JPH0726853Y2 - Led表示装置 - Google Patents
Led表示装置Info
- Publication number
- JPH0726853Y2 JPH0726853Y2 JP1989064824U JP6482489U JPH0726853Y2 JP H0726853 Y2 JPH0726853 Y2 JP H0726853Y2 JP 1989064824 U JP1989064824 U JP 1989064824U JP 6482489 U JP6482489 U JP 6482489U JP H0726853 Y2 JPH0726853 Y2 JP H0726853Y2
- Authority
- JP
- Japan
- Prior art keywords
- lens
- led
- display device
- led chips
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989064824U JPH0726853Y2 (ja) | 1989-06-01 | 1989-06-01 | Led表示装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989064824U JPH0726853Y2 (ja) | 1989-06-01 | 1989-06-01 | Led表示装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH033762U JPH033762U (cs) | 1991-01-16 |
| JPH0726853Y2 true JPH0726853Y2 (ja) | 1995-06-14 |
Family
ID=31596110
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989064824U Expired - Lifetime JPH0726853Y2 (ja) | 1989-06-01 | 1989-06-01 | Led表示装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0726853Y2 (cs) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61205463A (ja) * | 1985-03-08 | 1986-09-11 | Shinwa Seisakusho:Kk | 生海苔連続軟化洗浄装置 |
| JP2540829Y2 (ja) * | 1993-04-02 | 1997-07-09 | 信男 鈴木 | ガス発生装置およびガス発生装置用除じん装置 |
| EP2027412B1 (en) * | 2006-05-23 | 2018-07-04 | Cree, Inc. | Lighting device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4912881U (cs) * | 1972-05-11 | 1974-02-02 | ||
| JPS5315269Y2 (cs) * | 1972-06-26 | 1978-04-21 | ||
| JPS51154160U (cs) * | 1975-06-02 | 1976-12-08 | ||
| JPS5950455U (ja) * | 1982-09-24 | 1984-04-03 | 三洋電機株式会社 | 発光ダイオ−ド装置 |
| JPH0447747Y2 (cs) * | 1986-08-25 | 1992-11-11 | ||
| JPS648762U (cs) * | 1987-07-07 | 1989-01-18 | ||
| JPS6449987U (cs) * | 1987-09-22 | 1989-03-28 |
-
1989
- 1989-06-01 JP JP1989064824U patent/JPH0726853Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH033762U (cs) | 1991-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |