JPH07307131A - Image forming apparatus manufacturing method - Google Patents

Abstract

PURPOSE:To accurately position an electron emitting part of a back surface plate with an image forming member at a reduced cost by making the reference surfaces of each assembling jig plate abut against the reference surfaces of an assembling jig so as to position the electron emitting part of the back surface plate and the image forming member of the front surface plate. CONSTITUTION:A back surface plate 11 serving as an electron emitting unit comprising a plurality of electrodes and elements are secured, by a pressing mechanism 41, onto a rectangular jig plate 12 for fixing a back surface plate having reference surfaces 14, the X and Y end surfaces of which cross perpendicularly to each other. Positioning markers 13 of the back surface plate 11 are such positioned as to be located at a designated distance from the reference surfaces 14 of the plate 12. In the same manner, an image forming member consisting of a phosphor and a front surface plate 21 having positioning markers are mounted on a rectangular jig plate 22 for fixing a front surface plate having reference surfaces 24 by the mechanism 41. The reference surfaces 14, 24 of the plates 12, 22 abut against reference surfaces 32 of an assembling jig 31 in such a manner that the back surface plate 11 and the front surface plate 21 are interposed between the plates 12, 22, thus accurately making the electron emitting unit of the back surface plate 11 accord with the image forming member of the front surface plate 21, which are sealed with a heat resistant adhesive.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an image forming apparatus for forming an image by applying an electron source, and more particularly, to a substrate having an electron emitting portion and an electronic device for manufacturing the image forming apparatus. The present invention relates to alignment with a substrate on which an image forming member on which an image is formed by the emitting portion is mounted.

[0002]

2. Description of the Related Art When manufacturing a high-luminance, high-resolution image forming apparatus having a simple structure, a substrate having a plurality of elements and electrodes which are electron emission parts (hereinafter referred to as "rear plate").
And a transparent substrate (hereinafter, referred to as a “front plate”) on which phosphors such as R, G, and B, which are image forming members on which images are formed by irradiation of electron beams emitted from the electron emitting portion, are formed. And are manufactured in separate steps, and finally integrated. At the time of this integration, it is required to align the electron-emitting portion of the rear plate and the image forming member of the front plate with high accuracy, and this may cause color misregistration of characters, images and the like.

Conventionally, such a highly accurate positioning method is disclosed in, for example, Japanese Patent Laid-Open No. 61-64036.

FIG. 10 is a perspective view showing a conventional jig for aligning a plurality of electrode substrates.

In FIG. 10, a jig 10 for positioning is shown.
Reference numeral 0 has a mounting surface 101 on which an electrode substrate can be mounted, and corners 101a, 101b, 101c, 101 of the mounting surface 101.
The mounting surface 1 is set so that the corner 101a of d is the lowest.
01 is inclined at a predetermined angle. And the corner 101
An X reference surface 102 and a Y reference surface 103 are installed perpendicularly to the mounting surface 101 at both ends of X and Y in a.

With such a jig configuration, the X and Y end surfaces of each electrode substrate are connected to the X reference surface 102 and the Y reference surface 10.
It is possible to assemble the substrates in a state in which the substrates are aligned with each other by pressing the substrates against each other and stacking them at the positioning portions 104 of the substrates.

[0007]

However, in the above-mentioned conventional example, the electrode pattern must be accurately formed on the X and Y end surfaces of the electrode substrate, and therefore the X and Y end surfaces are accurately formed. The processed substrate had to be used for the electron emitter and the imaging member. Therefore, since the X and Y end surfaces are processed with high precision for each substrate, the manufacturing cost is high and it is not suitable for mass production.

The present invention has been made in view of the above problems of the prior art, and it is possible to align the electron emitting portion of the back plate and the image forming member of the front plate at low cost and with high accuracy. It is an object of the present invention to provide a method of manufacturing an image forming apparatus that can be performed.

