JPH0737632A - Surface mount connector - Google Patents
Surface mount connectorInfo
- Publication number
- JPH0737632A JPH0737632A JP5200448A JP20044893A JPH0737632A JP H0737632 A JPH0737632 A JP H0737632A JP 5200448 A JP5200448 A JP 5200448A JP 20044893 A JP20044893 A JP 20044893A JP H0737632 A JPH0737632 A JP H0737632A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- wiring board
- contact
- soldering
- portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
(57)【要約】 (修正有)
【目的】 絶縁ハウジングに上下2段以上に配列して収
容された複数のコンタクトのハウジングの背面から突出
するリード部先端のはんだ付け部をプリント配線板表面
に一列に配列させると共に、はんだ付け部の位置ずれ及
びばた付きが確実に防止でき、実装スペースを縮小して
省スペース化が図れる表面実装コネクタを供給する。
【構成】 配線板表面に沿って延びるはんだ付け部11
b〜13bとを有している表面実装コネクタにおいて、
リード部11〜13の脚部分11a〜13aが、ハウジ
ング背面2bに沿って、かつ互いに干渉しないように軸
線をずらせて延びると共に、はんだ付け部11b〜13
bの近傍においてハウジング2側に突出する係合突部1
1c〜13cを有し、係合突部11c〜13cがハウジ
ング背面2bに設けた位置規制凹部21〜23に係合し
て、はんだ付け部11b〜13bが配線板表面に一列に
整列されるように構成されている。
(57) [Summary] (Modified) [Purpose] The soldering part of the lead tip protruding from the back of the housing of multiple contacts housed in an insulating housing arranged in two or more stages on the printed wiring board surface. (EN) Provided is a surface mount connector which can be arranged in a row and can surely prevent the position shift and fluttering of the soldering portion and reduce the mounting space to save space. [Structure] Soldering portion 11 extending along the surface of a wiring board
In a surface mount connector having b to 13b,
The leg portions 11a to 13a of the lead portions 11 to 13 extend along the housing rear surface 2b with their axes shifted so as not to interfere with each other, and the soldering portions 11b to 13a.
Engagement protrusion 1 protruding toward the housing 2 in the vicinity of b
1c to 13c, the engaging protrusions 11c to 13c engage with the position regulating recesses 21 to 23 provided on the housing back surface 2b, and the soldering portions 11b to 13b are aligned in a line on the surface of the wiring board. Is configured.
Description
【0001】[0001]
【産業上の利用分野】本発明は、プリント配線板上に載
置され、配線板表面に形成した導電パッドにはんだ付け
して接合される表面実装コネクタに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount connector which is placed on a printed wiring board and soldered to a conductive pad formed on the surface of the wiring board.
【0002】[0002]
【従来の技術】この種の表面実装コネクタについて、例
えば特開平3−134973号公報には、絶縁ハウジン
グに複数のコンタクトがプリント配線板表面に対し上下
2段に配列して収容され、前記絶縁ハウジングの背面か
ら突出する各コンタクトのリード部を、その軸線がずれ
て平行移動するようにクランク状に形成され、前記リー
ド部先端のはんだ付け部がプリント配線板上に一列に整
列される構造を有し、表面実装後にすべてのはんだ付け
部の接着状態を確認できると共に、接着不良箇所を容易
に修正できるようにした表面実装コネクタが開示されて
いる。2. Description of the Related Art A surface mount connector of this type is disclosed in, for example, Japanese Unexamined Patent Publication No. 3-134973, in which a plurality of contacts are housed in an insulating housing arranged in two rows above and below the surface of a printed wiring board. The contact has a structure in which the lead portion of each contact protruding from the back surface is formed in a crank shape so that the axis of the contact portion is displaced in parallel, and the soldered portion at the tip of the lead portion is aligned in a line on the printed wiring board. However, a surface mount connector is disclosed in which the bonding state of all the soldered portions can be confirmed after the surface mounting and the defective bonding can be easily corrected.
