JPH073876B2 - Photovoltaic device - Google Patents
Photovoltaic deviceInfo
- Publication number
- JPH073876B2 JPH073876B2 JP61267212A JP26721286A JPH073876B2 JP H073876 B2 JPH073876 B2 JP H073876B2 JP 61267212 A JP61267212 A JP 61267212A JP 26721286 A JP26721286 A JP 26721286A JP H073876 B2 JPH073876 B2 JP H073876B2
- Authority
- JP
- Japan
- Prior art keywords
- amorphous silicon
- layer
- photovoltaic device
- conductivity type
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/17—Photovoltaic cells having only PIN junction potential barriers
- H10F10/172—Photovoltaic cells having only PIN junction potential barriers comprising multiple PIN junctions, e.g. tandem cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/10—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material
- H10F71/103—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials
- H10F71/1035—Manufacture or treatment of devices covered by this subclass the devices comprising amorphous semiconductor material including only Group IV materials having multiple Group IV elements, e.g. SiGe or SiC
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Photovoltaic Devices (AREA)
Description
【発明の詳細な説明】 (イ)産業上の利用分野 本発明は複数個の単位発電素子を積層した光起電力装置
に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a photovoltaic device in which a plurality of unit power generation elements are stacked.
(ロ)従来の技術 特開昭55-125680号公報等に開示された如く、pin、pn-n
+等の半導体接合を有する単位発電素子を2重、3重或
いはそれ以上に多重に積層せしめた所謂タンデム構造の
光起電力装置は既に知られている。この様なタンデム構
造の光起電力装置は光入射側から見て前段の単位発電素
子に於いて発電に寄与することなく透過した光を、後段
の単位発電素子に於いて吸収することができトータル的
な光電変換効率を上昇せしめることができる。また各単
位発電素子の上記i型層やn-型層のように光入射がある
と主として光キャリアを発生する光活性層の光学的禁止
帯幅(Egopt)を調整すれば各単位発電素子に於ける感
光ピーク波長をシフトせしめることができ、より一層の
光電変換効率の上昇が図れる。(B) Prior art As disclosed in Japanese Patent Laid-Open No. 55-125680, pin, pn - n
A photovoltaic device having a so-called tandem structure, in which unit power generating elements having semiconductor junctions such as + are stacked in a double, triple or more layers, is already known. Such a tandem structure photovoltaic device can absorb the transmitted light without contributing to power generation in the unit power generation element in the front stage when viewed from the light incident side, and can absorb the light in the unit power generation element in the rear stage. The photoelectric conversion efficiency can be increased. Moreover, if the optical bandgap (Egopt) of the photoactive layer that mainly generates photocarriers when light is incident, such as the i-type layer or the n − type layer of each unit power generation element, is adjusted, each unit power generation element It is possible to shift the photosensitivity peak wavelength in the photosensitivity and further increase the photoelectric conversion efficiency.
上記光活性層で発生した電子及び正孔の光キャリアは、
該光活性層を挾むp型層及びn型層が作る接合電界に引
かれて、電子はn型層に向って移動すると共に、正孔は
p型層に向って移動して集電され外部に取り出される。
従って、単位発電素子にあっては実際に発電に寄与する
i型層やn-型層のように不純物が全くドープされていな
いか、僅かにドープされた光活性層のみならず上記接合
電界を形成するための不純物層が不可欠な存在である。The photo carriers of electrons and holes generated in the photoactive layer are
The electrons move toward the n-type layer and the holes move toward the p-type layer and are collected by the junction electric field created by the p-type layer and the n-type layer sandwiching the photoactive layer. It is taken out.
Therefore, actually contributes to the power generation i-type layer and n In the unit power generating element - or is not at all doped impurities as type layer, the junction field not only photoactive layer slightly doped The impurity layer for forming is indispensable.
然し乍ら、この様に接合電界を形成するために不可欠な
不純物層は光活性層と同じく光入射経路に介在せしめら
れる結果、斯る不純物層に於ける光吸収が多くなると光
活性層への光到達率が減少し、光電変換効率の大幅な低
下を招く。However, the impurity layer indispensable for forming the junction electric field is interposed in the light incident path like the photoactive layer, and as a result, when the light absorption in the impurity layer increases, the light reaches the photoactive layer. The rate is reduced, and the photoelectric conversion efficiency is significantly reduced.
特開昭57-95677号公報、特開昭57-104276号公報及び特
開昭57-136377号公報には、一つの単位発電素子からな
る光起電力装置に於いて、光活性層の光入射側前方に配
置される不純物層、所謂窓層を光活性層より光学的禁止
帯幅Egoptの広いアモルファスシリコンカーバイド、ア
モルファスシリコンナイトライドのワイドバンドギャッ
プ材料によって構成することにより、斯る窓層に於ける
光吸収の低減を図る技術が開示されている。JP-A-57-95677, JP-A-57-104276, and JP-A-57-136377 disclose that in a photovoltaic device including one unitary power generating element, light is incident on a photoactive layer. In the window layer, the impurity layer disposed on the front side, that is, a so-called window layer is made of a wide bandgap material such as amorphous silicon carbide having a wider optical bandgap Egopt than the photoactive layer or amorphous silicon nitride. A technique for reducing light absorption is disclosed.
従って、斯るワイドバンドギャップ材料の光吸収の低減
作用を、タンデム構造に於いて発電に殆ど寄与しない接
合電界形成用の不純物層に適用すれば当該不純物層に於
ける光吸収を可及的に減少させ、光電変換効率の上昇を
図ることができる。Therefore, if the effect of reducing the light absorption of such a wide band gap material is applied to the impurity layer for forming the junction electric field that hardly contributes to power generation in the tandem structure, the light absorption in the impurity layer can be minimized. The photoelectric conversion efficiency can be increased by decreasing the amount.
然し乍ら、単位発電素子が相隣り合う接触界面は逆接合
となり、界面接合性が悪く電圧降下の原因となる。従っ
て界面不純物層に於ける光吸収を減少させるべく、ワイ
ドバンドギャップ材料を用いても界面接合性の悪化を招
き、その結果大幅な光電変換効率の上昇を実現すること
ができなかった。However, the contact interface where the unitary power generating elements are adjacent to each other has a reverse junction, and the interface junction property is poor and causes a voltage drop. Therefore, even if a wide band gap material is used in order to reduce the light absorption in the interface impurity layer, the interface bondability is deteriorated, and as a result, the photoelectric conversion efficiency cannot be significantly increased.
(ハ)発明が解決しようとする問題点 本発明光起電力装置は上述の如く複数個の単位発電素子
を積層した所謂タンデム構造に於いて、発電に殆ど寄与
しない接合電界形成用の不純物層に於ける光吸収をワイ
ドバンドギャップ材料を使用することにより、可及的に
減少させることが可能となる反面、電圧が降下する点を
解決しようとするものである。(C) Problems to be Solved by the Invention The photovoltaic device of the present invention has a so-called tandem structure in which a plurality of unit power generation elements are stacked as described above, and has an impurity layer for forming a junction electric field that hardly contributes to power generation. By using a wide band gap material, it is possible to reduce light absorption as much as possible, but it is intended to solve the problem of voltage drop.
(ニ)問題点を解決するための手段 本発明光起電力装置は、上記問題点を解決するために、
相隣り合う単位発電素子の接触界面に配置される不純物
層は、上記アモルファスシリコンより光学的禁止帯幅の
広い、一導電型と逆導電型とのワイドバンドギャップア
モルファスシリコン合金の層、で構成され、これら不純
物層間には導電型を有する非単結晶シリコンの層が介在
せしめられたことを特徴とする。(D) Means for Solving the Problems In order to solve the above problems, the photovoltaic device of the present invention comprises:
The impurity layer arranged at the contact interface between adjacent unit power generation elements is composed of a layer of a wide band gap amorphous silicon alloy of one conductivity type and opposite conductivity type, which has a wider optical band gap than the amorphous silicon. A layer of non-single crystal silicon having a conductivity type is interposed between these impurity layers.
(ホ)作用 上述の如く一導電型及び逆導電型のワイドバンドギャッ
プアモルファスシリコン合金の層を相隣り合う単位発電
素子の接触界面に配置することによって、各層は前段の
単位発電素子に於ける光活性層で吸収されなかった入射
光を後段の単位発電素子に透過させると共に、斯るアモ
ルファスシリコン合金に挾まれる非単結晶シリコンが界
面接合性を改善する。(E) Action As described above, by arranging the layers of wide bandgap amorphous silicon alloys of one conductivity type and reverse conductivity type at the contact interfaces of the adjacent unit power generating elements, each layer is a light source in the unit power generating element of the preceding stage. The incident light that is not absorbed by the active layer is transmitted to the unitary power generating element in the subsequent stage, and the non-single-crystal silicon sandwiched by the amorphous silicon alloy improves the interfacial bondability.
(ヘ)実施例 第1図は本発明光起電力装置の基本構造を示す模式的断
面図で、ガラス等の透光性且つ絶縁性の基板(1)の一
方の主面にITO、SnO2等に代表される透光性導電酸化物
(TCO)の受光面電極(2)を形成した後、夫々が単独
で実質的に発電素子として機能する第1及び第2の単位
発電素子(SC1)(SC2)が第1の単位発電素子(SC1)
を上記受光面電極(2)と接した状態で順次積層されて
いる。そして、第2の単位発電素子(SC2)の露出面で
ある光入射方向から見て背面に、Al、Ag、Al/Ti、Al/Ti
Ag、TCO/Ag、TCO/Al、TCO/Al/Ti等の単層乃至三層構造
の背面電極(3)が結合されている。(F) Example FIG. 1 is a schematic sectional view showing the basic structure of the photovoltaic device of the present invention. ITO, SnO 2 is provided on one main surface of a transparent and insulating substrate (1) such as glass. After forming the light-receiving surface electrode (2) of a translucent conductive oxide (TCO) typified by, for example, each of the first and second unit power generating elements (SC 1 ) (SC 2 ) is the first unitary power generation element (SC 1 )
Are sequentially stacked in contact with the light-receiving surface electrode (2). Then, Al, Ag, Al / Ti, Al / Ti are formed on the back surface of the second unit power generation element (SC 2 ) which is the exposed surface when viewed from the light incident direction.
A back electrode (3) having a single-layer or three-layer structure of Ag, TCO / Ag, TCO / Al, TCO / Al / Ti, etc. is connected.
上記第1・第2の単位発電素子(SC1)(SC2)の各々
は、アモルファスシリコン(a−Si)を主体とし、Si
H4、SiH4、SiH4+SiF4、Si2H6等のシリコン化合物ガス
を主原料ガスとし、適宜p型、n型の価電子制御用のB2
H6、PH3等の不純物ガスやワイドバンドギャップ用のC
H4、C2H6、C2H2、NH3、NO等のワイドバンドギャップ用
ガスを添加した原料ガスによるプラズマ分解や低圧水銀
ランプを使用した光分解等により形成される。そして、
各単位発電素子(SC1)(SC2)は、上記価電子制御用の
不純物ガスを全く含まない状態で形成されたノンドープ
なi型層か、僅かに不純物を含んだスライトリィドープ
な層からなる光活性層(41)(42)と、該光活性層
(41)(42)で形成された光キャリアの移動を促進する
接合電界を発生させるべく当該光活性層(41)(42)を
挾んだp型或いはn型の不純物層(5d11)(5d12)(5d
21)(5d22)と、からなり、光入射側から見て、pin/pi
n或いはnip/nipのタンデム構造を備えている。Each of the first and second unit power generating elements (SC 1 ) (SC 2 ) is mainly composed of amorphous silicon (a-Si)
A silicon compound gas such as H 4 , SiH 4 , SiH 4 + SiF 4 , and Si 2 H 6 is used as a main raw material gas, and B 2 for controlling p-type and n-type valence electrons is appropriately used.
