JPH07256362A - Press dies for high-mix low-volume production - Google Patents

Abstract

(57) [Summary] [Purpose] Not only can a different type be easily dealt with by simply exchanging a part of the die, but also die parts can be easily incorporated. [Structure] A press die for different types of semiconductor products by exchanging a guide die and an exchange unit in the upper die and exchanging cutting blades 37A to 37C, a die yoke insert piece 38, and a die set insert piece 34 in the lower die. Therefore, even if different types are used, some of them can be replaced. Therefore, it is not necessary to design and manufacture a press die each time as in the conventional technique, so that not only the time and effort of die production can be saved but also the cost can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-mix low-volume production press die suitable for press-processing a high-mix low-volume product by exchanging a part of the die.

[0002]

2. Description of the Related Art The structure of a conventional press die is discussed in "Press Technology Vol. 29, No. 12, pages 89 to 92" (published by Nikkan Kogyo Shimbun). That is, the upper mold has a structure in which a punch plate has a stripper guide pin and a punch incorporated therein, while the lower mold has a structure in which a die, a backing plate and the like have been incorporated in a die set. Then, when pressing a new product of a different type, it was necessary to remanufacture a die corresponding to the new product.

[0003]

By the way, in the case of semiconductor products, not only the length of the lead terminal differs depending on the type, but also a small amount may be produced for each type. When a semiconductor product of a different type from the conventional one is to be pressed, it is inevitable that a press die is designed and manufactured each time. Therefore, it not only takes time and effort to manufacture the mold, but also the cost is high, and if the manufactured mold is to be assembled into the press machine, each part of the mold must be set again from the beginning. Since it has to be done, there is also a problem that it takes too much time to assemble the parts.

In view of the above-mentioned problems of the prior art, the object of the present invention is not only to easily deal with different types of products by simply exchanging a part of the mold, but also to easily incorporate mold parts. An object is to provide a press die for high-mix low-volume production that can perform.

[0005]

In a press die for high-mix low-volume production of the present invention, different types of workpieces are machined, and it comprises an upper die and a lower die fixed to a press machine. ing. The upper die includes an upper die set movably attached to the pressing device toward the lower die, and an exchange unit attached to the upper die set in an exchangeable manner and having a punch capable of pressing a workpiece. , A punch guide that is attached to a position below the replacement unit of the upper die set in a state of being urged toward the lower mold and that can guide a punch of the replacement unit. The lower die is fixed at a position facing the upper die of the press machine, and has a lower die set with a replaceable die set insert die having a drop hole for a scrap produced when processing a workpiece. It has a cutting blade that is fixed on the die set and that is arranged on the upper side and that processes a workpiece, and a die plate that has a backing insert piece that is arranged below the cutting blade and that is replaceably attached. Then, according to the type of workpiece, the replacement unit and the punch guide are selectively attached to the upper die set in the upper die, while the die set insert piece is cut into the lower die set and cut in the lower die. The blade and the backing insert piece are configured to be selectively attached to the die plate, respectively.

[0006]

According to the present invention, as described above, the replacement unit and the punch guide are selectively attached to the upper die set in the upper die according to the type of the workpiece, while the die set is inserted in the lower die. Since the piece is selectively attached to the lower die set and the cutting blade and the backing insert piece are selectively attached to the die plate respectively, it is possible to deal with different types by simply replacing a part of the upper die and the lower die. However, even if different types are used, some of them can be replaced. Therefore, it is not necessary to design and manufacture a press die each time as in the conventional technique, so that not only the time and effort of die production can be saved but also the cost can be reduced. Moreover, as described above, since it is only necessary to replace a part of the upper mold and the lower mold, as compared with the conventional technique,
Since it is not necessary to reset each part of the mold from the beginning, positioning and assembling between the parts become easy.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. The press die of the embodiment is for collectively cutting a plurality of lead terminals B protruding around the semiconductor product A as shown in FIGS. 7 and 8 into a predetermined length. Similar to the above, the mold is roughly divided into an upper mold and a lower mold, and a part of the upper mold and the lower mold is configured to be exchangeable for each type of semiconductor product to be pressed. Specifically, as shown in FIGS. 2 and 4, the upper die has a shank holder 11 attached to the upper part of the press machine and an upper die set 9 via the shank plate 12 on the shank holder 11. There is. The shank holder 11 is attached by engaging with a ram of a pressing device (not shown). The upper die set 9 is attached to the shank holder 11 by a bolt 42 passing through the holder 11 and the shank plate 12, and moves downward during press working, and an exchange unit is exchangeably attached to the bottom surface thereof. . The replacement unit is used separately for each type of the semiconductor product A, and as shown in FIG. 3, is mounted on the backing plate 8 and the screws on the backing plate 8 to hold the punch 1 described later. The punch plate 2, the punch 1C for cutting the lead terminal B of the semiconductor product A into a desired length, and the neck plate 1a of the punch 1C which is attached to the punch plate 2 by the fixing screw 13.
It is composed of a punch holder 7 for fixing. The punch plate 2 is configured to be positioned and held by inserting the punch 1C. Although only one punch 1C is shown in FIGS. 2 and 3, the lead terminals B projecting around the semiconductor product A and bent into a desired shape as shown by the solid line in FIG. 8 are collectively formed. It is configured as a set of four so that it can be cut into.

