JPH0729263B2 - Lapping machine - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lapping machine used for polishing a quartz oscillator or the like.

2. Description of the Related Art A conventional lapping machine of this type includes an upper plate, a lower plate, and a carrier. Both the upper plate and the lower plate are ring-shaped and sandwich a work piece with each other. Rotating in the opposite direction, the carrier consists of a small circular thin plate with a hole inside and a gear around it, and the workpiece is fitted in the hole and placed between the upper and lower plates,
It meshes with the center gear and the internal gear, and together with the workpiece, the upper plate,
It moves while rotating along the lower plate.

In this conventional lapping machine, the entire carrier passes between the upper plate and the lower plate, so that the entire carrier must be thinner than the work piece. Further, since the carrier receives a driving force from the surrounding gear portion, distortion is likely to occur. Therefore, it is difficult to process a very thin work piece, and the thickness of the work piece is usually about 40 μm.
The carrier thickness is limited to about 35 micrometers.
In recent years, as the frequency of crystal oscillators has increased, thinner crystal oscillators have been demanded. Therefore, in order to meet this demand, the present invention aims to obtain a lapping machine capable of polishing a thinner workpiece.

In the conventional lapping machine, all the work pieces are taken out and attached by hand. Further, since the hole of the carrier draws a very complicated locus, the picking-up and mounting positions of the work piece are indefinite, and it is difficult to automate using a robot. Therefore, the present invention also has an object to obtain a lapping machine that can fix the position of a work piece and is suitable for automating the taking out and mounting work.

Means for Solving the Problems The present invention includes an upper plate and a lower plate that sandwich a workpiece from above and below and rotate in mutually opposite directions, and a thin plate having holes, and is placed between the upper plate and the lower plate. , A carrier whose peripheral edge protrudes to the outer periphery without being sandwiched between the upper and lower plates, and which allows a workpiece to be fitted into a hole to move, and a thick annular body, and is sandwiched between the upper and lower plates. The holder that holds the peripheral end of the carrier without rotating, rotates the carrier without distorting it, and moves the position, and the lifting force is applied to the upper plate, and the pressure applied by the upper plate to the workpiece is small. With a lifting mechanism that operates, and after operating this lifting mechanism,
This is a lapping machine in which the holder can be moved to expose the holes of the carrier and the workpiece can be taken out or attached without removing the upper board.

Further, it is preferable that the holder can set the exposed hole of the carrier at a fixed position.

Further, according to the present invention, after the lifting mechanism is operated on the lapping machine after the completion of processing, the holder moving mechanism moves the holder to expose the carrier hole, and the holder rotates intermittently to rotate the exposed hole sequentially. It includes the addition of a take-out rotation mechanism and a suction device for taking out a workpiece from the exposed hole.

Action In the lapping machine with this configuration, the carrier is held by a holder with a large circumference and a large rigidity, and receives a driving force from this holder, so even if it is thin, it is unlikely to cause distortion.
The thin carrier can be used to polish a thin workpiece.

Also, the carrier and holder rotate from the outside of the upper and lower plates,
Since it is to move, it is easy to move and expose the hole of the carrier, and it is also easy to make the movement trajectory of the hole simple and to set the position of the exposed hole constant. By doing so, it becomes possible to automate the operation of taking out and attaching the workpiece by using the robot.

Therefore, by adding the lifting mechanism, the take-out rotation mechanism, and the suction device as described above, the work taking-out operation can be automated. It should be noted that this lifting mechanism facilitates withdrawing the workpiece from the space between the upper and lower plates, and further prevents the excessive reduction of the pressure on the reduced workpiece due to the progress of the extraction work.

Examples Hereinafter, examples illustrating the present invention will be specifically described.

In this lap machine 11, 11 is an upper board, 12 is a lower board,
Both are annular plates, and the upper plate 11 is the work piece 1 on the lower plate 12.
They are placed on both sides of 3, ... and rotate in the opposite directions about a common central axis 14. Although not shown in the drawing, a mechanism used for the conventional lapping machine is used as it is as the rotating mechanism.

Reference numeral 15 denotes a carrier, which is composed of an annular thin plate, and its peripheral edge projects more outward than the upper plate 11 and the lower plate 12. The carrier 15 is provided with a number of holes 17, ... At equal intervals along the arc 16, into which the workpieces 13 ,. The carrier 15 is thinner than the work pieces 13, ..., The work pieces 13, ... Are fitted into the holes 17 ,. The thicknesses of the workpieces 13, ... And the carrier 15 are shown thick in the drawing for convenience of drawing, but in reality, they are both about several tens to several hundreds of micrometers.