【0003】また、前記絶縁ハウジングの背面から突出
する各コンタクトのリード部を前記ハウジングの背面側
に設けた位置規制ガイド部に係合させてピッチ方向(配
列方向)の位置ずれを防止した表面実装コネクタは、例
えば実開昭59−126465号公報、特開平1−23
5174号公報などにより知られている。Further, the surface mounting in which the lead portion of each contact protruding from the rear surface of the insulating housing is engaged with the position regulating guide portion provided on the rear surface side of the housing to prevent the positional deviation in the pitch direction (arrangement direction). The connector is disclosed, for example, in Japanese Utility Model Laid-Open No. 59-126465 and Japanese Patent Laid-Open No. 1-23.
It is known from Japanese Patent No. 5174.
【0004】[0004]
【発明が解決しようとする課題】しかし、前者すなわち
特開平3−134973号公報に記載のコネクタは、ク
ランク状に形成された各コンタクトのリード部が絶縁ハ
ウジングの背面側後方へ長く延びているため、実装スペ
ースが大きくなるばかりではなく、ピッチ方向の位置ず
れが生じ易く、また前記リード部先端のはんだ付け部が
ばた付いて、該はんだ付け部の接着不良が生じ易いとい
う問題があった。However, in the former connector, that is, in the connector disclosed in Japanese Patent Laid-Open No. 3-134973, the lead portion of each crank-shaped contact extends to the rear side of the back side of the insulating housing. However, there is a problem that not only the mounting space becomes large, but also the positional deviation in the pitch direction is likely to occur, and the soldering portion at the tip of the lead portion is fluttered, so that the adhesion failure of the soldering portion is likely to occur.
【0005】一方、後者の実開昭59−126465号
公報あるいは特開平1−235174号公報に記載のコ
ネクタでは、前記リード部のピッチ方向の位置ずれは防
止されるけれども、該リード部先端のはんだ付け部のば
た付きは確実には無くすることができない。また、前記
位置規制ガイド部が前記ハウジングの背面側へ突出して
設けられているため、前記リード部も必然的にハウジン
グの背面後方へ長く延びるので、実装スペースが大きく
なることは避けられない。On the other hand, in the latter connector disclosed in Japanese Utility Model Laid-Open No. 59-126465 or Japanese Patent Application Laid-Open No. 1-235174, the displacement of the lead portion in the pitch direction is prevented, but the solder at the tip of the lead portion is prevented. Flapping of the attachment cannot be eliminated with certainty. Further, since the position regulation guide portion is provided so as to project to the rear surface side of the housing, the lead portion inevitably extends long rearward of the rear surface of the housing, so that a large mounting space cannot be avoided.
【0006】本発明は、上記従来の問題点を解決するも
ので、絶縁ハウジングに上下2段以上に配列して収容さ
れた複数のコンタクトの前記ハウジングの背面から突出
するリード部先端のはんだ付け部をプリント配線板表面
に一列に整列させることができると共に、前記はんだ付
け部の位置ずれ及びばた付きが確実に防止でき、かつ実
装スペースを縮小して省スペース化が図れる表面実装コ
ネクタを提供することを目的とする。The present invention solves the above-mentioned conventional problems, and a soldering portion at the tip of a lead portion protruding from the back surface of the housing of a plurality of contacts housed in an insulating housing arranged in two or more upper and lower stages. Provided is a surface-mounted connector that can be aligned in a line on the surface of a printed wiring board, can reliably prevent positional deviation and fluttering of the soldering portion, and can reduce the mounting space to save space. The purpose is to
【0007】[0007]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、絶縁ハウジングに複数のコンタクトがプ
リント配線板表面に対し上下2段以上に配列して収容さ
れ、前記ハウジングの背面から突出する各コンタクトの
リード部が、前記配線板表面に向かって延びる脚部分
と、前記配線板表面に沿って延びるはんだ付け部とを有
している表面実装コネクタにおいて、前記リード部の脚
部分が、前記ハウジングの背面に沿って、かつ互いに干
渉しないように軸線をずらせて延びると共に、前記はん
だ付け部の近傍において前記ハウジング側に突出する係
合突部を有し、該係合突部が前記ハウジングの背面に設
けた位置規制凹部に係合して、前記はんだ付け部が前記
配線板表面に一列に整列されるように構成されている。To achieve the above object, according to the present invention, a plurality of contacts are housed in an insulating housing arranged in two or more steps above and below the surface of a printed wiring board, and protrude from the back surface of the housing. In the surface mount connector, wherein the lead portion of each contact has a leg portion extending toward the wiring board surface and a soldering portion extending along the wiring board surface, the leg portion of the lead portion is Along the back surface of the housing and with an axis shifted so as not to interfere with each other, there is an engaging projection protruding toward the housing in the vicinity of the soldering portion, and the engaging projection is the housing. The soldering portions are arranged in a line on the surface of the wiring board by engaging with the position regulating recesses provided on the back surface of the wiring board.
