JPH0727677Y2 - Refrigerant flow guide mechanism for heat sink - Google Patents
Refrigerant flow guide mechanism for heat sinkInfo
- Publication number
- JPH0727677Y2 JPH0727677Y2 JP1988164874U JP16487488U JPH0727677Y2 JP H0727677 Y2 JPH0727677 Y2 JP H0727677Y2 JP 1988164874 U JP1988164874 U JP 1988164874U JP 16487488 U JP16487488 U JP 16487488U JP H0727677 Y2 JPH0727677 Y2 JP H0727677Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- refrigerant
- heat
- guide mechanism
- flow guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電子装置等に使用される冷却機構に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a cooling mechanism used for an electronic device or the like.
従来、電子装置等に使用される電子部品の冷却を強制対
流冷却で行う場合、電子部品から発生した熱を、電子部
品に熱伝導率の良好な接着剤で固着したヒートシンクに
伝達させ、さらに、ヒートシンクの放熱フィンより、ヒ
ートシンクに接している流体に伝達させている。Conventionally, when the cooling of electronic components used in electronic devices and the like is performed by forced convection cooling, the heat generated from the electronic components is transferred to the heat sink fixed to the electronic components with an adhesive having good thermal conductivity, and The heat is dissipated from the heat dissipating fins of the heat sink to the fluid in contact with the heat sink.
従来は第７図に示すように電子部品４に断面櫛歯状のヒ
ートシンク5aを固着するか、又は第８図に示すように電
子部品４にピン状のヒートシンク5bを固着し、これを第
９図に示すようにプリント基板５に搭載し、ファン等で
ヒートシンク5a又は5bに冷媒を流して冷却を行ってい
た。Conventionally, a heat sink 5a having a comb-shaped cross section is fixed to the electronic component 4 as shown in FIG. 7, or a pin-shaped heat sink 5b is fixed to the electronic component 4 as shown in FIG. As shown in the figure, it was mounted on a printed circuit board 5 and cooled by flowing a coolant through a heat sink 5a or 5b with a fan or the like.
上述した従来の強制対流冷却において、プリント基板へ
の実装段階あるいは製品段階において、ヒートシンク5
a,5bによる冷却能力不足が判明した場合、ヒートシンク
5a,5bとIC等の電子部品４は十分に固着されているた
め、ヒートシンク5a,5bをIC等の電子部品４より取外す
のは困難であり、ヒートシンク5a,5b自体を更に冷却能
力の高い他の冷却フィンに付け替えるのは通常不可能で
ある。また、ICの高集積化により、電力が増大し従来の
冷媒量では冷却が十分にできないことがある。In the conventional forced convection cooling described above, the heat sink 5
If it is found that the cooling capacity due to a, 5b is insufficient, heat sink
Since the electronic components 4 such as ICs are sufficiently fixed to the electronic components 4 such as ICs, it is difficult to remove the heat sinks 5a and 5b from the electronic components 4 such as ICs, and the heat sinks 5a and 5b themselves have a higher cooling capacity. It is usually impossible to replace it with the cooling fin. Also, due to the high integration of ICs, electric power increases, and cooling may not be sufficiently performed with the conventional amount of refrigerant.
冷却能力を増加するには、冷媒量を増せばよいが、例え
ばファンなどは騒音が問題になり、容易に能力を向上さ
せることは難しい。また、ヒートシンクを大型のものに
すれば熱伝達面積が増加させることができ所定の冷却能
力を確保できるが、プリント基板６の実装密度が下がっ
てしまい、装置そのものが大きくなってしまうという欠
点がある。In order to increase the cooling capacity, it is sufficient to increase the amount of the refrigerant, but noise is a problem with a fan, for example, and it is difficult to improve the capacity easily. Further, if the heat sink is large, the heat transfer area can be increased and a predetermined cooling capacity can be secured, but there is a disadvantage that the mounting density of the printed circuit board 6 is reduced and the device itself becomes large. .