Reference numeral 18 denotes a holder, which is composed of a thick annular upper holder 18a and a lower holder 18b, and holds the peripheral edge of the carrier 15 between them. It should be noted that the holder 18 is designed such that the carrier 15 can be separated and replaced with one having a different thickness, shape of the holes 17, ... May be.

Reference numeral 19 denotes a rotation mechanism, which mainly includes a holder receiver 21 and a motor 22 provided on the holder base 20. The holder base 20 has a shape in which protrusions 23 and 24 are provided on both ends of a circular plate. The holder receiver 21 has a substantially circular ring shape, has a gear 25 around it, holds the holder 18, and is rotatably mounted on the holder base 20 via a ball bearing 26.
The motor 22 is attached to the protrusion 23 of the holder base,
The gear 27 attached to the shaft is meshed with the gear 25 to rotate the holder receiver 21, the holder 18, and the carrier 15. The motor 22 can be operated to determine the positions of the holes 17, ... Of the carrier and rotate for one interval. By selecting this operation, the rotating mechanism 19 can also be used as a take-out rotating mechanism described later. Function.

28 is a moving mechanism, which is mainly composed of rails 29, 29, a motor 30, and a link 31. Rails 29, 29 are machine bases 32
Fixed to the leg base 33, which is provided on the lower surface of the holder base 20,
... is mounted to support the holder base 20 so that it can move linearly. The motor 30 is attached to a motor base 34, and its shaft is provided with an eccentric pin 35. One end of the link 31 is connected to the protrusion 24 of the holder base by a pin 36,
The other end is connected to the eccentric pin 35. Therefore, the rotation of the motor 30 causes the holder base 20, the holder 18, and the carrier 15 to reciprocate along the rails 29, 29. The motor 30 can be stopped at a fixed position to determine the stop position of the holder base 20.

37 is a moving mechanism for taking out, and mainly the rails 38, 38
And an air cylinder 39. The rails 38, 38 extend in the same direction as the rails 29, 29, are fixed to the machine base 32, and have the legs 40, 40 provided on the lower surface of the motor base 34 mounted thereon, so that the motor base 34 can be moved linearly. support. Air cylinder
39 is fixed to the machine base 32, and the tip of its operating shaft is connected to the motor base 34. Therefore, the air cylinder 39
Holds the motor base 34 immovably when the moving mechanism 28 is activated, and operates when the moving mechanism 28 is stopped, so that the holder base 20, the holder 18, and the holder 18, via the motor base 34 and the link 31,
By moving the carrier 15, the holes 17, ... Can be exposed outside the upper plate 11 and the lower plate 12.

Reference numeral 41 denotes an auxiliary table, which is provided adjacent to the side of the lower plate 12 so as to have the same height. When the holes 17, ... Of the carrier are exposed, the workpieces fitted in the holes 17 ,. Place and support.

Reference numeral 42 denotes a suction device, which is provided above the auxiliary base 41 and can pick up the workpiece from the holes 17, ... Of the carrier by vacuum suction.

Reference numeral 43 denotes a lifting mechanism, which is operated by an air cylinder to hook the suspension frame 44 of the upper board 11 and apply a lifting force to the upper board 11. Note that this mechanism is the same as that provided in the conventional lapping machine.

Further, in order to realize the operation described below, a control device that controls each unit is provided.

The lapping machine 10 has the above configuration and operates as follows.

At the time of polishing work, as shown in FIG. 2, the carrier 15 is placed on the lower plate 12, the work pieces 13 are fitted into the holes 17, ... of the carrier, and the upper plate 11 is placed on the holes 13 ... 11. Rotate the lower plate 12 in the opposite direction and simultaneously rotate the motors 22 and 30.
In this way, the carrier 15 reciprocates while rotating, and the hole 1
As shown in FIG. 3, the centers of 7, ... Move in the region between the arcs 16a and 16b, and the workpieces 13 ,. At this time, it is necessary to inject an abrasive material between the upper plate 11 and the lower plate 12 and to activate the lifting mechanism 43 at the start of the work to keep the pressure applied to the upper plate 11 small. It is similar to driving.

When the polishing is completed, the rotation of the upper plate 11, the lower plate 12, the motors 22 and 30 is stopped, and the next take-out work is started. At this time, the motor 2
2, 30 stop at a fixed position, and the positions of the holes 17, ... Of the carrier are fixed.

