JPH0731047B2 - Electronic component lead inspection method - Google Patents
Electronic component lead inspection methodInfo
- Publication number
- JPH0731047B2 JPH0731047B2 JP60074609A JP7460985A JPH0731047B2 JP H0731047 B2 JPH0731047 B2 JP H0731047B2 JP 60074609 A JP60074609 A JP 60074609A JP 7460985 A JP7460985 A JP 7460985A JP H0731047 B2 JPH0731047 B2 JP H0731047B2
- Authority
- JP
- Japan
- Prior art keywords
- leads
- optical sensor
- electronic component
- light
- inspection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 7
- 238000007689 inspection Methods 0.000 title claims description 6
- 230000003287 optical effect Effects 0.000 claims description 19
- 230000002950 deficient Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、LSIフラットパッケージ等の電子部品のリー
ドの変形をプリント基板に実装する前に検査し、変形の
許容値をこえたものと、良品を判別する方法等に使用す
る電子部品リード検査方法に関する。DETAILED DESCRIPTION OF THE INVENTION Industrial Field of the Invention The present invention examines the deformation of leads of an electronic component such as an LSI flat package before mounting it on a printed circuit board, and judges whether the deformation exceeds an allowable deformation value or a non-defective product. The present invention relates to an electronic component lead inspection method used for a determination method and the like.
従来の技術 第１図に示すようなLSIフラットパッケージをプリント
基板の所定の位置に実装する場合、従来はあらかじめLS
Iフラットパッケージのリードの変形を目視で良品、不
良品に分別するか、コンピュータを使った高度な認識技
術によって良否を判別していた。2. Description of the Related Art When mounting an LSI flat package as shown in FIG.
The deformation of the leads of the I flat package was visually classified into good products and defective products, or good or bad was determined by advanced computer-based recognition technology.
発明が解決しようとする問題点 しかしながら、従来の目視による方法では、変形の許容
値を境界にして、良品、不良品を正確に判別することが
難しく、また数多くの部品を、継続して判別する作業
は、検査者に極度の疲労を強制していた。Problems to be Solved by the Invention However, with the conventional visual inspection method, it is difficult to accurately determine a good product and a defective product with the allowable value of deformation as a boundary, and many parts are continuously identified. The work forced the examiner to be extremely tired.
またコンピュータによる形状認識の方法は、ソフトウェ
ア開発に多くの時間と費用を要し、検査装置として高価
になってしまうという問題を有していた。In addition, the method of shape recognition by a computer requires a lot of time and cost for software development, and has a problem that it becomes expensive as an inspection device.
問題点を解決するための手段 本発明は上記目的を達成するために、互いに平行に設け
られた複数個のリードを有する電子部品の上記複数個の
リードに光を投射し、反射光の変化を電圧変化に変換し
て出力する光センサを、上記複数個のリードに順次光が
投射するように等速度に移動させ、上記光センサからの
出力より上記複数個のリードに対応した波形の山部の最
大値と最小値の差と予め設定された基準値とを比較して
上記複数個のリードの高さ方向の変形に対する良否を判
別し、上記波形の山部もしくは谷部の出力時間の差と予
め設定された基準時間とを比較して上記複数個のリード
の水平方向の変形に対する良否を判別するようにしたも
のである。Means for Solving the Problems In order to achieve the above object, the present invention projects light onto the plurality of leads of an electronic component having a plurality of leads arranged in parallel with each other to change the reflected light. An optical sensor that converts and outputs the voltage change is moved at a constant speed so that light is sequentially projected onto the plurality of leads, and a peak portion of a waveform corresponding to the plurality of leads is obtained from the output from the optical sensor. The difference between the maximum value and the minimum value of the above is compared with a preset reference value to determine the quality of the plurality of leads with respect to the deformation in the height direction, and the difference in the output time of the peak portion or the valley portion of the waveform. And a reference time set in advance are compared to judge whether the plurality of leads are deformed in the horizontal direction.
