JPH0740507A - Production of metal foil clad laminated sheet - Google Patents
Production of metal foil clad laminated sheetInfo
- Publication number
- JPH0740507A JPH0740507A JP18540193A JP18540193A JPH0740507A JP H0740507 A JPH0740507 A JP H0740507A JP 18540193 A JP18540193 A JP 18540193A JP 18540193 A JP18540193 A JP 18540193A JP H0740507 A JPH0740507 A JP H0740507A
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin
- laminating
- base material
- aluminum hydroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 56
- 239000011347 resin Substances 0.000 claims abstract description 56
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 24
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000011889 copper foil Substances 0.000 claims abstract description 15
- 239000012790 adhesive layer Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000010030 laminating Methods 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 9
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 claims description 3
- 229920001567 vinyl ester resin Polymers 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 8
- 239000011888 foil Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 3
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板用の基
板等として用いられる金属箔張り積層板の製造方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a metal foil-clad laminate used as a substrate for printed wiring boards.
【０００２】[0002]
【従来の技術】従来より金属箔張り積層板の連続工法に
よる製法はガラス布または、紙などの長尺の基材に熱硬
化性樹脂のワニスを含浸させ、この工程で熱硬化性樹脂
を含浸した複数枚の長尺の基材に添って移送された長尺
の銅箔をロールを介して積層して積層帯とし、この積層
帯を硬化炉に順次送りつつ、積層帯中の熱硬化性樹脂を
加熱硬化させて、加圧を伴うことなく積層板を連続的に
製造できる点で生産性の高いものである。2. Description of the Related Art Conventionally, a continuous process for manufacturing a metal foil-clad laminate is performed by impregnating a long base material such as glass cloth or paper with a varnish of thermosetting resin, and then impregnating the thermosetting resin in this step. The long copper foil transferred along with the plurality of long base materials that have been transferred are laminated with a roll to form a laminated band, and this laminated band is sequentially sent to a curing furnace while thermosetting in the laminated band. It is highly productive in that the resin can be heated and cured to continuously produce a laminated plate without applying pressure.
【０００３】しかしこのような連続工法は、加熱硬化炉
において加圧を伴わないため熱硬化性樹脂は、基材に対
して比率が小さく、得られる積層板は、緻密性が低い。
その結果水分が積層板内に吸収され易く、吸湿後の耐熱
性（ＰＣＴ特性）が低下する。However, in such a continuous construction method, since the thermosetting resin has a small ratio with respect to the substrate because no pressure is applied in the heating and curing furnace, the obtained laminated plate has a low density.
As a result, moisture is easily absorbed in the laminate, and heat resistance (PCT characteristic) after moisture absorption is reduced.
【０００４】そこで吸湿後の耐熱性の低下を防止するた
めに、基材が積層された絶縁基板の表面に厚みが５〜３
０μｍ程度の熱硬化性樹脂の接着層を形成した金属箔張
り積層板が造出されているが、熱硬化性樹脂の接着層
は、積層板の耐衝撃性、耐ヒートサイクル性及び耐トラ
ッキング性に対して阻害要因である。Therefore, in order to prevent deterioration of heat resistance after moisture absorption, a thickness of 5 to 3 is formed on the surface of an insulating substrate on which base materials are laminated.
A metal foil-clad laminate having an adhesive layer of thermosetting resin of about 0 μm has been produced, but the adhesive layer of thermosetting resin has impact resistance, heat cycle resistance and tracking resistance of the laminate. Is an inhibiting factor against.
【０００５】[0005]
【発明が解決しようとする課題】本発明は上記の欠点を
除去するためになされたもので、その目的とするところ
は、耐衝撃性、耐ヒートサイクル性及び耐トラッキング
性が良好であり、加えて反りの小さい金属箔張り積層板
の製造方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made to eliminate the above-mentioned drawbacks, and its object is to provide good impact resistance, heat cycle resistance and tracking resistance. Another object of the present invention is to provide a method for producing a metal foil-clad laminate having a small warpage.