【0008】前記コンタクトのリード部に設ける前記係
合突部及び前記脚部分の軸線をずらせるための屈曲は、
前記コンタクトの打ち抜き加工と同時に成形可能であ
る。また、前記コンタクトは上下3段以上に配列して前
記ハウジングに収容することも可能である。The bending for shifting the axes of the engaging projections and the leg portions provided on the lead portion of the contact is
The contact can be formed at the same time as the punching process. Further, the contacts can be housed in the housing by arranging the contacts in three or more stages.
【0009】[0009]
【作用】上記構成により、前記ハウジングの背面から突
出するリード部の脚部分が前記ハウジングの背面に沿っ
て延びると共に、該脚部分に設けた前記係合突部が前記
ハウジングの背面に設けた位置規制凹部に係合するの
で、前記リード部の前記ハウジングの背面後方への突出
量が小さくて、実装スペースが大幅に縮小される。ま
た、前記位置規制凹部に係合する前記係合突部が前記は
んだ付け部の近傍に設けられているので、一列に整列さ
れた前記はんだ付け部の位置ずれ及びばた付きが確実に
防止される。With the above structure, the leg portion of the lead portion projecting from the rear surface of the housing extends along the rear surface of the housing, and the engaging projection provided on the leg portion is provided on the rear surface of the housing. Since it engages with the regulation recess, the amount of protrusion of the lead portion to the rear of the rear surface of the housing is small, and the mounting space is greatly reduced. Further, since the engaging projections that engage with the position regulating recesses are provided in the vicinity of the soldering portions, positional deviation and fluttering of the soldering portions arranged in a line are surely prevented. It
【0010】[0010]
【実施例】以下、本発明の実施例を図面に基づいて説明
する。図1は本発明をDサブコネクタに適用した例を示
す背面図、図2は同縦断側面図である。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a rear view showing an example in which the present invention is applied to a D-sub connector, and FIG. 2 is a vertical sectional side view thereof.
【0011】本発明の表面実装コネクタ1は、絶縁ハウ
ジング2と、該絶縁ハウジング2の前面(嵌合面)2a
から背面2bまで貫通して上段、中段及び下段の上下3
段に設けたコンタクト収容室3,4,5にそれぞれ挿入
して収容される上段コンタクト6群、中段コンタクト群
7及び下段コンタクト8群とから構成されている。The surface mount connector 1 of the present invention comprises an insulating housing 2 and a front surface (fitting surface) 2a of the insulating housing 2.
From top to back 2b, upper, middle and lower top and bottom 3
It is composed of an upper stage contact group 6, an intermediate stage contact group 7 and a lower stage contact group 8 which are respectively inserted and accommodated in the contact accommodating chambers 3, 4, 5 provided in the stages.
【0012】上中下3段のコンタクト収容室3,4,5
は、図1に示すように、千鳥状に配列して設けられ、上
段コンタクト収容室3と下段コンタクト収容室5の軸線
Aが一致し、中間コンタクト収容室4の軸線Bが一定距
離(K)横方向へずれている。そして、ハウジング2の
背面2bの下側部には軸線A及びBと平行に延びる位置
規制凹部21,22,23が一定ピッチ(P)で設けら
れ、そのうち凹部21,22は同一形状であるが、凹部
23は下段コンタクト収容室6まで延びる長溝に形成さ
れている。該位置規制凹部21,22,23はそれぞ
れ、後述するコンタクト6,7,8のリード部11,1
2,13の位置を規制する役割を果す。Contact storage chambers 3, 4, 5 in upper, middle, and lower three stages
1 are arranged in a staggered arrangement as shown in FIG. 1, the axis A of the upper contact housing chamber 3 and the lower contact housing chamber 5 are aligned, and the axis B of the intermediate contact housing chamber 4 is a constant distance (K). It is displaced laterally. Then, on the lower side of the back surface 2b of the housing 2, position regulating recesses 21, 22, 23 extending parallel to the axes A and B are provided at a constant pitch (P), of which the recesses 21, 22 have the same shape. The recess 23 is formed as a long groove extending to the lower contact accommodation chamber 6. The position regulating recesses 21, 22, 23 are respectively the lead portions 11, 1 of the contacts 6, 7, 8 which will be described later.
