JPH07331092A - Thermoplastic resin composition - Google Patents
Thermoplastic resin compositionInfo
- Publication number
- JPH07331092A JPH07331092A JP23174994A JP23174994A JPH07331092A JP H07331092 A JPH07331092 A JP H07331092A JP 23174994 A JP23174994 A JP 23174994A JP 23174994 A JP23174994 A JP 23174994A JP H07331092 A JPH07331092 A JP H07331092A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin composition
- layered silicate
- functional group
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 83
- 239000011342 resin composition Substances 0.000 title claims abstract description 53
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims abstract description 82
- 229920005989 resin Polymers 0.000 claims abstract description 73
- 239000011347 resin Substances 0.000 claims abstract description 73
- 125000003118 aryl group Chemical group 0.000 claims abstract description 50
- 125000000524 functional group Chemical group 0.000 claims abstract description 42
- 150000001875 compounds Chemical class 0.000 claims abstract description 37
- 150000004010 onium ions Chemical class 0.000 claims abstract description 36
- 229920005668 polycarbonate resin Polymers 0.000 claims abstract description 23
- 239000004431 polycarbonate resin Substances 0.000 claims abstract description 23
- 238000005341 cation exchange Methods 0.000 claims abstract description 21
- 238000002834 transmittance Methods 0.000 claims abstract description 11
- 239000011229 interlayer Substances 0.000 claims abstract description 8
- 238000009830 intercalation Methods 0.000 claims description 31
- 230000002687 intercalation Effects 0.000 claims description 29
- 229920001955 polyphenylene ether Polymers 0.000 claims description 21
- 229920006122 polyamide resin Polymers 0.000 claims description 18
- 239000004417 polycarbonate Substances 0.000 claims description 16
- 125000003700 epoxy group Chemical group 0.000 claims description 13
- 239000004645 polyester resin Substances 0.000 claims description 13
- 229920001225 polyester resin Polymers 0.000 claims description 13
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 9
- 229920000412 polyarylene Polymers 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 9
- 125000003277 amino group Chemical group 0.000 claims description 8
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- 239000011159 matrix material Substances 0.000 abstract description 22
- 238000000465 moulding Methods 0.000 abstract description 20
- 230000005484 gravity Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 3
- 230000001771 impaired effect Effects 0.000 abstract description 3
- 229920006352 transparent thermoplastic Polymers 0.000 abstract description 2
- -1 phenol compound Chemical class 0.000 description 46
- 238000000034 method Methods 0.000 description 38
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 23
- 238000002156 mixing Methods 0.000 description 22
- 239000003795 chemical substances by application Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 21
- 239000000203 mixture Substances 0.000 description 20
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000004952 Polyamide Substances 0.000 description 14
- 239000010410 layer Substances 0.000 description 14
- 229920002647 polyamide Polymers 0.000 description 14
- 239000004721 Polyphenylene oxide Substances 0.000 description 12
- 229920013636 polyphenyl ether polymer Polymers 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- 125000000217 alkyl group Chemical group 0.000 description 11
- 238000006116 polymerization reaction Methods 0.000 description 11
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 10
- XYFCBTPGUUZFHI-UHFFFAOYSA-O phosphonium Chemical compound [PH4+] XYFCBTPGUUZFHI-UHFFFAOYSA-O 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- 229920002292 Nylon 6 Polymers 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 125000004432 carbon atom Chemical group C* 0.000 description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 9
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 9
- 125000001453 quaternary ammonium group Chemical group 0.000 description 9
- 239000002994 raw material Substances 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- 229920001577 copolymer Polymers 0.000 description 8
- 238000005227 gel permeation chromatography Methods 0.000 description 8
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 8
- 239000004734 Polyphenylene sulfide Substances 0.000 description 7
- 239000006185 dispersion Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 229920000642 polymer Polymers 0.000 description 7
- 229920000069 polyphenylene sulfide Polymers 0.000 description 7
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 6
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 6
- 239000005062 Polybutadiene Substances 0.000 description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 239000002798 polar solvent Substances 0.000 description 6
- 229920001707 polybutylene terephthalate Polymers 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920000728 polyester Polymers 0.000 description 6
- 229920005990 polystyrene resin Polymers 0.000 description 6
- 239000005046 Chlorosilane Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 5
- 150000004651 carbonic acid esters Chemical class 0.000 description 5
- 239000003153 chemical reaction reagent Substances 0.000 description 5
- OGQYPPBGSLZBEG-UHFFFAOYSA-N dimethyl(dioctadecyl)azanium Chemical compound CCCCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCCCC OGQYPPBGSLZBEG-UHFFFAOYSA-N 0.000 description 5
- 238000004898 kneading Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 239000012994 photoredox catalyst Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 230000009257 reactivity Effects 0.000 description 5
- 150000004760 silicates Chemical class 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 5
- 125000003396 thiol group Chemical group [H]S* 0.000 description 5
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 4
- HPYNZHMRTTWQTB-UHFFFAOYSA-N 2,3-dimethylpyridine Chemical compound CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000004594 Masterbatch (MB) Substances 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical class Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 4
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 4
- 150000001991 dicarboxylic acids Chemical class 0.000 description 4
- SWSFKKWJEHRFFP-UHFFFAOYSA-N dihexadecyl(dimethyl)azanium Chemical compound CCCCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCCCC SWSFKKWJEHRFFP-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 4
- 239000011737 fluorine Substances 0.000 description 4
- 229910052731 fluorine Inorganic materials 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910052901 montmorillonite Inorganic materials 0.000 description 4
- 229920006287 phenoxy resin Polymers 0.000 description 4
- 239000013034 phenoxy resin Substances 0.000 description 4
- 229920002857 polybutadiene Polymers 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- PDSVZUAJOIQXRK-UHFFFAOYSA-N trimethyl(octadecyl)azanium Chemical compound CCCCCCCCCCCCCCCCCC[N+](C)(C)C PDSVZUAJOIQXRK-UHFFFAOYSA-N 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 3
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 3
- RLGQACBPNDBWTB-UHFFFAOYSA-N cetyltrimethylammonium ion Chemical compound CCCCCCCCCCCCCCCC[N+](C)(C)C RLGQACBPNDBWTB-UHFFFAOYSA-N 0.000 description 3
- 238000003776 cleavage reaction Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- CJBMLKNLJXFFGD-UHFFFAOYSA-N dimethyl-di(tetradecyl)azanium Chemical compound CCCCCCCCCCCCCC[N+](C)(C)CCCCCCCCCCCCCC CJBMLKNLJXFFGD-UHFFFAOYSA-N 0.000 description 3
- VICYBMUVWHJEFT-UHFFFAOYSA-N dodecyltrimethylammonium ion Chemical compound CCCCCCCCCCCC[N+](C)(C)C VICYBMUVWHJEFT-UHFFFAOYSA-N 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 125000001072 heteroaryl group Chemical group 0.000 description 3
- TXPMUPUOSOZCCS-UHFFFAOYSA-N hexadecyl(trimethyl)phosphanium Chemical compound CCCCCCCCCCCCCCCC[P+](C)(C)C TXPMUPUOSOZCCS-UHFFFAOYSA-N 0.000 description 3
- 230000007062 hydrolysis Effects 0.000 description 3
- 238000006460 hydrolysis reaction Methods 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000010445 mica Substances 0.000 description 3
- 229910052618 mica group Inorganic materials 0.000 description 3
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 3
- 230000000269 nucleophilic effect Effects 0.000 description 3
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 3
- 125000005496 phosphonium group Chemical group 0.000 description 3
- 229920001281 polyalkylene Polymers 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- 239000001294 propane Substances 0.000 description 3
- 230000007017 scission Effects 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 229920001169 thermoplastic Polymers 0.000 description 3
- 239000004416 thermosoftening plastic Substances 0.000 description 3
- PMJCFMOHKYAWDN-UHFFFAOYSA-N tributyl(octadecyl)phosphanium Chemical compound CCCCCCCCCCCCCCCCCC[P+](CCCC)(CCCC)CCCC PMJCFMOHKYAWDN-UHFFFAOYSA-N 0.000 description 3
- IKANSXQHJXBNIN-UHFFFAOYSA-N trimethyl(octadecyl)phosphanium Chemical compound CCCCCCCCCCCCCCCCCC[P+](C)(C)C IKANSXQHJXBNIN-UHFFFAOYSA-N 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- JYYNAJVZFGKDEQ-UHFFFAOYSA-N 2,4-Dimethylpyridine Chemical compound CC1=CC=NC(C)=C1 JYYNAJVZFGKDEQ-UHFFFAOYSA-N 0.000 description 2
- XWKFPIODWVPXLX-UHFFFAOYSA-N 2,5-dimethylpyridine Chemical compound CC1=CC=C(C)N=C1 XWKFPIODWVPXLX-UHFFFAOYSA-N 0.000 description 2
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- XCUMMFDPFFDQEX-UHFFFAOYSA-N 2-butan-2-yl-4-[2-(3-butan-2-yl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)CC)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)CC)=C1 XCUMMFDPFFDQEX-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical compound O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 2
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 description 2
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 description 2
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 2
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- 238000012695 Interfacial polymerization Methods 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229920000571 Nylon 11 Polymers 0.000 description 2
- 229920000299 Nylon 12 Polymers 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- 229920001283 Polyalkylene terephthalate Polymers 0.000 description 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 229960002684 aminocaproic acid Drugs 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- ACWNVEXNIHQIOQ-UHFFFAOYSA-N azanium;12-aminododecanoate Chemical compound [NH4+].NCCCCCCCCCCCC([O-])=O ACWNVEXNIHQIOQ-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 2
- 239000002734 clay mineral Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- CSHHUPZZJWPKLG-UHFFFAOYSA-N didodecyl(diethyl)azanium Chemical compound CCCCCCCCCCCC[N+](CC)(CC)CCCCCCCCCCCC CSHHUPZZJWPKLG-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- MTMYNZJXHXNCTQ-UHFFFAOYSA-N diethyl(dihexadecyl)azanium Chemical compound CCCCCCCCCCCCCCCC[N+](CC)(CC)CCCCCCCCCCCCCCCC MTMYNZJXHXNCTQ-UHFFFAOYSA-N 0.000 description 2
- UIPRNZFLDHNPDH-UHFFFAOYSA-N diethyl(dioctadecyl)azanium Chemical compound CCCCCCCCCCCCCCCCCC[N+](CC)(CC)CCCCCCCCCCCCCCCCCC UIPRNZFLDHNPDH-UHFFFAOYSA-N 0.000 description 2
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- 150000003222 pyridines Chemical class 0.000 description 1
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- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
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- SXVODTLPSBRQLU-UHFFFAOYSA-N trichloro(3-nitropropyl)silane Chemical compound [O-][N+](=O)CCC[Si](Cl)(Cl)Cl SXVODTLPSBRQLU-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- HKFSBKQQYCMCKO-UHFFFAOYSA-N trichloro(prop-2-enyl)silane Chemical compound Cl[Si](Cl)(Cl)CC=C HKFSBKQQYCMCKO-UHFFFAOYSA-N 0.000 description 1
- XBWRLPTYWJUPKS-UHFFFAOYSA-N trichloro-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound Cl[Si](Cl)(Cl)CCCOCC1CO1 XBWRLPTYWJUPKS-UHFFFAOYSA-N 0.000 description 1
- WIMCSFQYNXRDOM-UHFFFAOYSA-N tridodecyl(ethyl)azanium Chemical compound CCCCCCCCCCCC[N+](CC)(CCCCCCCCCCCC)CCCCCCCCCCCC WIMCSFQYNXRDOM-UHFFFAOYSA-N 0.000 description 1
- SBHRWOBHKASWGU-UHFFFAOYSA-M tridodecyl(methyl)azanium;chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(CCCCCCCCCCCC)CCCCCCCCCCCC SBHRWOBHKASWGU-UHFFFAOYSA-M 0.000 description 1
- FPBXRRDHCADTAL-UHFFFAOYSA-N triethoxy(3-nitropropyl)silane Chemical group CCO[Si](OCC)(OCC)CCC[N+]([O-])=O FPBXRRDHCADTAL-UHFFFAOYSA-N 0.000 description 1
- QPPXVBLDIDEHBA-UHFFFAOYSA-N trimethoxy(3-nitropropyl)silane Chemical compound CO[Si](OC)(OC)CCC[N+]([O-])=O QPPXVBLDIDEHBA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- AUSVCTPDUJVUGB-UHFFFAOYSA-N trimethyl(octadec-1-enyl)azanium Chemical compound CCCCCCCCCCCCCCCCC=C[N+](C)(C)C AUSVCTPDUJVUGB-UHFFFAOYSA-N 0.000 description 1
- ZBMLLSYGUXEKLB-UHFFFAOYSA-N trimethyl(octadeca-1,3-dienyl)azanium Chemical compound CCCCCCCCCCCCCCC=CC=C[N+](C)(C)C ZBMLLSYGUXEKLB-UHFFFAOYSA-N 0.000 description 1
- ZNEOHLHCKGUAEB-UHFFFAOYSA-N trimethylphenylammonium Chemical compound C[N+](C)(C)C1=CC=CC=C1 ZNEOHLHCKGUAEB-UHFFFAOYSA-N 0.000 description 1
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- 238000005303 weighing Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
- GKXVJHDEWHKBFH-UHFFFAOYSA-N xylylenediamine group Chemical group C=1(C(=CC=CC1)CN)CN GKXVJHDEWHKBFH-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
(57)【要約】
【構成】 反応性官能基を有する陽イオン交換性層状珪
酸塩をホストとし有機オニウムイオンをゲストとする層
間化合物と、反応性官能基と反応しうる熱可塑性樹脂と
を含有し、層間化合物を無機灰分量として0.1〜20
重量%含む熱可塑性樹脂組成物、及び、芳香族ポリカー
ボネート樹脂及び層状珪酸塩を含有する熱可塑性樹脂組
成物であって、熱可塑性樹脂組成物中の無機灰分量が
0.25〜10重量%であり、熱可塑性樹脂組成物から
なる厚さ3mmの成形品に対する平行可視光線の平行透
過率P(%)と無機灰分量A(重量%)との積が下記式
aを満たす熱可塑性樹脂組成物。
【数1】P×A≧20・・・・(a)
【効果】 強度や剛性に優れ、靱性を損なわず、かつ比
重の増加が少なく、良好な成形表面性や溶融流動性、低
い成形収縮率のような優れた成形性を有する。また、特
に芳香族ポリカーボネート樹脂に代表される透明な熱可
塑性樹脂をマトリックスとした場合、優れた透明性を有
する。(57) [Summary] [Structure] Containing an interlayer compound having a cation-exchange layered silicate having a reactive functional group as a host and an organic onium ion as a guest, and a thermoplastic resin capable of reacting with the reactive functional group. Then, the interlayer compound is used as the inorganic ash content of 0.1 to 20.
A thermoplastic resin composition containing 1% by weight, and a thermoplastic resin composition containing an aromatic polycarbonate resin and a layered silicate, wherein the amount of inorganic ash in the thermoplastic resin composition is 0.25 to 10% by weight. A thermoplastic resin composition in which the product of the parallel transmittance P (%) of parallel visible light and the inorganic ash content A (% by weight) with respect to a molded product of a thermoplastic resin composition having a thickness of 3 mm satisfies the following formula a: . [Equation 1] P × A ≧ 20 (A) [Effect] Excellent strength and rigidity, toughness is not impaired, specific gravity does not increase, good molding surface properties, melt flowability, and low molding shrinkage. It has excellent moldability such as rate. Further, when a transparent thermoplastic resin typified by an aromatic polycarbonate resin is used as a matrix, it has excellent transparency.
Description
【0001】[0001]
【産業上の利用分野】本発明は、熱可塑性樹脂と該熱可
塑性樹脂マトリックスに極めて均一に分散した層状珪酸
塩あるいは層間化合物からなる熱可塑性樹脂組成物に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoplastic resin composition comprising a thermoplastic resin and a layered silicate or intercalation compound which is extremely uniformly dispersed in the thermoplastic resin matrix.
【0002】[0002]
【従来の技術】従来より、熱可塑性樹脂材料の強度や剛
性を高めたり寸法精度を高める目的で、様々な充填材、
例えばガラス繊維、炭素繊維、チタン酸カリウムウイス
カー等の無機繊維、ガラスフレーク、ガラスビーズ、タ
ルク、マイカ、カオリン、ウオラストナイト等の無機粉
体の配合が行われてきている。しかし、これらの方法は
強度や剛性を高めるものの、靱性を損なう欠点、比重が
増す欠点、表面外観が低下するといった欠点があった。
こうした充填材の混合における欠点は、一般に充填材の
分散不良あるいは分散物のサイズが大き過ぎること、及
びマトリックス樹脂との界面の接着不良に起因するもの
と考えられており、こうした観点から充填材の表面処理
や微粉化、形状の工夫等様々な試みがなされてきた。2. Description of the Related Art Conventionally, various fillers have been used for the purpose of increasing strength and rigidity of thermoplastic resin materials and increasing dimensional accuracy.
For example, glass fibers, carbon fibers, inorganic fibers such as potassium titanate whiskers, and glass flakes, glass beads, talc, mica, kaolin, wollastonite, and other inorganic powders have been compounded. However, although these methods increase strength and rigidity, they have drawbacks of impairing toughness, increasing specific gravity, and decreasing surface appearance.
Such defects in the mixing of fillers are generally considered to be due to poor dispersion of fillers or an excessively large size of the dispersion, and poor adhesion at the interface with the matrix resin. Various attempts have been made such as surface treatment, pulverization, and devising the shape.
【0003】例えば、特開昭61−266461号公報
には、界面の接着向上の試みとして、ポリフェニレンス
ルフィド樹脂にシランカップリング剤で処理した珪酸及
び/又は珪酸塩を配合することにより、未処理品に比べ
機械的物性や耐湿性が向上することが記載されている
が、その分散サイズは比較的大きく成形表面性に問題が
あった。For example, in JP-A-61-266461, in an attempt to improve the adhesion at the interface, a polyphenylene sulfide resin is blended with a silicic acid and / or a silicate treated with a silane coupling agent to obtain an untreated product. Although it is described that the mechanical properties and the moisture resistance are improved as compared with, the dispersion size was relatively large and there was a problem in the molding surface property.
【0004】また、分散サイズの低減の試みとして、熱
可塑性樹脂マトリックスに対し、陽イオン交換能を有す
る層状珪酸塩に有機オニウムイオンをインターカレーシ
ョンした層間化合物を分散する方法が提案されており、
例えば、ポリアミド樹脂については特開昭48−103
653号公報、特開昭51−109998号公報、特開
昭58−35542号公報、特開昭62−74957号
公報、特願平5−245199号において、芳香族ポリ
エステル樹脂については特開平3−62846号公報、
特願平5−245200号において、それぞれ開示され
ている。これらの技術により層状珪酸塩は極めて微細に
分散され、少量の添加量での強度・剛性の顕著な向上や
良好な成形表面性が達成されるが、靱性の保持は必ずし
も満足できるものではなかった。As an attempt to reduce the dispersion size, there has been proposed a method of dispersing an intercalation compound in which an organic onium ion is intercalated in a layered silicate having a cation exchange ability in a thermoplastic resin matrix,
For example, regarding polyamide resin, JP-A-48-103
Japanese Patent Application Laid-Open No. 3-153, No. 6599, Japanese Patent Application Laid-Open No. 51-109998, Japanese Patent Application Laid-Open No. 58-35542, Japanese Patent Application Laid-Open No. 62-74957, and Japanese Patent Application No. 5-245199 disclose the aromatic polyester resin. 62846 publication,
They are disclosed in Japanese Patent Application No. 5-245200. By these techniques, the layered silicate is extremely finely dispersed, and the strength and rigidity can be remarkably improved and good molding surface properties can be achieved with a small amount of addition, but retention of toughness is not always satisfactory. .
