JPH07308917A - Wire saw equipment - Google Patents

Abstract

PURPOSE:To dispense with handling of an object of machining covered with a muddy cutting liquid and thereby to improve an environment of operation by a construction wherein a washing arrangement is provided adjacently to a cutting part in a vertical running part of a wire and the object of machining is moved to the wire by a moving device and then moved from the cutting part to the washing arrangement together with the moving device by a machining object carrying device. CONSTITUTION:A machining object fitting stage 29 whereon an object 45a to be machined is mounted is fitted to a base stage 42 and positioned in a cutting zone A by a machining object carrying device 40. Next, the object 45a to be machined is pressed against a wire 2 by a machining object moving device 30, while a cutting liquid is supplied simultaneously from a cutting liquid supply part 35, and cutting is executed. Then, the machining object carrying device 40 transfers the object 45b for which the cutting is completed to a preliminary washing zone B, with a turn at an angle of 90 deg., and a washing liquid is sprayed on the object already machined from a shower nozzle 36 by a lifting pump so that the cutting liquid be washed away roughly. Subsequently, a clean washing liquid is sprayed from a shower nozzle 37 in a main washing zone C. In this way, the machining object carrying device 40 is rotated at 360 deg. and each process is executed automatically.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a novel wire saw device capable of cutting a workpiece, for example, a cylindrical or prismatic ingot, and subsequently washing and removing the cut workpiece.

[0002]

2. Description of the Related Art A wafer is obtained by cutting a silicon single crystal into thin slices and grinding the surface. Single-crystal silicon wafers are widely used in various applications, for example, as raw materials for solar cells and raw materials for various integrated circuits. On the other hand, as a result of fierce competition, there are strong demands for cost reduction. Therefore, it is now strongly demanded by users that a large number of wafers can be manufactured by one operation. However, the current wire saw device (a method of cutting a work piece by pressing it against a horizontally running wire from below or from above) has only one cutting point, and cuts the work piece at one time at multiple points. I couldn't do it.

When the work piece is cut with a wire,
There is a problem that a large amount of mud-like cutting fluid is generated along with the cutting work and is scattered around to contaminate the working environment. In particular,
When removing the cut work piece from the work piece conveying device, a large amount of mud-like cutting fluid is attached not only in the cut groove of the work piece but also around it, and the work piece is mounted. Since a large amount of mud-like cutting fluid adheres to the moving device as well, there is a problem that the worker's hands and clothes are soiled.

[0004]

The problems to be solved by the present invention are as follows.
It is to improve the working environment in the work of cutting a work piece and to enable mass production of wafers.

[0005]

A wire saw device according to claim 1 runs a wire (2) in a vertical direction and cuts a work (45a) at a vertical running portion of the wire (2). Cutting part (1) and the work piece placed adjacent to the cutting part (1) and cut
Cleaning device (S) for cleaning (45b), and moving device for moving the workpiece (45a) mounted on the surface of the wire (2) facing the vertically running portion toward the wire (2)
(30) and the workpiece (45a) mounted on the moving device (30)
(30) and a workpiece transfer device (40) that moves from the cutting part (1) to the cleaning device (S).

As a result, the work piece (45a) is cut at the cutting portion (1).
After cutting, the cleaning device (S) located adjacent to the cutting part (1) can automatically transfer and clean the workpiece (45b). It is not necessary to handle the workpiece (45b) covered with the liquid (35a), and the working environment can be improved.

A second aspect of the present invention is the apparatus for conveying a workpiece (40).
It is characterized in that "the workpiece transfer device (40) is adapted to perform intermittent rotation". As a result, it is possible to automatically perform the cutting to cleaning of the workpiece (45a) only by intermittently rotating the workpiece transfer device (40).

A third aspect of the wire saw device according to the present invention is (1)
Regarding the cutting part (1) and the workpiece transfer device (40) of B), the cutting head (1) is a set of four and the processing head roller is horizontally supported so as to occupy a square corner part. (10) (11)
(12) (13) and machining head rollers located above and below (11) (12)
And (10) and (13) are suspended so as to run in the vertical direction, and the processing head rollers (11) (13) and
(10) (12) is composed of a wire (2) suspended in a cross so as to intersect with each other, and the workpiece transfer device (40) (40) is connected to the cutting part (1). It is characterized in that it is installed on both sides so that the workpiece (45a) (45a) can be cut from both sides of the cutting part (1).