作用 したがって、本発明によれば、人間の眼に代って光セン
サで、人間の頭脳に代って判別器により、自動的に良不
良の判別ができるという効果を有する。Effect Therefore, according to the present invention, there is an effect that the good / bad can be automatically discriminated by the optical sensor in place of the human eye and the discriminator in place of the human brain.
実施例 第１図、第２図は、本発明の一実施例を示すものであ
る。１はLSiフラットパッケージ、２は光センサで投射
光３を発し、投射光４を受光する。ここで、光センサ２
は、光センサ２と投射光を反射させるリードＬとの距離
によって、反射光４が強弱に変化するその変化を感知で
きるものである。６は判別器で光センサ２とケーブル５
で結ばれていて、反射光の強弱を光電変換により電圧の
変化として受け、その大小によるり良否を判別する。Embodiment FIG. 1 and FIG. 2 show an embodiment of the present invention. Reference numeral 1 is an LSi flat package, and 2 is an optical sensor that emits projection light 3 and receives projection light 4. Here, the optical sensor 2
Is capable of sensing the change in the reflected light 4 that changes strongly depending on the distance between the optical sensor 2 and the lead L that reflects the projected light. 6 is a discriminator, which is an optical sensor 2 and a cable 5.
The received light intensity is reflected by photoelectric conversion as a voltage change, and whether the light is good or bad is determined.
さて、光センサ２は第２図に示す如く、LSiフラットパ
ッケージ１の一辺のリード群L1〜L5の先端ほぼ直角に投
射するようにセットし、リードL1からリードL4の方向へ
矢印７の如く平行移し、２′の位置に動かす。その時判
別器６に表示される電圧は、例えば第３図に示す如くに
なる。つまり、光センサがリードL1の直上にある時の電
圧がV1、L2の直上にある時がV2以下同様に、L5の直上に
ある時がV5となる。この例ではV3が最大値、V4が最小値
であり、従って、リードL3と光学センサ２の距離が最も
短かく、リードL4と光センサとの距離が最も長いことを
示している。ここでリードＬの高さのバラツキの許容値
から決まる電圧をＶａとすると、Ｖmax−Ｖmin＞Ｖａな
らば、このLSiフラットパッケージは、不良品、Ｖmax−
Ｖmin≦Ｖａならばリードの高さの変形に関しては良品
とされている。Now, as shown in FIG. 2, the optical sensor 2 is set so that the ends of the lead groups L 1 to L 5 on one side of the LSi flat package 1 are projected almost at right angles, and the arrow is directed from the lead L 1 to the lead L 4. Move in parallel to position 7 and move to position 2 '. At this time, the voltage displayed on the discriminator 6 is as shown in FIG. 3, for example. That is, the voltage when the optical sensor is directly above the lead L 1 is V 1 , the voltage immediately above L 2 is V 2 or less, and similarly when it is immediately above L 5 , it is V 5 . In this example, V 3 is the maximum value and V 4 is the minimum value. Therefore, it is shown that the distance between the lead L 3 and the optical sensor 2 is the shortest and the distance between the lead L 4 and the optical sensor is the longest. . Here, when the voltage determined by the allowable value of variation in the height of the lead L and V a, if V max -V min> V a, the LSi flat package, defective, V max -
If V min ≦ V a , the deformation of the height of the lead is regarded as a good product.
また一方、光センサ２を第２図に示す矢印の方向に等速
度で移動させていくと、第３図の波形の谷の個所X1、
X2、X3、X4は、それぞれリードL1とL2、L2とL3、L3と
L4、L4とL5のセンタC1、C2、C3、C4に相当する。従って
第３図の時間t1、t2、t3はそれぞれ第２図のa1、a2、a3
に相当する。従ってリードの水平方向の変形はt1、t2、
t3の大小によって判別できる。On the other hand, when the optical sensor 2 is moved at a constant speed in the direction of the arrow shown in FIG. 2, the valley portion X 1 of the waveform shown in FIG.
X 2 , X 3 and X 4 are leads L 1 and L 2 , L 2 and L 3 , L 3 and
Equivalent to the centers C 1 , C 2 , C 3 , C 4 of L 4 , L 4 and L 5 . Therefore, the times t 1 , t 2 and t 3 in FIG. 3 are respectively a 1 , a 2 and a 3 in FIG.
Equivalent to. Therefore, the horizontal deformation of the lead is t 1 , t 2 ,
It can be determined by the size of t 3 .
また、第３図のS1、S2、S3、S4はそれぞれリードL1と
L2、L2とL3、L3とL4、L4とL5の距離に相当する時間を表
わしている。Further, S 1 of FIG. 3, S 2, S 3, S 4 and the lead L 1 respectively
It represents the time corresponding to the distance between L 2 , L 2 and L 3 , L 3 and L 4 , and L 4 and L 5 .
第４図、第５図は、同様にして検査した波形の例を示し
ている。第４図に示すような、波形の山部がフラット
で、谷部がシャープに出る如き場合は、t1、t2、t3によ
って良否を判定し、第５図に示すような、波形の山部が
シャープで、谷部がフラットの場合は、S1、S2、S3、S4
によって良否を判定する方がよい。第３図、第４図、第
５図に示す波形のどれになるかは、光センサの種類とLS
iフラットパッケージのリード寸法によって決まる。な
お以上の実施例では、投射光とほぼ平行な反射光を受光
して検出する光センサであるが、乱反射して投射光と平
行でない反射光を受光する光センサでも同様な働きをさ
せることができるのは勿論である。FIGS. 4 and 5 show examples of waveforms similarly tested. When the peaks of the waveform are flat and the valleys are sharp as shown in FIG. 4, the quality is judged by t 1 , t 2 , and t 3 , and the waveform of the waveform as shown in FIG. If the peaks are sharp and the valleys are flat, S 1 , S 2 , S 3 , S 4
It is better to judge pass / fail by. Which of the waveforms shown in FIG. 3, FIG. 4 and FIG.
Determined by the lead size of the i flat package. In the above embodiments, the optical sensor receives and detects the reflected light that is substantially parallel to the projected light. However, an optical sensor that receives the reflected light that is irregularly reflected and is not parallel to the projected light can also perform the same function. Of course you can.
発明の効果 本発明は上記実施例より明らかなように、光センサを互
いに平行に設けられた複数個のリードに順次光が投射す
るように等速度に移動させることにより、光センサの出
力波形の山部の最大値と最小値の差からリードの高さ方
向の変形の良否を判別し、波形の山部もしくは谷部の出
力時間差からリードの水平方向の変形の良否を判別でき
るため、画像信号を２値化処理して形状認識を行う検査
方法に比べて機械構成が簡単で、検査機器の価格も安価
でき、しかも目視による良不良の判別の如き不確実性と
作業者の疲労といった問題点もなく、確実に良、不良を
判別することができる。EFFECTS OF THE INVENTION As is apparent from the above-described embodiment, the present invention moves an optical sensor at a constant speed so that light is sequentially projected onto a plurality of leads provided in parallel with each other, and thereby the output waveform of the optical sensor is changed. The quality of the lead deformation in the height direction can be determined from the difference between the maximum and minimum values of the peaks, and the quality of the horizontal deformation of the lead can be determined from the output time difference of the peaks or troughs of the waveform. Compared with the inspection method that performs binarization processing for shape recognition, the structure of the machine is simpler, the price of inspection equipment can be lower, and there is the problem of uncertainty such as visual judgment of good and bad and fatigue of the operator. Without it, it is possible to surely determine whether it is good or bad.
第１図は本発明の一実施例の構成図、第２図は同実施例
の詳細図、第３図〜第５図は同実施例の信号波形図、第
６図は一般の集積回路フラットパッケージの斜視図、第
７図は同一般例の上面図、第８図は同一般例の正面図で
ある。 １……集積回路、２……光センサ、３……投射光、４…
…反射光、５……ケーブル、６……判別器。1 is a block diagram of an embodiment of the present invention, FIG. 2 is a detailed view of the same embodiment, FIGS. 3 to 5 are signal waveform diagrams of the same embodiment, and FIG. 6 is a general integrated circuit flat. FIG. 7 is a perspective view of the package, FIG. 7 is a top view of the same general example, and FIG. 8 is a front view of the same general example. 1 ... Integrated circuit, 2 ... Optical sensor, 3 ... Projected light, 4 ...