【０００６】[0006]
【課題を解決するための手段】本発明に係る金属箔張り
積層板の製造方法は、熱硬化性樹脂を含浸した基材
（１）と銅箔（２）とをロール圧で積層する積層工程と
この積層工程で得られた積層帯を硬化炉（１０）内にお
いて無圧で硬化する硬化工程を含む銅張り積層板の製法
において、上記積層工程における熱硬化性樹脂を含浸し
た基材（１）が積層された絶縁基板（４）と銅箔（２）
との間に水酸化アルミニウムが粒径１０μｍ以下でかつ
基材に含浸させた上記熱硬化性樹脂と同種の熱硬化性樹
脂１００重量部に対して水酸化アルミニウムが５０重量
部以下の割合で含有する熱硬化性樹脂の接着層（５）を
形成することを特徴とするものである。A method for manufacturing a metal foil-clad laminate according to the present invention comprises a step of laminating a base material (1) impregnated with a thermosetting resin and a copper foil (2) by roll pressure. And a method for producing a copper-clad laminate including a curing step in which the laminated band obtained in this laminating step is cured in a curing furnace (10) without pressure, a base material (1) impregnated with a thermosetting resin in the laminating step (1 ) Laminated insulating substrate (4) and copper foil (2)
Aluminum hydroxide is contained in an amount of 50 parts by weight or less with respect to 100 parts by weight of a thermosetting resin of the same type as the thermosetting resin impregnated in the base material with aluminum hydroxide having a particle size of 10 μm or less. A thermosetting resin adhesive layer (5) is formed.
【０００７】また、上記熱硬化性樹脂として、不飽和ポ
リエステル樹脂、エポキシ樹脂、ビニルエステル樹脂、
フェノール樹脂、ポリイミド樹脂、ポリフェニレンエー
テル樹脂、フッ素樹脂のいずれかを用いることができ
る。Further, as the thermosetting resin, unsaturated polyester resin, epoxy resin, vinyl ester resin,
Any of a phenol resin, a polyimide resin, a polyphenylene ether resin, and a fluororesin can be used.
【０００８】[0008]
【作用】本発明によって製造される金属箔張り積層板
は、熱硬化性樹脂を含浸した基材（１）が積層された絶
縁基板（４）の表面に水酸化アルミニウムを含有する熱
硬化性樹脂の接着層（５）が形成されているため耐衝撃
性、耐ヒートサイクル性及び耐トラッキング性が良好で
ある。The metal foil-clad laminate produced according to the present invention is a thermosetting resin containing aluminum hydroxide on the surface of an insulating substrate (4) on which a base material (1) impregnated with a thermosetting resin is laminated. Since the adhesive layer (5) is formed, impact resistance, heat cycle resistance and tracking resistance are good.
【０００９】[0009]
【実施例】以下、本発明を実施例によって詳述する。EXAMPLES The present invention will be described in detail below with reference to examples.
【００１０】図１は、本発明の方法を実施するのに用い
る製造装置の概略図である。基材をロールに巻いた状態
から連続して繰り出し、含浸槽等に浸漬させることによ
り基材に液状の熱硬化性樹脂を含浸させる。（図示せ
ず） このように複数枚の熱硬化性樹脂を含浸させた基材
（１）は、図１に示すごとく、スクウィーズロール
（６）を通過し、余分な熱硬化性樹脂を絞って厚みを調
整しながら重ね合わされ、ラミネートロール（７）に送
られる。ロールから繰り出される長尺の銅箔（２）を最
外層の熱硬化性樹脂を含浸させた基材（１）の外面に重
ねるが、ラミネートロール（７）に送られる手前で最外
層の熱硬化性樹脂を含浸させた基材（１）の外面に水酸
化アルミニウムを含有する熱硬化性樹脂を塗布する。水
酸化アルミニウムを含有する熱硬化性樹脂の塗布は、容
器（８）に充満された水酸化アルミニウムを含有する熱
硬化性樹脂を塗布ローラー（９）によって熱硬化性樹脂
を含浸させた基材（１）の外面に塗布することによって
行うことができる。FIG. 1 is a schematic diagram of a manufacturing apparatus used to carry out the method of the present invention. The base material is continuously unrolled from a state of being wound on a roll and immersed in an impregnation tank or the like to impregnate the base material with a liquid thermosetting resin. The base material (1) thus impregnated with a plurality of thermosetting resins passes through a squeeze roll (6) to squeeze the excess thermosetting resin as shown in FIG. While adjusting the thickness, the layers are stacked and sent to the laminating roll (7). A long copper foil (2) fed from a roll is placed on the outer surface of the base material (1) impregnated with the outermost thermosetting resin, but the outermost layer is thermoset before being sent to the laminating roll (7). A thermosetting resin containing aluminum hydroxide is applied to the outer surface of the base material (1) impregnated with the functional resin. The application of the thermosetting resin containing aluminum hydroxide is carried out by filling the container (8) with the thermosetting resin containing aluminum hydroxide impregnated with the thermosetting resin by the application roller (9) ( It can be performed by applying to the outer surface of 1).
【００１１】ここで水酸化アルミニウムの添加量は、熱
硬化性樹脂１００重量部に対して５０重量部以下に制限
され、好ましくは、１０〜３０重量部が良い。また水酸
化アルミニウムの粒径としては、１０μｍ以下に制限さ
れ、好ましくは、５μｍ以下が良い。水酸化アルミニウ
ムの添加量が多過ぎたり粒径が大きすぎると、表面突起
による外観不良が発生し、また接着層（５）内での水酸
化アルミニウムの分散が不均一になり易いため反り及び
ねじれが発生し易くなる。The amount of aluminum hydroxide added is limited to 50 parts by weight or less, preferably 10 to 30 parts by weight, based on 100 parts by weight of the thermosetting resin. The particle size of aluminum hydroxide is limited to 10 μm or less, preferably 5 μm or less. If the amount of aluminum hydroxide added is too large or the particle size is too large, appearance defects will occur due to surface protrusions, and the dispersion of aluminum hydroxide in the adhesive layer (5) tends to be uneven, causing warpage and twisting. Is likely to occur.
【００１２】そして上記のように複数枚の熱硬化性樹脂
を含浸させた基材（１）と銅箔（２）とが重ねられた積
層物は、硬化炉（１０）に連続して送られ、硬化炉（１
０）内で熱硬化性樹脂が加熱硬化され、複数枚の熱硬化
性樹脂を含浸させた基材（１）と銅箔（２）とが一体に
積層される。硬化炉（１０）から連続して出てくるこの
積層物を切断機（１１）によって所定の寸法に切断し、
プリント配線板用基板となる金属箔張り積層板を得る。The laminate in which the base material (1) impregnated with a plurality of thermosetting resins and the copper foil (2) are stacked as described above is continuously sent to a curing furnace (10). , Curing furnace (1
In (0), the thermosetting resin is heat-cured, and the base material (1) impregnated with a plurality of thermosetting resins and the copper foil (2) are integrally laminated. This laminate continuously coming out of the curing furnace (10) is cut into a predetermined size by a cutting machine (11),
A metal foil-clad laminate serving as a substrate for a printed wiring board is obtained.
【００１３】このようにして得た金属箔張り積層板にあ
っては、図２に示すように複数枚の基材が積層された絶
縁基板（４）の外面に水酸化アルミニウムを含有する熱
硬化性樹脂の接着層（５）が形成されることになり銅箔
（２）は、この水酸化アルミニウムを含有する熱硬化性
樹脂の接着層（５）を介して絶縁基板（４）に接着され
ることになる。In the metal foil-clad laminate thus obtained, as shown in FIG. 2, a thermosetting resin containing aluminum hydroxide is provided on the outer surface of an insulating substrate (4) having a plurality of base materials laminated thereon. The adhesive layer (5) of the thermosetting resin is formed, and the copper foil (2) is adhered to the insulating substrate (4) via the adhesive layer (5) of the thermosetting resin containing aluminum hydroxide. Will be.