【0005】更に、特開平4−80259号公報、特開
平4−178459号公報には、ポリアミド樹脂とこれ
に均一に分散した層状珪酸塩の系に、ヒンダードフェノ
ール系化合物やシランカップリング剤及び/又はチタネ
ートカップリング剤等を添加してなる延伸ポリアミドフ
ィルム用樹脂組成物が開示されている。しかし、これら
の添加剤の混合方法は、ポリアミドに層状珪酸塩を均一
に分散させた組成物への混合、ポリアミドへの層状珪酸
塩分散時の同時混合等、いずれもポリアミドマトリック
スに対する混合であり、フィルム延伸時の透明性低下を
の抑制においては必ずしも十分でなかった。Further, in JP-A-4-80259 and JP-A-4-178459, a hindered phenol compound, a silane coupling agent and a hindered phenol compound are added to a system of a polyamide resin and a layered silicate uniformly dispersed therein. A resin composition for a stretched polyamide film, which is obtained by adding a titanate coupling agent or the like, is disclosed. However, the mixing method of these additives, mixing into a composition in which a layered silicate is uniformly dispersed in polyamide, simultaneous mixing at the time of dispersing the layered silicate in polyamide, etc., are both mixed with a polyamide matrix, It was not always sufficient in suppressing the decrease in transparency during film stretching.
【0006】特開平5−194851号公報には、ポリ
アリーレンスルフィド分子に含まれる官能基との反応性
を有する有機オニウムイオンやシラン化合物を、それぞ
れイオン結合や共有結合させた有機変性層状珪酸塩を、
ポリアリーレンスルフィドと接触及び反応させることに
より得られる樹脂組成物が開示されている。こうした接
触及び反応をポリアリーレンスルフィド溶液において行
った場合には珪酸塩層が均一に分散し、機械的強度や弾
性率及び熱変形温度が上昇するものの、このような溶液
中での反応によると溶融粘度の上昇を来す場合があるだ
けでなく、有機変性層状珪酸塩の分散を溶融混練等の無
溶媒の条件にて行った場合には分散性は不十分であっ
た。JP-A-5-194851 discloses an organically modified layered silicate in which an organic onium ion or a silane compound having reactivity with a functional group contained in a polyarylene sulfide molecule is ionic or covalently bonded, respectively. ,
A resin composition obtained by contacting and reacting with a polyarylene sulfide is disclosed. When such contact and reaction are carried out in a polyarylene sulfide solution, the silicate layer is uniformly dispersed and the mechanical strength, elastic modulus and heat distortion temperature rise, but the reaction in such a solution causes melting. Not only may the viscosity increase, but the dispersibility was insufficient when the organically modified layered silicate was dispersed under solvent-free conditions such as melt-kneading.
【0007】[0007]
【発明が解決しようとする課題】以上のように、熱可塑
性樹脂の強度や剛性等を改良する目的で様々な無機充填
材の使用が提案されてきたが、材料の靱性の保持は必ず
しも満足できるものではなく、また、溶融流動性改良の
要請は依然としてあり、寸法精度の改良の点においても
特に繊維状充填材の配合での異方性の問題が残されてお
り、更に透明なマトリックス樹脂において強度や剛性の
改良と透明性保持の両立は達成は困難であった。本発明
の目的は、強度や剛性に優れると同時に靱性、特に延性
に優れ、かつ比重の増加が少なく成形表面外観や溶融流
動性に優れ、しかも寸法精度が等方的に改良された熱可
塑性樹脂組成物、更に機械的強度、剛性、靱性、成形
性、透明性の優れた層状珪酸塩を含有する熱可塑性芳香
族ポリカーボネート樹脂組成物を提供することにある。As described above, it has been proposed to use various inorganic fillers for the purpose of improving the strength and rigidity of the thermoplastic resin, but the toughness of the material can always be maintained. In addition, there is still a demand for improvement of melt flowability, and in terms of improvement of dimensional accuracy, there is still a problem of anisotropy particularly in blending of fibrous filler. It was difficult to achieve both improvement of strength and rigidity and maintenance of transparency. The object of the present invention is a thermoplastic resin having excellent strength and rigidity as well as toughness, particularly excellent ductility, a small increase in specific gravity, excellent molding surface appearance and melt flowability, and isotropically improved dimensional accuracy. Another object of the present invention is to provide a thermoplastic aromatic polycarbonate resin composition containing a composition and a layered silicate having excellent mechanical strength, rigidity, toughness, moldability, and transparency.
【0008】[0008]
【課題を解決するための手段】本発明は、上述の問題を
解決するためになされたものであり、その要旨は、反応
性官能基を有する陽イオン交換性層状珪酸塩をホストと
し有機オニウムイオンをゲストとする層間化合物と、該
反応性官能基と反応しうる熱可塑性樹脂とを含有し、該
層間化合物を無機灰分量として0.1〜20重量%含む
ことを特徴とする熱可塑性樹脂組成物、及び、芳香族ポ
リカーボネート樹脂及び層状珪酸塩を含有する熱可塑性
樹脂組成物であって、該熱可塑性樹脂組成物中の無機灰
分量が0.25〜10重量%であり、該熱可塑性樹脂組
成物からなる厚さ3mmの成形品に対する平行可視光線
の平行透過率P(%)と無機灰分量A(重量%)との積
が下記式aThe present invention has been made to solve the above problems, and its gist is to use an organic onium ion with a cation exchange layered silicate having a reactive functional group as a host. As a guest, and a thermoplastic resin capable of reacting with the reactive functional group, and the interlayer compound is contained in an amount of 0.1 to 20% by weight as an inorganic ash content. And a thermoplastic resin composition containing an aromatic polycarbonate resin and a layered silicate, wherein the amount of inorganic ash in the thermoplastic resin composition is 0.25 to 10% by weight. The product of the parallel transmittance P (%) of parallel visible light and the amount of inorganic ash A (% by weight) for a molded product made of the composition and having a thickness of 3 mm is represented by the following formula a.
【0009】[0009]
【数2】P×A≧20・・・・(a) を満たすことを特徴とする熱可塑性樹脂組成物に存す
る。以下、本発明をさらに詳細に説明する。本発明にお
ける層状珪酸塩の反応性官能基と反応しうる熱可塑性樹
脂(以下、反応性熱可塑性樹脂とも称する。)は、反応
性官能基を有する層状珪酸塩との任意の混合過程におい
て該官能基と反応しうるものであればその種類、組成、
及び相分離の有無等特に制限は無い。本発明における反
応性官能基とこれと反応しうる反応性熱可塑性樹脂成分
との組み合わせの例を表ー1に例示する。## EQU00002 ## A thermoplastic resin composition characterized by satisfying P.times.A.gtoreq.20 (a). Hereinafter, the present invention will be described in more detail. The thermoplastic resin capable of reacting with the reactive functional group of the layered silicate in the present invention (hereinafter, also referred to as a reactive thermoplastic resin) is a functional resin in any mixing process with the layered silicate having a reactive functional group. If it can react with a group, its type, composition,
There is no particular limitation such as the presence or absence of phase separation. Table 1 shows examples of combinations of the reactive functional group and the reactive thermoplastic resin component capable of reacting with the reactive functional group in the present invention.
【0010】[0010]
【表1】 表ー1 ──────────────────────────────────── 有機官能基 :反応性熱可塑性樹脂 ──────────────────────────────────── アミノ基 ;酸変性されたPPO・PO・PSt系各樹脂、PAR樹脂 エポキシ樹脂、ポリアミド樹脂、芳香族ポリエステル樹脂 、アクリル樹脂、PC樹脂 エポキシ基 ;ポリアミド樹脂、酸変性されたPPO・PO・PSt系各 樹脂、PAR樹脂、芳香族ポリエステル樹脂、フェノキシ 樹脂、エポキシ樹脂、PPE樹脂、PAS樹脂、PC樹脂 カルボキシル基 ;エポキシ変性されたPPE・PO・PSt系各樹脂、エポ キシ樹脂、ポリアミド樹脂、芳香族ポリエステル樹脂、フ ェノキシ樹脂、PAR樹脂、PPE樹脂、PAS樹脂、P C樹脂 メルカプト基 ;エポキシ変性されたPPE・PO・PSt系各樹脂、エポ キシ樹脂、ポリアミド樹脂、芳香族ポリエステル樹脂、P AR樹脂、PPE樹脂、アクリル樹脂、PC樹脂 炭素ー炭素 ;ポリブタジエン、ポリイソプレン、PPE樹脂、PO樹脂 不飽和結合 アクリル樹脂、PAS樹脂 ニトロ基 ;PAS樹脂 アルコキシリル基;ポリアミド樹脂、芳香族ポリエステル樹脂、PAR樹脂、 PC樹脂、フェノキシ樹脂、エポキシ樹脂、PPE樹脂、 PAS樹脂 ──────────────────────────────────── PPE樹脂 :ポリフェニレンエーテル樹脂 PO樹脂 :ポリオレフィン樹脂 PSt系樹脂:ポリスチレン系樹脂(例えばABS樹
脂、ポリスチレン樹脂、スチレン系エラストマー等) PAR樹脂 :ポリアリレート樹脂 PC樹脂 :芳香族ポリカーボネイト樹脂 PAS樹脂 :ポリアリーレンスルフィド樹脂[Table 1] Table-1 ──────────────────────────────────── Organic functional group: Reactive heat Plastic resin ──────────────────────────────────── Amino group; Acid-modified PPO / PO / PSt -Based resins, PAR resins Epoxy resins, polyamide resins, aromatic polyester resins, acrylic resins, PC resins Epoxy groups; Polyamide resins, acid-modified PPO / PO / PSt-based resins, PAR resins, aromatic polyester resins, phenoxy Resin, Epoxy resin, PPE resin, PAS resin, PC resin Carboxyl group; Epoxy-modified PPE / PO / PSt resins, epoxy resin, polyamide resin, aromatic polyester resin, phenoxy resin, PAR resin, PPE resin , P S resin, PC resin mercapto group; epoxy-modified PPE / PO / PSt based resins, epoxy resin, polyamide resin, aromatic polyester resin, PAR resin, PPE resin, acrylic resin, PC resin carbon-carbon; Polybutadiene, polyisoprene, PPE resin, PO resin unsaturated bond acrylic resin, PAS resin nitro group; PAS resin alkoxylyl group; polyamide resin, aromatic polyester resin, PAR resin, PC resin, phenoxy resin, epoxy resin, PPE resin, PAS resin ──────────────────────────────────── PPE resin: Polyphenylene ether resin PO resin: Polyolefin resin PSt Resin: Polystyrene resin (eg ABS resin, polystyrene resin, styrene elastomer Mer, etc.) PAR resin: polyarylate resin PC resin: aromatic polycarbonate resin PAS Resin: polyarylene sulfide resin
【0011】これらの組み合わせのうち、反応性官能基
としてアミノ基、エポキシ基、カルボキシル基、メルカ
プト基を用いるのがその効果及び幅広い熱可塑性樹脂マ
トリックスへの適用性の点で好ましく、更に反応の容易
性の点でアミノ基及び/又はエポキシ基を用いるのがよ
り好ましい。また反応性官能基と反応しうる熱可塑性樹
脂としては反応性及び機械的物性の改良の点から、ポリ
アミド樹脂、ポリフェニレンエーテル樹脂、芳香族ポリ
エステル樹脂、ポリアリーレンスルフィド樹脂、酸変性
ポリオレフィン樹脂、芳香族ポリカーボネイト樹脂等が
挙げられる。Of these combinations, it is preferable to use an amino group, an epoxy group, a carboxyl group, or a mercapto group as a reactive functional group from the viewpoint of its effect and applicability to a wide range of thermoplastic resin matrices, and further easy reaction. It is more preferable to use an amino group and / or an epoxy group from the viewpoint of properties. Further, as a thermoplastic resin capable of reacting with a reactive functional group, from the viewpoint of improving reactivity and mechanical properties, polyamide resin, polyphenylene ether resin, aromatic polyester resin, polyarylene sulfide resin, acid-modified polyolefin resin, aromatic resin Examples thereof include polycarbonate resin.
【0012】本発明におけるポリアミド樹脂としては、
主鎖中にアミド結合(−NHCO−)を含み加熱溶融で
きる重合体である。好適なポリアミド樹脂として、ポリ
テトラメチレンアジパミド(ナイロン46)、ポリカプ
ロラクタム(ナイロン6)、ポリヘキサメチレンアジパ
ミド(ナイロン66)、ポリヘキサメチレンセバカミド
(ナイロン610)、ポリヘキサメチレンドデカミド
(ナイロン612)、ポリウンデカノラクタム(ナイロ
ン11)、ポリドデカノラクタム(ナイロン12)、テ
レフタル酸及び/又はイソフタル酸とヘキサメチレンジ
アミンとから得られるポリアミド、アジピン酸とメタキ
シリレンジアミンとから得られるポリアミド、テレフタ
ル酸とアジピン酸とヘキサメチレンジアミンとから得ら
れるポリアミド、共重合成分として二量体化脂肪酸を含
む共重合ポリアミド、及びこれらのうち少なくとも2種
の異なったポリアミド形成成分を含むポリアミド共重合
体並びにこれらの混合物などが挙げられる。この中でナ
イロン6、ナイロン66はそれ自身が靱性と剛性のバラ
ンスに優れているため特に好適である。かかるポリアミ
ドの原料は、ジアミンとジカルボン酸、ラクタム類、又
は重合可能なω−アミノ酸類、ジアミンとジカルボン酸
からなる塩、及びこれら原料のオリゴマーである。こう
したポリアミド原料の具体例は、特願平5−24519
9号等に詳述されているとおりであるが、ジアミンとし
てはテトラメチレンジアミン、ヘキサメチレンジアミン
等の脂肪族ジアミン、キシリレンジアミン類等が、ジカ
ルボン酸としてはアジピン酸、セバシン酸等の脂肪族ジ
カルボン酸、テレフタル酸、イソフタル酸等の芳香族ジ
カルボン酸、二量体化脂肪酸類等が、ラクタム類として
はカプロラクタム、ウンデカノラクタム、ドデカノラク
タム等が、重合可能なω−アミノ酸類としては6−アミ
ノカプロン酸、11−アミノウンデカン酸、12−アミ
ノドデカン酸等が代表的なものとして挙げられる。これ
ら各種のポリアミド樹脂又はポリアミド原料は数種組み
合わせて用いても良い。なお、これらのポリアミド樹脂
の分子量には特に制限はないが、通常1g/dl濃度の
濃硫酸溶液での25℃における相対粘度ηrel が0.9
〜6.0であり、靱性と成形性の点から好ましくは1.
0〜5.0である。As the polyamide resin in the present invention,
It is a polymer that contains an amide bond (-NHCO-) in the main chain and can be melted by heating. Suitable polyamide resins include polytetramethylene adipamide (nylon 46), polycaprolactam (nylon 6), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebacamide (nylon 610), polyhexamethylene dodeca. Mido (nylon 612), polyundecanolactam (nylon 11), polydodecanolactam (nylon 12), polyamide obtained from terephthalic acid and / or isophthalic acid and hexamethylenediamine, from adipic acid and metaxylylenediamine The polyamide obtained, the polyamide obtained from terephthalic acid, adipic acid and hexamethylenediamine, the copolymerized polyamide containing a dimerized fatty acid as a copolymerization component, and the polyamide containing at least two different polyamide forming components among these. Such as amide copolymer and mixtures thereof. Of these, nylon 6 and nylon 66 are particularly suitable because they have excellent balance between toughness and rigidity. The starting materials for such polyamides are diamines and dicarboxylic acids, lactams or polymerizable ω-amino acids, salts of diamines and dicarboxylic acids, and oligomers of these starting materials. A specific example of such a polyamide raw material is Japanese Patent Application No. 5-24519.
As described in detail in No. 9 and the like, diamines include aliphatic diamines such as tetramethylenediamine and hexamethylenediamine, xylylenediamines, and dicarboxylic acids such as adipic acid and sebacic acid. Aromatic dicarboxylic acids such as dicarboxylic acid, terephthalic acid and isophthalic acid, dimerized fatty acids and the like, lactams such as caprolactam, undecanolactam and dodecanolactam, and polymerizable ω-amino acids are 6 -Aminocaproic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid and the like are mentioned as typical ones. These various polyamide resins or polyamide raw materials may be used in combination. The molecular weight of these polyamide resins is not particularly limited, but the relative viscosity η rel at 25 ° C. in a concentrated sulfuric acid solution having a concentration of 1 g / dl is usually 0.9.
Is about 6.0, and preferably 1.
It is 0 to 5.0.
【0013】本発明におけるポリフェニレンエーテル樹
脂としては、ベンゼン環残基がエーテル結合を介して結
ばれた重合体であり加熱溶融できるものである。これら
はフェノール類又はその反応性誘導体を原料として、公
知の方法、例えば酸化カップリング触媒を用いた酸素又
は酸素含有ガスによる酸化カップリング重合等で製造さ
れる。該フェノール類及び重合触媒等の具体例は例えば
特開平4ー239029号公報等に詳述されているが、
代表的なフェノール類としてはフェノール、o−クレゾ
ール、2,6−キシレノール、2,5−キシレノール、
2,3,6−トリメチルフェノール等のメチルフェノー
ル類等が挙げられ、これらフェノール類は単独あるいは
2種以上の組み合わせとして用いても良い。最も一般的
なポリフェニレンエーテル樹脂としてはポリ(2,6−
ジメチル−1,4−フェニレン)エーテル、又はこれを
主構造とする共重合体が挙げられるが、2種以上のポリ
フェニレンエーテル樹脂を含む混合物も使用できる。ま
た、本発明の目的を逸脱しない範囲で、溶融流動性改善
の目的でポリスチレン樹脂を配合した相溶性混合物とす
ることも可能である。本第一発明に用いられるポリフェ
ニレンエーテル樹脂の分子量には特に制限はないが、通
常0.6g/dl濃度のクロロホルム溶液の25℃での極限
粘度[η]が0.2〜0.6dl/gであり、靱性及び
成形性の点からより好ましくは0.35〜0.55dl
/gである。The polyphenylene ether resin in the present invention is a polymer in which benzene ring residues are linked via an ether bond and can be heated and melted. These are produced by a known method, for example, oxidative coupling polymerization with oxygen or an oxygen-containing gas using an oxidative coupling catalyst, using a phenol or a reactive derivative thereof as a raw material. Specific examples of the phenols and the polymerization catalyst are described in detail, for example, in JP-A-4-239029,
Typical phenols include phenol, o-cresol, 2,6-xylenol, 2,5-xylenol,
Examples include methylphenols such as 2,3,6-trimethylphenol and the like, and these phenols may be used alone or in combination of two or more kinds. The most common polyphenylene ether resin is poly (2,6-
Examples thereof include dimethyl-1,4-phenylene) ether and copolymers having a main structure thereof, but a mixture containing two or more polyphenylene ether resins can also be used. It is also possible to make a compatible mixture containing a polystyrene resin for the purpose of improving the melt fluidity without departing from the object of the present invention. The molecular weight of the polyphenylene ether resin used in the first invention is not particularly limited, but the intrinsic viscosity [η] of a chloroform solution having a concentration of 0.6 g / dl at 25 ° C. is usually 0.2 to 0.6 dl / g. And more preferably from 0.35 to 0.55 dl from the viewpoint of toughness and formability.
/ G.