The exchange unit also has punches 1A and 1B in addition to the punch 1C. That is, the punch 1A is, as shown in FIG. 6, when the plate material C on which the semiconductor product A is to be molded is conveyed and positioned, the punch 1A is pressed to form the lead terminals of the semiconductor product A from the plate material C. This is to hollow out B horizontally. The punch 1B is arranged between the punch 1A and the punch 1C,
As shown in FIG. 6, each lead terminal B is punched by the punch 1A.
When the plate material C, which is hollowed out horizontally, is conveyed and positioned, each lead terminal C is pressed by pressing.
Is bent into a desired shape, that is, it is molded from the chain line state shown in FIG. 8 as shown by the solid line. Again punch 1
Similarly to the punch 1C, A and 1B are exchanged according to the type of the semiconductor product A. Further, the punches 1A and 1B are fixed to the punch plate 2 by the punch presser 7 as in the case of 1C. Therefore, the plate material C is sequentially fed from the punch 1A side to the 1B and 1C sides between the upper die and the lower die. In FIG. 6, the semiconductor product A whose lead terminals B are cut by the punch 1C is adsorbed and ejected by the adsorbing means that moves between the punch 1C and a lower mold described later. As shown in FIG. 1, this exchange unit has punch blocks 3, 3 on the upper die set when one of the two side plates 4, 4 provided on the upper die set 9 is removed. After being inserted in between, it is fixed to the upper die set 9 by being tightened by the bolt 14 for fixing the unit. Therefore, the punch blocks 3 and 3 are assembled on the lower surface of the upper die set 9 so as to face each other, and the side plates 4 and 4 are fixed by the bolts 15 on both sides of the punch blocks 3 and 3.

In addition to the upper die set 9 and the exchange unit, the upper die has a guide die for guiding the punches 1A to 1C of the exchange unit. The guide type is shown in FIG.
As shown in FIG. 2, it has a punch guide 5 and a stripper plate 6 assembled by a knock pin 15 and a screw 16. Like the replacement unit, the punch guide 5 is used separately for each type of the semiconductor product A, and the punch guide 5 and the stripper plate 6 have punches 1A to 1A, respectively, as shown in FIG. 1C
Guide holes 5A to 5C and 6A, 6B are formed to pass through. As shown in FIG. 2, the guide holes 5A to 5C are formed through the punch guide 5 in a shape corresponding to the punches 1A to 1C. Of the guide holes 6A and 6B, the guide hole 6A is formed in a shape similar to the guide hole 5A, and the guide hole 6B is formed in one shape in which the guide holes 5B and 5C are integrated, and a stripper plate having these 6 is always used regardless of the type of punch guide 5. Further, insertion holes 6a are provided at four positions around the stripper plate 6 as shown in FIGS. 1 and 2, and guide pins 18 fixed to the upper die set 9 are inserted into the insertion holes 6a via guide bushes 17. is doing.
In addition to this, the tip of the connecting screw 19 is screwed onto the upper portion of the stripper plate 6, and the screw 19 inserts the collar 20. The head of the collar 20 is fitted in the spring accommodating portion 9a of the upper die set 9 so as to be movable in the vertical direction, and the lower portion of the collar 20 is in contact with the upper surface of the stripper plate 6 with the screw 19 inserted as described above. The stripper plate 6 is urged toward the lower mold by the spring force of the spring 21 arranged in the spring accommodating portion 9a.

When the upper die set 9 and the guide die of the upper die are in the states as shown in FIGS. 2 and 4, the upper die set 9, the replacement unit and the guide die are all driven to the top dead center by driving the press machine. , The guide die punch guide 5 presses the semiconductor product A to be processed against the lower die described later to stop, and at that time, the upper die set 9 resists the elastic force of the spring 21 and further the guide pin. As the process proceeds while being guided by 18, the tips of the punches 1A to 1C of the replacement unit on the upper die set 9 pass through the inside of the punch guide 5,
The lead terminal B of the semiconductor product A is processed and moved to the position of the bottom dead center in the lower die to perform a predetermined press work. That is, the guide die plays a role of guiding the punch 1 when the punch 1 is moved and pressing the semiconductor product A to be processed to the lower die. Therefore,
The upper die has an upper die set 9, an exchange unit and a guide die.