Impurity gas such as H 6 and PH 3 and C for wide band gap
It is formed by plasma decomposition with a raw material gas to which a wide band gap gas such as H 4 , C 2 H 6 , C 2 H 2 , NH 3 , and NO is added, or photolysis using a low-pressure mercury lamp. And
Each unit power generation element (SC 1 ) (SC 2 ) is composed of a non-doped i-type layer formed in a state that does not contain any impurity gas for controlling valence electrons or a slightly doped layer containing slightly impurities. photoactive layer as a (4 1) (4 2), the photoactive layer (4 1) (4 2) so as to generate a junction field that promotes movement of the optical carriers is formed in the photoactive layer (4 1 ) (4 2 ) sandwiched between p-type and n-type impurity layers (5d 11 ) (5d 12 ) (5d
21 ) (5d 22 ), and, when viewed from the light incident side, pin / pi
It has a tandem structure of n or nip / nip.
而して、本発明の特徴は互いに相隣り合う第1・第2の
単位発電素子(SC1)(SC2)のn/p或いはp/n接触界面に
配置される不純物層(5d12)(5d21)が、第2図(a)
に示す如く、第1単位発電素子(SC1)側を第1層(5d
12w)と第2層(5d12n)の二層構成としたり、第2図
(b)の如く第2単位発電素子(SC2)側を第2層(5d
12n)と第3層(5d21w)の二層構成としたり、また第2
図(c)のように両者ともに第1層(5d12w)と第2層
(5d12n)及び第3層(5d21n′)と第4層(5d21w′)
の二層構成とすると共に、その何れの形態に於いてもp
型或いはn型の導電型を有するアモルファスシリコン或
いは微結晶シリコン(μc−Si)等の非単結晶シリコン
の層(5d12n′)、(5d21n)、(5d12n)、(5d21n′)
を、上記第1i型層(i1)のアモルファスシリコンより光
学的禁止帯幅の広いワイドバンドギャップアモルファス
シリコン合金の層(5d12w)(5d21)、(5d12)(5
d21w)、(5d12w)(5d21′)で挾着したサンドイッチ
構造としたところにある。そして、上記ワイドバンドギ
ャップアモルファスシリコン合金は、光学的禁止帯幅が
約1.8eV以上のアモルファスシリコンカーバイド(a−S
i1-xCx)、アモルファスシリコンナイトライド(a−Si
1-xNx)、アモルファスシリコンオキサイド(a−Si1-x
Ox)、アモルファスシリコンオキシナイトライド(a−
Si1-2xNxOx)等からなり、この内から1種或いは2種が
選択され使用される。そして、種々のワイドバンドギャ
ップ材料の組合せの内から、n型のa−Si1-xNxとp型
のa−Si1-xCxとの組合せ、p型a−Si1-xNxとn型a−
Si1-xCxとの組合せ、p型a−Si1-2xNxOxとn型a−Si
1-xCxとの組合せ、或いはn型a−Si1-xNxとp型a−Si
1-2xNxOxとの組合せが好適である。Thus, the feature of the present invention is that the impurity layer (5d 12 ) arranged at the n / p or p / n contact interface of the first and second unit power generating elements (SC 1 ) (SC 2 ) adjacent to each other. (5d 21 ) is shown in Fig. 2 (a).
As shown in, the first unit power generation element (SC 1 ) side is connected to the first layer (5d
12w ) and the second layer (5d 12n ), or as shown in FIG. 2 (b), the second unit power generating element (SC 2 ) side is connected to the second layer (5d).
12n ) and the third layer (5d 21w ), or the second layer
As shown in Figure (c), both are the first layer (5d 12w ), the second layer (5d 12n ), the third layer (5d 21n ′) and the fourth layer (5d 21w ′).