本考案の目的は前記課題を解決したヒートシンクの冷媒
流案内機構を提供することにある。An object of the present invention is to provide a coolant flow guide mechanism for a heat sink that solves the above problems.
前記目的を達成するため、本考案に係るヒートシンクの
冷媒流案内機構は、ヒートシンクと、案内板と、装着手
段とを有するヒートシンクの冷媒流案内機構であって、 ヒートシンクは、流通する冷媒との間に熱交換を行い放
熱するものであり、 案内板は、前記ヒートシンクの冷媒取込側に配置して風
上側に向けて拡開され、前記ヒートシンクへの取込冷媒
の流速を高め、かつ冷媒の取込流量を増大するのに必要
な開口を有するものであり、 装着手段は、前記案内板を前記ヒートシンクに脱着可能
に取付けるものである。To achieve the above object, a coolant flow guide mechanism for a heat sink according to the present invention is a coolant flow guide mechanism for a heat sink having a heat sink, a guide plate and a mounting means, wherein the heat sink is between a circulating coolant. The guide plate is disposed on the refrigerant intake side of the heat sink and is expanded toward the windward side to increase the flow rate of the refrigerant taken into the heat sink and The mounting means has an opening necessary for increasing the flow rate of intake, and the mounting means detachably mounts the guide plate to the heat sink.
以下、本考案の実施例を図により説明する。 Embodiments of the present invention will be described below with reference to the drawings.
（実施例１） 第１図は本考案の実施例１を示す斜視図、第２図は同正
面図である。(Embodiment 1) FIG. 1 is a perspective view showing Embodiment 1 of the present invention, and FIG. 2 is a front view thereof.
図において、電子部品４には断面櫛歯型のヒートシンク
5aが装着されており、ヒートシンク5aの放熱フィン5c間
のスリ割Ｓを冷却媒体が流通することにより電子部品４
の熱が放熱フィン5cを介して放熱され該電子部品４が冷
却される。In the figure, the electronic component 4 has a comb-shaped heat sink.
5a is mounted, and the cooling medium circulates through the slit S between the heat radiation fins 5c of the heat sink 5a so that the electronic component 4
Is radiated through the radiation fins 5c to cool the electronic component 4.
本考案はヒートシンク5aを通過する直前の冷媒を取込
み、流速を高めてより多くの冷媒をヒートシンク5aに導
入する機能を備えたものであり、ヒートシンク5aの両端
に位置する放熱フィン5c1の外面にあてがわれ、ヒート
シンク5aの外側に向けてハの字状に拡開した対をなす案
内板1,1と、対をなす案内板1,1間を連結する板バネ２と
からなる。The present invention has a function of taking in the refrigerant immediately before passing through the heat sink 5a and increasing the flow velocity to introduce more refrigerant into the heat sink 5a, and the function is provided on the outer surfaces of the heat dissipation fins 5c1 located at both ends of the heat sink 5a. It is composed of a pair of guide plates 1 and 1 which are applied to each other and open in a V shape toward the outside of the heat sink 5a, and a plate spring 2 which connects the pair of guide plates 1 and 1.
実施例において、対をなす案内板1,1間を板バネ2bのば
ね力に抗して押し開き、これをヒートシンク5aの両端の
放熱フィン5c1の外面にあてがい、その板バネ2bのばね
力をもって対をなす案内板1,1によりヒートシンク5aを
挟持して装着し、その案内板１をヒートシンク5aの風上
側に配設する。In embodiments, pushes open against between guide plates 1 and 1 a pair to the spring force of the leaf spring 2b, which Ategai the outer surface of the heat radiating fins 5 c1 across the heat sink 5a, the spring force of the leaf spring 2b The heat sink 5a is sandwiched by the pair of guide plates 1, 1 and mounted, and the guide plate 1 is arranged on the windward side of the heat sink 5a.