[0009]

SUMMARY OF THE INVENTION To achieve the above object, the present invention provides a back plate having an electron emitting portion mounted thereon, and an electron emitted from the electron emitting portion which is arranged so as to face the back plate. In a method of manufacturing an image forming apparatus including at least a front plate having an image forming member on which an image is formed by irradiating a line, the back plate is fixed on a back plate fixing jig plate having a reference surface, The front plate is fixed on a front plate fixing jig plate having a reference surface, the back plate and the front plate are opposed to each other, and the reference surfaces of the respective jig plates are aligned, The electron-emitting portion of the front plate and the image forming member of the rear plate are mutually positioned by abutting the reference surfaces against the reference surface of the assembly jig.

In this method of manufacturing an image forming apparatus, positioning markers are formed on the back plate and the front plate respectively, and the back plate is positioned on the jig plate for fixing the back plate and the positioning marker for the back plate. The front plate on the jig plate for fixing the front plate and the positioning marker of the front plate for fixing the front plate. The jig plate was fixed so that it came to the specified position from the reference plane.

A pressing mechanism is used when the back plate is fixed to the back plate fixing jig plate and when the front plate is fixed to the front plate fixing jig plate.

The reference planes of the back plate fixing jig plate and the front plate fixing jig plate are composed of two orthogonal side surfaces, and the reference plane of the assembly jig is the back plate fixing jig. A plate and a jig for fixing the front plate, wherein the two orthogonal side surfaces are all in contact with each other, the jig for fixing the back plate and the jig for fixing the front plate The reference surface of the plate is composed of a plurality of parts of two orthogonal side surfaces, and the reference surface of the assembly jig is two lateral surfaces of the back plate fixing jig plate and the front plate fixing jig plate. Characterized in that it is configured by a surface that corresponds to a plurality of portions of, and the reference surface of the back plate fixing jig plate and the front plate fixing jig plate,
The reference surface of the assembly jig has a plurality of protrusions protruding from two orthogonal side surfaces, and the reference surface of the assembly jig has a plurality of protrusions protruding from two orthogonal side surfaces of the back plate fixing jig plate and the front plate fixing jig plate. What is characterized in that it is composed of a surface that contacts the protrusions is applied.

Further, a surface conduction electron-emitting device is used as the electron-emitting portion.

In addition, the image forming apparatus may be a gas discharge type image forming apparatus.

[0015]

In the present invention configured as described above, the back plate on which the electron emitting portion is mounted is fixed on the back plate fixing jig plate having the reference surface, and the electron beam emitted from the electron emitting portion is fixed. A front plate on which an image forming member on which an image is formed by irradiation is mounted is fixed on a front plate fixing jig plate having a reference surface, and the back plate and the front plate are opposed to each other and each jig plate is fixed. The reference surfaces of the jig plates are aligned, and the reference surfaces of the jig plates are abutted against the reference surfaces of the assembly jigs, respectively, so that the electron emitting portion of the front plate and the image forming member of the rear plate are mutually positioned.

As a result, every time a plurality of image forming apparatuses are manufactured, it is not necessary to precisely process both X and Y end surfaces of each substrate as in the prior art, but the reference surface is accurately processed. Only the fixing jig plate, the back plate fixing jig plate, and the assembly jig need to be prepared in advance, and the cost for manufacturing the substrate can be significantly reduced.

Further, since it is not necessary to process the X and Y end surfaces of each substrate every time the image forming apparatus is manufactured, the manufacturing time is shortened.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view showing a state in which the back plate is fixed by a back plate fixing jig plate used in the method for manufacturing an image forming apparatus of the present invention, and FIG. FIG. 6 is a plan view showing a state in which the front plate is fixed by a front plate fixing jig plate used in the method of manufacturing the image forming apparatus. FIG. 3 is a perspective view showing an assembled state of the back plate and the front plate by the assembly jig used in the method for manufacturing the image forming apparatus of the present invention.

In this embodiment, as shown in FIG. 1, X, Y
On a rectangular back plate fixing jig plate 12 having both end surfaces orthogonal to each other and having a highly accurately processed reference surface 14,
An electron emitting portion (not shown) including a plurality of electrodes and elements,
The back plate 11 having the positioning marker 13 was fixed by the pressing mechanism 41.