【0014】本発明における芳香族ポリエステル樹脂と
しては、ジカルボン酸あるいはそのエステル形成性誘導
体とジオールあるいはそのエステル形成性誘導体との縮
合反応により得られる芳香環を主鎖中に有するポリエス
テルである。芳香族ポリエステル原料及び芳香族ポリエ
ステルの具体例については、例えば特開平5−2452
00号公報に詳述されているが、代表的な原料としてジ
カルボン酸としてはテレフタル酸、イソフタル酸、2,
6−ナフタレンジカルボン酸等の芳香族ジカルボン酸
が、ジオールとしてはエチレングリコール、1,4−ブ
タンジオール、シクロヘキサンジメタノール、シクロヘ
キサンジオール、分子量400〜6、000の長鎖グリ
コール等がそれぞれ挙げられる。代表的な芳香族ポリエ
ステルを列挙すると、ポリエチレンテレフタレート、ポ
リブチレンテレフタレート、ポリシクロヘキサンジメチ
レンテレフタレート等のポリアルキレンテレフタレー
ト、ポリ(エチレンテレフタレート/エチレンイソフタ
レート)共重合体、ポリ(ブチレンテレフタレート/ブ
チレンイソフタレート)共重合体等のポリアルキレンフ
タレート、ポリエチレンナフタレート、ポリブチレンナ
フタレート等のポリアルキレンナフタレート等が挙げら
れる。このうち本発明において好適に用いられるのは、
ポリエチレンテレフタレート、ポリブチレンテレフタレ
ート、ポリシクロヘキサンジメチレンテレフタレート等
のポリアルキレンテレフタレート、ポリエチレンナフタ
レート、ポリブチレンナフタレート等のポリアルキレン
ナフタレートであり、最も好適に用いられるのは、ポリ
エチレンテレフタレートとポリブチレンテレフタレート
である。本発明で用いられる芳香族ポリエステルの分子
量には特に制限はないが、通常フェノールとテトラクロ
ロエタンとの重量比1:1の混合溶媒を使用し濃度1g
/dlとし30℃で測定した極限粘度[η]が0.5〜
3.5の範囲であり、靱性及び成形性の点からより好ま
しくは0.7〜2.5の範囲である。The aromatic polyester resin in the present invention is a polyester having an aromatic ring in the main chain obtained by a condensation reaction of a dicarboxylic acid or its ester-forming derivative with a diol or its ester-forming derivative. Specific examples of the aromatic polyester raw material and the aromatic polyester are described in, for example, JP-A-5-2452.
As described in detail in JP-A-00-00, typical dicarboxylic acids as raw materials are terephthalic acid, isophthalic acid, 2,
Examples of the aromatic dicarboxylic acid such as 6-naphthalenedicarboxylic acid and the diol include ethylene glycol, 1,4-butanediol, cyclohexanedimethanol, cyclohexanediol, and long-chain glycol having a molecular weight of 400 to 6,000. Listed as typical aromatic polyesters are polyalkylene terephthalates such as polyethylene terephthalate, polybutylene terephthalate, polycyclohexane dimethylene terephthalate, poly (ethylene terephthalate / ethylene isophthalate) copolymers, poly (butylene terephthalate / butylene isophthalate). Examples include polyalkylene phthalates such as copolymers, polyethylene naphthalates, polyalkylene naphthalates such as polybutylene naphthalates, and the like. Among these, what is preferably used in the present invention is
Polyethylene terephthalate, polybutylene terephthalate, polycyclohexane dimethylene terephthalate and other polyalkylene terephthalates, polyethylene naphthalate, polybutylene naphthalate and other polyalkylene naphthalates, most preferably polyethylene terephthalate and polybutylene terephthalate is there. The molecular weight of the aromatic polyester used in the present invention is not particularly limited, but usually a mixed solvent of phenol and tetrachloroethane in a weight ratio of 1: 1 is used and the concentration is 1 g.
/ Dl and the intrinsic viscosity [η] measured at 30 ° C is 0.5 to
It is in the range of 3.5, and more preferably in the range of 0.7 to 2.5 in terms of toughness and moldability.
【0015】本発明におけるポリアリーレンスルフィド
樹脂としては、芳香族残基がチオエーテル結合を介して
結ばれた重合体であり加熱溶融できるものである。こう
した重合体構造の具体例と製造方法は例えば特開平5−
194851号公報に詳述されているが、本発明におい
て好適に用いられる主鎖構造は、ポリフェニレンスルフ
ィド(下記式b)、ポリフェニレンスルフィドスルホン
(下記式c)である。ここでPhはフェニレン基を、m
とnは各構造の繰り返しを意味する自然数であり式cに
おいてmとnで表される各繰り返し単位はランダム配列
あるいはブロックを構成する配列いずれであっても良
い。The polyarylene sulfide resin in the present invention is a polymer in which an aromatic residue is bonded through a thioether bond and is a resin which can be heated and melted. Specific examples of such a polymer structure and a production method are described in, for example, Japanese Patent Application Laid-Open No.
As described in detail in Japanese Patent Laid-Open No. 194851, the main chain structures preferably used in the present invention are polyphenylene sulfide (the following formula b) and polyphenylene sulfide sulfone (the following formula c). Here, Ph is a phenylene group, m
And n are natural numbers meaning repetition of each structure, and each repeating unit represented by m and n in the formula c may be either a random array or an array constituting a block.
【0016】[0016]
【化1】 −(−S−Ph−)n− (b) −(−S−Ph−)m−(−SO2 −Ph−)n− (c)## STR1 ## - (- S-Ph-) n- (b) - (- S-Ph-) m - (- SO 2 -Ph-) n- (c)
【0017】本発明に用いられるポリアリーレンスルフ
ィド樹脂の分子量に特に制限はないが、通常は重量平均
分子量にして10、000〜500、000の範囲であ
り、靱性及び成形性の点からより好ましくは30、00
0〜300、000の範囲である。該重量平均分子量は
ゲルパーミエーションクロマトグラフィ(GPC)によ
り求めることができ、例えばポリフェニレンスルフィド
の場合には1−クロロナフタレンを展開溶媒として用い
ることができる。The molecular weight of the polyarylene sulfide resin used in the present invention is not particularly limited, but it is usually in the range of 10,000 to 500,000 in terms of weight average molecular weight, and more preferably from the viewpoint of toughness and moldability. 30,00
It is in the range of 0 to 300,000. The weight average molecular weight can be determined by gel permeation chromatography (GPC), and for example, in the case of polyphenylene sulfide, 1-chloronaphthalene can be used as a developing solvent.
【0018】本発明における酸変性ポリオレフィン樹脂
としては、ポリオレフィン骨格、例えばポリエチレン、
ポリプロピレン、エチレン−プロピレン共重合体、エチ
レン−ブテン共重合体、ポリイソプレン、エチレン−イ
ソプレン共重合体等にカルボキシル基含有化合物ををグ
ラフト、又は不飽和カルボン酸類を共重合したしたもの
である。カルボキシル基含有化合物のグラフトは公知の
方法、例えば有機過酸化物の存在下不飽和カルボン酸及
び/又はその無水物を溶融混合して行われる。好適な不
飽和カルボン酸としては無水マレイン酸、マレイン酸、
フマル酸、イタコン酸、アクリル酸、メタクリル酸、ク
ロトン酸等が挙げられる。本第一発明において好適に用
いられるポリオレフィン骨格としては靱性と剛性のバラ
ンスからポリエチレン、ポリプロピレン、エチレン−プ
ロピレン共重合体、エチレン−ブテン共重合体が挙げら
れる。また製造の容易性から好ましいカルボキシル基の
導入方法は、有機過酸化物存在下での無水マレイン酸の
溶融混合によるグラフト反応である。例えば無水マレイ
ン酸のグラフトの場合、グラフト量は未反応無水マレイ
ン酸をアセトン等の適切な溶剤で抽出除去した後赤外吸
収スペクトル(IR)によりカルボキシル基由来の吸収
強度の定量により決定でき、通常0.01〜0.8重量
%、反応性の点から好適には0.03〜0.8重量%、
架橋や分子鎖切断等のポリオレフィン骨格の変質を抑制
する観点から更に好適には0.03〜0.6重量%、最
も好適には0.05〜0.5重量%である。As the acid-modified polyolefin resin in the present invention, a polyolefin skeleton such as polyethylene,
Polypropylene, ethylene-propylene copolymer, ethylene-butene copolymer, polyisoprene, ethylene-isoprene copolymer and the like are grafted with a carboxyl group-containing compound or copolymerized with unsaturated carboxylic acids. The grafting of the carboxyl group-containing compound is carried out by a known method, for example, by melt mixing an unsaturated carboxylic acid and / or its anhydride in the presence of an organic peroxide. Suitable unsaturated carboxylic acids include maleic anhydride, maleic acid,
Examples include fumaric acid, itaconic acid, acrylic acid, methacrylic acid, crotonic acid and the like. Examples of the polyolefin skeleton preferably used in the first invention include polyethylene, polypropylene, ethylene-propylene copolymer, and ethylene-butene copolymer in terms of balance between toughness and rigidity. The method of introducing a carboxyl group which is preferable from the viewpoint of ease of production is a graft reaction by melt mixing maleic anhydride in the presence of an organic peroxide. For example, in the case of maleic anhydride grafting, the grafted amount can be determined by quantitatively determining the absorption intensity derived from the carboxyl group by infrared absorption spectrum (IR) after extracting and removing unreacted maleic anhydride with a suitable solvent such as acetone, 0.01 to 0.8% by weight, preferably 0.03 to 0.8% by weight from the viewpoint of reactivity,
The content is more preferably 0.03 to 0.6% by weight, and most preferably 0.05 to 0.5% by weight from the viewpoint of suppressing deterioration of the polyolefin skeleton such as crosslinking and molecular chain cutting.
【0019】本発明における芳香族ポリカーボネート樹
脂としては、多価フェノール類を共重合成分として含有
しても良い1種以上のビスフェノール類と、ビスアルキ
ルカーボネート、ビスアリールカーボネート、ホスゲン
等の炭酸エステル類との反応により製造される。ビスフ
ェノール類としては、具体的にはビス(4−ヒドロキシ
フェニル)メタン、1,1−ビス(4−ヒドロキシフェ
ニル)エタン、1,1−ビス(4−ヒドロキシフェニ
ル)プロパン、2,2−)プロパン、2,2−ビス(4
−ヒドロキシフェニル)プロパンすなわちビスフェノー
ルA、2,2−ビス(4−ヒドロキシフェニル)ブタ
ン、2,2−ビス(4−ヒドロキシフェニル)ペンタ
ン、2,2−ビス(4−ヒドロキシフェニル)−3−メ
チルブタン、2,2−ビス(4−ヒドロキシフェニル)
ヘキサン、2,2−ビス(4−ヒドロキシフェニル)−
4−メチルペンタン、1,1−ビス(4−ヒドロキシフ
ェニル)As the aromatic polycarbonate resin in the present invention, one or more kinds of bisphenols which may contain polyhydric phenols as a copolymerization component, and carbonic acid esters such as bisalkyl carbonate, bisaryl carbonate and phosgene. It is produced by the reaction of. Specific examples of bisphenols include bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 1,1-bis (4-hydroxyphenyl) propane, 2,2-) propane. , 2,2-bis (4
-Hydroxyphenyl) propane or bisphenol A, 2,2-bis (4-hydroxyphenyl) butane, 2,2-bis (4-hydroxyphenyl) pentane, 2,2-bis (4-hydroxyphenyl) -3-methylbutane , 2,2-bis (4-hydroxyphenyl)
Hexane, 2,2-bis (4-hydroxyphenyl)-
4-methylpentane, 1,1-bis (4-hydroxyphenyl)
【0020】シクロペンタン、1,1−ビス(4−ヒド
ロキシフェニル)シクロヘキサン、ビス(4−ヒドロキ
シ−3−メチルフェニル)メタン、ビス(4−ヒドロキ
シ−3−メチルフェニル)フェニルメタン、1,1−ビ
ス(4−ヒドロキシ−3−メチルフェニル)エタン、
2,2−ビス(4−ヒドロキシ−3−メチルフェニル)
プロパン、2,2−ビス(4−ヒドロキシ−3−エチル
フェニル)プロパン、2,2−ビス(4−ヒドロキシ−
3−イソプロピルフェニル)プロパン、2,2−ビス
(4−ヒドロキシ−3−sec-ブチルフェニル)プロ
パン、2,2−ビス(4−ヒドロキシ−3−sec-ブ
チルフェニル)プロパン、ビス(4−ヒドロキシフェニ
ル)フェニルメタン、1,1−ビス(4−ヒドロキシフ
ェニル)−1−フェニルエタン、1,1−ビス(4−ヒ
ドロキシフェニル)−1−フェニルプロパン、ビス(4
−ヒドロキシフェニル)ジフェニルメタン、ビス(4−
ヒドロキシフェニル)ジベンジルメタン、4,4’−ジ
ヒドロキシジフェニルエーテル、Cyclopentane, 1,1-bis (4-hydroxyphenyl) cyclohexane, bis (4-hydroxy-3-methylphenyl) methane, bis (4-hydroxy-3-methylphenyl) phenylmethane, 1,1- Bis (4-hydroxy-3-methylphenyl) ethane,
2,2-bis (4-hydroxy-3-methylphenyl)
Propane, 2,2-bis (4-hydroxy-3-ethylphenyl) propane, 2,2-bis (4-hydroxy-)
3-isopropylphenyl) propane, 2,2-bis (4-hydroxy-3-sec-butylphenyl) propane, 2,2-bis (4-hydroxy-3-sec-butylphenyl) propane, bis (4-hydroxy) Phenyl) phenylmethane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 1,1-bis (4-hydroxyphenyl) -1-phenylpropane, bis (4
-Hydroxyphenyl) diphenylmethane, bis (4-
Hydroxyphenyl) dibenzylmethane, 4,4′-dihydroxydiphenyl ether,
【0021】4,4’−ジヒドロキシジフェニルスルホ
ン、4,4’−ジヒドロキシジフェニルスルフィド、
4,4’−ジヒドロキシベンゾフェノン、フェノールフ
タレイン等が挙げられる。この中で代表的なものは、ビ
スフェノールA、1,1−ビス(4−ヒドロキシフェニ
ル)−1−フェニルエタン、1,1−ビス(4−ヒドロ
キシフェニル)シクロヘキサン、2,2−ビス(4−ヒ
ドロキシ−3−メチルフェニル)プロパン等であり、最
も一般的にはビスフェノールAが用いられる。多価フェ
ノール類は、芳香族ポリカーボネート樹脂のレオロジー
的性質を変化させたり表面摩耗特性を改良する目的で共
重合成分として用いられ、例えば1,1,1−トリス
(4−ヒドロキシフェニル)エタ 等のトリスフェノー
ル類等が挙げられる。本発明に使用される芳香族ポリカ
ーボネート樹脂の製造方法に制限はないが、ビスフェノ
ール類のアルカリ金属塩と求核攻撃に活性な炭酸エステ
ル誘導体とを原料とし生成ポリマーを溶解する有機溶剤
とアルカリ水との界面にて重縮合反応させる界面重合
法、ビスフェノール類と求核攻撃に活性な炭酸エステル
誘導体とを原料としピリジン等の有機塩基中で重縮合反
応させるピリジン法、ビスフェノール類とビスアルキル
カーボネートやビスアリールカーボネート等の炭酸エス
テルとを原料とし溶融重縮合させる溶融重合法が一般に
知られている。ここで界面重合法とピリジン法で用いら
れる求核攻撃に活性な炭酸エステル誘導体としては、ホ
スゲン、カルボジイミダゾール等が挙げられ、中でもホ
スゲンが入手容易性から最も一般的である。溶融重合法
に用いられる炭酸エステルの具体例については、例えば
特願平4−214282号等に詳しく記載されている通
りであるが、好適なものはジメチルカーボネート、ジエ
チルカーボネート等のジアルキルカーボネート、ジフェ
ニルカーボネート等のジアリールカーボネートである。
本発明で用いられる芳香族ポリカーボネート樹脂の分子
量には特に制限はないが、通常は40℃のテトラヒドロ
フラン(THF)溶媒によるゲルパーミエーションクロ
マトグラフィ(GPC)において、単分子量分散ポリス
チレンを対照としての重量平均分子量Mw が15、00
0以上、靱性や成形容易性から好ましくは20、000
〜80、000程度が適当である。4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxydiphenyl sulfide,
4,4'-dihydroxybenzophenone, phenolphthalein and the like can be mentioned. Typical of these are bisphenol A, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, 1,1-bis (4-hydroxyphenyl) cyclohexane, 2,2-bis (4-). Hydroxy-3-methylphenyl) propane and the like, and most commonly bisphenol A is used. Polyhydric phenols are used as a copolymerization component for the purpose of changing the rheological properties of aromatic polycarbonate resins and improving the surface wear properties. For example, 1,1,1-tris (4-hydroxyphenyl) ethane and the like are used. Examples thereof include trisphenols. The method for producing the aromatic polycarbonate resin used in the present invention is not limited, but an organic solvent and an alkaline water which dissolve the produced polymer from an alkali metal salt of bisphenol and a carbonate derivative active in nucleophilic attack as raw materials Interfacial polymerization method of polycondensation reaction at the interface of bisphenols, pyridine method of polycondensation reaction of bisphenols and carbonic acid ester derivative active in nucleophilic attack in organic base such as pyridine, bisphenols and bisalkyl carbonate or bis A melt polymerization method in which a carbonic acid ester such as an aryl carbonate is used as a raw material and melt polycondensation is generally known. Examples of the carbonic acid ester derivative active in the nucleophilic attack used in the interfacial polymerization method and the pyridine method include phosgene and carbodiimidazole. Among them, phosgene is the most common because it is easily available. Specific examples of the carbonic acid ester used in the melt polymerization method are as described in detail in, for example, Japanese Patent Application No. 4-214282, and preferred examples are dialkyl carbonates such as dimethyl carbonate and diethyl carbonate, and diphenyl carbonate. And the like diaryl carbonate.
The molecular weight of the aromatic polycarbonate resin used in the present invention is not particularly limited, but usually, in gel permeation chromatography (GPC) with a solvent of tetrahydrofuran (THF) at 40 ° C., the weight average molecular weight of polystyrene with a single molecular weight as a control is used. Mw is 15,000
0 or more, preferably 20,000 from the viewpoint of toughness and moldability.
Approximately 80,000 is suitable.
【0022】本発明の熱可塑性樹脂組成物においては、
反応性熱可塑性樹脂を2種以上含んでいても良く、また
反応性官能基と反応しない熱可塑性樹脂等を含んでいて
もよい。熱可塑性樹脂組成物における熱可塑性樹脂マト
リックス中の反応性熱可塑性樹脂の総含量は通常30〜
100重量%、剛性の向上の点から好ましくは50〜1
00重量%、更に好ましくは60〜100重量%であ
る。In the thermoplastic resin composition of the present invention,
Two or more reactive thermoplastic resins may be contained, and a thermoplastic resin that does not react with a reactive functional group may be contained. The total content of the reactive thermoplastic resin in the thermoplastic resin matrix in the thermoplastic resin composition is usually 30-.
100% by weight, preferably 50 to 1 from the viewpoint of improving rigidity
The amount is 00% by weight, more preferably 60 to 100% by weight.