… Reflected light, 5 …… Cable, 6 …… Discriminator.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 鳥羽 広門 神奈川県横浜市港北区綱島東４丁目３番１ 号 松下通信工業株式会社内 (56)参考文献 実開 昭56−62508（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Hiromon Toba 4-3-1 Tsunashima East, Kohoku Ward, Yokohama City, Kanagawa Matsushita Communication Industrial Co., Ltd. (56) References )
Claims (1)
有する電子部品の上記複数個のリードに光を投射し、反
射光の変化を電圧変化に変換して出力する光センサを、
上記複数個のリードに順次光が投射するように等速度に
移動させ、上記光センサからの出力より上記複数個のリ
ードに対応した波形の山部の最大値と最小値の差と予め
設定された基準値とを比較して上記複数個のリードの高
さ方向の変形に対する良否を判別し、上記波形の山部も
しくは谷部の出力時間の差と予め設定された基準時間と
を比較して上記複数個のリードの水平方向の変形に対す
る良否を判別する電子部品リード検査方法。1. An optical sensor for projecting light onto the plurality of leads of an electronic component having a plurality of leads arranged in parallel with each other, converting a change in reflected light into a voltage change and outputting the voltage change.
The leads are moved at a constant speed so that light is sequentially projected onto the leads, and the difference between the maximum value and the minimum value of the peak portion of the waveform corresponding to the leads is preset from the output from the optical sensor. The difference between the output time of the peak portion or the valley portion of the waveform and a preset reference time are compared with each other to determine whether the plurality of leads are deformed in the height direction. An electronic component lead inspection method for determining the quality of a plurality of leads against horizontal deformation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60074609A JPH0731047B2 (en) | 1985-04-09 | 1985-04-09 | Electronic component lead inspection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60074609A JPH0731047B2 (en) | 1985-04-09 | 1985-04-09 | Electronic component lead inspection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61233304A JPS61233304A (en) | 1986-10-17 |
| JPH0731047B2 true JPH0731047B2 (en) | 1995-04-10 |
Family
ID=13552083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60074609A Expired - Lifetime JPH0731047B2 (en) | 1985-04-09 | 1985-04-09 | Electronic component lead inspection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0731047B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4875778A (en) * | 1987-02-08 | 1989-10-24 | Luebbe Richard J | Lead inspection system for surface-mounted circuit packages |
| JPS63281007A (en) * | 1987-05-13 | 1988-11-17 | Sumitomo Metal Mining Co Ltd | Detecting method for defective anode |
| US4875779A (en) * | 1988-02-08 | 1989-10-24 | Luebbe Richard J | Lead inspection system for surface-mounted circuit packages |
| JP2890578B2 (en) * | 1989-12-25 | 1999-05-17 | ソニー株式会社 | IC lead inspection device and IC lead inspection method |
| US5406372A (en) * | 1993-04-16 | 1995-04-11 | Modular Vision Systems Inc. | QFP lead quality inspection system and method |
| CN102435614B (en) * | 2011-12-06 | 2013-09-25 | 爱普科斯科技（无锡）有限公司 | Reverse cover screening system |
| KR101429692B1 (en) * | 2012-11-12 | 2014-08-13 | 주식회사 고영테크놀러지 | Inspection method for lead of electron component |
| JP6829946B2 (en) * | 2016-04-28 | 2021-02-17 | 川崎重工業株式会社 | Parts inspection equipment and methods |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5662508U (en) * | 1979-10-22 | 1981-05-27 |
-
1985
- 1985-04-09 JP JP60074609A patent/JPH0731047B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61233304A (en) | 1986-10-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |