, the vacuum pump 9, the pump drive unit 10, and the motor drive unit 11 constitute a suction / holding unit 4 for holding the chip component 1 in vacuum and holding the component 1.

Next, the operation of this embodiment will be described.

The constant temperature chamber 3 is kept at a constant temperature to be tested by the constant temperature section 8.

When the chip component 1 to be subjected to the temperature test is conveyed on the supply line 2 and reaches right under the temperature-controlled room 3, the motor drive unit 11 is controlled by the control unit 12 so that the second drive mechanism 7 is driven. The motor 72 is driven to lower the support member 71 along the slide rail 70 via a rack and pinion mechanism (not shown).

When the support member 71 descends, the support member 71
The elastic member 73 provided on the distal end side of the suction holding mechanism 5
The upper end surface 51c of the vacuum shaft 51 is contacted, and the supporting member 71 further lowers the holding member 53. The first spring 52 is compressed, the second spring 553 of the link mechanism 55 expands, the connecting link 552 is pushed downward, and the pair of chucks 551 are opened.

On the other hand, when the vacuum shaft 51 starts descending, the pump drive section 10 drives the vacuum pump 9 under the control of the control section 12 to start the intake operation.

When the vacuum shaft 51 further descends and the contact surface 51a comes into close contact with the upper surface of the chip component 1,
As shown in FIG. 7, the bellows 56 is compressed upward and adheres to the upper surface of the chip component 1, and the chip component 1 is adsorbed to the contact surface 51 a of the vacuum shaft 51.

Next, the motor drive section 11 is controlled by the control section 12 to reversely rotate the second motor 72 of the drive mechanism 7,
The support member 71 is raised along the slide rail 70 via a rack and pinion mechanism (not shown). At this time,
, The first spring 52 expands, the second spring 553 compresses, the connecting link 552 returns upward, and the pair of chucks 551 close to close the chip component 1.
Is clamped.

When the chip part 1 is clamped by the pair of chucks 551, the pump drive section 10 stops the suction operation by the vacuum pump 9 under the control of the control section 12.

Next, the motor drive unit 11 rotates the rotary plate 61 under the control of the control unit 12 so that the suction holding mechanism 5 adjacent to the suction holding mechanism 5 that clamps the chip component 1 faces the drive mechanism 7. The chip component 1 is moved to the position and the chip component 1 is sucked and pinched in the same manner as described above. In this way, the plurality of chip components 1 that are sequentially supplied are placed in a thermostatic chamber 3
The temperature load can be continuously applied to the plurality of chip parts 1 by sequentially moving the inside. On the contrary, when the rotating plate 61 goes around once, in order to return the sandwiched chip component 1 onto the supply line 2, the vacuum shaft 51 is lowered while the chip component 1 is adsorbed by the suction operation, and the second spring 5
The chuck 5 is extended by extending 53 and pushing down the connecting link 552.
After opening and releasing 51, the intake operation is stopped.

According to this embodiment, since the chip component 1 is vacuum-sucked and the component 1 is clamped, the chip component 1 can be held even when the vacuum source is cut off, and the chip component 1 can be held. Can be reliably held. Therefore, it is possible to carry the chips upside down, and a large number of chip components 1 can be sent three-dimensionally. Also,
Since the plurality of suction holding mechanisms 5 are rotatably held in the vertical plane, the installation area can be reduced. Further, since the suction holding mechanism 5 is configured to hold or release the chip component 1 in conjunction with the movement operation of the vacuum shaft 51,
The suction and clamping mechanism 5 can be made smaller and simpler. Furthermore, unlike mounting on a plate or block such as a turntable, the chip components 1 of different sizes can be clamped, so that setup change can be eliminated.

The present invention is not limited to the above embodiment,
Various modifications can be made without departing from the spirit of the invention.

[0038]

As described in detail above, the present invention has the following effects.

According to the first aspect of the invention, the chip parts are clamped or released interlockingly with the reciprocating motion of the slide shaft, so that the mechanism can be downsized and simplified, and the device using the mechanism can be installed. The area can be reduced. Further, even if the chip parts are different in size, they can be sucked and pinched, and the setup change which has been conventionally required can be eliminated.

According to the second aspect of the present invention, since the chip component is vacuum-sucked and is sandwiched, the chip component can be held even when the vacuum source is cut off, and the chip component can be reliably held. Like Further, even if the chip parts are different in size, they can be sucked and pinched, and the setup change which has been conventionally required can be eliminated.

According to the third aspect of the present invention, since the plurality of suction holding mechanisms are rotatably held in the vertical plane, the installation area can be reduced.

According to the fourth aspect of the present invention, since the suction holding mechanism is configured to hold the chip component in conjunction with the reciprocating movement of the slide shaft, the suction holding mechanism can be downsized and simplified.

[Brief description of drawings]

FIG. 1 is an external perspective view showing an embodiment of a temperature test device of the present invention.

FIG. 2 is a front view showing a schematic configuration of this embodiment.

FIG. 3 is a side view showing a suction-holding mechanism, a rotation mechanism, and a drive mechanism of this embodiment.

FIG. 4 is a detailed side view showing a state before the operation of the suction holding mechanism of the present embodiment.

FIG. 5 is a detailed side view showing a state after the operation of the suction holding mechanism of the present embodiment.

FIG. 6 is a block diagram showing a control system of this embodiment.

FIG. 7 is a side view for explaining the operation of this embodiment.

FIG. 8 is a side view for explaining the operation of this embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip parts 2 Supply line 3 Temperature-controlled room 4 Adsorption pinching means 5 Adsorption pinching mechanism 51 Vacuum shaft (slide shaft) 55 Link mechanism 551 Chuck 56 Bellows (suction port) 6 Rotating mechanism 61 Rotating plate 63 Rotating shaft

Claims (4)

[Claims] 1. A slide shaft supported so as to be reciprocally movable,
A suction-holding mechanism provided at the tip of the slide shaft, which has a suction port for vacuum-sucking a chip component, and a chuck for holding or releasing the chip component in conjunction with the reciprocating movement of the slide shaft. 2. A temperature test apparatus for moving successively supplied chip components into a temperature-controlled room to apply a temperature load to the chip components, which has a suction clamping means for vacuum clamping the chip components and clamping the chip components. A temperature test device. 3. The suction holding means includes a suction opening for vacuum-sucking the chip component, and a plurality of suction holding mechanisms for holding the chip components sucked in the suction opening. The temperature test apparatus according to claim 2, further comprising a rotation mechanism that holds the mechanism rotatably in a vertical plane. 4. The suction holding mechanism is provided with a slide shaft supported so as to be capable of reciprocating movement, a suction port provided at a tip of the slide shaft for vacuum suction of a chip component, and interlocked with reciprocating movement of the slide shaft. 4. A temperature test apparatus according to claim 3, further comprising a chuck that clamps or releases the chip component.