At this time, the positioning marker 1 on the rear plate 11
3 is positioned using a microscope or the like so that it comes to a designated position (which can be designated by X and Y coordinates) from the reference surface 14 of the jig plate 12, and then fixed. The positioning marker 13 may be the edge of the element. A surface conduction electron-emitting device was used as the device. The positioning marker 13 is most preferably formed during the process of forming the electron emitting portion.

Similarly, as shown in FIG. 2, R is mounted on a rectangular front plate fixing jig plate 22 having X and Y both end surfaces which are orthogonal to each other and which is provided with a highly accurately processed reference surface 24. ，
An image forming member (not shown) on which an image is formed by irradiation with an electron beam emitted from an electron emitting portion, which is made of a phosphor such as G or B, and a front plate 21 having a positioning marker 23.
Was fixed by the pressing mechanism 41.

Also at this time, the positioning marker 23 on the front plate 21 is positioned and fixed using a microscope so that the positioning marker 23 comes to a specified position (which can be specified by the X and Y coordinates) from the reference surface 24 of the jig plate 22. is doing.

Next, the back plate fixing jig plate 12 shown in FIG. 1 and the front plate fixing jig plate 2 shown in FIG.
2 and an electron emitting portion (not shown) of the rear plate 11 and the front plate 2
The first image forming member (not shown) is opposed to the first image forming member, and the reference surfaces 14 and 24 are aligned and combined. Therefore, a rectangular parallelepiped is cut out so that the combined jig plates 12 and 22 can be placed on each other to prepare an assembly jig 31 in which a reference plane 32 orthogonal to the X and Y directions is formed with high accuracy.

Then, as shown in FIG. 3, the reference surfaces 32 of the jigs 12, 22 are attached to the reference surface 32 of the assembly jig 31.
4, the back plate 11 and the front plate 21 are jig plates 12, 2
The rear plate 11 and the front plate 21 are abutted so as to be arranged between the two and sealed with a heat-resistant adhesive such as frit glass.

In this way, the highly accurate alignment of the electron emitting portion of the rear plate 11 and the image forming member of the front plate 21 can be achieved at a low cost because only one set of highly accurate assembly jigs is prepared. become.

As shown in FIGS. 1 and 2, the pressing mechanism 41 presses the rear plate fixing jig plate 12 and the front plate fixing jig plate 22 so as not to interfere with each other when they are stacked. The position is changed by 90 degrees.

Here, the fixed state by the pressing mechanism and the assembled state of the image forming apparatus by the jig will be described in detail.

FIG. 4 shows a fixed state by the pressing mechanism, and FIG. 5 shows a state in which the image forming apparatus is assembled by a jig.
3 to 5 are views as seen from the Y direction.

As shown in FIG. 4, in the pressing mechanism 41, the fixing metal fitting 41 hung on the end portion of the back plate 11 by tightening the screw 41a into the back plate fixing jig plate 12.
c is pressed by the spring 41b, and the pressing force to the back plate 11 can be adjusted by the tightening condition of the screw 41a.

More specifically, the fixing bracket 41 shown in FIG.
The rear plate 11 is sandwiched between c and the rear plate fixing jig plate 12, and the positioning marker formed on the rear plate 11 (see FIG.
After positioning the back plate 11 with the micro head so that it comes to the specified position, the length of the spring 41b is made constant by tightening the screw 41a, and each end of the back plate 11 is fixed by a uniform spring force. did.

The front plate 21 is fixed to the front plate fixing jig plate 22 in the same manner as the structure shown in FIG.