On the other hand, the lower mold is, as shown in FIGS. 4 and 5,
It has a lower die set (die holder) 31 and a die yoke 32. As shown in FIGS. 4 and 5, the lower die set 31 is fixed at a position corresponding to the upper die in the lower portion of the pressing device, and inside thereof, a scrap generated when the lead terminal B of the semiconductor product A is processed is formed. A die set insert piece 34 having a drop hole 33 for dropping is attached by a bolt 35. Die set entry piece 34
Is to be replaced for each type of semiconductor product A. When replacing, the bolt 35 is removed and the die set insert piece 3
4 is removed from below. A guide post 36 is provided between the lower die set 31 and the upper die set 9 of the upper die. The lower portion of the guide post 36 is press-fitted and fixed to the lower die set 31, and the upper portion thereof is the upper die set 31. It is inserted into the guide bush 39 mounted in the hole of the set 9 to guide the movement of the upper die set 9.

The die yoke 32 is fixed on the lower die set 31, and the lead terminals B of the semiconductor product A are mounted on the upper surface of the die yoke 32.
In addition to having cutting edges 37A to 37C for forming a desired shape, a backing insert piece 38 is provided below the cutting edges 37A to 37C to reduce the impact when the lead terminal B is punched out. Of the cutting blades 37A to 37C, the cutting blade 37C is inserted into a hole provided at a position corresponding to the punch 1C in the die yoke 32, as shown in FIG.
Further, by tightening the die retainer 40 with bolts 41, the die retainer 40 is replaceably attached to the die yoke 32. This cutting edge 37C is, as shown in FIG.
The tip end is tapered so that the scraps B ′ generated when the lead terminal B of FIG.
In addition, in FIG. 6, the spring 4 is provided inside the cutting edge 37C.
An ejector 45 biased upward by 4 is arranged. Although the cutting blades 37A and 37B are shown only in FIG. 6, they are arranged in the holes provided at the positions corresponding to the punches 1A and 1B in the die yoke 32, and are replaced, like the cutting blade 37C shown in FIG. Installed as possible.
The backing insert piece 38 is replaceably attached to the lower position of the cutting blades 37A to 37C in the die yoke 32, and when exchanging, the die 37A to 37C is extracted upward from the die yoke 32 and then extracted in the same direction as the die. I have to. Therefore, the backing insert piece 38 is the die 37
It is formed to a size equal to or smaller than that of A to 37C, and has a slightly smaller shape in this example. Therefore, the die set insert piece 34, the cutting edge 37, and the backing insert piece 38 correspond to the type of the semiconductor product A to be processed, and they are replaced when processing a semiconductor product different from the conventional ones. It In FIG. 4, 43 is a guide bush mounted in the hole of the die yoke 32, and the guide pin 18 is inserted when the upper die is lowered. In such a die, the plate material C is conveyed and sequentially passes through the punches 1A, 1B, 1C, so that the lead terminals B of the semiconductor product A are hollowed out.
Bending of the lead terminal B and cutting of the lead terminal B are sequentially performed collectively.

Since the mold for multi-product small-quantity production of the embodiment has the above-mentioned structure, its handling will be described below. Now, after pressing a specific type of semiconductor product A as shown in the drawing, and then pressing a semiconductor product of a different type from this, after removing the mold in which the upper die and the lower die are integrated from the press machine, , By exchanging a part of the upper mold and the lower mold from this integrated mold. That is, in the upper mold, first, the bolt 42 is pulled out to integrally remove the shank holder 11 and the shank plate 12, and then the spring 21 is removed from the upper die set 9 of the upper mold.
After removing, the guide mold is removed by removing the connecting screw 19. After that, one side plate 4 is removed on the upper die set 9 as shown in FIG. 1, the replacement unit is removed from the removed side, and then the replacement unit of the semiconductor product to be pressed is taken out and placed on top. Insert it on the die set 9 and attach it. Further, the removed guide type is the stripper plate 6
After removing the knock pin 15 and the screw 16 from the punch guide 5 to remove the punch guide of the semiconductor product to be replaced, the punch guide is attached to the stripper plate 6 by the knock pin 15 and the screw 16. When the semiconductor products to be replaced in this way are incorporated into the replacement unit and the guide die, the upper die is assembled by attaching them to the upper die set 9 in the reverse order of the above, and the die is also pressed. Attach to the mold.