In addition to the two-layer structure of
-Type or n-type conductivity type non-single-crystal silicon layers such as amorphous silicon or microcrystalline silicon (μc-Si) (5d 12n ′), (5d 21n ), (5d 12n ), (5d 21n ′)
A wide bandgap amorphous silicon alloy layer (5d 12w ) (5d 21 ), (5d 12 ), (5d 12 ) (5) having an optical bandgap wider than the amorphous silicon of the first i-type layer (i 1 ) above.
d 21w ), (5d 12w ) (5d 21 ′) and sandwich structure. The wide bandgap amorphous silicon alloy is an amorphous silicon carbide (a-S) having an optical bandgap of about 1.8 eV or more.
i 1-x C x ), amorphous silicon nitride (a-Si
1-x N x ), amorphous silicon oxide (a-Si 1-x
O x ), amorphous silicon oxynitride (a-
Si 1-2x N x O x ), etc., and one or two of them are selected and used. Among various combinations of wide band gap materials, a combination of n-type a-Si 1-x N x and p-type a-Si 1-x C x , a p-type a-Si 1-x N x x and n-type a-
Combination with Si 1-x C x , p-type a-Si 1-2x N x O x and n-type a-Si
Combination with 1-x C x , or n-type a-Si 1-x N x and p-type a-Si
Combination of 1-2x N x O x is preferable.
下記第1表は光起電力装置の基本特性(初期値)である
開放電圧Voc(V)、短絡電流Isc(mA)、フィルファタ
クFF(%)、光電変換効率η(%)につき本発明構造の
第2図(a)の実施例と従来構造の比較例と、を赤道直
下の太陽光線(AM−1)を擬似的に照射する照射強度10
0mW/cm2のソーラシュミレータを用いて測定した実測値
をまとめたものである。Table 1 below shows the basic characteristics (initial values) of the photovoltaic device, which are the open circuit voltage Voc (V), short circuit current Isc (mA), fill factor FF (%), and photoelectric conversion efficiency η (%) of the present invention. Irradiation intensity for artificially irradiating the sunbeam (AM-1) immediately below the equator between the embodiment of FIG.
This is a summary of the actual measurement values measured using a 0 mW / cm 2 solar simulator.
斯る測定に供せられた光起電力装置は何れも光入射側か
ら見て、ガラス基板(1)/TCO受光面電極(2)/pin接
合型第1単位発電素子(SC1)/pin接合型第2単位発電
素子(SC2)/Al背面電極(3)のタンデム構造であり、
第1単位発電素子(SC1)と第2単位発電素子(SC2)と
の接触界面には、第1単位発電素子(SC1)の不純物層
(5d12)はn型であり、a−Si1-xNxの第1層(5d12w)
と、a−Si或いはμc−Siの第2層(5d12n)とからな
り二層が、第2単位発電素子(SC2)の不純物層(5
d21)はp型のa−Si1-xCxが夫々配置された。そして、
接触界面を構成する第1単位発電素子(SC1)の不純物
層(5d12)と第2単位発電素子(SC2)の不純物層(5d
21)の組成のみを可変とし、他の構成要素は実施例及び
比較例ともに共通仕様とした。第1・第2の単位発電素
子(SC1)(SC2)は特開昭56-114387号公報に開示され
た、当該アモルファスシリコンを主体とする単位発電素
子(SC1)(SC2)の製造方法として一般的な三室分離式
プラズマCVD法を用いて製造した。本実施例1及び2に
於けるプラズマCVD条件を第2表に記すと共に、斯るCVD
条件により製造された構成を第3表に示す。 The photovoltaic devices used for such measurement are all viewed from the light incident side, the glass substrate (1) / TCO light receiving surface electrode (2) / pin junction type first unit power generating element (SC 1 ) / pin It is a tandem structure of the junction type second unit power generation element (SC 2 ) / Al back electrode (3),
At the contact interface between the first unit power generating element (SC 1 ) and the second unit power generating element (SC 2 ), the impurity layer (5d 12 ) of the first unit power generating element (SC 1 ) is n-type, and a− First layer of Si 1-x N x (5d 12w ).
And the second layer (5d 12n ) of a-Si or μc-Si, the two layers are the impurity layers (5) of the second unit power generating element (SC 2 ).