Machining head rollers (11) (12) located at the top and bottom
Between (10) and (10) is suspended so as to run in the vertical direction, so the cutting conditions for this part are the same on the left and right, and there are two cutting points. Therefore, the work piece (45
a) (45a) can be cut, and the cutting can be performed twice as much as the conventional cutting method.

[0010]

The present invention will be described below with reference to the illustrated embodiments. FIG. 1 shows the wire of the cutting part (1) in the first embodiment (1A).
The winding state of (2) and its drive system are shown. In the present Example (1A), the object to be processed (45a) is like a single crystal ingot, and its shape is a columnar shape or a substantially prismatic shape. Of course, other than this, all of those in which the columnar workpiece (45a) is cut to form a wafer are included.

The wire (2) is wound around a pair of reels (3) and (4) in an aligned state, and a pair of spring (or weighted) dancer rollers (5) (6) and tension rollers are provided between them.
(7) Through (8), the processing head roller with three guide grooves provided at the apex position of the triangle when viewed from the front (10) (11) (1
It is wound multiple times on 2). 2 set up and down
The intermediate position of the two processing head rollers (11) (12) is the ingot.
At the cutting position of (45a), the wire (2) runs vertically in this portion.

The workpiece (45a) is attached to the workpiece mount (29) of the workpiece moving device (30) for moving the workpiece mount (29) in the horizontal direction, and the cutting liquid ( The work piece (45a) is in contact with the cutting position of the wire (2) by a predetermined force through the abrasive grains contained in 35a), and the work piece (45a) is cut by the relative movement of both. It is designed to go.

The supply-side reel (3) is connected to the supply-side torque motor (1
4) is driven while slightly resisting the wire (2) in the feeding direction, and the winding reel (4) is driven in the winding direction by the winding torque motor (15). To be done. Incidentally, a traverse mechanism (not shown) is attached to these reels (3) and (4), and as a result of this action, the wire (2) is always in an aligned winding state, and the reel (3)
It is wrapped around the outer circumference of (4) or unwound.

On the other hand, the pair of tension rollers (7) and (8) are
It is designed to be driven by a drive motor (9).
That is, the rotation of the drive motor (9) is transmitted through the intermediate shaft (16) and the pair of gears (17) and (18) as one rotation transmission path to the input shaft of the first differential gear mechanism (21) ( 19) and further transmitted to one tension roller (7) via the output shaft (20).

Further, as the other rotation transmission path, it is branched by the timing belt (23) on the way and transmitted to the other tension roller (8) via the intermediate shaft (24). Further, the rotation of the intermediate shaft (16) is passed through the timing belt (25),
It is transmitted to the input shaft (26) of the second differential gear mechanism (22),
Differential gear mechanism (22) output shaft (27) and timing belt
It is transmitted to the drive shaft of each processing head roller (10), (11) and (12) via (28). The first differential gear mechanism (21) and the second differential gear mechanism (22) both have control shafts (31) and (32) as a third shaft, and the reversible parts are respectively provided at those parts. It is connected to a rotatable tension control motor (33) and a phase control motor (34).

The feature of the first embodiment (1A) of the present invention shown in FIG. 1 is that the portion of the wire (2) for cutting the workpiece (45a) runs vertically. That is the point. That is, the processing head rollers (11) (12) are installed vertically, and the wire (2) stretched between the processing head rollers (11) (12) runs vertically. is there. The wire (2) is generally run from top to bottom as shown in FIG. 4, but it may be run from bottom to top on the contrary. Attach wire
(2) may be gradually reciprocated while being fed in one direction.
In the first embodiment (1A), the case where the wire (2) is run from top to bottom will be described as an example.