It plays the role of controlling the positions of 2 and 13.
【0013】コンタクト6,7,8は銅合金などの導電
性金属薄板を打ち抜き曲げ加工して形成され、ピン端子
(図示せず)に嵌合接続する雌型接触部9とその断面コ
字形部の側板に連設された基部10が同一形状で共通し
ているが、基部10に連設するリード部11,12,1
3の形状が異なっている。そして、各コンタクト6,
7,8の雌型接触部9と基部10がハウジング2の各コ
ンタクト収容室4,5,6に挿入して収容され、リード
部11,12,13がハウジング2の背面2から突出し
プリント配線板30の表面に向かって延びる。The contacts 6, 7 and 8 are formed by punching and bending a conductive metal thin plate such as a copper alloy, and a female contact portion 9 to be fitted and connected to a pin terminal (not shown) and its U-shaped section. The base portions 10 connected to the side plates of the same have the same shape and are common, but the lead portions 11, 12, 1 connected to the base portion 10 are connected.
The shapes of 3 are different. And each contact 6,
Female contact portions 9 and base portions 7 and 8 of the housing 2 are inserted and accommodated in the respective contact accommodation chambers 4, 5 and 6 of the housing 2, and lead portions 11, 12 and 13 project from the rear surface 2 of the housing 2 and a printed wiring board. It extends toward the surface of 30.
【0014】上段コンタクト6は、図3に示すように、
リード部11が最も長く形成され、基部10から直角方
向へ屈曲しハウジング2の背面2aに沿って、かつ配線
板30表面に向かって延びる脚部分11aと、該脚部分
11aの下端から配線板30表面に沿って延びるはんだ
付け部11bとを有し、さらにはんだ付け部11bの近
傍においてハウジング2側に突出する係合突部11cを
有している。そして、リード部11が後述する他のコン
タクト7,8のリード部12,13と互いに干渉しない
ようにするため、図1及び図3(b)に示されているよ
うに脚部11aを僅かに屈曲させてはんだ付け部11b
と係合突部11cが軸線Aに沿って延びるように位置を
ずらせて形成されている。このような脚部11aの屈曲
並びにはんだ付け部11b及び係合突部11cはコンタ
クト6の打ち抜き曲げ加工と同時に成形され、別工程を
必要としないので、製造コストを下げる点でも有利であ
る。The upper contact 6 is, as shown in FIG.
The lead portion 11 is formed to have the longest length, is bent at a right angle from the base portion 10, extends along the rear surface 2a of the housing 2, and extends toward the surface of the wiring board 30; It has a soldering part 11b extending along the surface, and further has an engaging projection 11c projecting toward the housing 2 in the vicinity of the soldering part 11b. Then, in order to prevent the lead portion 11 from interfering with the lead portions 12 and 13 of the other contacts 7 and 8 which will be described later, as shown in FIGS. 1 and 3 (b), the leg portion 11a is slightly Bend and solder part 11b
The engaging projection 11c is formed so as to be displaced in position so as to extend along the axis A. Since the bending of the leg portion 11a and the soldering portion 11b and the engaging projection portion 11c are formed at the same time as the punching and bending of the contact 6 and a separate step is not required, it is also advantageous in reducing the manufacturing cost.
【0015】中段コンタクト7は、図4に示すように、
リード部12の脚部分12aがコンタクト6のリード部
11の脚部分11aより若干短く形成されている点が異
なるだけで、はんだ付け部12b及び係合突部12cは
コンタクト6のそれと同一の形状及び大きさを有してい
る。脚部分12aはコンタクト6の脚部分11aより大
き屈曲している。このような脚部分12aの屈曲並びに
はんだ付け部12b及び係合突部12cの成形もコンタ
クト7の打ち抜き曲げ加工と同時に行なえ、別工程を必
要としない。The middle contact 7 is, as shown in FIG.