この状態で案内板１は図に示すようにヒートシンク5aの
風上側でヒートシンク5aの外側に向けてハ字状に拡開す
るため、冷却ファンからの冷媒は拡開した対をなす案内
板1,1により取り込まれ、その流速を高められてヒート
シンク5aの放熱フィン5c間に流通することになる。した
がって、多くの冷媒がヒートシンク5aに導入され、さら
に案内板１の分だけ総熱伝達面積が増大し冷却能力が向
上することとなる。In this state, the guide plate 1 expands in a V shape toward the outside of the heat sink 5a on the windward side of the heat sink 5a as shown in the figure, so that the refrigerant from the cooling fan expands to form a pair of guide plates 1. It is taken in by 1, and its flow velocity is increased so that it flows between the heat radiation fins 5c of the heat sink 5a. Therefore, a large amount of refrigerant is introduced into the heat sink 5a, and the total heat transfer area is increased by the amount corresponding to the guide plate 1, so that the cooling capacity is improved.
第３図，第４図は本考案の案内板1,1の取付構造の他の
例を示すものである。前実施例では案内板1,1間を板バ
ネ２にて連結し、対をなす案内板1,1でヒートシンク5a
を挟持することにより装着する構造を示したが、本実施
例では各案内板１を別個独立に板バネ２によりヒートシ
ンク5aの両端に位置する放熱フィン5c1にそれぞれ装着
するようにしたものである。3 and 4 show another example of the mounting structure of the guide plates 1 and 1 of the present invention. In the previous embodiment, the guide plates 1 and 1 are connected by the leaf springs 2, and the pair of guide plates 1 and 1 are used to form the heat sink 5a.
Although the structure is shown in which the guide plates 1 are attached by sandwiching the guide plates 1, the guide plates 1 are individually and independently attached to the radiating fins 5c1 located at both ends of the heat sink 5a by the leaf springs 2 in this embodiment. .
（実施例２） 第５図，第６図は本考案の実施例２を示す図である。(Embodiment 2) FIGS. 5 and 6 are views showing Embodiment 2 of the present invention.
本実施例はピン状のヒートシンク5bを対象とするもので
あり、対をなす案内板1,1を天板３によって連結し、案
内板1,1にそれぞれ固着された板バネ２をヒートシンク5
bのベース部5dに引掛けることにより案内板1,1をヒート
シンク5bの放熱フィン5c上面に押し付けて装着するもの
であり、これにより実施例１と同様な効果が得られる。The present embodiment is intended for a pin-shaped heat sink 5b, in which a pair of guide plates 1 and 1 are connected by a top plate 3, and leaf springs 2 respectively fixed to the guide plates 1 and 1 are attached to the heat sink 5b.
The guide plates 1 and 1 are pressed against the upper surfaces of the heat radiation fins 5c of the heat sink 5b by being hooked on the base portion 5d of b, whereby the same effect as that of the first embodiment can be obtained.
以上説明したとおり、本考案はヒートシンクの放熱フィ
ンに案内板を容易に装着することができ、これによりヒ
ートシンクを通過する直前の冷媒を取り込み、ヒートシ
ンクを通過する冷媒の流速を高め、より多くの冷媒をヒ
ートシンクに導くことができるとともに、熱伝達面積を
増加させることができ、ヒートシンクの冷却能力を容易
に向上させることができる。As described above, the present invention can easily attach the guide plate to the heat dissipation fins of the heat sink, thereby taking in the refrigerant immediately before passing through the heat sink, increasing the flow velocity of the refrigerant passing through the heat sink, and increasing the amount of refrigerant. The heat transfer area can be increased and the cooling capacity of the heat sink can be easily improved.