【0023】上記熱可塑性樹脂マトリックスにおける反
応性熱可塑性樹脂以外の熱可塑性樹脂としては、本発明
の目的を損なわない限りにおいて必要に応じて任意の熱
可塑性樹脂や熱可塑性エラストマーを用いることがで
き、例えばポリエチレン樹脂、ポリプロピレン樹脂、ポ
リスチレン樹脂、ポリアミド樹脂、芳香族ポリエステル
樹脂、芳香族ポリカーボネート樹脂、ポリアリレート樹
脂、ABS樹脂、ポリフェニレンエーテル樹脂、ポリア
リーレンスルフィド樹脂、エポキシ樹脂、フェノキシ樹
脂、無水マレイン酸を共重合したポリスチレン樹脂、エ
ポキシ基を有する化合物で変性されたポリスチレン樹
脂、芳香族ホ゜リカーホ゛ネート-ホ゜リシロキサン共重合体、エチレン−
αオレフィン共重合体、イソプレンゴム、ブタジエンゴ
ム、ポリスチレン−ポリブタジエンブロック共重合体
(SBS)、ポリスチレン−水素添加ポリブタジエンブ
ロック共重合体(SEBS)、ポリスチレン−ポリ(エ
チレン−プロピレン)ブロック共重合体(SEP)、ポ
リアミドエラストマー、ポリエステルエラストマー、酸
無水物基またはエポキシ基を有する化合物で変性された
SBS、SEBS、SEP等のスチレン系熱可塑性エラ
ストマー、アクリルゴム、コア−シェル型アクリルゴ
ム、MBSゴム等が挙げられる。As the thermoplastic resin other than the reactive thermoplastic resin in the thermoplastic resin matrix, any thermoplastic resin or thermoplastic elastomer can be used as needed as long as the object of the present invention is not impaired. For example, polyethylene resin, polypropylene resin, polystyrene resin, polyamide resin, aromatic polyester resin, aromatic polycarbonate resin, polyarylate resin, ABS resin, polyphenylene ether resin, polyarylene sulfide resin, epoxy resin, phenoxy resin, maleic anhydride are used together. Polymerized polystyrene resin, polystyrene resin modified with an epoxy group-containing compound, aromatic polycarbonate-polysiloxane copolymer, ethylene-
α-olefin copolymer, isoprene rubber, butadiene rubber, polystyrene-polybutadiene block copolymer (SBS), polystyrene-hydrogenated polybutadiene block copolymer (SEBS), polystyrene-poly (ethylene-propylene) block copolymer (SEP) ), Polyamide elastomers, polyester elastomers, styrene-based thermoplastic elastomers such as SBS, SEBS, and SEP modified with a compound having an acid anhydride group or an epoxy group, acrylic rubber, core-shell type acrylic rubber, MBS rubber, and the like. To be
【0024】本発明における陽イオン交換性層状珪酸塩
としては、Al、Mg、Li等を含む八面体シート構造
を2枚のSO4 四面体シート構造がはさんだ形の2:1
型が好適でありその単位構造である1層の厚みは通常
9.5オングストローム程度である。具体的には、モン
モリロナイト、ヘクトライト、フッ素ヘクトライト、サ
ポナイト、バイデライト、スチブンサイト等のスメクタ
イト系粘土鉱物、Li型フッ素テニオライト、Na型フ
ッ素テニオライト、Na型四珪素フッ素雲母、Li型四
珪素フッ素雲母等の膨潤性合成雲母、バーミキュライ
ト、フッ素バーミキュライト、ハロイサイト等が挙げら
れ、天然のものでも合成されたものでも良い。As the cation-exchange layered silicate in the present invention, a 2: 1 structure in which an octahedral sheet structure containing Al, Mg, Li and the like is sandwiched between two SO 4 tetrahedral sheet structures is used.
A mold is preferable, and the thickness of one layer which is a unit structure thereof is usually about 9.5 angstrom. Specifically, smectite clay minerals such as montmorillonite, hectorite, fluorohectorite, saponite, beidellite, and stevensite, Li-type fluoroteniolite, Na-type fluoroteniolite, Na-type tetrasilicon-fluorine mica, Li-type tetrasilicon-fluorine mica, etc. Examples of the swelling synthetic mica, vermiculite, fluorine vermiculite, halloysite, etc. may be natural or synthetic.
【0025】これらの陽イオン交換性層状珪酸塩の陽イ
オン交換容量(CEC)は通常30ミリ当量/100g
以上とするが、好適には50ミリ当量/100g以上、
さらに好適には70ミリ当量/100g以上であるのが
望ましい。陽イオン交換容量は、メチレンブルーの吸着
量測定により求めることで測定される。陽イオン交換容
量が30ミリ当量/100g未満では、層間への有機オ
ニウムイオンのインターカレーション量が不十分となり
熱可塑性樹脂への分散性が低下し、熱可塑性樹脂組成物
の強度や剛性の上昇が十分でなく成形表面外観も悪くな
る。陽イオン交換容量や入手容易性からこれらの層状珪
酸塩の中でも、モンモリロナイト、ヘクトライト等のス
メクタイト系粘土鉱物、Li型フッ素テニオライト、N
a型フッ素テニオライト、Na型四珪素フッ素雲母等の
膨潤性合成雲母が好適に用いられ、特に入手容易性から
はベントナイトを精製して得られるモンモリロナイト
が、純度の点ではLi型フッ素テニオライト(下記式
d)、Na型フッ素テニオライト(下記式e)、Na型
四珪素フッ素雲母(下記式f)等の膨潤性フッ素雲母が
本発明には最適である。なお、式d,e,fは理想的な
組成を示したものであり、厳密に一致している必要はな
い。The cation exchange capacity (CEC) of these cation-exchange layered silicates is usually 30 meq / 100 g.
However, preferably 50 meq / 100 g or more,
More preferably, it is 70 meq / 100 g or more. The cation exchange capacity is measured by determining the amount of methylene blue adsorbed. If the cation exchange capacity is less than 30 meq / 100 g, the intercalation amount of the organic onium ion between layers becomes insufficient, the dispersibility in the thermoplastic resin decreases, and the strength and rigidity of the thermoplastic resin composition increase. Is not sufficient and the appearance of the molded surface is also poor. Among these layered silicates due to their cation exchange capacity and availability, smectite clay minerals such as montmorillonite and hectorite, Li-type fluorine teniolite, N
Swelling synthetic mica such as a-type fluorine teniolite and Na-type tetrasilicon fluorine mica is preferably used, and in particular, montmorillonite obtained by refining bentonite is easy to obtain, in terms of purity, Li-type fluorine teniolite (the following formula: d), swelling fluoromica such as Na-type fluoroteniolite (the following formula e) and Na-type tetrasilicon fluoromica (the following formula f) are most suitable for the present invention. The expressions d, e, and f show ideal compositions, and it is not necessary that they exactly match.
【0026】[0026]
【化2】 LiMg2 Li(Si4 O10)F2 (d) NaMg2 Li(Si4 O10)F2 (e) NaMg2.5 (Si4 O10)F2 (f)Embedded image LiMg 2 Li (Si 4 O 10 ) F 2 (d) NaMg 2 Li (Si 4 O 10 ) F 2 (e) NaMg 2.5 (Si 4 O 10 ) F 2 (f)
【0027】本発明における反応性官能基を有する層状
珪酸塩及び反応性官能基を有する陽イオン交換性層状珪
酸塩は、層状珪酸塩に含まれるシラノール基(−Si−
OH)との反応性を有する構造とアミノ基、エポキシ
基、カルボキシル基、メルカプト基等の反応性官能基と
を兼備する化合物(以下、官能化試剤と称する)を層状
珪酸塩に接触させることにより製造される。The layered silicate having a reactive functional group and the cation exchange layered silicate having a reactive functional group in the present invention are silanol groups (-Si-) contained in the layered silicate.
By contacting a layered silicate with a compound (hereinafter, referred to as a functionalizing agent) having both a structure having reactivity with OH) and a reactive functional group such as an amino group, an epoxy group, a carboxyl group, and a mercapto group Manufactured.
【0028】シラノール基との反応性を有する構造とし
て、下記一般式gで示される塩素−珪素結合、臭素−珪
素結合、沃素−珪素結合等のハロゲン−珪素結合、下記
一般式hで示されるアルコキシ−ホウ素結合、アルコキ
シ−アルミニウム結合、アルコキシ−珪素結合、アルコ
キシ−チタン結合、アルコキシ−ゲルマニウム結合、ア
ルコキシ−ジルコニウム結合、アルコキシ−スズ結合、
アルコキシ−鉛結合等の加水分解性を有する酸素−金属
結合、下記一般式iで示される珪素−窒素−珪素結合等
を有するものが挙げられる。As a structure having reactivity with a silanol group, a halogen-silicon bond such as a chlorine-silicon bond, a bromine-silicon bond or an iodine-silicon bond represented by the following general formula g, and an alkoxy represented by the following general formula h. -Boron bond, alkoxy-aluminum bond, alkoxy-silicon bond, alkoxy-titanium bond, alkoxy-germanium bond, alkoxy-zirconium bond, alkoxy-tin bond,
Examples thereof include a hydrolyzable oxygen-metal bond such as an alkoxy-lead bond and a silicon-nitrogen-silicon bond represented by the following general formula i.
【0029】[0029]
【化3】 X−Si (g) R−O−M (h) Si−HN−Si (i)Embedded image X—Si (g) R—O—M (h) Si—HN—Si (i)
【0030】ここで、式gのXはハロゲン原子を、式h
のRは、通常炭素数6以下のアルキル基、好ましくは炭
素数4以下のアルキル基、更に好ましくはメチル基又は
エチル基を、Mはホウ素、アルミニウム、珪素、チタ
ン、ゲルマニウム、ジルコニウム、スズ、鉛のいずれか
の元素を表す。これらの構造のうち、構造の安定性、取
扱いの容易性、経済性の点からは、塩素−珪素結合、ア
ルコキシ−珪素結合、珪素−窒素−珪素結合が好まし
く、アルコキシ−珪素結合が最も好ましい。Here, X in the formula g represents a halogen atom, and X in the formula h
R is usually an alkyl group having 6 or less carbon atoms, preferably an alkyl group having 4 or less carbon atoms, more preferably a methyl group or an ethyl group, and M is boron, aluminum, silicon, titanium, germanium, zirconium, tin or lead. Represents one of the elements. Among these structures, a chlorine-silicon bond, an alkoxy-silicon bond, and a silicon-nitrogen-silicon bond are preferable, and an alkoxy-silicon bond is most preferable, from the viewpoints of structural stability, easy handling, and economical efficiency.
【0031】こうした構造を有する官能化試剤の具体例
としては、塩素−珪素結合を有するものとしては、3−
グリシジルオキシプロピルジメチルクロロシラン、β−
(3、4−エポキシシクロヘキシル)エチルジメチルク
ロロシラン、3−グリシジルオキシプロピルトリクロロ
シラン等のエポキシ基を有するクロロシラン類、トリク
ロロシリル酢酸、3−トリクロロシリルプロピオン酸、
5−カルボキシヘキシルジメチルクロロシラン等のカル
ボキシル基を有するクロロシラン類、3−メルカプトプ
ロピルジメトリクロロシラン、3−メルカプトプロピル
トリクロロシラン、4−メルカプトフェニルジメチルク
ロロシラン等のメルカプト基を有するクロロシラン類、
3−メタクリロキシプロピルジメチルクロロシラン、ジ
メチルビニルクロロシラン、アリルジメチルクロロシラ
ン、5−ヘキセニルジメチルクロロシラン、7−オクテ
ニルジメチルクロロシラン、4−ビニルフェニルジメチ
ルクロロシラン、ビニルトリクロロシラン、アリルトリ
クロロシラン、3−メタクリロキシプロピルトリクロロ
シラン等の炭素−炭素不飽和結合を有するクロロシラン
類、3−ニトロプロピルジメチルクロロシラン、4−ニ
トロフェニルジメチルクロロシラン、3−ニトロプロピ
ルトリクロロシラン等のニトロ基を有するクロロシラン
類等が挙げられる。アルコキシ酸素−珪素結合を有する
ものとしては、3−アミノプロピルトリエトキシシラ
ン、N−(2−アミノエチル)−3−アミノプロピルト
リメトキシシラン、N−(2−アミノエチル)−3−ア
ミノプロピルメチルジメトキシシラン等のアミノ基を有
するアルコキシシラン類、3−グリシジルオキシプロピ
ルトリメトキシシラン、3−グリシジルオキシプロピル
メチルジエトキシシラン、β−(3,4−エポキシシク
ロヘキシル)エチルトリメトキシシラン等のエポキシ基
を有するアルコキシシラン類、3−メルカプトプロピル
トリメトキシシラン、3−メルカプトプロピルメチルジ
エトキシシラン等のメルカプト基を有するアルコキシシ
ラン類、トリス(2−メトキシエトキシ)ビニルシラ
ン、ビニルトリエトキシシラン、ビニルトリメトキシシ
ラン、3−メタクリロキシプロピルトリメトキシシラ
ン、ビニルメチルジエトキシシラン等の炭素−炭素不飽
和結合を有するアルコキシシラン類、3−ニトロプロピ
ルトリエトキシシラン、3−ニトロプロピルトリメトキ
シシラン等のニトロ基を有するアルコキシシラン類、テ
トラエトキシシラン等のテトラアルコキシシラン類等が
挙げられる。珪素−窒素−珪素結合を有するものとして
は、1,3−ビス(3−アミノプロピル)−1,1,
3,3−テトラメチルジシラザン、1,3−ビス(3−
グリシジルオキシプロピル)−1,1,3,3−テトラ
メチルジシラザン、1,3−ビス(3−メルカプトプロ
ピル)−1,1,3,3−テトラメチルジシラザン、
1,3−ジビニル−1,1,3,3−テトラメチルジシ
ラザン等のジシラザン類が挙げられる。Specific examples of the functionalizing agent having such a structure include those having a chlorine-silicon bond, and 3-
Glycidyloxypropyl dimethylchlorosilane, β-
Chlorosilanes having an epoxy group such as (3,4-epoxycyclohexyl) ethyldimethylchlorosilane, 3-glycidyloxypropyltrichlorosilane, trichlorosilylacetic acid, 3-trichlorosilylpropionic acid,
Chlorosilanes having a carboxyl group such as 5-carboxyhexyldimethylchlorosilane, mercapto group-containing chlorosilanes such as 3-mercaptopropyldimetrichlorosilane, 3-mercaptopropyltrichlorosilane and 4-mercaptophenyldimethylchlorosilane,
3-methacryloxypropyldimethylchlorosilane, dimethylvinylchlorosilane, allyldimethylchlorosilane, 5-hexenyldimethylchlorosilane, 7-octenyldimethylchlorosilane, 4-vinylphenyldimethylchlorosilane, vinyltrichlorosilane, allyltrichlorosilane, 3-methacryloxypropyltrisilane Examples thereof include chlorosilanes having a carbon-carbon unsaturated bond such as chlorosilane, nitrosilanes having a nitro group such as 3-nitropropyldimethylchlorosilane, 4-nitrophenyldimethylchlorosilane, and 3-nitropropyltrichlorosilane. As those having an alkoxy oxygen-silicon bond, 3-aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropylmethyl Epoxy groups such as alkoxysilanes having an amino group such as dimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropylmethyldiethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, etc. Alkoxysilanes having, mercapto group-containing alkoxysilanes such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropylmethyldiethoxysilane, tris (2-methoxyethoxy) vinylsilane, vinyltriethoxysilane, and vinylto Alkoxysilanes having a carbon-carbon unsaturated bond such as methoxysilane, 3-methacryloxypropyltrimethoxysilane and vinylmethyldiethoxysilane, and nitro groups such as 3-nitropropyltriethoxysilane and 3-nitropropyltrimethoxysilane. And alkoxysilanes such as tetraethoxysilane and the like. As those having a silicon-nitrogen-silicon bond, 1,3-bis (3-aminopropyl) -1,1,
3,3-tetramethyldisilazane, 1,3-bis (3-
Glycidyloxypropyl) -1,1,3,3-tetramethyldisilazane, 1,3-bis (3-mercaptopropyl) -1,1,3,3-tetramethyldisilazane,
Examples of the disilazanes include 1,3-divinyl-1,1,3,3-tetramethyldisilazane.
【0032】これらの官能化試剤の層状珪酸塩への接触
方法には特に制限はないが、通常無溶媒あるいは極性溶
媒中での混合により行われ、該試剤の導入効率を向上さ
せる目的で混合温度を上昇させると好ましい場合もあ
る。またいずれの場合も官能化試剤の加水分解の過度の
進行を防ぐためには無水条件とするのが望ましい。極性
溶媒を用いる場合には、官能化試剤に含まれる熱可塑性
樹脂との反応性官能基が影響を受けにくい不活性な極性
溶媒を選択することが好ましい。このような好ましい極
性溶媒としては、ジメチルホルムアミド(DMF)、ジ
メチルアセトアミド(DMA)、N−メチルピロリドン
(NMP)等のアミド系溶剤、ジメチルスルホキシド
(DMSO)のようなスルホキシド類、テトラヒドロフ
ラン、1,4−ジオキサン等の環状エーテル類等が一般
に用いられ、官能化試剤がカルボキシル基のような酸性
基を持たない場合には更にピリジン、2−メチルピリジ
ン、3−メチルピリジン、4−メチルピリジン等のメチ
ルピリジン類、2,3−ジメチルピリジン、2,4−ジ
メチルピリジン、2,5−ジメチルピリジン、3,4−
ジメチルピリジン等のジメチルピリジン類、N,N−ジ
メチルアミノピリジン、N,N−ジエチルアミノピリジ
ン等のジアルキルアミノピリジン類、キノリン、The method of contacting these functionalized agents with the layered silicate is not particularly limited, but it is usually carried out by mixing without solvent or in a polar solvent, and the mixing temperature is used for the purpose of improving the introduction efficiency of the agent. In some cases it may be preferable to increase. In any case, anhydrous conditions are desirable in order to prevent excessive hydrolysis of the functionalizing agent. When a polar solvent is used, it is preferable to select an inert polar solvent in which the functional group reactive with the thermoplastic resin contained in the functionalizing agent is not easily affected. Such preferable polar solvents include amide solvents such as dimethylformamide (DMF), dimethylacetamide (DMA), N-methylpyrrolidone (NMP), sulfoxides such as dimethylsulfoxide (DMSO), tetrahydrofuran, 1,4 -Cyclic ethers such as dioxane are generally used, and when the functionalizing agent does not have an acidic group such as a carboxyl group, methyl groups such as pyridine, 2-methylpyridine, 3-methylpyridine and 4-methylpyridine are further used. Pyridines, 2,3-dimethylpyridine, 2,4-dimethylpyridine, 2,5-dimethylpyridine, 3,4-
Dimethylpyridines such as dimethylpyridine, dialkylaminopyridines such as N, N-dimethylaminopyridine and N, N-diethylaminopyridine, quinoline,
【0033】イソキノリン等のキノリン類等の複素環式
含窒素化合物も使用できる。これらのうち官能化試剤の
導入効率の点で、DMF、DMAのようなアミド系溶
剤、及びDMSOが好適に用いられる。これらの極性溶
媒を用いると、層状珪酸塩の膨潤が起こり官能化試剤の
導入効率が向上する場合があるが、過度に激しい条件、
例えば150℃以上の高温での長時間の混合では反応性
官能基の分解等の悪影響が見られる場合がある。通常
は、混合温度を室温〜120℃程度、反応時間を30分
〜48時間程度、好ましくは1時間〜24時間程度とす
る。官能化試剤と層状珪酸塩の接触方法としては、極性
溶媒中での撹拌翼による懸濁撹拌、無溶媒での各種ミ
ル、各種ミキサー等による機械的撹拌混合、無溶媒含浸
後のロールによる圧縮接触等が例示できる。なお、これ
ら官能化試剤は単独でも2種以上を組み合わせても使用
できる。Heterocyclic nitrogen-containing compounds such as quinolines such as isoquinoline can also be used. Among these, amide solvents such as DMF and DMA, and DMSO are preferably used in terms of the introduction efficiency of the functionalizing agent. When these polar solvents are used, swelling of the layered silicate may occur and the introduction efficiency of the functionalizing agent may be improved, but under extremely severe conditions,
For example, when mixing at a high temperature of 150 ° C. or higher for a long time, adverse effects such as decomposition of reactive functional groups may be observed. Usually, the mixing temperature is about room temperature to 120 ° C., and the reaction time is about 30 minutes to 48 hours, preferably about 1 hour to 24 hours. The functionalizing agent and the layered silicate can be contacted with each other by suspension stirring in a polar solvent with a stirring blade, mechanical stirring and mixing with various mills without solvent, various mixers, etc., and compression contact with rolls after impregnation without solvent. Etc. can be illustrated. These functionalizing agents may be used alone or in combination of two or more.