The take-out work is performed by the control device as shown in FIG. That is, first, the lifting mechanism 43 is activated, and the upper board
The pressure applied to the work pieces 17, ... by 11 becomes very small. The smaller the pressure at this time is, the better, but when the upper plate 11 is lifted, the work piece may adhere with the abrasive and may be pulled out from the holes 17, ... of the carrier. Set it to the extent that it will not happen. Next, the take-out moving mechanism
The air cylinder 39 of 37 is actuated to move the carrier 15 so that the holes 17, ... Are located on the arc 16c and exposed to the outside of the upper plate 11, as shown in FIG. At this time hole 1
The position of 7,… is fixed. Next, the suction device 42 is operated to take out the workpiece 13 from one hole 17, and then the rotating mechanism 19 is operated as a rotating mechanism for taking out the next hole 17
Is moved to the position of the suction mechanism 42. By repeating this, all the work pieces 13, ... Are taken out, and the work is finished.

Regarding the mounting work, after lifting the upper plate 11, the suction device 42 is used to fit a new workpiece into the hole as in the above-mentioned taking-out work, or the taking-out moving mechanism 37 is operated to move the carrier 15 to the carrier 15. It is possible to use various methods and configurations such as returning to the original position, and in this state, a separately provided attachment device having an appropriate configuration is extended and attached onto the hole 17.

As described above, in the lapping machine of the present invention, the carrier is held by the holder having a thick peripheral edge and high rigidity, and moreover, the holder is driven, and the driving force is dispersed and applied to the entire carrier. Therefore, even if the carrier is made thin, distortion is unlikely to occur. For this reason, it is possible to polish a thinner work piece by using a thinner carrier, and to reduce the carrier thickness to 25
The thickness of the work piece can be 30 μm or less and the thickness of the work piece can be 30 μm or less.

Also, the carrier and holder rotate from the outside of the upper and lower plates,
Since it moves the carrier, unlike the conventional carrier that is driven by the operation of the center gear and internal gear, it is easy to move and expose the hole of the carrier, and the movement trajectory of the hole It is also easy to make the position of the exposed hole constant by simplifying. At this time, since the pressure exerted on the workpiece is made small by the lifting mechanism, this movement can be realized without any trouble. For this reason, it is possible to easily realize the work of taking out and attaching the workpiece by using the robot. Especially, when the carrier and the holder are moved linearly, it becomes extremely easy to determine the exposed position of the hole.

Further, in a lapping machine to which a lifting mechanism, a take-out rotation mechanism and a suction device are added, the work taking-out work can be automated.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 shows an embodiment of the present invention, FIG. 1 is an exploded perspective view,
FIG. 2 is a front sectional view, FIG. 3 is an explanatory plan view showing the positions of the holes of the carrier, and FIG. 4 is a flow chart showing the taking out work. 10 …… lap board, 11 …… upper board, 12 …… lower board, 13, …… workpiece, 15 …… carrier, 17, …… hole, 18 …… holder, 19
...... Rotation mechanism, 28 …… Movement mechanism, 37 …… Removal mechanism, 42 …… Suction device, 43 …… Lift mechanism.

Claims (3)

[Claims] 1. An upper plate and a lower plate that sandwich a workpiece from above and below and rotate in opposite directions, and a thin plate having holes,
A carrier that is placed between the upper plate and the lower plate, has a peripheral edge protruding to the outer periphery without being sandwiched between the upper plate and the lower plate, and is capable of fitting and moving a workpiece in a hole, and a thick ring. A holder that holds the peripheral edge of the carrier without being sandwiched between the upper plate and the lower plate, rotates the carrier without distorting the carrier, and moves the position, and applies a lifting force to the upper plate. , The upper plate has a lifting mechanism that makes the pressure applied to the workpiece very small, and after operating this lifting mechanism, the holder moves to expose the holes of the carrier and process without removing the upper plate. A lapping machine that allows you to take out or attach things. 2. The lapping machine according to claim 1, wherein the hole of the exposed carrier can be set at a fixed position. 3. The take-out moving mechanism for moving the holder to expose the hole of the carrier after the lifting mechanism is operated after the machining is completed, and the take-out for sequentially rotating the exposed hole by rotating the holder intermittently. Lapping machine having a rotating mechanism for suction and a suction device for taking out a workpiece from the exposed hole.