In d 21 ), p-type a-Si 1-x C x was arranged, respectively. And
The impurity layer (5d 12 ) of the first unit power generating element (SC 1 ) and the impurity layer (5d of the second unit power generating element (SC 2 ) that form the contact interface
Only the composition of 21 ) was made variable, and the other constituents had the same specifications for both the examples and comparative examples. First and second unitary power generation element (SC 1) (SC 2) is disclosed in JP-A-56-114387, the unit power generating element (SC 1) mainly comprising the amorphous silicon (SC 2) A general three-chamber separation type plasma CVD method was used as a manufacturing method. Table 2 shows the plasma CVD conditions in Examples 1 and 2 and
Table 3 shows the structure manufactured under the conditions.
ただし、層5d12nの( )内は実施例2のみの条件であ
って、その他は実施例1及び2ともに共通である。 However, the conditions in parentheses of the layers 5d 12n are the conditions for only the second embodiment, and the other conditions are common to both the first and second embodiments.
共通条件 電源:13.56MHz高周波電源 SiH4ガス流量:10(SCCM) ガス圧力:0.3〜0.5(Torr) ただし、層5d12nの( )内は実施例2のみの構成であ
って、その他は実施例1及び2共に共通である。Common conditions Power supply: 13.56MHz high frequency power supply SiH 4 Gas flow rate: 10 (SCCM) Gas pressure: 0.3 to 0.5 (Torr) However, the layer 5d 12n in parentheses is the configuration of only the second embodiment, and the other is common to both the first and second embodiments.
一方、比較対象となった比較例1及び比較例2の界面不
純物層(5d12)(5d21)の構成は下記第4表の通りであ
る。On the other hand, the structures of the interface impurity layers (5d 12 ) (5d 21 ) of Comparative Examples 1 and 2 which are comparison targets are as shown in Table 4 below.
この様に第1・第2単位発電素子(SC1)(SC2)の接合
界面の不純物層(5d12w)(5d21)として、比較例2と
同じワイドバンドギャップ材料のa−Si1-xNx、a−Si
1-xCxにより構成したにも拘わず、a−Si或いはμc−S
iの層(5d12)をその両者間に介在させることによって
開放電圧Vocが向上し、また斯るa−Si或いはμc−Si
の層(5d12n)を設けても比較例2の短絡電流Iscとほと
んど変わりのない数値が得られ、その結果光電変換効率
が上昇した。 Thus, as the impurity layers (5d 12w ) (5d 21 ) at the junction interface between the first and second unit power generating elements (SC 1 ) (SC 2 ), the same wide bandgap material a-Si 1- x N x, a-Si
Despite being composed of 1-x C x , a-Si or μc-S
The open-circuit voltage Voc is improved by interposing the i layer (5d 12 ) between the two, and the a-Si or μc-Si
Even if the layer (5d 12n ) was provided, a numerical value almost the same as the short circuit current Isc of Comparative Example 2 was obtained, and as a result, the photoelectric conversion efficiency was increased.
一方、上記構成に於ける実施例及び比較例につき経時劣
化について測定した。劣化試験は、赤道直下の太陽光線
の光強度100mV/cm2の5倍の強度である500mW/cm2のAM−
1光を5時間照射したときの光電変換効率と測定する光
劣化試験と、200℃50時間経過後の光電変換効率の初期
値に対する劣化を求める熱劣化試験とを夫々個別に施し
た。その結果が第5表に示してある。On the other hand, the deterioration over time was measured for the examples and comparative examples having the above-mentioned constitution. The deterioration test is AM- of 500 mW / cm 2 which is 5 times the intensity of 100 mV / cm 2 of the sunlight directly below the equator.
A photodegradation test for measuring the photoelectric conversion efficiency when irradiated with one light for 5 hours and a heat deterioration test for determining deterioration with respect to the initial value of the photoelectric conversion efficiency after 200 hours at 50 ° C. were individually performed. The results are shown in Table 5.