On the other hand, in the lower die, as shown in FIG. 5, the bolts 35 are removed from the lower die set 31 and the die set insert pieces 34 are removed, and then the die set insert pieces to be replaced are lowered by the bolts 35. Attach to the die set 31. Further, after removing the bolt 41 and the die retainer 40 from the die yoke 32, the cutting edges 37A to 37C are respectively removed, and the die yoke insertion piece 38 at the lower position thereof is removed.
Then, the die yoke insert piece and the die to be replaced are respectively inserted into the die yoke 32, and then the die retainer 40 is tightened with the bolts 41. This completes the replacement of the lower mold.

As described above, in the upper die, the guide type punch guide 5 and the exchange unit are exchanged, and in the lower die, the cutting blades 37A to 37C, the die yoke insertion piece 38, and the die set insertion piece 34 are exchanged. Since it can be a press die for different semiconductor products, that is,
Since it is possible to deal with different types by simply exchanging a part of the upper mold and the lower mold, even if the types are different, only a part of them needs to be replaced. Therefore, it is not necessary to design and manufacture a press die each time as in the conventional technique, so that not only the time and effort of die production can be saved but also the cost can be reduced. Moreover, as described above, since it is only necessary to replace a part of the upper mold and the lower mold, it is not necessary to reset each part of the mold from the beginning as compared with the prior art, and positioning and assembling between the parts. Will be easier. Further, in the illustrated embodiment, as the upper die replacement unit, three types of punches 1A to 1C are provided, and the plate material C on which the semiconductor product A is formed is simply sent to the die, and the lead terminals B of the semiconductor product A are simply sent. Since the hollowing, bending, and cutting are sequentially performed, the steps from the hollowing to the cutting can be reliably performed with one set of molds. Therefore, the plate material C on which the semiconductor product A is formed is conveyed to the next step each time the boring step or the bending step is completed,
Moreover, since it is not necessary to set the semiconductor product, the pressing process of the semiconductor product can be smoothly performed, and an extremely rational process can be obtained.

[0016]

As described above, according to the present invention, different types of press products can be dealt with by simply exchanging a part of the upper die and the lower die. Even if it is a thing, it will be possible to replace part of it,
Therefore, not only the time and effort of the die manufacturing process can be saved, but also the cost can be reduced, and the parts of the die are not reset from the beginning.
As a result of facilitating positioning and assembling between the parts, there is an effect that it is possible to provide a press die suitable for high-mix low-volume production.

[Brief description of drawings]

FIG. 1 is a schematic perspective view for explaining an upper die showing an embodiment of a press die for high-mix low-volume production according to the present invention.

FIG. 2 is an enlarged sectional view showing an assembled state of the upper mold.

FIG. 3 is an explanatory sectional view showing a replacement unit.

FIG. 4 is an explanatory sectional view showing an assembled state of a mold.

FIG. 5 is an explanatory cross-sectional view showing a main part of a lower mold.

FIG. 6 is an explanatory diagram when a semiconductor product is pressed by an upper die and a lower die.

FIG. 7 is a plan view (a) and a front view (b) showing a semiconductor product.

8 is a Z of FIG. 7 (b) showing a lead terminal of a semiconductor product.
FIG.

[Explanation of symbols]

1A to 1C ... punch, 2 ... punch plate, 7 ... punch holder, 8 ... backing plate, 5 ... punch guide,
6 ... Stripper plate, 9 ... Upper die set, 3 ... Punch block, 4 ... Side plate, 31 ... Lower die set, 32 ... Die yoke, 33 ... Drop hole for removing scraps, 3
4 ... die set insert piece, 37A to 37C ... cutting edge, 38 ... die yoke insert piece.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Akito Hidaka 393 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Hitate Shonan Electronics Co., Ltd.

Claims (1)

[Claims] 1. A press die for multi-product small-quantity production for processing different kinds of workpieces, which comprises an upper die and a lower die fixed to a press device, the upper die being a lower die for the press device. An upper die set movably attached to the upper die set, an exchange unit exchangeably attached to the upper die set and having a punch capable of pressing a workpiece, and a position lower than the exchange unit of the upper die set. And a punch guide capable of guiding the punch of the replacement unit, the lower die being fixed at a position facing the upper die of the pressing device, A lower die set having a replaceable die set insert piece having a drop hole for a scrap generated when processing a workpiece, and a cutting die fixed on the lower die set and arranged on the upper portion for processing a workpiece. Blade, the cutting edge And a backing insert piece arranged at the lower part of each of the upper and lower sides of the die plate. On the other hand, in the lower die, the die set insert die is selectively attached to the lower die set, and the cutting blade and the backing insert die are selectively attached to the die plate, respectively.