Reference numeral (40) denotes a work piece conveying device installed on the side of the cutting portion (1), around which the work piece moving device (30) radially projects around the rotating column (43) at 90 ° intervals. It is installed and is a rotating cylinder
(43) is designed to rotate intermittently at an angle of 90 °. The intermittent rotation mechanism of the workpiece transfer device (40) has a known structure, and for example, a drive mechanism using a barrel cam can be considered. A horizontal arm (32) is attached to the tip of the workpiece moving device (30) so as to project horizontally from the tip and to be retracted into the tip, and a base ( 42) is installed.

The work (45a) is fixed to the work mount (29) mounted on the base (42) with an adhesive, and the base (4a)
The dovetail groove (42) of 2) is inserted into the dovetail groove of the workpiece mount (29) to mount the workpiece mount (29) on the base (42). The base (42) and the workpiece mounting base (29) are fixed by pressing the dovetail ridges (42a) against the dovetail groove by, for example, a cylinder (not shown). A moving roller (47) may be attached to the workpiece transfer device (40) so that it can be separated from the cutting section (1) as necessary. This allows an operator to freely enter the periphery of the cutting portion (1) and facilitate reattachment work of the wire (2) and other maintenance.

FIG. 2 is a schematic front sectional view of FIG. 1, showing a cutting portion (1).
Is housed in the wire saw body device (a), and the workpiece transfer device (40) is installed adjacent to the cutting part (1). At the stop position of each work moving device (30) of the work transfer device (40), the preliminary cleaning device (b) and the main cleaning device
(C) is installed. In the present embodiment, since the workpiece transfer device (40) is adapted to perform the intermittent rotation motion by 90 °, the cleaning device (S) is divided into the preliminary cleaning device (b) and the main cleaning device (c). Areas are prepared. Of course,
Leave the position of the main cleaning device (c) "or preliminary cleaning device (b)" empty, and install the cleaning device (S) only at the position of the preliminary cleaning device (b) "or main cleaning device (c)". The cleaning work may be completed, or the workpiece transfer device (40) may be intermittently rotated at 120 °, and the cleaning device (S) may be provided at one location. In addition, the preliminary cleaning device (b) and the main cleaning device (c) have basically the same structure.
In (1A), the case of using the preliminary cleaning device (b) and the main cleaning device (c) will be described as a typical example.

According to FIG. 2, the preliminary cleaning device (b) and the main cleaning device (c) are provided with a cleaning liquid storage tank (46) containing the cleaning liquid (41).
, Pumping pump (38) and filter (39) connected to the cleaning liquid storage tank (46), and the workpiece (45b) that has been cut.
And a shower nozzle (36) (37) for showering the cleaning liquid (41), and these are housed in the housing of the preliminary cleaning device (b) and the main cleaning device (c). The preliminary cleaning device (b) and the main cleaning device (c) are independent of each other and can be moved.

Next, the operation of the present invention will be described. In FIG. 3, the work piece mounting base with the work piece (45b) (= cleaned cutting ingot) mounted on the base (42) in the attachment / detachment zone (D) of the work piece transfer device (40) ( 29) to the base (42)
Then, the workpiece mount (29) with the workpiece (45a) (= the ingot before cutting) attached is attached to the base (42).
When the work transfer device (40) is operated in this state and rotated 90 °, the work (45a) mounted in the attachment / detachment zone (D) moves from the attachment / detachment zone (D) to the cutting zone (A). Rotate 90 ° and stop.

During this time, the drive motor (9) is operating,
The wire (2) travels around the processing head rollers (10), (11) and (12). The workpiece moving device (30) that is in line with the cutting zone (A) is operated to move the workpiece (45a) vertically downward from the processing head rollers (11) to (12). Press the workpiece (45a) against the wire (2), and at the same time, supply the cutting fluid (35a) from the cutting fluid supply unit (35) to the contact area between the workpiece (45a) and the wire (2). The workpiece (45a) is cut by the abrasive grains contained in (35a).

As shown in FIG. 4, the cutting fluid (35a) is supplied to the inside of the kerf (45a) through the wire (2), effectively cutting the workpiece (45a). . The cutting powder generated by the cutting is cut along with the wire (2) by the cutting groove (45a) of the workpiece (45a).
It flows down to the lower side, and quickly goes out from the kerf (45 a).