斯る光劣化及び熱劣化試験の結果、本実施例構造はa−
Siを主体とする発電素子特有の光劣化及び熱劣化にも有
効であることが判明した。 As a result of such light deterioration and heat deterioration tests, the structure of this embodiment is a-
It was found that it is also effective for the photodegradation and heat degradation peculiar to the power generation element mainly composed of Si.
(ト)発明の効果 本発明は以上の説明から明らかな如く、相隣り合う単位
発電素子の接触界面に配置される不純物層として、ワイ
ドバンドギャップアモルファスシリコン合金の層で構成
され、これら不純物層間には導電型を有する非単結晶シ
リコンの層を介在させたものであることから、界面不純
物層に於ける光吸収の低減と界面接合性の改善を同時に
達成することができ、電圧を降下させることなく電流量
の増加が図れ光電変換効率の上昇を実現することができ
る。(G) Effect of the Invention As is apparent from the above description, the present invention is constituted by a wide band gap amorphous silicon alloy layer as an impurity layer arranged at the contact interface between adjacent unit power generating elements, and the impurity layers are formed between these impurity layers. Since a non-single-crystal silicon layer having a conductivity type is interposed, it is possible to reduce the light absorption in the interface impurity layer and improve the interface bondability at the same time, and to lower the voltage. Therefore, the amount of current can be increased and the photoelectric conversion efficiency can be increased.
第1図は本光起電力装置の基本構成の模式的断面図、第
2図(a)乃至第2図(c)は本発明光起電力装置の種
々の実施例の模式的断面図、を夫々示している。 (1)…基板、(41)(42)…光活性層、(5d11)(5d
12)(5d21)(5d22)…不純物層、(5d12w)…第1
層、(5d12n)(5d21n)…第2層、(5d21n′)…第3
層、(5d21w′)…第4層。FIG. 1 is a schematic cross-sectional view of the basic structure of the photovoltaic device of the present invention, and FIGS. 2 (a) to 2 (c) are schematic cross-sectional views of various embodiments of the photovoltaic device of the present invention. Each one is shown. (1) ... Substrate, (4 1 ) (4 2 ) ... Photoactive layer, (5d 11 ) (5d
12 ) (5d 21 ) (5d 22 ) ... impurity layer, (5d 12w ) ... first
Layer, (5d 12n ) (5d 21n ) ... second layer, (5d 21n ′) ... third
Layer, (5d 21w ') ... 4th layer.
Claims (8)
電素子を複数個積層した光起電力装置であって、相隣り
合う単位発電素子の接触界面に配置される不純物層は、
上記アモルファスシリコンより光学的禁止帯幅の広い、
一導電型と逆導電型とのワイドバンドギャップアモルフ
ァスシリコン合金の層、で構成され、これら不純物層間
には導電型を有する非単結晶シリコンの層が介在せしめ
られたことを特徴とした光起電力装置。1. A photovoltaic device comprising a plurality of unitary power generating elements mainly composed of amorphous silicon, wherein an impurity layer disposed at a contact interface between adjacent unitary power generating elements comprises:
Wider optical bandgap than the amorphous silicon,
Photovoltaic characterized by comprising a layer of a wide bandgap amorphous silicon alloy of one conductivity type and an opposite conductivity type, and a layer of non-single-crystal silicon having a conductivity type interposed between these impurity layers. apparatus.
が、一導電型のアモルファスシリコン或いは微結晶シリ
コンであることを特徴とした特許請求の範囲第1項記載
の光起電力装置。2. The photovoltaic device according to claim 1, wherein the non-single crystal silicon layer having a conductivity type is one conductivity type amorphous silicon or microcrystalline silicon.
が、夫々同一の導電型のワイドバンドギャップアモルフ
ァスシリコン合金の層と接するように配置された、一導
電型及び逆導電型のアモルファスシリコン或いは微結晶
シリコンであることを特徴とした特許請求の範囲第1項
記載の光起電力装置。3. One-conductivity-type and opposite-conductivity-type amorphous silicon, wherein the non-single-crystal silicon layers having the conductivity type are arranged so as to be in contact with the wide-band-gap amorphous silicon alloy layers having the same conductivity type, respectively. Alternatively, the photovoltaic device according to claim 1, which is microcrystalline silicon.