【0034】本発明における有機オニウムイオンとして
は、アンモニウムイオン、ホスホニウムイオン、スルホ
ニウムイオン、複素芳香環由来のオニウムイオンに代表
されるものである。本発明における該オニウムイオン構
造の役割は、負に帯電した珪酸塩層の層間に有機化合物
を導入するためのものであって、その種類には特に制限
はない。これらのうち入手容易性、安定性の観点から
は、アンモニウムイオン、ホスホニウムイオン、複素芳
香環由来のオニウムイオンが好適である。The organic onium ion in the present invention is represented by ammonium ion, phosphonium ion, sulfonium ion and onium ion derived from a heteroaromatic ring. The role of the onium ion structure in the present invention is to introduce an organic compound between the layers of the negatively charged silicate layer, and the kind thereof is not particularly limited. Of these, ammonium ions, phosphonium ions and onium ions derived from a heteroaromatic ring are preferable from the viewpoints of easy availability and stability.
【0035】アンモニウムイオンとしては、ドデシルア
ンモニウム、ヘキサデシルアンモニウム、オクタデシル
アンモニウム、[PEG]アンモニウム(以下[PE
G]はポリエチレングリコール鎖を表す)等の1級アン
モニウム、メチルドデシルアンモニウム、ブチルドデシ
ルアンモニウム、メチルオクタデシルアンモニウム、メ
チル[PEG]アンモニウム、ドデシル[PEG]アン
モニウム、ヘキサデシル[PEG]アンモニウム等の2
級アンモニウム、ジメチルドデシルアンモニウム、ジメ
チルヘキサデシルアンモニウム、ジメチルオクタデシル
アンモニウム、ジフェニルドデシルアンモニウム、ジフ
ェニルオクタデシルアンモニウム、ジメチル[PEG]
アンモニウム、メチルドデシル[PEG]アンモニウ
ム、メチルオクタデシル[PEG]アンモニム、メチル
ビス[PEG]アンモニウム、ドデシルビス[PEG]
アンモニウム、ヘキサデシルビス[PEG]アンモニウ
ム等の3級アンモニウム、テトラエチルアンモニウム、
テトラブチルアンモニウムテトラオクチルアンモニウム
等の同一のアルキル基を有する4級アンモニウム、トリ
メチルオクチルアンモニウム、トリメチルデシルアンモ
ニウム、トリメチルドデシルアンモニウム、トリメチル
テトラデシルアンモニウム、トリメチルヘキサデシルア
ンモニウム、トリメチルオクタデシルアンモニウム、ト
リメチルエイコサニルアンモニウム、トリメチルオクタ
デセニルアンモニウム、トリメチルオクタデカジエニル
アンモニウム等のトリメチルアルキルアンモニウム、ト
リエチルドデシルアンモニウム、トリエチルテトラデシ
ルアンモニウム、トリエチルヘキサデシルアンモニウ
ム、トリエチルオクタデシルアンモニウム等のトリエチ
ルアルキルアンモニウム、トリブチルドデシルアンモニ
ウム、トリブチルテトラデシルアンモニウム、トリブチ
ルヘキサデシルアンモニウム、トリブチルオクタデシル
アンモニウム等のトリブチルアルキルアンモニウム、ジ
メチルジオクチルアンモニウム、ジメチルジデシルアン
モニウム、ジメチルジテトラデシルアンモニウム、ジメ
チルジヘキサデシルアンモニウム、ジメチルジオクタデ
シルアンモニウム、ジメチルジオクタデセニルアンモニ
ウム、ジメチルジオクタデカジエニルアンモニウム等の
ジメチルジアルキルアンモニウム、ジエチルジドデシル
アンモニウム、ジエチルジテトラデシルアンモニウム、
ジエチルジヘキサデシルアンモニウム、ジエチルジオク
タデシルアンモニウム等のジエチルジアルキルアンモニ
ウム、ジブチルジドデシルアンモニウム、ジブチルジテ
トラデシルアンモニウム、ジブチルジヘキサデシルアン
モニウム、ジブチルジオクタデシルアンモニウム等のジ
ブチルジアルキルアンモニウム、メチルベンジルジヘキ
サデシルアンモニウム等のメチルベンジルジアルキルア
ンモニウム、ジベンジルジヘキサデシルアンモニウム等
のジベンジルジアルキルアンモニウム、トリオクチルメ
チルアンモニウム、トリドデシルメチルアンモニウム、
トリテトラデシルメチルアンモニウム等のトリアルキル
メチルアンモニウム、トリオクチルエチルアンモニウ
ム、トリドデシルエチルアンモニウム等のトリアルキル
エチルアンモニウム、トリオクチルブチルアンモニウ
ム、トリドデシルブチルアンモニウム等のトリアルキル
ブチルアンモニウム、トリメチルベンジルアンモニウム
等の芳香環を有する4級アンモニウム、トリメチルフェ
ニルアンモニウム等の芳香族アミン由来の4級アンモニ
ウム、下記式jで示される[PEG]含有4級アンモニ
ウム(式j及び式k中、As ammonium ions, dodecyl ammonium, hexadecyl ammonium, octadecyl ammonium, [PEG] ammonium (hereinafter [PE]
G] represents a polyethylene glycol chain) and the like, and 2 such as methyl dodecyl ammonium, butyl dodecyl ammonium, methyl octadecyl ammonium, methyl [PEG] ammonium, dodecyl [PEG] ammonium, hexadecyl [PEG] ammonium and the like.
Grade ammonium, dimethyl dodecyl ammonium, dimethyl hexadecyl ammonium, dimethyl octadecyl ammonium, diphenyl dodecyl ammonium, diphenyl octadecyl ammonium, dimethyl [PEG]
Ammonium, methyldodecyl [PEG] ammonium, methyloctadecyl [PEG] ammonium, methylbis [PEG] ammonium, dodecylbis [PEG]
Ammonium, tertiary ammonium such as hexadecylbis [PEG] ammonium, tetraethylammonium,
Quaternary ammonium having the same alkyl group such as tetrabutyl ammonium tetraoctyl ammonium, trimethyl octyl ammonium, trimethyl decyl ammonium, trimethyl dodecyl ammonium, trimethyl tetradecyl ammonium, trimethyl hexadecyl ammonium, trimethyl octadecyl ammonium, trimethyl eicosanyl ammonium, Trimethylalkylammonium such as trimethyloctadecenylammonium, trimethyloctadecadienylammonium, triethyldodecylammonium, triethyltetradecylammonium, triethylhexadecylammonium, triethylalkylammonium such as triethyloctadecylammonium, tributyldodecylammonium, tributyltedecammonium Tributylalkylammonium such as radecylammonium, tributylhexadecylammonium, tributyloctadecylammonium, dimethyldioctylammonium, dimethyldidecylammonium, dimethylditetradecylammonium, dimethyldihexadecylammonium, dimethyldioctadecylammonium, dimethyldioctadecenyl Ammonium, dimethyldialkylammonium such as dimethyldioctadecadienylammonium, diethyldidodecylammonium, diethylditetradecylammonium,
Diethyldialkylammonium such as diethyldihexadecylammonium, diethyldioctadecylammonium, dibutyldidodecylammonium, dibutylditetradecylammonium, dibutyldihexadecylammonium, dibutyldialkylammonium such as dibutyldioctadecylammonium, methylbenzyldihexadecylammonium, etc. Dibenzyldialkylammonium such as methylbenzyldialkylammonium, dibenzyldihexadecylammonium, trioctylmethylammonium, tridodecylmethylammonium,
Trialkylmethylammonium such as tritetradecylmethylammonium, trialkylethylammonium such as trioctylethylammonium, tridodecylethylammonium, trialkylbutylammonium such as trioctylbutylammonium, tridodecylbutylammonium, fragrance such as trimethylbenzylammonium A quaternary ammonium having a ring, a quaternary ammonium derived from an aromatic amine such as trimethylphenylammonium, a [PEG] -containing quaternary ammonium represented by the following formula j (in the formulas j and k,
【0036】R1 ,R2 は独立に炭素数18以下のアル
キル基を表し、m,n>1なる整数であり、2<m+n
<60、好ましくは10≦m+n<30である。)、具
体的にはジメチルビス[PEG]アンモニウム、ジエチ
ルビス[PEG]アンモニウム、ジブチルビス[PE
G]アンモニウム、メチルエチルビス[PEG]アンモ
ニウム、メチルドデシルビス[PEG]アンモニウム、
メチルオクタデシルビス[PEG]アンモニウム等のジ
アルキルビス[PEG]アンモニウム等のイオンが、ホ
スホニウムイオンとしては、テトラブチルホスホニウ
ム、テトラオクチルホスホニウム、トリメチルデシルホ
スホニウム、トリメチルドデシルホスホニウム、トリメ
チルヘキサデシルホスホニウム、トリメチルオクタデシ
ルホスホニウム,トリブチルドデシルホスホニウム、ト
リブチルヘキサデシルホスホニウム、トリブチルオクタ
デシルホスホニウム等のアルキル4級ホスホニウム、前
出の式kで表される[PEG]含有4級ホスホニウム、
具体的にはジメチルビス[PEG]ホスホニウム、ジエ
チルビス[PEG]ホスホニウム、ジブチルビス[PE
G]ホスホニウム、メチルエチルビス[PEG]ホスホ
ニウム、メチルドデシルビス[PEG]ホスホニウム、
メチルオクタデシルビス[PEG]ホスホニウム等のジ
アルキルビス[PEG]ホスホニウム等のイオンが、複
素芳香環由来のオニウムイオンとしては、ピリジニウ
ム、メチルピリジニウム、ジメチルピリジニウム、キノ
リニウム、イソキノリニウム等のイオンが挙げられる。R1 and R2 independently represent an alkyl group having 18 or less carbon atoms, m and n> 1, and 2 <m + n.
<60, preferably 10 ≦ m + n <30. ), Specifically, dimethylbis [PEG] ammonium, diethylbis [PEG] ammonium, dibutylbis [PE]
G] ammonium, methylethylbis [PEG] ammonium, methyldodecylbis [PEG] ammonium,
Ions such as dialkylbis [PEG] ammonium such as methyloctadecylbis [PEG] ammonium are tetrabutylphosphonium, tetraoctylphosphonium, trimethyldecylphosphonium, trimethyldodecylphosphonium, trimethylhexadecylphosphonium, trimethyloctadecylphosphonium, as phosphonium ions. Alkyl quaternary phosphonium such as tributyldodecylphosphonium, tributylhexadecylphosphonium and tributyloctadecylphosphonium, [PEG] -containing quaternary phosphonium represented by the above formula k,
Specifically, dimethylbis [PEG] phosphonium, diethylbis [PEG] phosphonium, dibutylbis [PE
G] phosphonium, methylethylbis [PEG] phosphonium, methyldodecylbis [PEG] phosphonium,
Ion such as dialkylbis [PEG] phosphonium such as methyloctadecylbis [PEG] phosphonium and the onium ion derived from the heteroaromatic ring include ions such as pyridinium, methylpyridinium, dimethylpyridinium, quinolinium and isoquinolinium.
【0037】[0037]
【化4】 [Chemical 4]
【0038】これらの有機オニウムイオンのうち珪酸塩
層間の疎水化に寄与する炭化水素構造の有効性の点か
ら、トリメチルドデシルアンモニウム、トリメチルテト
ラデシルアンモニウム、トリメチルヘキサデシルアンモ
ニウム、トリメチルオクタデシルアンモニウム、トリエ
チルドデシルアンモニウム、トリエチルテトラデシルア
ンモニウム、トリエチルヘキサデシルアンモニウム、ト
リエチルオクタデシルアンモニウム等の炭素数12以上
のアルキル基を1分子中に1つ有する4級アンモニウ
ム、ジメチルジドデシルアンモニウム、ジメチルジテト
ラデシルアンモニウム、ジメチルジヘキサデシルアンモ
ニウム、ジメチルジオクタデシルアンモニウム、ジエチ
ルジドデシルアンモニウム、ジエチルジテトラデシルア
ンモニウム、Among these organic onium ions, trimethyldodecylammonium, trimethyltetradecylammonium, trimethylhexadecylammonium, trimethyloctadecylammonium, and triethyldodecylammonium are considered in terms of the effectiveness of the hydrocarbon structure that contributes to the hydrophobicity between silicate layers. , Quaternary ammonium having one or more alkyl groups having 12 or more carbon atoms in one molecule such as triethyltetradecylammonium, triethylhexadecylammonium, triethyloctadecylammonium, dimethyldidodecylammonium, dimethylditetradecylammonium, dimethyldihexadecyl Ammonium, dimethyldioctadecyl ammonium, diethyl didodecyl ammonium, diethyl ditetradecyl ammonium,
【0039】ジエチルジヘキサデシルアンモニウム、ジ
エチルジオクタデシルアンモニウム等の炭素数12以上
のアルキル基を1分子中に2つ有する4級アンモニウ
ム、トリメチルドデシルホスホニウム、トリメチルヘキ
サデシルホスホニウム、トリメチルオクタデシルホスホ
ニウム、トリブチルドデシルホスホニウム、トリブチル
ヘキサデシルホスホニウム、トリブチルオクタデシルホ
スホニウム等の炭素数12以上のアルキル基を有する4
級ホスホニウム等のイオンが好適に用いられる。中で
も、トリメチルヘキサデシルアンモニウム、トリメチル
オクタデシルアンモニウム等の炭素数16以上のアルキ
ル基を1分子中に1つ有する4級アンモニウム、ジメチ
ルジテトラデシルアンモニウム、ジメチルジヘキサデシ
ルアンモニウム、ジメチルジオクタデシルアンモニウム
等の炭素数14以上のアルキル基を1分子中に2つ有す
る4級アンモニウム、トリメチルヘキサデシルホスホニ
ウム、トリメチルオクタデシルホスホニウム、トリブチ
ルヘキサデシルホスホニウム、トリブチルオクタデシル
ホスホニウム等の炭素数14以上のアルキル基を有する
4級ホスホニウム等のイオンが本発明の樹脂組成物の靱
性保持と入手容易性の観点から更に好適に用いられ、最
も好適にはトリメチルオクタデシルアンモニウムイオ
ン、ジメチルジヘキサデシルアンモニウムイオン、ジメ
チルジオクタデシルアンモニウムイオン、トリブチルヘ
キサデシルホスホニウムイオン、トリブチルオクタデシ
ルホスホニウムイオンが用いられる。また、樹脂マトリ
ックスがポリアミド樹脂、芳香族ポリエステル樹脂、芳
香族ポリカーボネート樹脂等の縮合系ポリマーの場合、
樹脂マトリックスと有機オニウムイオンとの親和性の点
からジメチルビス[PEG]アンモニウム、メチルドデ
シルビス[PEG]アンモニウム等のジアルキルビス
[PEG]アンモニウムイオン、及びジメチルビス[P
EG]ホスホニウム、メチルドデシルビス[PEG]ホ
スホニウム等のジアルキルビス[PEG]ホスホニウム
イオン等の[PEG]含有有機オニウムイオンも好適に
用いられる。なおこれらの有機オニウムイオンは、単独
でも複数種類の混合物としても使用できる。Quaternary ammonium having two alkyl groups having 12 or more carbon atoms in one molecule such as diethyldihexadecylammonium, diethyldioctadecylammonium, trimethyldodecylphosphonium, trimethylhexadecylphosphonium, trimethyloctadecylphosphonium, tributyldodecylphosphonium. Having an alkyl group having 12 or more carbon atoms such as tributylhexadecylphosphonium and tributyloctadecylphosphonium 4
Ions such as primary phosphonium are preferably used. Among them, carbons such as quaternary ammonium having one alkyl group having 16 or more carbon atoms in one molecule such as trimethylhexadecyl ammonium, trimethyl octadecyl ammonium, dimethyl ditetradecyl ammonium, dimethyl dihexadecyl ammonium, dimethyl dioctadecyl ammonium, etc. Quaternary ammonium having two or more alkyl groups having 14 or more carbon atoms in one molecule, trimethylhexadecylphosphonium, trimethyloctadecylphosphonium, tributylhexadecylphosphonium, tributyloctadecylphosphonium, etc. quaternary phosphonium having an alkyl group having 14 or more carbon atoms, etc. Are more preferably used from the viewpoint of maintaining the toughness and availability of the resin composition of the present invention, and most preferably trimethyloctadecyl ammonium ion and dimethyldi Hexadecyl ammonium ion, dimethyl dioctadecyl ammonium ion, tributyl hexadecyl phosphonium ion, tributyl octadecyl phosphonium ion used. When the resin matrix is a condensation polymer such as a polyamide resin, an aromatic polyester resin, or an aromatic polycarbonate resin,
From the viewpoint of the affinity between the resin matrix and the organic onium ion, dialkylbis [PEG] ammonium ion such as dimethylbis [PEG] ammonium and methyldodecylbis [PEG] ammonium, and dimethylbis [P].
[PEG] -containing organic onium ions such as dialkylbis [PEG] phosphonium ions such as EG] phosphonium and methyldodecylbis [PEG] phosphonium are also preferably used. These organic onium ions can be used alone or as a mixture of plural kinds.
【0040】本発明における反応性官能基を有する陽イ
オン交換性層状珪酸塩をホストとし有機オニウムイオン
をゲストとする層間化合物としては、該反応性官能基の
層状珪酸塩への導入反応と、有機オニウムイオンと負の
層格子および交換可能なカチオンを含有する粘土とのイ
オン交換反応の2種の反応を含む工程により製造され
る、層間に該オニウムイオンが挿入(インターカレーシ
ョン)された化合物を意味する。該イオン交換反応は、
例えば特公昭61−5492号公報、特開昭60−42
451号公報等に記載された公知の方法に準じて行うこ
とができ、その好ましい反応条件等は例えば特願平5−
245199号、特願平5−245200号に記載され
た4級アンモニウムイオンの挿入の場合の反応及び精製
方法が適用できる。The intercalation compound having a cation-exchange layered silicate having a reactive functional group as a host and an organic onium ion as a guest in the present invention includes an introduction reaction of the reactive functional group into the layered silicate and an organic compound. A compound having intercalation (intercalation) of onium ions between layers, which is produced by a process including two reactions of ion exchange reaction between onium ions and a clay containing a negative layer lattice and exchangeable cations. means. The ion exchange reaction is
For example, Japanese Examined Patent Publication No. 61-5492 and Japanese Patent Laid-Open No. 60-42.
It can be carried out according to a known method described in, for example, Japanese Patent Application No. 451 and its preferred reaction conditions are, for example, Japanese Patent Application No.
The reaction and purification methods in the case of inserting a quaternary ammonium ion described in Japanese Patent Application No. 245199 and Japanese Patent Application No. 5-245200 can be applied.
【0041】層間化合物中の有機オニウムイオンの量
は、原料の層状珪酸塩の陽イオン交換容量に対し0.8
〜2.0当量の範囲であれば特に制限はないが、通常の
反応条件では1.0〜1.3当量程度となる。この量が
0.8当量よりも少ないと、マトリックス樹脂への分散
性が低下し、2.0当量より多いと該オニウムイオン由
来の遊離化合物が顕著となり、成形時の熱安定性低下、
発煙、金型汚染、臭気等の原因となる場合がある。層間
化合物の配合量は、熱可塑性樹脂100重量部に対し
0.1〜50重量部、好ましくは0.1〜30重量部、
より好ましくは0.1〜20重量部である。The amount of the organic onium ion in the intercalation compound was 0.8 with respect to the cation exchange capacity of the layered silicate as a raw material.
There is no particular limitation as long as it is in the range of 2.0 to 2.0 equivalents, but it is about 1.0 to 1.3 equivalents under normal reaction conditions. When this amount is less than 0.8 equivalent, dispersibility in the matrix resin is lowered, and when it is more than 2.0 equivalent, the free compound derived from the onium ion becomes prominent and the thermal stability at the time of molding is lowered,
May cause smoke, mold contamination, odor, etc. The compounding amount of the intercalation compound is 0.1 to 50 parts by weight, preferably 0.1 to 30 parts by weight, relative to 100 parts by weight of the thermoplastic resin,
It is more preferably 0.1 to 20 parts by weight.
