JPH0732508Y2 - Electronic component supply device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a device for extracting and supplying in a row electronic components stored in bulk in a hopper.

[Prior Art] In a conventional component supply device of this type, as shown in FIG. 4, a hopper 1 is formed by a base member 38 and a cylindrical body 41 standing upright therefrom, and the base member 38 A sloped surface 2 having a funnel-shaped slope is formed on the bottom surface.
The upper end of the component discharge pipe 49 is vertically slidably inserted through a through hole formed in the lowest central part of the.
The upper end of the component discharge pipe 49 is opened obliquely. The slide member 37 protruding from the bottom of the base member 38 is slidably fitted in the recess of the guide member 36 fixed to the frame 35, whereby the hopper 1 is slidably guided up and down. Is reciprocated up and down by a drive mechanism (not shown).

In this way, by driving the hopper 1 up and down,
The upper end of the component discharge pipe 49 relatively reciprocates up and down in the hopper 1. The parts a, a ... Of the hopper 1 are crushed when the upper end of the component discharge pipe 49 rises from the bottom of the base member 38, and the electronic part a is removed from the opening when the upper end of the component discharge pipe 49 is lowered. Enter the inside of the pipe for discharging the parts. In this way, the electronic components a that have entered the component discharge pipe 49 are lined up in a line and are sequentially sent downward.

At the lower end of the component discharge pipe 49, an escapement mechanism for releasing the electronic components a one by one to the pipe-shaped component transport paths 10, 10 ... Is provided. As a result, the electronic parts a lined up in a line in the parts discharge pipe 49 become
Are sent one by one to be transported.

[Problems to be Solved by the Invention] In such a conventional electronic component supply device, dust in the hopper 1 enters the component discharge pipe 49 together with the electronic components a, a ... For example, it may be transported to a circuit board. If such dust is transported to the circuit board together with the electronic components, it may cause a circuit function trouble such as a short circuit of the circuit or a defective connection of the electronic components.

An object of the present invention is to solve the above conventional problems and to provide an electronic component supply device capable of removing dust in the hopper when supplying electronic components from the hopper.

[Means for Solving the Problems] That is, in order to achieve the above object, the present invention has a hopper 1 in which electronic components a, a ... Are stored in a bulk shape, and a hopper having a sloped surface 2 inclined like a funnel. In an electronic component supply device having a through hole 2 opened at the bottom of the device 1 and a component discharge pipe 49 that is inserted into the hopper 1 through the through hole 2 and moves up and down relatively to the hopper 1. Grooves 4, 4 ... Are vertically formed on the peripheral wall of the through hole 2 surrounding the component discharge pipe 49, and the diameter between the electronic component a, a ... Is narrower between the component discharge pipe 49 and the peripheral wall of the through hole 2. An electronic component supply device having a gap is provided.

[Operation] In the electronic component feeder according to the present invention, fine dust in the hopper 1 moves to the lower side of the hopper 1 together with the electronic components a and a, and the component discharge pipe 49 is at the lowest portion of the bottom.
Before it goes into the inside, it goes into the grooves 4, 4, ... Of the through hole 2 around it. Further, the electronic components a, a ...
Since the diameter is larger than the size of the gap formed by the grooves 4, 4, ..., It does not enter the grooves 4, 4 ,. Therefore, only dust is removed from the hopper 1 through the grooves 4, 4, ....

[Embodiment] Next, an embodiment of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the component supply device of the illustrated embodiment is
Similar to the conventional one already described, the base member 38 to the cylindrical body
41 stands up and the hopper 1 is constituted. Base member 38
A sloped surface 2 having a funnel-shaped inclination is formed on the bottom surface of the, and a through hole 2 is opened in the center of the lowest bottom. The upper end of the component discharge pipe 49 is slidably inserted vertically through the through hole 2.
The upper end of 49 is open obliquely.

The slide member 37 protruding from the bottom of the base member 38 is slidably fitted in the recess of the guide member 36 fixed to the frame 35, whereby the hopper 1 is slidably guided up and down. Is reciprocated up and down by a drive mechanism (not shown). By the vertical movement of this hopper 1,
The upper end of the component discharge pipe 49 reciprocates up and down relative to the hopper 1, and this reciprocating operation causes the electronic components a, a ... Inside the hopper 1 to enter the component discharge pipe 49 one by one.

At the lower end of the component discharge pipe 49, an escapement mechanism for releasing the electronic components a one by one to the pipe-shaped component transport paths 10, 10 ... Is provided. That is, the center axes of the lower end of the component discharge pipe 49 and the upper end of the component transport path 10 are laterally displaced from each other. Then, during this time, the slider 54 slides left and right in FIG. 2, and the through hole 64 provided therein reciprocates between the lower end of the component discharge pipe 49 and the upper end of the component transport path 10. This allows the parts discharge pipe 49
The electronic components a lined up in a row are sent one by one to the component transport path 10 and transported.

The vicinity of the bottom of the hopper 1 into which the discharge pipe 49 is fitted is shown in FIG. 2, and the through hole 2 and the component discharge pipe are shown.
A cross section of 49 is shown in FIG. As is clear from FIG. 3, longitudinal grooves 4 are formed at a constant angular interval on the peripheral wall of the through hole 2 into which the component discharge pipe 49 is fitted, and the through holes 2 are formed by these grooves 4, 4 ... Peripheral wall and parts discharge pipe
A gap is formed between the peripheral wall of 49. This groove 4, 4
The gap defined by ... Is formed continuously from the bottom surface of the hopper 1 to the base member 38 and the slide member 37. The opening size of the gap formed by the grooves 4, 4, ... On the bottom surface of the hopper 1 is set to be sufficiently smaller than the diameter of the electronic components a, a ... Therefore, the electronic components a, a ... It doesn't fit in 4 ...

Since the grooves 4, 4, ... Are around the part discharge pipe 49, dust that has descended on the bottom surface of the hopper 1 along the slope is caught by the grooves 4, 4, ... Before entering the part discharge pipe 49. Is excluded from the hopper 1. Also, these grooves 4, 4
Are provided on the peripheral wall of the through hole 2 at regular intervals, so that the interval between the peripheral wall of the through hole 2 and the peripheral surface of the component discharge pipe 49 is increased, and the component discharge pipe 49 is loosened. Nor.

[Advantages of the Invention] As described above, in the present invention, the dust in the hopper 1 is trapped and removed by the grooves 4, 4, ... Before entering the component discharge pipe 49. Since dust is not sent to the substrate or the like, it is possible to reduce the defects of the circuit board caused by the dust.

[Brief description of drawings]

FIG. 1 is a half sectional perspective view of a component supply device according to a first embodiment of the present invention, FIG. 2 is a longitudinal sectional front view of a main part of the same electronic component supply device, and FIG. FIG. 4 is a vertical cross-sectional front view of a conventional component supplying device, which is taken along line AA. 1 ... Hopper, 2 ... Through hole, 4 ... Groove, 49 ... Component discharge pipe, a ... Electronic component

Claims (1)

[Scope of utility model registration request] 1. A hopper 1 for accommodating electronic parts a, a ... In a bulk shape, a through hole 2 formed in the bottom of the hopper 1 having a sloped surface 2 inclined like a funnel, and the through hole 2 From the same hopper 1
In the electronic component supply device having a component discharge pipe 49 that moves up and down relatively to the groove, the peripheral wall of the through hole 2 that surrounds the component discharge pipe 49 has grooves 4, 4
Are vertically formed, and a gap narrower than the diameter of the electronic components a, a ... Is formed between the component discharge pipe 49 and the peripheral wall of the through hole 2.