【００１４】この金属箔張り積層板は、熱硬化性樹脂が
含浸された基材（１）が積層された絶縁基板（４）の表
面に水酸化アルミニウムを含有する熱硬化性樹脂の接着
層（５）が形成されている。基材としては、長尺のガラ
ス布、ガラス不織布や紙等が用いられ、熱硬化性樹脂と
しては、不飽和ポリエステル樹脂、エポキシ樹脂、ビニ
ルエステル樹脂、フェノール樹脂、ポリイミド樹脂、ポ
リフェニレンエーテル樹脂、フッ素樹脂のいずれかを用
いることができる。In this metal foil-clad laminate, a thermosetting resin adhesive layer (aluminum hydroxide-containing adhesive layer) is formed on the surface of an insulating substrate (4) on which a base material (1) impregnated with a thermosetting resin is laminated. 5) is formed. As the substrate, a long glass cloth, a glass non-woven fabric, paper or the like is used, and as the thermosetting resin, an unsaturated polyester resin, an epoxy resin, a vinyl ester resin, a phenol resin, a polyimide resin, a polyphenylene ether resin, or fluorine. Any of the resins can be used.
【００１５】次に、更に具体的な実施例及び比較例につ
いて説明する。 （実施例１〜５、比較例１〜３）熱硬化性樹脂の組成物
として、不飽和ポリエステルを１００重量部、開始材
（ベンゾイルパーオキサイド；ＢＰＯ）を１重量部、水
酸化アルミニウムの粒径と量とは、表１に示しているよ
うに配合したものを用い、また基材としてガラス布を用
い、更に銅箔（２）としては、厚み１８μｍの銅箔を用
いて、前記の製造方法によって板厚１．６ｍｍの積層板
を製造した。硬化炉（１０）の温度は、最高温度が１６
０℃，最低温度が６０℃であった。Next, more specific examples and comparative examples will be described. (Examples 1 to 5, Comparative Examples 1 to 3) As a thermosetting resin composition, 100 parts by weight of unsaturated polyester, 1 part by weight of an initiator (benzoyl peroxide; BPO), and a particle size of aluminum hydroxide. The amount and the amount used are those compounded as shown in Table 1, a glass cloth is used as the substrate, and a copper foil having a thickness of 18 μm is used as the copper foil (2). A laminated plate having a plate thickness of 1.6 mm was manufactured by. The maximum temperature of the curing furnace (10) is 16
The temperature was 0 ° C and the minimum temperature was 60 ° C.
【００１６】これらについて耐衝撃性、耐ヒートサイク
ル性及び耐トラッキング性、表面突起及び反り変形をそ
れぞれ測定した。The impact resistance, heat cycle resistance and tracking resistance, surface protrusions and warp deformation of each of these were measured.
【００１７】以上の結果を表１に示す。The above results are shown in Table 1.
【００１８】[0018]
【表１】 [Table 1]
【００１９】表１において、耐衝撃性は、パンチング試
験によって評価した。パンチング試験は、パンチング試
験用金型と１５０トンプレスを用い、銅箔張り積層板の
銅箔を全面エッチング後、両面に厚み７０μｍのフィル
ムを貼り、ホルダー圧２トンで、端部より約１ｍｍの部
分をパンチングしてパンチング後の表面樹脂層のクラッ
クの有無を目視で観察した。クラックのないものを○、
有るものを×で示した。In Table 1, impact resistance was evaluated by a punching test. The punching test uses a punching test die and a 150 ton press, after etching the entire surface of the copper foil of the copper foil-clad laminate, a film with a thickness of 70 μm is pasted on both sides, and a holder pressure of 2 tons, about 1 mm from the end. The portion was punched and the presence or absence of cracks in the surface resin layer after punching was visually observed. ○ with no crack
Those that exist are indicated by x.