リコン合金の少なくとも一方がアモルファスシリコンカ
ーバンドであることを特徴とした特許請求の範囲第1項
乃至第3項記載の光起電力装置。4. The photovoltaic device according to claim 1, wherein at least one of the wide band gap amorphous silicon alloys is an amorphous silicon car band.
リコン合金の少なくとも一方がアモルファスシリコンナ
イトライドであることを特徴とした特許請求の範囲第1
項乃至第3項記載の光起電力装置。5. The method according to claim 1, wherein at least one of the wide band gap amorphous silicon alloys is amorphous silicon nitride.
The photovoltaic device according to any one of items 1 to 3.
リコン合金の少なくとも一方がアモルファスシリコンオ
キサイドであることを特徴とした特許請求の範囲第1項
乃至第3項記載の光起電力装置。6. The photovoltaic device according to claim 1, wherein at least one of the wide band gap amorphous silicon alloys is amorphous silicon oxide.
リコン合金の少なくとも一方がアモルファスシリコンオ
キシナイトライドであることを特徴とした特許請求の範
囲第1項乃至第3項記載の光起電力装置。7. The photovoltaic device according to claim 1, wherein at least one of the wide band gap amorphous silicon alloys is amorphous silicon oxynitride.
ギャップアモルファスシリコン合金の組成は互いに異な
ることを特徴とした特許請求の範囲第1項乃至第7項記
載の光起電力装置。8. The photovoltaic device according to claim 1, wherein the compositions of the one conductivity type and the opposite conductivity type wide band gap amorphous silicon alloys are different from each other.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267212A JPH073876B2 (en) | 1986-11-10 | 1986-11-10 | Photovoltaic device |
| US07/084,947 US4776894A (en) | 1986-08-18 | 1987-08-13 | Photovoltaic device |
| FR878711691A FR2602913B1 (en) | 1986-08-18 | 1987-08-18 | PHOTOVOLTAIC DEVICE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61267212A JPH073876B2 (en) | 1986-11-10 | 1986-11-10 | Photovoltaic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63120476A JPS63120476A (en) | 1988-05-24 |
| JPH073876B2 true JPH073876B2 (en) | 1995-01-18 |
Family
ID=17441694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61267212A Expired - Lifetime JPH073876B2 (en) | 1986-08-18 | 1986-11-10 | Photovoltaic device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073876B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4257332B2 (en) * | 2003-07-24 | 2009-04-22 | 株式会社カネカ | Silicon-based thin film solar cell |
| JP4068043B2 (en) * | 2003-10-28 | 2008-03-26 | 株式会社カネカ | Stacked photoelectric conversion device |
| JP4063735B2 (en) * | 2003-07-24 | 2008-03-19 | 株式会社カネカ | Thin film photoelectric conversion module including stacked photoelectric conversion device |
| WO2005011001A1 (en) * | 2003-07-24 | 2005-02-03 | Kaneka Corporation | Stacked photoelectric converter |
| JP2006319068A (en) * | 2005-05-11 | 2006-11-24 | Kaneka Corp | Multi-junction silicon-based thin film photoelectric conversion device and manufacturing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56142680A (en) * | 1980-04-07 | 1981-11-07 | Matsushita Electric Ind Co Ltd | Photoconductive semiconductor device |
| JPS58122783A (en) * | 1982-01-14 | 1983-07-21 | Sanyo Electric Co Ltd | Photovoltaic device |
| JPS609178A (en) * | 1983-06-29 | 1985-01-18 | Toshiba Corp | Photovoltaic device |
| JPS61172380A (en) * | 1985-01-28 | 1986-08-04 | Semiconductor Energy Lab Co Ltd | semiconductor equipment |
| JPS61208878A (en) * | 1985-03-14 | 1986-09-17 | Ricoh Co Ltd | Amorphous silicon photoelectric conversion element |
-
1986
- 1986-11-10 JP JP61267212A patent/JPH073876B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63120476A (en) | 1988-05-24 |
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