Since the abrasive grains in the cutting fluid (35a) are transmitted to the wire (2) and enter the inside of the cut groove (45a) as described above, the change in the cutting speed between the peripheral portion and the inside is small. Therefore, the parallelism between the front and back surfaces of the cut wafer is remarkably improved as compared with the conventional one.

The work piece (45a) is cut in this manner. When the work piece (45b) is cut, the work piece moving device (30) is actuated in the dipping direction. object
Pull out (45b) from the wire (2). In this case, since the cutting powder flows down from the kerf (45a) and is not much accumulated in the kerf (45a), the wire (2) can be smoothly pulled out from the kerf (45a). The processed object (45b) is in a muddy state covered with the cutting fluid (35a) containing a large amount of cutting powder.

When the cutting work is completed, the workpiece transfer device
(40) is activated to complete cutting Cutting the workpiece (45b)
90 ° transfer from position (A) to position in pre-wash zone (B). A pre-cleaning device (b) is installed here, and the pumping pump (38) is activated by sensing that the processed workpiece (45b) has been transferred into the pre-cleaning device (b), Is sprayed from the shower nozzle (36) onto the processed workpiece (35b), and the highly viscous cutting fluid containing cutting powder and abrasive grains is washed off.

The workpiece (45a) newly transferred from the attachment / detachment zone (D) is cut by the same operation as described above. When the work piece (45a) is cut at the position of the cutting zone (A), the work piece transfer device (40) is actuated to further 90
° Rotate. As a result, the workpiece (45b) preliminarily cleaned in the preliminary cleaning zone (B) is transferred to the main cleaning zone (C), and the workpiece (45b) cut in the subsequent cutting zone (A) is It will be transferred to the preliminary cleaning device (b).

The prewashed workpiece (45b) transferred to the main washing zone (C) has a clean washing liquid as a shower nozzle.
It will be sprayed from (37) and cleanly washed.
In this way, the cleaned and processed workpiece (45b) that has been main-cleaned in the main cleaning liquid zone (E) waits for the completion of cutting of the workpiece (45a) newly supplied to the cutting zone (A), and Workpiece transfer device
It is transferred 90 ° by (40) and moves from the main cleaning zone (C) to the attachment / detachment zone (D). When moving to the attachment / detachment zone (D), the worker removes the workpiece mount (29) with the workpiece (45b) that has been cleaned from the base (42), and the workpiece (45a) before machining
The work piece mounting base (29) with is attached to the base (42) to prepare for the start of the next cutting. In this way, by rotating the workpiece transfer device (40) 360 °, "workpiece mounting → cutting → preliminary cleaning → main cleaning → workpiece removal" is automatically performed, and the attachment / detachment zone (D) With this, you can get a beautifully cleaned work piece (45b) that has been completely cleaned, and you can keep the working environment clean inside the factory.

Also, only one work piece (45a) to be cut may be attached to the work piece mounting base (29) as shown in FIG. Or more can be installed.

The running direction of the wire (2) may be one direction vertically, such as from top to bottom or conversely from bottom to top, or may be changed intermittently while switching the running direction. You may make it move to one side. Also wire
It is desirable that the traveling direction of (2) is a vertical direction, but it is not limited to this, of course, and it is at right angles to the central axis of the work piece (45a), but oblique to the work piece (45a). The wires (2) may come into contact from any direction.

Next, the cutting part (1) is also of the three type (first embodiment (A
It is not limited to the one of 1)) but may be of the four-line type (second embodiment (1B)) as shown in FIGS. This case is an example in which the wire (2) is struck, and the traveling directions of both vertical parts are the same, and the workpiece (35a) can be cut from both sides under the same conditions. Thereby, the cutting efficiency can be improved at least twice.

In the following, a description will be given for the case of the four-line type, omitting the overlapping parts. In this case, the processing head roller (10) with four guide grooves provided at the apex position of a square (obviously, a rhombus, a trapezoid, or a parallelogram) may be seen from the front.
The wire (2) is multiply wound around (11), (12) and (13). As shown in FIG. 5, the method of suspending the wire (2) is such that the processing head rollers (11) (12) and (10) (13) are located above and below.
It is suspended so as to run in the vertical direction between the processing head rollers (11), (13) and (10) (12) which are diagonally positioned, and is suspended by a cross so as to intersect with each other. Here, since the wire (2) shifts by one pitch per winding, the intersecting portion of the wire (2) just passes between the wires (2) and the wire (2) does not come into contact with it. Absent.