【0042】層間化合物の水分量は、特にポリアミド樹
脂、芳香族ポリエステル樹脂、芳香族ポリカーボネート
樹脂のような縮合系樹脂をマトリックス樹脂とする場合
の混合時の加水分解等の望ましくない副反応を低減する
ために、7重量%以下、好ましくは5重量%以下、最も
好ましくは3重量%以下に制御することが望ましい。該
水分量が7重量%を超えると縮合系樹脂の加水分解によ
る分子量低下が顕著となり組成物の靱性が大きく低下す
る場合がある。The water content of the intercalation compound reduces undesired side reactions such as hydrolysis during mixing particularly when a condensation resin such as a polyamide resin, an aromatic polyester resin or an aromatic polycarbonate resin is used as the matrix resin. Therefore, it is desirable to control the content to 7% by weight or less, preferably 5% by weight or less, and most preferably 3% by weight or less. If the water content exceeds 7% by weight, the molecular weight of the condensation resin may be significantly reduced due to hydrolysis, and the toughness of the composition may be significantly reduced.
【0043】本発明の熱可塑性樹脂組成物は、層間化合
物を無機灰分量として通常0.1〜20重量%、靱性保
持と補強効果発現の点から好ましくは0.3〜8重量
%、さらに好ましくは0.3〜5重量%、延性発現の点
で最も好ましくは0.3〜4重量%含む。ここで無機灰
分量とは、熱可塑性樹脂組成物の有機成分を650℃の
電気炉内で完全に焼失せしめた残渣の重量分率のことで
ある。該無機灰分量が0.1重量%未満の場合は機械的
強度や弾性率の向上が顕著でなく、一方20重量%を超
えると靱性低下が大きく、いずれの場合も好ましくな
い。またマスターバッチとしての使用においても、該無
機灰分量が20重量%を超えると希釈混合時の層状珪酸
塩の分散性が悪くなる場合があり好ましくない。なお、
層間化合物を添加する場合は各々単独で用いてもよく併
用してもよい。また、熱可塑性組成物をいわゆるマスタ
ーバッチとして配合して所定の無機灰分量に希釈混合す
ることも可能であり、この場合の該組成物の好適な無機
灰分量は8〜20重量%、マスターバッチ使用の経済性
の点から更に好ましくは10〜20重量%である。The thermoplastic resin composition of the present invention has an interlayer compound in an amount of inorganic ash of usually 0.1 to 20% by weight, preferably 0.3 to 8% by weight, and more preferably from the viewpoint of maintaining toughness and reinforcing effect. Is 0.3 to 5% by weight, and most preferably 0.3 to 4% by weight in terms of ductility. Here, the amount of inorganic ash means the weight fraction of the residue obtained by completely burning off the organic component of the thermoplastic resin composition in an electric furnace at 650 ° C. When the amount of the inorganic ash is less than 0.1% by weight, the mechanical strength and elastic modulus are not significantly improved, while when it exceeds 20% by weight, the toughness is greatly reduced, which is not preferable. Also in use as a masterbatch, if the amount of the inorganic ash exceeds 20% by weight, the dispersibility of the layered silicate during diluting and mixing may be deteriorated, which is not preferable. In addition,
When an intercalation compound is added, they may be used alone or in combination. It is also possible to blend the thermoplastic composition as a so-called masterbatch and dilute and mix it to a predetermined amount of inorganic ash, and in this case, a suitable inorganic ash content of the composition is 8 to 20% by weight, masterbatch. From the viewpoint of economy of use, it is more preferably 10 to 20% by weight.
【0044】本発明においては、陽イオン交換能を持つ
層状珪酸塩の層間陽イオンの有機オニウムイオンによる
交換(有機オニウムイオンのインターカレーション)と
いう現象において、有機オニウムイオンの構造制御によ
り層間の疎水性を変化させ、構造が制御された有機オニ
ウムイオンのインターカレーションによる層間引力の低
減と層間距離の増大の相乗効果により、溶融した熱可塑
性樹脂中での機械的剪断力のような簡便な手段でもかな
りの劈開分散が達成される。In the present invention, in the phenomenon of the exchange of the interlayer cation of the layered silicate having the cation exchange ability with the organic onium ion (intercalation of the organic onium ion), the hydrophobicity between the layers is controlled by controlling the structure of the organic onium ion. The synergistic effect of decreasing the intercalation force and increasing the interlaminar distance by intercalation of organic onium ions whose structure is controlled and controlled in structure, provides a simple means such as mechanical shearing force in molten thermoplastic resin. However, a considerable cleavage dispersion is achieved.
【0045】しかも、表面シラノール基が存在する1:
1型層状珪酸塩や−O−Si−O−結合で覆われた構造
の2:1型層状珪酸塩等、一般に層状珪酸塩表面は比較
的親水的であるが、親油性マトリックス樹脂に対して
も、珪酸塩層へのマトリックス樹脂との反応点を導入す
ることにより微分散と界面の接着性の向上が達成され
る。Moreover, the surface silanol groups are present 1:
Generally, the surface of the layered silicate is relatively hydrophilic, such as the type 1 layered silicate and the 2: 1 type layered silicate having a structure covered with -O-Si-O- bond, but it is relatively hydrophilic to the lipophilic matrix resin. Also, by introducing reaction points with the matrix resin into the silicate layer, fine dispersion and improvement of interfacial adhesion can be achieved.
【0046】マトリックス樹脂との反応性官能基を有す
る試剤を結合した層状珪酸塩に有機オニウムイオンをイ
ンターカレーションした層間化合物は幅広い熱可塑性樹
脂マトリックスに対し極めて優れた劈開分散性を有し、
マトリックス樹脂の靱性を大きく損なうことなく極めて
効率的に強度や剛性を向上させ、射出成形品において等
方的に低い成形収縮率を発現し、しかも溶融粘度の上昇
のない好ましい成形性を与えるものであり、特に透明な
マトリックス樹脂においてはその透明性を良く保持する
ことができる。An intercalation compound obtained by intercalating an organic onium ion with a layered silicate having a reagent having a functional group reactive with a matrix resin has an extremely excellent cleavage dispersibility in a wide range of thermoplastic resin matrices,
The strength and rigidity of the matrix resin can be improved extremely efficiently without significantly impairing the toughness of the matrix resin, and a low isotropic molding shrinkage ratio is exhibited in injection-molded products. In particular, a transparent matrix resin can maintain its transparency well.
【0047】本発明の芳香族ポリカーボネート樹脂及び
層状珪酸塩を含有してなる熱可塑性樹脂組成物であっ
て、該熱可塑性樹脂組成物中の層状珪酸塩の無機灰分量
が0.25〜10重量%である熱可塑性組成物における
透明性は、該熱可塑性樹脂組成物からなる厚さ3mmの
成形品に対する平行可視光線の平行透過率P(%)と無
機灰分量A(重量%)との積が下記式aA thermoplastic resin composition comprising the aromatic polycarbonate resin of the present invention and a layered silicate, wherein the layered silicate in the thermoplastic resin composition has an inorganic ash content of 0.25 to 10% by weight. %, The transparency in the thermoplastic composition is the product of the parallel transmittance P (%) of parallel visible light and the inorganic ash content A (% by weight) with respect to a molded product made of the thermoplastic resin composition and having a thickness of 3 mm. Is the following formula a
【0048】[0048]
【数3】P×A≧20・・・・(a) を満たすものである。該平行透過率Pは、3mmの厚み
に成形された組成物の厚み方向に入射した平行可視光線
の強度に対する平行透過光線の強度の百分率で定義され
る。ここで、可視光線とは例えば理化学辞典第3版(岩
波書店)に記載されている様に、波長の下限が3800
〜4000オングストローム、上限が7600〜800
0オングストローム程度の電磁波のことであり、平行透
過光線とは熱可塑性樹脂組成物中で散乱されず厚み方向
に平行なまま透過する光線のことである。[Formula 3] P × A ≧ 20 (a) is satisfied. The parallel transmittance P is defined as the percentage of the intensity of parallel transmitted light with respect to the intensity of parallel visible light incident in the thickness direction of a composition molded to a thickness of 3 mm. Here, the visible light has a lower limit of wavelength of 3800, as described in, for example, the Physical and Chemical Dictionary, 3rd edition (Iwanami Shoten).
~ 4000 angstrom, upper limit 7600-800
It means an electromagnetic wave of about 0 angstrom, and a parallel transmitted light ray means a light ray which is not scattered in the thermoplastic resin composition and is transmitted while being parallel to the thickness direction.
【0049】層状珪酸塩の分散粒径が可視光線の波長よ
りも小さい場合には、入射した可視光線の熱可塑性樹脂
組成物中での散乱は実質的に起こらないと考えられるの
で、該平行透過率Pは層状珪酸塩の分散の程度を規定す
る量である。更に詳しくは、層状珪酸塩の基本構造は、
2:1型層状珪酸塩の場合厚さが約10オングストロー
ム、一辺の長さが通常1000オングストローム程度の
層であり、いずれも可視光線の波長よりも小さいことか
ら、該平行透過率Pは実質的には層の厚さ方向の重なり
の程度、即ち積層した構造の劈開の程度を規定する量と
みなすことができる。When the dispersed particle diameter of the layered silicate is smaller than the wavelength of visible light, it is considered that the incident visible light is not substantially scattered in the thermoplastic resin composition. The rate P is an amount that defines the degree of dispersion of the layered silicate. More specifically, the basic structure of layered silicate is
In the case of the 2: 1 type layered silicate, the layer has a thickness of about 10 angstroms and a side length of about 1000 angstroms, and each layer is smaller than the wavelength of visible light. Can be regarded as an amount that defines the degree of overlap in the thickness direction of the layers, that is, the degree of cleavage of the laminated structure.
【0050】該平行透過率Pの測定に用いられる試料の
成形方法には特に制限はないが、表面での入射光の散乱
を最小限とするために表面は平滑である必要がある。従
って好ましい成形方法は射出成形、熱プレス成形であ
る。なお、該平行透過率Pの測定は精密に光度を測定で
きる装置によりなされる限り特に制限はないが、例えば
市販の濁度計(ヘーズメーター)が使用できる。There is no particular limitation on the method of molding the sample used for measuring the parallel transmittance P, but the surface needs to be smooth in order to minimize scattering of incident light on the surface. Therefore, preferable molding methods are injection molding and hot press molding. The parallel transmittance P is not particularly limited as long as it is measured by an apparatus capable of measuring the luminous intensity accurately, but for example, a commercially available turbidimeter (haze meter) can be used.
【0051】本発明の芳香族ポリカーボネート樹脂及び
層状珪酸塩を含有してなる熱可塑性樹脂組成物における
層状珪酸塩としては前述した陽イオン交換性層状珪酸塩
の他にタルク、カオリン、雲母等が使用できるが、樹脂
組成物の透明性の点からその基本構造である層の一辺の
長さが平均1200オングストローム以下、好ましくは
1000オングストローム以下、更に好ましくは900
オングストローム以下となる様に粉砕されていることが
樹脂組成物の透明性の点で好ましい。ここで層状珪酸塩
としては、芳香族ポリカーボネートと反応しうる反応性
官能基を有し、反応性官能基が珪素原子を含む共有結合
連鎖を介して層状珪酸塩に結合しているものが好まし
く、また、陽イオン交換性層状珪酸塩であって、陽イオ
ン交換性層状珪酸塩をホストとし、有機オニウムイオン
をゲストとする層間化合物を形成していることが好まし
い。層状珪酸塩を有機オニウムイオンとの層間化合物と
して使用する場合には陽イオン交換容量が70ミリ当量
/100g以上であることが十分な透明性を発現する分
散性の確保の点で望ましい。As the layered silicate in the thermoplastic resin composition containing the aromatic polycarbonate resin and the layered silicate of the present invention, talc, kaolin, mica, etc. are used in addition to the above-mentioned cation-exchangeable layered silicate. However, in view of the transparency of the resin composition, the length of one side of the layer which is the basic structure thereof is on average 1200 angstroms or less, preferably 1000 angstroms or less, more preferably 900 angstroms or less.
From the viewpoint of transparency of the resin composition, it is preferable that the resin composition is pulverized so as to have an angstrom or less. Here, the layered silicate preferably has a reactive functional group capable of reacting with an aromatic polycarbonate, and the reactive functional group is bonded to the layered silicate through a covalent bond chain containing a silicon atom, In addition, it is preferable that the cation-exchange layered silicate forms an intercalation compound in which the cation-exchange layered silicate serves as a host and the organic onium ion serves as a guest. When the layered silicate is used as an intercalation compound with an organic onium ion, the cation exchange capacity is preferably 70 meq / 100 g or more from the viewpoint of ensuring sufficient dispersibility to express transparency.
【0052】芳香族ポリカーボネートと反応しうる反応
性官能基を有し、反応性官能基が珪素原子を含む共有結
合連鎖を介して層状珪酸塩に結合している層状珪酸塩
は、反応性官能基を有する陽イオン交換性層状珪酸塩の
製造方法と同様の方法で製造される。芳香族ポリカーボ
ネート樹脂及び層状珪酸塩を含有してなる熱可塑性樹脂
組成物は、層状珪酸塩を無機灰分量にして0.25〜1
0重量%、透明性の点から好適には0.25〜5重量
%、更に好適には0.25〜3重量%含むのが望まし
い。この無機灰分量が0.25重量%に満たないと機械
的強度、剛性の向上が十分でなくなる傾向があり、10
重量%を超えると透明性が悪くなる傾向がある。なお、
無機灰分量の定義は前述と同様である。The layered silicate having a reactive functional group capable of reacting with an aromatic polycarbonate, and the reactive functional group is bonded to the layered silicate through a covalent bond chain containing a silicon atom is a reactive functional group. It is manufactured by a method similar to the method for manufacturing a cation-exchange layered silicate having A thermoplastic resin composition containing an aromatic polycarbonate resin and a layered silicate has a layered silicate content of 0.25 to 1 in terms of inorganic ash content.
0% by weight, preferably 0.25 to 5% by weight from the viewpoint of transparency, and more preferably 0.25 to 3% by weight. If the amount of the inorganic ash is less than 0.25% by weight, the mechanical strength and rigidity tend to be insufficiently improved.
If it exceeds 5% by weight, the transparency tends to deteriorate. In addition,
The definition of the amount of inorganic ash is the same as above.
【0053】なお、層状珪酸塩の含有量、即ち無機灰分
量Aの増加により熱可塑性樹脂組成物中での入射光の散
乱の確率が増加するので、この時平行透過率Pは減少す
るものと考えられる。従って式aは無機灰分量にして
0.25〜10重量%の範囲において、無機灰分量が増
加しても透明性が大きく損なわれないという本発明の芳
香族ポリカーボネート樹脂及び層状珪酸塩を含有してな
る熱可塑性樹脂組成物の特徴を示していると言える。Since the probability of scattering of incident light in the thermoplastic resin composition increases as the content of the layered silicate, that is, the inorganic ash content A increases, the parallel transmittance P decreases at this time. Conceivable. Therefore, the formula a contains the aromatic polycarbonate resin of the present invention and the layered silicate which does not significantly impair the transparency even when the amount of inorganic ash is increased in the range of 0.25 to 10% by weight as the amount of inorganic ash. It can be said that it exhibits the characteristics of the thermoplastic resin composition.
【0054】本発明において、層間化合物又は層状珪酸
塩と各種熱可塑性樹脂との混合方法には特に制限はない
が、熱可塑性樹脂の溶融状態で機械的剪断下混合するこ
とが肝要であり、この範囲において任意の段階で添加で
きる。例えば、ポリアミド樹脂、芳香族ポリエステル樹
脂、芳香族ポリカーボネート樹脂のような縮合系樹脂の
場合、重合前の樹脂原料に添加し溶融重合進行とともに
撹拌混合する方法、該溶融重合途中ないしは溶融重合後
チップ化前に添加し撹拌混合する方法が可能である。ま
た、一般的に重合終了後の粉体、フレーク、チップ等の
任意の形態の熱可塑性樹脂に添加し押出機等の混練機に
て溶融混合する方法も混合可能である。これらの方法の
中では生産性、簡便性、汎用性から、重合終了後の任意
の形態の熱可塑性樹脂と混練機により混合する方法が好
ましい。中でも、剪断効率の高い二軸押出機の使用が好
ましく、該層間化合物に含まれる水分を効率的に除去で
きるベント付き二軸押出機の使用が最適である。芳香族
ポリカーボネート樹脂及び層状珪酸塩を含有してなる熱
可塑性樹脂組成物における層状珪酸塩の分散方法におい
ては、例えば有機オニウムイオンをインターカレーショ
ンした陽イオン交換能を有する層間化合物として溶融状
態の芳香族ポリカーボネート樹脂と混合する方法が望ま
しく、層状珪酸塩にエポキシ基等の反応性官能基を導入
しておくことが好ましい。In the present invention, the method of mixing the intercalation compound or the layered silicate and the various thermoplastic resins is not particularly limited, but it is essential that the thermoplastic resin is mixed under mechanical shearing in the molten state. It can be added at any stage in the range. For example, in the case of a condensation resin such as a polyamide resin, an aromatic polyester resin, or an aromatic polycarbonate resin, a method of adding to a resin raw material before polymerization and stirring and mixing with progress of melt polymerization, chip formation after or during melt polymerization It is possible to use a method of adding and stirring and mixing before. In addition, a method of adding to a thermoplastic resin in any form such as powder, flakes, chips and the like after completion of polymerization and melt-mixing with a kneader such as an extruder can also be generally mixed. Among these methods, a method of mixing with a kneading machine with a thermoplastic resin in an arbitrary form after completion of the polymerization is preferable from the viewpoint of productivity, convenience and versatility. Above all, it is preferable to use a twin-screw extruder having high shear efficiency, and it is most preferable to use a twin-screw extruder with a vent capable of efficiently removing water contained in the intercalation compound. In a method for dispersing a layered silicate in a thermoplastic resin composition containing an aromatic polycarbonate resin and a layered silicate, for example, an aromatic compound in a molten state is used as an intercalation compound having a cation exchange ability by intercalating an organic onium ion. A method of mixing with a group polycarbonate resin is desirable, and it is preferable to introduce a reactive functional group such as an epoxy group into the layered silicate.
【0055】なお、本発明の熱可塑性樹脂組成物には、
本発明の目的を損なわない限りにおいて必要に応じ常用
の各種添加成分、例えばガラス繊維、炭素繊維等の無機
繊維、ガラスフレーク、ガラスビーズ、雲母等の無機粉
体、各種可塑剤、安定剤、着色剤、難燃剤等を添加でき
る。The thermoplastic resin composition of the present invention contains
As long as the purpose of the present invention is not impaired, various conventionally used additive components, for example, glass fibers, inorganic fibers such as carbon fibers, glass flakes, glass beads, inorganic powders such as mica, various plasticizers, stabilizers, coloring Agents and flame retardants can be added.
【0056】[0056]
【実施例】次に、本発明を、実施例および比較例により
更に詳細に説明するが、本発明は、その要旨を越えない
限り以下の実施例の記載に限定されるものではない。 評価項目と測定方法 ・引張試験:ASTM D−638によった。降伏強度
(YSと略記,単位kg/cm2)、弾性率(TMと略記,単
位kg/cm2)、破断伸び(UEと略記,単位%)を測定し
た。 ・表面外観観察:目視評価により射出成形品の表面の平
滑性を比較した。 ・光線透過特性:日本電色工業株製濁度NDH−300
Aにより、3mm厚の射出成形平板のヘーズ(濁度)、
全光線透過率、平行光線透過率を測定した。 ・成形収縮率:1mm厚のフィルムゲートの金型により
平板(2mm厚×80mm角)を射出成形し、流動方向
(MD)とMDと垂直方向(TD)の2方向の寸法を測
定して求めた。 ・溶融流動性:引張試験片射出成形時の最低充填射出圧
(kg/cm2)より評価した。 ・衝撃試験:ASTM D256により、1/8インチ
厚みのノッチ付きIZDO衝撃強度を測定した。 使用した層状珪酸塩 表ー2に使用した市販の層状珪酸塩の名称、鉱物名、種
類、メチレンブルー吸着法により測定した陽イオン交換
容量(CECと略記)、メーカーを記載した。EXAMPLES Next, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the description of the following Examples unless it exceeds the gist. Evaluation item and measuring method-Tensile test: According to ASTM D-638. The yield strength (abbreviated as YS, unit kg / cm 2 ), elastic modulus (abbreviated as TM, unit kg / cm 2 ) and elongation at break (abbreviated as UE, unit%) were measured. -Surface appearance observation: The surface smoothness of injection-molded articles was compared by visual evaluation. -Light transmission characteristics: turbidity NDH-300 manufactured by Nippon Denshoku Industries Co., Ltd.