To assemble the image forming apparatus, the back plate fixing jig plate 12 (see FIG. 1), the front plate fixing jig plate 22 (see FIG. 2), and the assembly jig 31 (see FIG. 3) are assembled.
5, the rear plate fixing jig plate 12 to which the rear plate 11 is fixed and the front plate fixing jig plate 22 to which the front plate 21 is fixed are connected to the reference surface 32 of the assembly jig 31. The electron emitting portion (not shown) of the back plate 11 and the image forming member (not shown) of the front plate 21 so as to face each other, and the front plate 21 and the back plate 11 are combined with a heat-resistant adhesive such as frit glass. Airtightly joined. At this time, the front plate 2
1 and the back plate 11, between the front plate 21 and the back plate 11
The support frame 42 surrounding the peripheral edge of the is arranged.

By doing so, highly accurate positioning for mass production could be performed.

In this embodiment, the jig plates 11,
Although a rectangle is used as the shape of 22, a polygon such as a rhombus may be used as long as it has a reference surface. However,
It is also necessary to change the shape of the reference surface of the assembly jig 31 according to the shape. This is the same in the present invention.

The pressing mechanism 41 may have the structure shown in FIG. FIG. 6 is a diagram showing another example of the pressing mechanism. As shown in this figure, one end is fixed to the back plate fixing jig plate 12 by a screw 41a,
A leaf spring-shaped fixing metal fitting 41c may be used as the pressing mechanism 41.

(Second Embodiment) In this embodiment, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 7 is a view for explaining a modified example of the assembly jig shown in FIG.

In this example, a surface conduction electron-emitting device was used as the device formed on the back plate.

As shown in FIG. 7, as the reference surfaces of the jig plates 52 and 53 when fixing the back plate and the front plate, four surfaces, which are a part of the side surfaces of the jig plates 52 and 53 which intersect at right angles, are used. Selected. Correspondingly, the reference surface 54 of the assembly jig 51 is also composed of four surfaces. By doing so, the areas of the reference surfaces of the jig plate and the assembly jig can be reduced, and as a result, it becomes easy to obtain the accuracy of the reference surfaces of the jig plate and the assembly jig.

The positioning method is the same as in the first embodiment. Further, the shapes of the assembly jig and the jig plate other than the reference surface may be any shape as long as they do not prevent the abutting against the reference surface.

(Third Embodiment) In this embodiment, the same components as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

FIG. 8 is a view for explaining a modified example of the assembly jig shown in FIG.

In this example, a surface conduction electron-emitting device was used as the device formed on the back plate.

Then, as shown in FIG. 8, a front plate fixing jig plate 62 having four protrusions on orthogonal side surfaces is provided.
The back plate fixing jig plate 63 was used, and the tip surfaces of the four protrusions were used as the reference surfaces 64 of the jig plates 62 and 63 when fixing the back plate and the front plate. In addition, the jig plates 62, 63 are also used as the reference surface of the assembly jig 61.
The tip surfaces of the four protrusions provided corresponding to the protrusions were used.

By constructing the reference plane in this way, the area of the contact portion 65 between the reference planes of the jig plates 62 and 63 and the reference plane of the assembly jig 61 can be reduced, and as a result, the repairing is possible. It became easier to obtain the accuracy of the reference plane of the tool plate and the assembly jig.

The positioning method is the same as in the first embodiment. Further, the shape of the assembly jig and the jig plate other than the protruding portion may be any shape as long as it does not interfere with the contact with the protruding portion.

In this embodiment, both the jig plate and the reference surface of the assembling jig are constituted by the protrusions shown in FIG. 8, but the present invention is not limited to this, and the jig plate 52, shown in FIG.
53 may be used for the assembly jig 61, or jig plates 62 and 63 may be used for the assembly jig 51 shown in FIG.

Here, the structure of the surface conduction electron-emitting device used in the above-described first to third embodiments will be briefly described.

FIG. 9 shows an example of the basic structure of a surface conduction electron-emitting device, (a) is a plan view thereof,
(B) is a longitudinal sectional view.

As shown in FIG. 9, the surface conduction electron-emitting device is provided with an insulating substrate 71, and device electrodes 75 and 76 are arranged on the insulating substrate 71 at regular intervals L1. Each element electrode 75 on the insulating substrate 71,
A thin-film conductor 74 is formed between 76. The thin-film conductor 74 is formed with an electron emitting portion 73 that emits electrons by heating the thin-film conductor 74 with electricity (Japanese Patent Application Laid-Open Nos. 2-56822 and 4-28139).
(See the official gazette).