また案内板の大きさを変更することにより、ヒートシン
ク自体の大きさを変えることなく、ヒートシンクに要求
される種々の要求例えば放熱量の変動等に対処できると
いう効果を有する。Further, by changing the size of the guide plate, it is possible to cope with various requirements required for the heat sink, such as fluctuations in the amount of heat radiation, without changing the size of the heat sink itself.
第１図は本考案の実施例１を示す斜視図、第２図は同正
面図、第３図は案内板の別の取付構造を示す斜視図、第
４図は同正面図、第５図は本考案の実施例２を示す斜視
図、第６図は同正面図、第７図，第８図は従来例を示す
斜視図、第９図は従来例をプリント基板に実装した状態
を示す図である。 １…案内板、2,2b…板バネ ３…天板、４…電子部品 5a,5b…ヒートシンク、5c,5c1…放熱フィン1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a front view thereof, FIG. 3 is a perspective view showing another mounting structure of a guide plate, FIG. 4 is a front view thereof, and FIG. Is a perspective view showing a second embodiment of the present invention, FIG. 6 is a front view thereof, FIGS. 7 and 8 are perspective views showing a conventional example, and FIG. 9 is a state in which the conventional example is mounted on a printed circuit board. It is a figure. 1 ... Guide plate, 2, 2b ... Leaf spring 3 ... Top plate, 4 ... Electronic component 5a, 5b ... Heat sink, 5c, 5 c1 ... Radiating fin
Claims (1)
有するヒートシンクの冷媒流案内機構であって、 ヒートシンクは、流通する冷媒との間に熱交換を行い放
熱するものであり、 案内板は、前記ヒートシンクの冷媒取込側に配置して風
上側に向けて拡開され、前記ヒートシンクへの取込冷媒
の流速を高め、かつ冷媒の取込流量を増大するのに必要
な開口を有するものであり、 装着手段は、前記案内板を前記ヒートシンクに脱着可能
に取付けるものであることを特徴とするヒートシンクの
冷媒流案内機構。1. A refrigerant flow guide mechanism for a heat sink having a heat sink, a guide plate, and a mounting means, wherein the heat sink exchanges heat with a circulating refrigerant and radiates heat. Having an opening that is arranged on the refrigerant intake side of the heat sink and is expanded toward the windward side to increase the flow velocity of the refrigerant taken into the heat sink and to increase the refrigerant intake flow rate. The mounting means attaches the guide plate to the heat sink in a detachable manner, and a coolant flow guide mechanism for the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988164874U JPH0727677Y2 (en) | 1988-12-20 | 1988-12-20 | Refrigerant flow guide mechanism for heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988164874U JPH0727677Y2 (en) | 1988-12-20 | 1988-12-20 | Refrigerant flow guide mechanism for heat sink |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0284392U JPH0284392U (en) | 1990-06-29 |
| JPH0727677Y2 true JPH0727677Y2 (en) | 1995-06-21 |
Family
ID=31450853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988164874U Expired - Lifetime JPH0727677Y2 (en) | 1988-12-20 | 1988-12-20 | Refrigerant flow guide mechanism for heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0727677Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010263142A (en) * | 2009-05-11 | 2010-11-18 | Hitachi Ltd | Heat sink, heat sink cover, electronic module, electronic substrate and electronic device |
| JP6389211B2 (en) * | 2016-07-15 | 2018-09-12 | 本田技研工業株式会社 | Protective cover for electronic devices |
| JP6386610B1 (en) * | 2017-03-24 | 2018-09-05 | ファナック株式会社 | Heat sink and motor drive device |
| JP2023096492A (en) * | 2021-12-27 | 2023-07-07 | キヤノン株式会社 | Cooling device, projection display device, and optical device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60179048U (en) * | 1984-05-10 | 1985-11-28 | 矢崎総業株式会社 | Switching device for blower |
| JPH0252491U (en) * | 1988-10-11 | 1990-04-16 |
-
1988
- 1988-12-20 JP JP1988164874U patent/JPH0727677Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0284392U (en) | 1990-06-29 |
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