According to A, haze (turbidity) of a 3 mm thick injection-molded flat plate,
The total light transmittance and the parallel light transmittance were measured. Molding shrinkage ratio: Obtained by injection-molding a flat plate (2 mm thickness x 80 mm square) using a film gate mold with a thickness of 1 mm, and measuring the dimensions in the flow direction (MD) and the MD and vertical directions (TD). It was Melt fluidity: Evaluated from the minimum filling injection pressure (kg / cm2) during tensile test piece injection molding. Impact test: Notched IZDO impact strength of 1/8 inch thickness was measured according to ASTM D256. Layered silicates used Table 2 shows the names, mineral names and types of commercially available layered silicates used, the cation exchange capacity (abbreviated as CEC) measured by the methylene blue adsorption method, and the manufacturer.
【0057】[0057]
【表2】 表ー2 1)単位:ミリ当量/100g ──────────────────────────────────── 名称 鉱物名 種類 CEC1) メーカー ──────────────────────────────────── クニピアF モンモリロナイト 天然 120 クニミネ工業(株) ME100 膨潤性フッ素雲母 合成 80 コープケミカル(株) ────────────────────────────────────[Table 2] Table-2 1) Unit: milliequivalent / 100 g ──────────────────────────────────── ─ Name Mineral name Type CEC 1) Manufacturer ───────────────────────────────────── Kunipia F Montmorillonite Natural 120 Kunimine Industries Co., Ltd. ME100 Swellable Fluorine Mica Synthetic 80 Corp Chemical Co., Ltd. ────────────────────────────────── ───
【0058】官能化試剤と層状珪酸塩の反応 市販の層状珪酸塩を窒素気流下180℃にて一昼夜乾燥
したもの100gを、乾燥窒素置換したボールミル中に
封入した。ここに2.0gの官能化試剤を乾燥アセトン
8mlに溶解した溶液を15分かけて5回に分割して加
え、密封して激しく撹拌混合した。該溶液を全量添加後
さらに20分間撹拌混合を継続し、官能化試剤を反応さ
せた層状珪酸塩を得た。官能化試剤には、反応性官能基
としてエポキシ基を有するものとして3−グリシジルオ
キシプロピルトリメトキシシラン、アミノ基を有するも
のとして3−アミノプロピルトリエトキシシランを起用
した。得られた粉体に対し、乾燥アセトンを用いて洗液
に官能化試剤が混入しなくなるまで撹拌懸濁洗浄と濾過
操作を繰り返し、80℃にて一昼夜真空乾燥後、セイコ
ー電子(株)製TG−DTA(熱重量分析−示差熱分
析)装置SSC−5200Hにより、窒素気流下毎分4
0℃の速度にて25℃から500℃に昇温した場合の発
生気体に、炭化水素成分、及び特にアミノシラン処理品
の場合には窒素原子が検出されることから該官能化試剤
が層状珪酸塩に共有結合しているものと推定した。更
に、アミノシラン処理品の該洗浄乾燥物をエタノール中
に撹拌懸濁させ、0.01Nの希塩酸で滴定したところ
アミノ基と考えられる変曲点が認められた。Reaction of Functionalized Reagent with Layered Silicate 100 g of a commercially available layered silicate dried at 180 ° C. for one day under a nitrogen stream was sealed in a ball mill substituted with dry nitrogen. A solution prepared by dissolving 2.0 g of the functionalized reagent in 8 ml of dry acetone was added thereto in 5 portions over 15 minutes, sealed, and vigorously stirred and mixed. After adding the whole amount of the solution, stirring and mixing were continued for another 20 minutes to obtain a layered silicate in which a functionalizing agent was reacted. As the functionalizing agent, 3-glycidyloxypropyltrimethoxysilane having an epoxy group as a reactive functional group and 3-aminopropyltriethoxysilane having an amino group were used. The obtained powder is repeatedly stirred and washed by stirring and filtering with dry acetone until the functionalizing agent is not mixed in the washing solution, and vacuum-dried at 80 ° C for 24 hours, and then TG manufactured by Seiko Denshi KK -DTA (thermogravimetric analysis-differential thermal analysis) device SSC-5200H, under nitrogen stream 4 per minute
Since hydrocarbon components, and particularly nitrogen atoms in the case of aminosilane-treated products, are detected in the gas generated when the temperature is raised from 25 ° C to 500 ° C at a rate of 0 ° C, the functionalizing agent is a layered silicate. Presumed to be covalently bound to. Furthermore, when the washed and dried product of the aminosilane-treated product was suspended in ethanol with stirring and titrated with 0.01N dilute hydrochloric acid, an inflection point considered to be an amino group was recognized.
【0059】層間化合物の調製 層状珪酸塩又は官能化試剤を反応させた層状珪酸塩約1
00gを精秤後室温の水10リットルに撹拌分散して、
均質な懸濁液を得た。ここに層状珪酸塩のCECの1.
2倍当量のオニウムイオンの塩酸塩を添加して2時間撹
拌した。精製した沈降性の固体を濾別し、次いで25リ
ットルの脱塩水中で撹拌洗浄後再び濾別した。この洗浄
と濾別の操作を少なくとも3回行い、洗液の硝酸銀試験
で塩化物イオンが検出されなくなるのを確認した。得ら
れた固体は3〜7日の風乾後乳鉢で粉砕し、更に50℃
の温風乾燥を3〜10時間行い再度乳鉢で粉砕した。乾
燥条件はゲストのオニウムイオンの種類により変動する
が、最大粒径が100μm程度となることと、窒素気流
下120℃で1時間保持した場合の熱重量減少で評価し
た残留水分量が2〜3wt%となることを指標とした。
オニウムイオンとしては、ジメチルジオクタデシルアン
モニウム(Me2(C18)2N+ と略記)、トリメチルドデシル
アンモニウム(Me3C12N+と略記)、トリブチルヘキサデ
シルホスホニウム(Bu3C16P+と略記)、12−アミノド
デカン酸アンモニウム(12ADA+と略記)の3種を用い
た。Preparation of Intercalation Compound Layered silicate or layered silicate reacted with functionalizing agent About 1
After precisely weighing 00 g, it is stirred and dispersed in 10 liters of water at room temperature,
A homogeneous suspension was obtained. The CEC of the layered silicate is 1.
A double equivalent of onium ion hydrochloride was added and stirred for 2 hours. The purified precipitated solid was filtered off, then washed with stirring in 25 liters of demineralized water, and then filtered off again. This washing and filtering operation was performed at least three times, and it was confirmed by the silver nitrate test of the washing liquid that chloride ions could not be detected. The obtained solid is air-dried for 3 to 7 days, then crushed in a mortar and further heated to 50 °
Was dried with warm air for 3 to 10 hours and pulverized again in a mortar. Drying conditions vary depending on the type of guest onium ion, but the maximum particle size is about 100 μm, and the residual water content evaluated by thermogravimetric reduction when kept at 120 ° C. for 1 hour under a nitrogen stream has a residual water content of 2-3 wt. % Was used as an index.
Examples of onium ions are dimethyldioctadecyl ammonium (abbreviated as Me 2 (C 18 ) 2 N + ), trimethyldodecyl ammonium (abbreviated as Me 3 C 12 N + ) and tributyl hexadecyl phosphonium (abbreviated as Bu 3 C 16 P + ). ) And ammonium 12-aminododecanoate (abbreviated as 12ADA + ).
【0060】使用した熱可塑性樹脂 ナイロン6・・・ノバミッド1020J(三菱化成
(株)製、1g/dl濃度の濃硫酸溶液の25℃での相対粘
度ηrel =3.5) ナイロン66・・ザイテルFE3421(デュポン
(株)製、1g/dl濃度の濃硫酸溶液の25℃での相対粘
度ηrel =3.0) 芳香族非晶ナイロン(APAと略記)・・・ノバミッド
X21(三菱化成(株)製、1g/dl濃度の濃硫酸溶液の
25℃での相対粘度ηrel =2.0 なるイソフタル酸、テレ
フタル酸、ヘキサメチレンジアミンからなるポリアミド
樹脂) ポリブチレンテレフタレート(PBTと略記)・・・・
・ノバドウール5020(三菱化成(株)製、1g/dl濃
度のフェノール/1,1,2,2−テトラクロロエタン
(重量比1:1)混合溶液の30℃での極限粘度[η]
=1.2(dl/g)、但しハギンズ定数は0.33とした。)Thermoplastic resin used Nylon 6 ... Novamid 1020J (manufactured by Mitsubishi Kasei Co., Ltd., relative viscosity η rel = 3.5 at 25 ° C. of a concentrated sulfuric acid solution having a concentration of 1 g / dl) Nylon 66 ... Zitel FE3421 (manufactured by DuPont Co., Ltd., relative viscosity η rel = 3.0 at 25 ° C. of a concentrated sulfuric acid solution having a concentration of 1 g / dl) Amorphous amorphous nylon (abbreviated as APA) ・ ・ ・ Novamid X21 (Mitsubishi Kasei ) Made of concentrated sulfuric acid solution of 1 g / dl concentration
Polyamide resin composed of isophthalic acid, terephthalic acid, and hexamethylenediamine having relative viscosity η rel = 2.0 at 25 ° C) Polybutylene terephthalate (abbreviated as PBT) ...
-Novado wool 5020 (manufactured by Mitsubishi Kasei Co., Ltd., 1 g / dl concentration of phenol / 1,1,2,2-tetrachloroethane (weight ratio 1: 1) mixed solution at 30 ° C, the intrinsic viscosity [η]
= 1.2 (dl / g), but the Huggins constant was 0.33. )
【0061】ポリフェニレンスルフィド(PPSと略
記)・・・・・ライトンE0780(東レ・フィリップ
ス(株)製、GPCによる重量平均分子量Mw =223,00
0 ) ポリフェニレンエーテル(PPEと略記)・・・・・G
EMポリマー(株)製PPE(0.6g/dl濃度のクロロホ
ルム溶液の25℃での極限粘度[η]=0.47(dl/g)、但し
ハギンズ定数は0.30とした。) エチレン−ブテン共重合体(EBRと略記)・・・AS
TM D1238規格による190℃、2.16kg/cm2
荷重におけるメルトインデックスが4.0、密度が0.
88のものを使用した。 無水マレイン酸をグラフトしたEBR(MEBRと略
記)・・・上記EBRに無水マレイン酸をグラフトした
ものを用いた。無水マレイン酸のグラフト量は0.45重量
%、上記メルトインデックスは1.9、密度は0.89であっ
た。 芳香族ポリカーボネート(PCと略記)・・・ノバレッ
クス7025PJ(三菱化成(株)製、GPCによる重
量平均分子量Mw =45,000)Polyphenylene sulfide (abbreviated as PPS) ... Ryton E0780 (manufactured by Toray Phillips Co., Ltd., weight average molecular weight by GPC Mw = 223,00)
0) Polyphenylene ether (abbreviated as PPE) ・ ・ ・ G
PPE manufactured by EM Polymer Co., Ltd. (Intrinsic viscosity [η] of a chloroform solution having a concentration of 0.6 g / dl at 25 ° C. [η] = 0.47 (dl / g), with a Huggins constant of 0.30.) Ethylene-butene copolymer ( Abbreviated as EBR) ・ ・ ・ AS
190 ° C according to TM D1238 standard, 2.16 kg / cm 2
Melt index under load is 4.0 and density is 0.
The one of 88 was used. EBR grafted with maleic anhydride (abbreviated as MEBR) ... The above EBR grafted with maleic anhydride was used. The grafted amount of maleic anhydride was 0.45% by weight, the melt index was 1.9, and the density was 0.89. Aromatic polycarbonate (abbreviated as PC) ・ ・ ・ NOVAREX 7025PJ (manufactured by Mitsubishi Kasei Co., Ltd., weight average molecular weight by GPC Mw = 45,000)
【0062】〔実施例1〜3及び6〜7〕表ー4に示す
官能化試剤を反応させ有機オニウムイオンをインターカ
レーションした層間化合物(表ー4に層状珪酸塩の名
称、オニウムイオン種、及び官能化試剤の反応性官能基
を記した)とナイロン6とを、東芝機械株製の二軸押出
機TEM35Bによりバレル温度設定280℃、スクリ
ュ回転数150rpmの条件でベントを使用しながら溶
融混練しチップ化した。得られたチップは120℃での
真空乾燥(一昼夜)後、日本製鋼所株製の射出成形機J
28SAにより、バレル温度280℃、金型表面実測温
度85℃、射出/冷却=10/10秒、射出速度最大の
条件で成形し、引張試験片、曲げ試験片、3mm厚平板
をそれぞれ得た。無機灰分量は、成形片約1.5gを精
秤し、650℃の電気炉内で完全に有機物を焼失せしめ
た残渣の重量分率を採用し、表ー4に灰分量として記し
た。[Examples 1 to 3 and 6 to 7] An intercalation compound in which a functionalizing agent shown in Table 4 was reacted to intercalate an organic onium ion (Table 4 shows the names of layered silicates, onium ion species, And the reactive functional groups of the functionalized reagent) and nylon 6 are melt-kneaded by using a twin screw extruder TEM35B manufactured by Toshiba Machine Co., Ltd. while using a vent under the conditions of a barrel temperature setting of 280 ° C. and a screw rotation speed of 150 rpm. It was made into chips. The obtained chips were vacuum dried at 120 ° C (for one day and night), and then injection molding machine J manufactured by Japan Steel Works Ltd.
With 28SA, molding was performed under the conditions of a barrel temperature of 280 ° C., a mold surface measured temperature of 85 ° C., injection / cooling = 10/10 seconds, and maximum injection speed, to obtain a tensile test piece, a bending test piece, and a 3 mm thick flat plate, respectively. For the amount of inorganic ash, about 1.5 g of a molded piece was precisely weighed, and the weight fraction of the residue in which the organic matter was completely burned off in an electric furnace at 650 ° C. was adopted, and the amount of ash is shown in Table 4.
【0063】〔実施例4〜5〕表ー4に示した官能化試
剤を反応させ12−アミノドデカン酸アンモニウムイオ
ンをインターカレーションした層間化合物を、ε−カプ
ロラクタム/6−アミノカプロン酸=9/1(重量比)
の混合物に対し混合した。次いで、反応器に仕込み窒素
置換後100℃に昇温融解し撹拌を30分行い層間化合
物を分散させた。その後250℃に昇温し大気圧で2時
間反応後、50Torrまで減圧して重合を完了した。
減圧時間は延べ2時間であった。生成した組成物は剪断
速度の低い状態では非常に溶融粘度が高く、反応器から
の通常の抜き出し作業が困難であった。こうして得た組
成物の粉砕物を熱水抽出し水溶性成分を除去後、真空乾
燥(120℃、16時間)して射出成形に供し実施例1
と同様の評価を行った。また、m−クレゾール/クロロ
ホルム=3/7(重量比)の混合溶媒を展開液とした4
0℃のゲルパーミエーションクロマトグラフィ(カラ
ム:東ソー株製PL−gel10μm MIXED)に
よれば、ナイロン6成分の数平均重合度は200であっ
た。[Examples 4 to 5] An intercalation compound obtained by reacting the functionalized reagents shown in Table 4 with 12-aminododecanoic acid ammonium ion intercalated was prepared as ε-caprolactam / 6-aminocaproic acid = 9/1. (Weight ratio)
Was mixed with the above mixture. Then, the reaction mixture was charged into a reactor, and after nitrogen substitution, the temperature was raised to 100 ° C., melting was performed, and stirring was performed for 30 minutes to disperse the intercalation compound. Thereafter, the temperature was raised to 250 ° C., the reaction was carried out at atmospheric pressure for 2 hours, and then the pressure was reduced to 50 Torr to complete the polymerization.
The depressurization time was 2 hours in total. The composition thus produced had a very high melt viscosity in a state where the shear rate was low, and it was difficult to carry out the usual operation of extracting from the reactor. The pulverized product of the composition thus obtained was extracted with hot water to remove the water-soluble components, dried under vacuum (120 ° C., 16 hours), and subjected to injection molding.
The same evaluation as was done. In addition, a mixed solvent of m-cresol / chloroform = 3/7 (weight ratio) was used as a developing solution 4
According to gel permeation chromatography at 0 ° C. (column: PL-gel 10 μm MIXED manufactured by Tosoh Corporation), the number average degree of polymerization of the nylon 6 component was 200.
【0064】〔実施例8〜16〕実施例1同様の実験を
表ー4に示した各種熱可塑性樹脂について行った。但
し、混練温度、成形条件は下記の表ー3の通りである
(射出速度は最大とした)。また、PPEとMEBRの
系は、ヘーズと全光線透過率も測定した。[Examples 8 to 16] The same experiment as in Example 1 was carried out on each of the thermoplastic resins shown in Table 4. However, the kneading temperature and molding conditions are as shown in Table 3 below (the injection speed was set to the maximum). The PPE and MEBR systems also measured haze and total light transmittance.
【0065】[0065]
【表3】 表ー3 ──────────────────────────────────── 成形条件 樹脂 混練温度(℃) 金型表面 射出/冷却 バレル温度(℃)実測温度(℃) (秒) ──────────────────────────────────── ナイロン66 280 280 85 10/10 APA 270 260 95 20/20 PBT 260 250 88 10/10 PPS 310 300 137 20/30 PPE 310 315 102 15/15 MEBR 200 200 30 15/15 ────────────────────────────────────[Table 3] Table-3 ──────────────────────────────────── Molding conditions Resin kneading temperature (℃ ) Mold surface Injection / cooling Barrel temperature (℃) Measured temperature (℃) (sec) ─────────────────────────────── ────── nylon 66 280 280 85 10/10 APA 270 260 95 20/20 PBT 260 250 88 10/10 PPS 310 300 137 20/30 PPE 310 315 102 15/15 MEBR 200 200 30 15/15 ─ ───────────────────────────────────
【0066】〔比較例1〕ナイロン6のみを実施例1と
同様溶融押出し、同様の評価を行った。 〔比較例2〕実施例1において、官能化試剤によるクニ
ピアFの処理を行わない他は、実施例1と同様に行っ
た。Comparative Example 1 Nylon 6 alone was melt extruded in the same manner as in Example 1 and evaluated in the same manner. [Comparative Example 2] The same procedure as in Example 1 was carried out except that in Example 1, Kunipia F was not treated with the functionalizing agent.
【0067】〔比較例3〕実施例4において、官能化試
剤による層状珪酸塩の処理を行わない他は、実施例4と
同様に行った。ナイロン6成分の数平均重合度は200
であった。 〔比較例4〕実施例1において、有機オニウムイオンの
インターカレーションを行わない他は、実施例1と同様
に行った。Comparative Example 3 The procedure of Example 4 was repeated, except that the layered silicate was not treated with the functionalizing agent in Example 4. Nylon 6 component has a number average degree of polymerization of 200
Met. [Comparative Example 4] The same procedure as in Example 1 was carried out except that the organic onium ion was not intercalated in Example 1.