The electron emitting portion 73 is made of conductive fine particles having a particle size of about several tens of angstroms.
The thin film conductors 74 other than 3 are made of a fine particle film.

The fine particle film described here is a film in which a plurality of fine particles are aggregated, and its fine structure is not only in a state in which fine particles are dispersed and arranged but also in a state in which fine particles are adjacent to each other or overlap each other (island). (Including the shape).

In addition to this, the thin film conductor 74 may be a carbon thin film in which conductive fine particles are dispersed.

To give a specific example of the thin film conductor 74,
Pb, Ru, Ag, Ti, In, Cu, Cr, Fe, Z
n, Sn, Ta, W, Pb and other metals, PbO, SnO
Oxides such as ₂ , In ₂ O ₃ , PbO and Sb ₂ O ₃ , HfB
2, boride such as ZrB2, LaB6, CeB6, YB4, GdB4, TiC, ZrC, HfC, TaC, SiC, W
Carbides such as C, nitrides such as TiN, ZrN and HfN, semiconductors such as Si and Ge, carbon, AgMg, N
iCu and the like.

The thin film conductor 74 is formed by the vacuum deposition method,
It is formed by a sputtering method, a chemical vapor deposition method, a dispersion coating method, a dipping method, a spinner method, or the like.

An example of the method of manufacturing the surface conduction electron-emitting device will be described. In FIG. 9, soda lime glass is used as the insulating substrate 71, and Ni is used on the insulating substrate 71 to form the device electrodes 75 and 76. Was formed. At this time,
Element electrode interval L1 is 3 μm, element electrode width W1 is 500 μm
m, and the thickness d of the device electrode was 1000Å.

Next, organopalladium (ccp-4230: manufactured by Okuno Chemical Industries Co., Ltd.) is placed at desired positions including on the device electrodes.
After applying the containing solution, heat treatment is performed at 300 ° C. for 10 minutes to obtain palladium oxide (PdO) fine particles (average particle diameter:
A thin film conductor 74 made of 70Å) was formed. At this time,
The width W2 of the thin film conductor 74 was 300 μm.

(Fourth Embodiment) This embodiment shows an example in which the present invention is applied to a gas discharge type image forming apparatus (not shown).

A gas discharge type electron-emitting device is formed on the back plate, and an image forming member is formed on the front plate. The front plate and the rear plate are aligned by the positioning method shown in the first to third embodiments,
A gas discharge type image forming apparatus was created.

As a result, the positioning accuracy is improved and mass production is possible.

[0062]

As described above, according to the present invention, when assembling and manufacturing an image forming apparatus using a surface conduction electron-emitting device or an image forming apparatus such as a gas discharge type image forming apparatus, each jig is used. By using the method of abutting the reference surface of the plate and the reference surface of the assembly jig and mutually positioning the electron emitting portion of the back plate and the image forming member of the front plate, each time the image forming apparatus is manufactured, Unlike the prior art, it is not necessary to precisely process both X and Y end surfaces of each substrate, and it is only necessary to prepare in advance a set of jigs with which the reference surface is accurately processed. Can be reduced.

Further, since it is not necessary to process the X and Y end surfaces of each substrate every time the image forming apparatus is manufactured, the manufacturing time can be shortened.

[Brief description of drawings]

FIG. 1 is a plan view showing a state in which a back plate is fixed by a back plate fixing jig plate used in a method for manufacturing an image forming apparatus according to the present invention.

FIG. 2 is a plan view showing a state in which the front plate is fixed by a front plate fixing jig plate used in the method for manufacturing an image forming apparatus of the present invention.

FIG. 3 is a perspective view showing an assembled state of a back plate and a front plate by an assembly jig used in the method for manufacturing an image forming apparatus of the present invention.

FIG. 4 is a view of a fixed state by a pressing mechanism as seen from the Y direction in FIGS. 1 to 3.