In this embodiment, the vertically running portion is stretched vertically, and the workpiece (45a) is cut from one side surface thereof at right angles to the central axis thereof. As a result, the traveling directions of the left and right vertical portions are the same, and the workpiece (35a) can be cut from both sides under the same conditions.

The traveling direction of the wire (2) is the same as in the case of the first embodiment. The workpiece transfer device (40) is symmetrically installed on the side of the cutting part (1), and similarly, the preliminary cleaning device (b) and the main cleaning device (c) are symmetrically installed. This allows the cutting part
The cutting work can be performed from both sides of (1), and the double cutting can be performed as described above.

In the present invention, since the traveling direction of the cut portion of the wire (2) is the vertical direction, the workpiece transfer device (40)
Can be located to the side of the cutting part (1) and therefore the cutting part
It is easy to move with respect to (1), and it is very convenient for maintenance and other aspects.

[0036]

According to the present invention, the workpiece is mounted on the surface of the moving device that faces the vertically traveling portion of the wire, and the workpiece is moved toward the vertically traveling portion of the wire. Cut the work piece, move the work piece mounted on the moving device by the work piece conveying device from the cutting part to the cleaning device together with the moving device, and cut it by the cleaning device arranged adjacent to the cutting part. Since it is designed to clean the processed work piece, it is possible to automatically transfer and clean the work piece that has been covered with mud-like cutting fluid, so the operator can only clean the non-processed work piece. Since there is no need to handle the work piece covered with the muddy cutting fluid, it is possible to improve the working environment.

In addition, the structure of the cutting portion is such that a set of four processing head rollers horizontally supported so as to occupy a square corner portion and the processing head rollers positioned above and below run vertically. It is suspended by the wire, and it is composed of a wire that is suspended in a slant so that it intersects between the processing head rollers that are located diagonally. By installing the object transfer device on both sides of the cutting part, the workpiece can be cut from both sides of the cutting part, and the productivity can be doubled.

[Brief description of drawings]

FIG. 1 is a perspective view showing an internal mechanical structure of a wire saw device according to a first embodiment of the present invention.

FIG. 2 is a front sectional view showing a schematic configuration of the wire saw device of FIG.

FIG. 3 is a plan view showing a schematic configuration of the wire saw device of FIG.

FIG. 4 is a sectional view of an essential part showing a cutting state when a wire is run from the top to the bottom in the present invention.

FIG. 5 is a perspective view showing the internal mechanical structure of a second embodiment of the wire saw device of the present invention.

6 is a front sectional view showing a schematic configuration of the wire saw device of FIG.

FIG. 7 is a plan view showing a schematic configuration of the wire saw device of FIG.

[Explanation of symbols]

 (2)… Wire (10) (11) (12) (13)… Processing head roller (30)… Workpiece moving device (35)… Cutting fluid supply unit (35a)… Cutting fluid (45a)… Working object

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 21/304 341 N

Claims (3)

[Claims] 1. A wire is run vertically,
A cutting part that cuts the work piece at the vertical running part of the wire, a cleaning device that is arranged adjacent to the cutting part and cleans the cut work piece, and is attached to the surface facing the vertical running part of the wire. It is characterized by comprising a moving device for moving the processed workpiece toward the wire and a workpiece conveying device for moving the workpiece mounted on the moving device together with the moving device from the cutting section to the cleaning device. Wire saw equipment. 2. The wire saw device according to claim 1, wherein the workpiece transfer device is adapted to perform intermittent rotation. 3. A set of four cutting parts, which run vertically between a processing head roller horizontally supported so as to occupy a square corner part and a processing head roller located above and below. It is composed of a wire that is suspended by a wire and suspended between the processing head rollers that are diagonally positioned so as to intersect with each other, and the workpiece transfer device is installed on both sides of the cutting part. The wire saw device according to claim 1 or 2, wherein the work piece can be cut from both sides of the cut portion.