【0068】〔比較例5〕実施例7において、官能化試
剤によるME100の処理を行わない他は、実施例7と
同様に行った。 〔比較例6,8,10,13,15,17〕実施例8,
9,10,12,14,16において、層間化合物を用
いず、熱可塑性樹脂のみをそれぞれ同様に溶融押出し、
同様の評価を行った。Comparative Example 5 The procedure of Example 7 was repeated, except that the ME100 was not treated with the functionalizing agent in Example 7. [Comparative Examples 6, 8, 10, 13, 15, 17] Example 8,
In 9, 10, 12, 14, and 16, without using an intercalation compound, only the thermoplastic resin was melt-extruded in the same manner,
Similar evaluation was performed.
【0069】〔比較例7,9,11,12,14,1
6、18〕実施例8,9,10,11,12,14,1
6において、官能化試剤による層状珪酸塩の処理を行わ
ない他はそれぞれ同様に行った。[Comparative Examples 7, 9, 11, 12, 14, 1
6, 18] Examples 8, 9, 10, 11, 12, 14, 1
6 was performed in the same manner except that the layered silicate was not treated with the functionalizing agent.
【0070】〔比較例19〕実施例16において、ME
BRの代わりに無水マレイン酸をグラフトしていないE
BRを使用し同様の実験を行った。実施例1〜16の評
価結果は表ー4に、また比較例1〜19の評価結果は表
5に示した。COMPARATIVE EXAMPLE 19 In Example 16, ME
E not grafted with maleic anhydride instead of BR
A similar experiment was performed using BR. The evaluation results of Examples 1 to 16 are shown in Table 4, and the evaluation results of Comparative Examples 1 to 19 are shown in Table 5.
【0071】[0071]
【表4】 [Table 4]
【0072】[0072]
【表5】 [Table 5]
【0073】〔実施例17〜21〕反応性官能基として
エポキシ基を導入したクニピアFにMe2(C18)2N+ をイン
ターカレーションした層間化合物を、東芝機械株製の二
軸押出機TEM35Bによりバレル温度設定290℃、
スクリュ回転数150rpmの条件でベントを使用しな
がらPCと溶融混練しチップ化した。得られたチップは
120℃で真空乾燥(一昼夜)後、日本製鋼所株製の射
出成形機J28SAにより、バレル温度280℃、金型
表面実測温度98℃、射出/冷却=15/15秒、射出
速度最大の条件で成形し、引張試験片、曲げ試験片、3
mm厚平板をそれぞれ得た。無機灰分量は、実施例1と
同様に求めた。[Examples 17 to 21] An intercalation compound of Me 2 (C 18 ) 2 N + intercalated with Kunipia F having an epoxy group introduced as a reactive functional group was used as a twin screw extruder manufactured by Toshiba Machine Co., Ltd. Barrel temperature setting by TEM35B 290 ℃,
Using a vent at a screw rotation speed of 150 rpm, the mixture was melt-kneaded with PC to form chips. The obtained chips were vacuum-dried at 120 ° C (one day and night), and then barrel temperature was 280 ° C, mold surface measurement temperature was 98 ° C, injection / cooling = 15/15 seconds, using an injection molding machine J28SA manufactured by Japan Steel Works Ltd. Molded under conditions of maximum speed, tensile test piece, bending test piece, 3
mm thick flat plates were obtained respectively. The amount of inorganic ash was determined in the same manner as in Example 1.
【0074】〔比較例20〜22〕実施例17〜21に
おいて、エポキシシランによるクニピアFの処理を行わ
ない以外はそれぞれ実施例17〜21と同様に行った。 〔比較例23〕実施例18において、Me2(C18)2N+のイ
ンターカレーションを行わない以外は実施例18と同様
に行った。[Comparative Examples 20 to 22] The same procedures as in Examples 17 to 21 were carried out except that the treatment of Kunipia F with epoxysilane was not carried out. [Comparative Example 23] The procedure of Example 18 was repeated, except that Me 2 (C 18 ) 2 N + was not intercalated.
【0075】〔比較例24〕実施例18において、層間
化合物の代わりに未処理のクニピアFを用いる以外は実
施例18と同様に行った。 〔比較例25〕PCのみを実施例17と同様溶融押出
し、同様の評価を行った。実施例17〜21及び比較例
20〜25の評価結果は表ー6に示した。また、実施例
18、比較例21、及び比較例25については、GPC
による重量平均分子量、引張試験片射出成形の際の最低
充填射出圧、及び成形収縮率を測定し、これらの結果を
表ー7に示した。[Comparative Example 24] The procedure of Example 18 was repeated except that untreated Kunipia F was used instead of the intercalation compound. [Comparative Example 25] Only PC was melt extruded in the same manner as in Example 17, and the same evaluation was performed. The evaluation results of Examples 17 to 21 and Comparative Examples 20 to 25 are shown in Table-6. Further, for Example 18, Comparative Example 21, and Comparative Example 25, GPC
The weight average molecular weight, the minimum filling injection pressure at the time of injection molding of the tensile test piece, and the molding shrinkage ratio were measured, and the results are shown in Table 7.
【0076】[0076]
【表6】 [Table 6]
【0077】[0077]
【表7】 [Table 7]
【0078】〔実施例22〕実施例1と同様の溶融混練
を、無機灰分量20wt%を目標に行った。こうして得
たチップを120℃で真空乾燥(一昼夜)後、成形品の
無機灰分量が2wt%となる様、乾燥したナイロン6の
チップと混合(ドライブレンド)し、実施例1と同様の
成形及び評価を行った。[Example 22] The same melt-kneading as in Example 1 was carried out with the goal of an inorganic ash content of 20 wt%. The chips thus obtained were vacuum-dried at 120 ° C. (one day and night), and then mixed (dry blended) with chips of dried nylon 6 so that the inorganic ash content of the molded product was 2 wt%, and the same molding as in Example 1 and An evaluation was made.
【0079】〔比較例26〕実施例22において、エポ
キシシランによるクニピアFの処理を行わずに同様の実
験を行った。実施例22と比較例26の評価結果は表ー
8に示した。[Comparative Example 26] The same experiment as in Example 22 was carried out without treating Kunipia F with epoxysilane. The evaluation results of Example 22 and Comparative Example 26 are shown in Table-8.
【0080】[0080]
【表8】 [Table 8]
【0081】[0081]
【表9】 [Table 9]
【0082】表ー4及び表ー5より、マトリックス樹脂
と反応性のある官能基を結合した層状珪酸塩に有機オニ
ウムイオンをインターカレーションした層間化合物を用
いると、官能基を結合しない場合に比べ、樹脂組成物の
強度や剛性と靱性とのバランスが改良され、成形体に透
明性のある場合、その透明性が良く保持されることもわ
かる。また表ー7より、本発明の熱可塑性樹脂組成物
は、溶融流動性、及び成形収縮率が改善され、優れた成
形性を有することもわかる。更に、表ー8の様に無機灰
分量の大きい本発明の熱可塑性樹脂組成物は、層状珪酸
塩のマスターバッチとしても優れることがわかる。From Table 4 and Table 5, it can be seen that when an intercalation compound in which an organic onium ion is intercalated in a layered silicate in which a functional group reactive with a matrix resin is bonded is used, it is compared with the case where the functional group is not bonded. It is also found that the balance between strength and rigidity of the resin composition and toughness is improved, and when the molded product has transparency, the transparency is maintained well. It is also seen from Table 7 that the thermoplastic resin composition of the present invention has improved melt flowability and molding shrinkage, and has excellent moldability. Further, as shown in Table-8, it can be seen that the thermoplastic resin composition of the present invention having a large amount of inorganic ash is excellent as a master batch of layered silicate.
【0083】また表ー7より、芳香族ポリカーボネート
をマトリックス樹脂とする本発明の熱可塑性樹脂組成物
は、例えば何の処理も施さない無機粉体を添加する汎用
的な手法(比較例24)やシランカップリング剤により
マトリックス樹脂との濡れ性を改良する従来技術(比較
例23)に比べ、同等の無機灰分量でもはるかに優れた
透明性を有することがわかる。更に、芳香族ポリカーボ
ネートをマトリックス樹脂とする本発明の熱可塑性樹脂
組成物は、優れた耐衝撃性を有することが表ー9よりわ
かる。Further, from Table 7, the thermoplastic resin composition of the present invention using an aromatic polycarbonate as a matrix resin can be prepared, for example, by a general method (Comparative Example 24) in which an inorganic powder which is not subjected to any treatment is added. It can be seen that compared to the conventional technique (Comparative Example 23) in which the wettability with the matrix resin is improved by the silane coupling agent, the transparency is far superior even with the same amount of inorganic ash. Further, it can be seen from Table 9 that the thermoplastic resin composition of the present invention containing an aromatic polycarbonate as a matrix resin has excellent impact resistance.
【0084】[0084]
【発明の効果】本発明の熱可塑性樹脂組成物は、強度や
剛性に優れ、靱性を損なわず、かつ比重の増加が少な
く、良好な成形表面性や溶融流動性、低い成形収縮率の
ような優れた成形性を有する。また、特に芳香族ポリカ
ーボネート樹脂に代表される透明な熱可塑性樹脂をマト
リックスとした場合、優れた透明性を維持する。本発明
の熱可塑性樹脂組成物は、溶融混練機のような汎用的な
設備で幅広い熱可塑性樹脂マトリックスにおいて容易に
製造可能であり、低比重、良好な表面外観と溶融流動
性、高強度、高剛性、高靱性、低成形収縮率、ガスバリ
ヤー性、良好な透明性等の特徴を生かして、様々な機械
部品、自動車部品、電気電子部品、シート、フィルム、
包材等に応用できる。INDUSTRIAL APPLICABILITY The thermoplastic resin composition of the present invention has excellent strength and rigidity, does not impair toughness, has a small increase in specific gravity, has good molding surface properties, melt fluidity, and low molding shrinkage. It has excellent moldability. Further, particularly when a transparent thermoplastic resin typified by an aromatic polycarbonate resin is used as a matrix, excellent transparency is maintained. The thermoplastic resin composition of the present invention can be easily produced in a wide range of thermoplastic resin matrices with general-purpose equipment such as a melt kneader, and has low specific gravity, good surface appearance and melt fluidity, high strength, and high strength. Making full use of features such as rigidity, high toughness, low molding shrinkage, gas barrier property, and good transparency, various mechanical parts, automobile parts, electric / electronic parts, sheets, films,
It can be applied to packaging materials.
Claims (10)
状珪酸塩をホストとし有機オニウムイオンをゲストとす
る層間化合物と、該反応性官能基と反応しうる熱可塑性
樹脂とを含有し、該層間化合物を無機灰分量として0.
1〜20重量%含むことを特徴とする熱可塑性樹脂組成
物。1. An interlayer compound containing a cation-exchange layered silicate having a reactive functional group as a host and an organic onium ion as a guest, and a thermoplastic resin capable of reacting with the reactive functional group, The intercalation compound was used as an inorganic ash content of 0.
A thermoplastic resin composition comprising 1 to 20% by weight.
状珪酸塩をホストとし有機オニウムイオンをゲストとす
る層間化合物と、該反応性官能基と反応しうる熱可塑性
樹脂とを含有し、該層間化合物を、熱可塑性樹脂100
重量部に対し0.1〜50重量部含むことを特徴とする
熱可塑性樹脂組成物。2. An interlayer compound containing a cation exchange layered silicate having a reactive functional group as a host and an organic onium ion as a guest, and a thermoplastic resin capable of reacting with the reactive functional group, The interlayer compound is a thermoplastic resin 100.
A thermoplastic resin composition comprising 0.1 to 50 parts by weight based on parts by weight.
合連鎖を介して層状珪酸塩に結合していることを特徴と
する請求項1又は請求項2に記載の熱可塑性樹脂組成
物。3. The thermoplastic resin composition according to claim 1 or 2, wherein the reactive functional group is bonded to the layered silicate through a covalent bond chain containing a silicon atom.
であることを特徴とする請求項1ないし3のいずれかに
記載の熱可塑性樹脂組成物。4. The thermoplastic resin composition according to claim 1, wherein the reactive functional group is an amino group or an epoxy group.
がポリアミド樹脂、芳香族ポリエステル樹脂、ポリアリ
ーレンスルフィド樹脂、ポリフェニレンエーテル樹脂、
酸変性ポリオレフィン樹脂及び芳香族ポリカーボネート
樹脂のいずれかであることを特徴とする請求項1ないし
4のいずれかに記載の熱可塑性樹脂組成物。5. A thermoplastic resin capable of reacting with a reactive functional group is a polyamide resin, an aromatic polyester resin, a polyarylene sulfide resin, a polyphenylene ether resin,
The thermoplastic resin composition according to any one of claims 1 to 4, which is either an acid-modified polyolefin resin or an aromatic polycarbonate resin.
酸塩を含有する熱可塑性樹脂組成物であって、該熱可塑
性樹脂組成物中の無機灰分量が0.25〜10重量%で
あり、該熱可塑性樹脂組成物からなる厚さ3mmの成形
品に対する平行可視光線の平行透過率P(%)と無機灰
分量A(重量%)との積が下記式aを満たすことを特徴
とする熱可塑性樹脂組成物。 【数1】P×A≧20・・・・(a)6. A thermoplastic resin composition containing an aromatic polycarbonate resin and a layered silicate, wherein the amount of inorganic ash in the thermoplastic resin composition is 0.25 to 10% by weight, and A thermoplastic resin composition characterized in that the product of parallel transmittance P (%) of parallel visible light and an inorganic ash content A (% by weight) for a molded product of a resin composition having a thickness of 3 mm satisfies the following formula a: object. [Equation 1] P × A ≧ 20 (A)
と反応しうる反応性官能基を有し、該反応性官能基が珪
素原子を含む共有結合連鎖を介して層状珪酸塩に結合し
ていることを特徴とする請求項6に記載の熱可塑性樹脂
組成物。7. The layered silicate has a reactive functional group capable of reacting with an aromatic polycarbonate, and the reactive functional group is bonded to the layered silicate via a covalent bond chain containing a silicon atom. 7. The thermoplastic resin composition according to claim 6.
応性官能基が、エポキシ基であることを特徴とする請求
項7に記載の熱可塑性樹脂組成物。8. The thermoplastic resin composition according to claim 7, wherein the reactive functional group capable of reacting with the aromatic polycarbonate is an epoxy group.
塩であって、該陽イオン交換性層状珪酸塩をホストと
し、有機オニウムイオンをゲストとする層間化合物を形
成していることを特徴とする請求項6ないし8のいずれ
かに記載の熱可塑性樹脂組成物。9. The layered silicate is a cation-exchangeable layered silicate, which forms an intercalation compound using the cation-exchanged layered silicate as a host and an organic onium ion as a guest. The thermoplastic resin composition according to any one of claims 6 to 8.
熱可塑性樹脂組成物の各成分を配合し、溶融混合してな
ることを特徴とする熱可塑性樹脂組成物の製造方法。10. A method for producing a thermoplastic resin composition, characterized in that the components of the thermoplastic resin composition according to claim 1 are blended and melt-mixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23174994A JP3269277B2 (en) | 1994-04-15 | 1994-09-27 | Thermoplastic resin composition |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6-77641 | 1994-04-15 | ||
| JP7764194 | 1994-04-15 | ||
| JP23174994A JP3269277B2 (en) | 1994-04-15 | 1994-09-27 | Thermoplastic resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07331092A true JPH07331092A (en) | 1995-12-19 |
| JP3269277B2 JP3269277B2 (en) | 2002-03-25 |
Family
ID=26418707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23174994A Expired - Fee Related JP3269277B2 (en) | 1994-04-15 | 1994-09-27 | Thermoplastic resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3269277B2 (en) |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939184A (en) * | 1996-05-14 | 1999-08-17 | Showa Denko K.K. | Polyolefin-based composite material containing a stratiform silicate and production process therefor |
| WO2000006649A1 (en) * | 1998-07-30 | 2000-02-10 | Toray Industries, Inc. | Polyamide resin composition and process for producing the same |
| JP2000129056A (en) * | 1998-10-21 | 2000-05-09 | Showa Denko Kk | Adhesive resin composite and laminate thereof |
| JP2002323700A (en) * | 2001-04-26 | 2002-11-08 | Keiwa Inc | Optical sheet and backlight unit using the same |
| JP2003012899A (en) * | 2001-07-02 | 2003-01-15 | Teijin Chem Ltd | Resin composition |
| KR100375438B1 (en) * | 2000-12-06 | 2003-03-10 | 제일모직주식회사 | Thermoplastic Composition and Method of Preparing the same |
| KR100383546B1 (en) * | 1997-12-16 | 2003-08-21 | 제일모직주식회사 | Manufacturing method of thermoplastic composite material |
| US6726989B2 (en) | 2001-02-09 | 2004-04-27 | Fiber Innovation Technology, Inc. | Fibers including a nanocomposite material |
| JP2004169010A (en) * | 2002-11-01 | 2004-06-17 | Teijin Chem Ltd | Aromatic polycarbonate resin composition |
| US7098263B2 (en) | 2001-07-23 | 2006-08-29 | Teijin Chemicals, Ltd. | Thermoplastic resin composition, molded article, and process for producing the same |
| JPWO2005085349A1 (en) * | 2004-03-05 | 2008-01-24 | 帝人株式会社 | Polyester resin composition |
| JP2009062520A (en) * | 2007-08-09 | 2009-03-26 | Nippon Polyethylene Kk | Polyethylene molding material and molded body thereof |
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| JP2010106114A (en) * | 2008-10-29 | 2010-05-13 | Japan Polyethylene Corp | Polyethylene-based laminating material and laminated body thereof |
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1994
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5939184A (en) * | 1996-05-14 | 1999-08-17 | Showa Denko K.K. | Polyolefin-based composite material containing a stratiform silicate and production process therefor |
| KR100383546B1 (en) * | 1997-12-16 | 2003-08-21 | 제일모직주식회사 | Manufacturing method of thermoplastic composite material |
| JP4635278B2 (en) * | 1998-07-30 | 2011-02-23 | 東レ株式会社 | "Polyamide resin composition and method for producing the same" |
| WO2000006649A1 (en) * | 1998-07-30 | 2000-02-10 | Toray Industries, Inc. | Polyamide resin composition and process for producing the same |
| CN1322057C (en) * | 1998-07-30 | 2007-06-20 | 东丽株式会社 | Polyamide resin compsn. and process for producing same |
| JP2000129056A (en) * | 1998-10-21 | 2000-05-09 | Showa Denko Kk | Adhesive resin composite and laminate thereof |
| KR100375438B1 (en) * | 2000-12-06 | 2003-03-10 | 제일모직주식회사 | Thermoplastic Composition and Method of Preparing the same |
| US6726989B2 (en) | 2001-02-09 | 2004-04-27 | Fiber Innovation Technology, Inc. | Fibers including a nanocomposite material |
| JP2002323700A (en) * | 2001-04-26 | 2002-11-08 | Keiwa Inc | Optical sheet and backlight unit using the same |
| JP2003012899A (en) * | 2001-07-02 | 2003-01-15 | Teijin Chem Ltd | Resin composition |
| US7098263B2 (en) | 2001-07-23 | 2006-08-29 | Teijin Chemicals, Ltd. | Thermoplastic resin composition, molded article, and process for producing the same |
| JP2004169010A (en) * | 2002-11-01 | 2004-06-17 | Teijin Chem Ltd | Aromatic polycarbonate resin composition |
| JPWO2005085349A1 (en) * | 2004-03-05 | 2008-01-24 | 帝人株式会社 | Polyester resin composition |
| US7514489B2 (en) | 2005-11-28 | 2009-04-07 | Martin Marietta Materials, Inc. | Flame-retardant magnesium hydroxide compositions and associated methods of manufacture and use |
| JP2009062520A (en) * | 2007-08-09 | 2009-03-26 | Nippon Polyethylene Kk | Polyethylene molding material and molded body thereof |
| JP2010106114A (en) * | 2008-10-29 | 2010-05-13 | Japan Polyethylene Corp | Polyethylene-based laminating material and laminated body thereof |
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