The soldering portion 12b and the engaging projection 12c have the same shape as that of the contact 6 except that the leg portion 12a of the lead portion 12 is formed slightly shorter than the leg portion 11a of the lead portion 11 of the contact 6. Has a size. The leg portion 12a is bent more than the leg portion 11a of the contact 6. Such bending of the leg portion 12a and molding of the soldering portion 12b and the engaging protrusion 12c can be performed at the same time as the punching and bending of the contact 7, and no separate process is required.
【0016】下段コンタクト8は、図5に示すように、
リード部13が上段コンタクト6のリード部11及び中
段コンタクト7のリード部12と若干異なり、基部10
から直角方向へ屈曲しハウジング2の背面2aに沿っ
て、かつ配線板30表面に向かって延びる脚部分13a
が途中でハウジング2の背面2aから離れる方向へ屈曲
して延び、該屈曲脚部13a´の下端に配線板30表面
に沿って延びるはんだ付け部13bが設けられている。
また、図5(b)に示すように脚部分13a及び屈曲脚
部13a´は屈曲せず、基部10と同一平面上に形成さ
れている。はんだ付け部13bは、はんだ付け部11b
及び12bと同一の形状及び大きさを有している。な
お、脚部分13a自体が上段コンタクト6及び中段コン
タクト7の係合突部11c及び12cに相当する係合突
部13cを兼ねる。The lower contact 8 is, as shown in FIG.
The lead portion 13 is slightly different from the lead portion 11 of the upper contact 6 and the lead portion 12 of the middle contact 7,
A leg portion 13a which is bent at a right angle from and extends along the back surface 2a of the housing 2 and toward the surface of the wiring board 30.
Is bent and extended in a direction away from the back surface 2a of the housing 2, and a soldering portion 13b extending along the surface of the wiring board 30 is provided at the lower end of the bent leg portion 13a '.
Further, as shown in FIG. 5B, the leg portion 13a and the bent leg portion 13a 'are not bent and are formed on the same plane as the base portion 10. The soldering portion 13b is the soldering portion 11b.
And 12b have the same shape and size. The leg portion 13a itself also serves as the engagement protrusion 13c corresponding to the engagement protrusions 11c and 12c of the upper contact 6 and the middle contact 7.
【0017】上記構成を有するコンタクト6,7,8の
接触部9を各コンタクト収容室3,4,5にハウジング
2の背面2b側から挿入して収容保持させると、上段コ
ンタクト6のリード部11の係合突部11cが位置規制
凹部21に係合し、また中段コンタクト7のリード部1
2の係合突部12cが位置規制凹部22に係合し、さら
に下段コンタクト8のリード部13の脚部分13aが位
置規制凹部23に係合して、各コンタクト6,7,8の
はんだ付け部11b,12b,13bがプリント配線板
30表面に一列に整列され、プリント配線板30表面に
形成した導電パッド31にはんだ付けして接合される。
このとき、各コンタクト6,7,8のリード部11,1
2,13は軸線がずれ、互いに干渉しない姿勢で配設さ
れる。なお、コネクタ1をプリント配線板30上に載置
して実装するに際しては、ハウジング2の底部に突設し
た固定用ボス25,25をプリント配線板30に設けた
取付孔(図示せず)に挿入して、各はんだ付け部11
b,12b,13bが導電パッド31に位置決めされた
状態でコネクタ1をプリント配線板30に固定する。When the contact portions 9 of the contacts 6, 7 and 8 having the above-described structure are inserted into the contact receiving chambers 3, 4 and 5 from the rear surface 2b side of the housing 2 and held therein, the lead portion 11 of the upper contact 6 is formed. Of the middle contact 7 is engaged with the position regulation recess 21.
The engaging protrusion 12c of No. 2 engages with the position regulating recess 22, and the leg portion 13a of the lead portion 13 of the lower contact 8 engages with the position regulating recess 23 to solder each contact 6, 7, 8. The parts 11b, 12b, 13b are aligned on the surface of the printed wiring board 30 in a line, and soldered and joined to the conductive pads 31 formed on the surface of the printed wiring board 30.