FIG. 5 is a diagram showing a state in which the image forming apparatus is assembled by a jig, as viewed from the Y direction in FIGS. 1 to 3.

FIG. 6 is a view showing another example of a pressing mechanism.

FIG. 7 is a view for explaining a modified example of the assembly jig shown in FIG.

FIG. 8 is a diagram for explaining a modified example of the assembly jig shown in FIG.

9A and 9B show an example of a basic configuration of a surface conduction electron-emitting device, FIG. 9A is a plan view thereof, and FIG. 9B is a longitudinal sectional view thereof.

FIG. 10 is a perspective view showing a conventional jig for aligning an electron emitting portion and an image forming member.

[Explanation of symbols]

 11 Rear plate 12, 53, 63 Rear plate fixing jig plate 13, 23 Positioning marker 14, 24, 32, 54, 64 Reference surface 21 Front plate 22, 52, 62 Front plate fixing jig plate 31, 51, 61 assembly jig 41 pressing mechanism 41a screw 41b spring 41c fixing metal fitting 65 contact part 71 insulating substrate 73 electron emission part 74 thin film conductor 75,76 element electrode

Claims (8)

[Claims] 1. A back plate on which an electron emitting portion is mounted, and an image forming member which is arranged to face the back plate and which forms an image by irradiation of an electron beam emitted from the electron emitting portion. In a method for manufacturing an image forming apparatus including at least a front plate, the back plate is fixed on a back plate fixing jig plate having a reference surface, and the front plate is fixed on the front plate fixing jig plate having a reference surface. By fixing the face plate, making the back plate and the front plate face each other, aligning the reference planes of the respective jig plates, and abutting the reference planes of the respective jig plates against the reference planes of the assembly jigs. A method for manufacturing an image forming apparatus, wherein the electron-emitting portion of the front plate and the image forming member of the rear plate are mutually positioned. 2. A positioning marker is formed on each of the back plate and the front plate, the back plate is placed on the back plate fixing jig plate, and the back plate positioning marker is placed on the back plate fixing jig. Fix it so that it comes to the specified position from the reference surface of the tool plate, and position the front plate on the front plate fixing jig plate, and the positioning marker of the front plate is from the reference surface of the front plate fixing jig plate. The method of manufacturing an image forming apparatus according to claim 1, wherein the image forming apparatus is fixed so as to come to a designated position. 3. A pressing mechanism is used when fixing the back plate to the back plate fixing jig plate and when fixing the front plate to the front plate fixing jig plate. The method of manufacturing an image forming apparatus according to claim 1, wherein 4. A reference surface of the back plate fixing jig plate and the front plate fixing jig plate is composed of two orthogonal side surfaces, and a reference surface of the assembly jig is the back plate fixing jig. 2. The method of manufacturing an image forming apparatus according to claim 1, wherein all of two orthogonal side surfaces of the plate and the front plate fixing jig plate are configured to be in contact with each other. 5. A reference surface of the back plate fixing jig plate and the front plate fixing jig plate is composed of a plurality of portions of two side surfaces orthogonal to each other, and the reference surface of the assembly jig is 2. The back plate fixing jig plate and the front plate fixing jig plate are constituted by surfaces that come into contact with a plurality of portions of two orthogonal side surfaces of each other and are in contact with each other. Manufacturing method of image forming apparatus. 6. A reference surface of the back plate fixing jig plate and the front plate fixing jig plate is composed of a plurality of protrusions projecting from two orthogonal side surfaces, and the reference surface of the assembly jig is 3. The back plate fixing jig plate and the front plate fixing jig plate are configured by surfaces that come into contact with a plurality of protrusions protruding from two orthogonal side surfaces of the front plate fixing jig plate. A method for manufacturing an image forming apparatus according to item 1. 7. The method of manufacturing an image forming apparatus according to claim 1, wherein a surface conduction electron-emitting device is used as the electron-emitting portion. 8. The method of manufacturing an image forming apparatus according to claim 1, wherein the image forming apparatus is a gas discharge type image forming apparatus.