At this time, the lead portions 11, 1 of the contacts 6, 7, 8
The axes 2 and 13 are arranged such that their axes are offset and do not interfere with each other. When mounting the connector 1 on the printed wiring board 30 and mounting it, the fixing bosses 25, 25 projecting from the bottom of the housing 2 are installed in mounting holes (not shown) provided in the printed wiring board 30. Insert and solder 11
The connector 1 is fixed to the printed wiring board 30 with b, 12b, and 13b positioned on the conductive pad 31.
【0018】[0018]
【発明の効果】以上説明したように、本発明によれば、
絶縁ハウジングの背面から突出する各コンタクトのリー
ド部の脚部分が前記ハウジングの背面に沿って、かつ互
いに干渉しないように軸線をずらせプリント配線板表面
に向かって延びると共に、前記脚部分に設けた係合突部
が前記ハウジングの背面に設けた位置規制凹部に係合す
るように構成したから、前記コンタクトが上下に2段以
上に配列して設けられているにもかかわらず、前記リー
ド部の前記ハウジングの背面後方への突出量が小さく、
したがって実装スペースを縮小でき省スペース化が図れ
る。As described above, according to the present invention,
The legs of the lead portions of the contacts protruding from the back surface of the insulating housing extend along the back surface of the housing with their axes offset so as not to interfere with each other, and extend toward the surface of the printed wiring board. Since the abutting portion is configured to engage with the position regulating recess provided on the back surface of the housing, the contact of the lead portion is formed even though the contacts are arranged vertically in two or more stages. The amount of protrusion to the rear of the housing is small,
Therefore, the mounting space can be reduced and the space can be saved.
【0019】また、前記位置規制凹部に係合する各リー
ドの前記係合突部が前記はんだ付け部の近傍に設けられ
ているので、一列に整列された前記はんだ付け部の位置
ずれ及びばた付きが確実に防止できる。さらに、前記は
んだ付け部を一列に整列することで、はんだ付け状態の
確認が容易で、修正も簡単に行なえる。Further, since the engaging projections of the respective leads engaging with the position regulating recesses are provided in the vicinity of the soldering portions, the soldering portions arranged in a line are displaced and spread. Sticking can be reliably prevented. Furthermore, by arranging the soldering portions in a line, it is possible to easily confirm the soldering state and easily perform correction.
【図1】本発明に係る表面実装コネクタの背面図であ
る。FIG. 1 is a rear view of a surface mount connector according to the present invention.
【図2】本発明に係る表面実装コネクタの実装状態を示
す縦断側面図である。FIG. 2 is a vertical cross-sectional side view showing a mounted state of the surface mount connector according to the present invention.
【図3】上段コンタクトを示し、(a)は正面図、
(b)は側面図である。FIG. 3 shows an upper contact, (a) is a front view,
(B) is a side view.
【図4】中段コンタクトを示し、(a)は正面図、
(b)は側面図である。FIG. 4 shows a middle contact, (a) is a front view,
(B) is a side view.
【図5】下段コンタクトを示し、(a)は正面図、
(b)は側面図である。FIG. 5 shows a lower contact, (a) is a front view,
(B) is a side view.
1 表面実装コネクタ 2 絶縁ハウジング 2b ハウジング背面 3 上段コンタクト収容室 4 中段コンタクト収容室 5 下段コンタクト収容室 6 上段コンタクト 7 中段コンタクト 8 下段コンタクト 11,12,13 リード部 11a,12a,13a 脚部分 11b,12b,13b はんだ付け部 11c,12c,13c 係合突部 21,22,23 位置規制凹部 1 Surface Mount Connector 2 Insulation Housing 2b Housing Rear Surface 3 Upper Contact Storage Chamber 4 Middle Contact Storage Chamber 5 Lower Contact Storage Chamber 6 Upper Contact 7 Middle Contact 8 Lower Contact 11, 12, 13 Leads 11a, 12a, 13a Legs 11b, 12b, 13b Soldering parts 11c, 12c, 13c Engaging projections 21, 22, 23 Position regulating recesses
Claims (3)
リント配線板表面に対し上下2段以上に配列して収容さ
れ、前記ハウジングの背面から突出する各コンタクトの
リード部が、前記配線板表面に向かって延びる脚部分
と、前記配線板表面に沿って延びるはんだ付け部とを有
している表面実装コネクタにおいて、 前記リード部の脚部分が、前記ハウジングの背面に沿っ
て、かつ互いに干渉しないように軸線をずらせて延びる
と共に、前記はんだ付け部の近傍において前記ハウジン
グ側に突出する係合突部を有し、該係合突部が前記ハウ
ジングの背面に設けた位置規制凹部に係合して、前記は
んだ付け部が前記配線板表面に一列に整列されるように
構成されている表面実装コネクタ。1. A plurality of contacts are arranged and housed in an insulating housing in two or more stages above and below the surface of a printed wiring board, and lead portions of each contact protruding from the back surface of the housing face the surface of the wiring board. In a surface mount connector having an extending leg portion and a soldering portion extending along the surface of the wiring board, the leg portion of the lead portion is arranged along the rear surface of the housing and so as not to interfere with each other. And an engaging protrusion that protrudes toward the housing in the vicinity of the soldering portion and that is engaged with a position regulating recess provided on the back surface of the housing, A surface mount connector configured such that the soldering portions are aligned on the surface of the wiring board.
係合突部及び前記脚部分の軸線のずれが、前記コンタク
トの打ち抜き加工と同時に成形されていることを特徴と
する請求項1記載の表面実装コネクタ。2. The surface mounting according to claim 1, wherein the engagement protrusion and the leg portion provided on the lead portion of the contact are misaligned with the axis at the same time when the contact is punched. connector.
対し上下3段以上に配列して前記ハウジングに収容され
ていることを特徴とする請求項1又は2記載の表面実装
コネクタ。3. The surface mount connector according to claim 1, wherein the contacts are arranged in three or more stages above and below the surface of the printed wiring board and housed in the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5200448A JP2769965B2 (en) | 1993-07-19 | 1993-07-19 | Surface mount connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5200448A JP2769965B2 (en) | 1993-07-19 | 1993-07-19 | Surface mount connector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0737632A true JPH0737632A (en) | 1995-02-07 |
| JP2769965B2 JP2769965B2 (en) | 1998-06-25 |
Family
ID=16424476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5200448A Expired - Fee Related JP2769965B2 (en) | 1993-07-19 | 1993-07-19 | Surface mount connector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2769965B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009025276A1 (en) * | 2007-08-22 | 2009-02-26 | Autonetworks Technologies, Ltd. | Board connector |
| US8375755B2 (en) | 2007-02-01 | 2013-02-19 | Kyodo Yushi Co., Ltd. | Metal working fluid composition and metal working method |
| JP2019192612A (en) * | 2018-04-27 | 2019-10-31 | パナソニックIpマネジメント株式会社 | connector |
| CN110416769A (en) * | 2018-04-27 | 2019-11-05 | 松下知识产权经营株式会社 | The terminal for connector that connector and the connector have |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485682U (en) * | 1990-11-30 | 1992-07-24 | ||
| JPH05109445A (en) * | 1991-10-17 | 1993-04-30 | Nec Corp | Surface mount connector |
-
1993
- 1993-07-19 JP JP5200448A patent/JP2769965B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0485682U (en) * | 1990-11-30 | 1992-07-24 | ||
| JPH05109445A (en) * | 1991-10-17 | 1993-04-30 | Nec Corp | Surface mount connector |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8375755B2 (en) | 2007-02-01 | 2013-02-19 | Kyodo Yushi Co., Ltd. | Metal working fluid composition and metal working method |
| WO2009025276A1 (en) * | 2007-08-22 | 2009-02-26 | Autonetworks Technologies, Ltd. | Board connector |
| JP2009048919A (en) * | 2007-08-22 | 2009-03-05 | Auto Network Gijutsu Kenkyusho:Kk | Board connector |
| US8083530B2 (en) | 2007-08-22 | 2011-12-27 | Autonetworks Technologies, Ltd. | Circuit board connector |
| JP2019192612A (en) * | 2018-04-27 | 2019-10-31 | パナソニックIpマネジメント株式会社 | connector |
| CN110416769A (en) * | 2018-04-27 | 2019-11-05 | 松下知识产权经营株式会社 | The terminal for connector that connector and the connector have |
| CN110416769B (en) * | 2018-04-27 | 2022-09-23 | 松下知识产权经营株式会社 | Connector and terminal for connector provided with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2769965B2 (en) | 1998-06-25 |
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Legal Events
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|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19980303 |
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| R250 | Receipt of annual fees |
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