【００２０】耐ヒートサイクル性は、熱衝撃試験によっ
て行い、積層板を２６０℃の半田に５秒間浸漬し、次い
で室温に放置して室温に戻すことを１サイクルとして、
５サイクル実施した後の表面樹脂層のクラックの有無を
顕微鏡を用いて観察した。クラックのないものを○、有
るものを×で示した。The heat cycle resistance was determined by a thermal shock test. One cycle was to immerse the laminated plate in solder at 260 ° C. for 5 seconds and then leave it at room temperature to return it to room temperature.
The presence or absence of cracks in the surface resin layer after 5 cycles were observed with a microscope. Those with no cracks are indicated by ◯, and those with cracks are indicated by x.
【００２１】耐トラッキング性は、白金電極を用いてＩ
ＥＣ法で試験をし、トラッキング電圧曲線からＣＴＩ
（耐トラッキング指数）を求めて耐トラッキング性を評
価した。Tracking resistance is measured by using a platinum electrode.
Tested by EC method, and from the tracking voltage curve, CTI
The (tracking resistance index) was obtained to evaluate the tracking resistance.
【００２２】表面突起は、目視により突起の有無を評価
した。表面突起がないものを○、多発するものを×、若
干有るものを△で示した。The presence or absence of the surface protrusions was visually evaluated. Those with no surface protrusions are indicated by ◯, those that occur frequently are indicated by x, and those with some surface protrusions are indicated by Δ.
【００２３】反り変形は、３３０ｍｍ×２５０ｍｍの積
層板を乾燥機に入れて１３０℃で１時間乾燥し、一点支
持法で反り量を測定した。As for the warp deformation, a 330 mm × 250 mm laminated plate was put in a drier and dried at 130 ° C. for 1 hour, and the warp amount was measured by a single-point support method.
【００２４】表１の結果、実施例１〜５のように水酸化
アルミニウムの粒径が１０μｍ以下で添加量５０重量部
以下の場合には、耐衝撃性、耐ヒートサイクル性、耐ト
ラッキング性が良好で、表面突起及び反りが殆どない。As shown in Table 1, when the particle size of aluminum hydroxide is 10 μm or less and the addition amount is 50 parts by weight or less as in Examples 1 to 5, impact resistance, heat cycle resistance and tracking resistance are high. Good, almost no surface protrusion and warpage.
【００２５】これに対して、比較例１のように水酸化ア
ルミニウムが無添加の積層板は、耐衝撃性、耐ヒートサ
イクル性及び耐トラッキング性が悪く、比較例２のよう
に水酸化アルミニウムの添加量が６０重量部の積層板及
び比較例３のように水酸化アルミニウムの粒径が２０μ
ｍの積層板は、表面突起が多く、反りも大きかった。On the other hand, the laminated plate containing no added aluminum hydroxide as in Comparative Example 1 was poor in impact resistance, heat cycle resistance and tracking resistance, and thus, as in Comparative Example 2, it was made of aluminum hydroxide. The particle size of aluminum hydroxide was 20 μm as in the case of Comparative Example 3 in which the addition amount was 60 parts by weight.
The laminated plate of m had many surface protrusions and had a large warp.
【００２６】[0026]
【発明の効果】本発明の金属箔張り積層板の製造方法に
よると、絶縁基板（４）と銅箔（２）との間に水酸化ア
ルミニウムを含有する熱硬化性樹脂の接着層（５）が形
成されているため、耐衝撃性、耐ヒートサイクル性、耐
トラッキング性に優れ、加えて表面突起がなく、反りも
小さい。According to the method for producing a metal foil-clad laminate of the present invention, a thermosetting resin adhesive layer (5) containing aluminum hydroxide between the insulating substrate (4) and the copper foil (2). Since it is formed, it is excellent in impact resistance, heat cycle resistance, and tracking resistance, and in addition, there is no surface protrusion and the warpage is small.
【図１】本発明の方法を実施するのに用いる製造装置の
概略図である。FIG. 1 is a schematic view of a manufacturing apparatus used for carrying out the method of the present invention.
【図２】本発明の実施例に係る金属箔張り積層板の断面
図である。FIG. 2 is a sectional view of a metal foil-clad laminate according to an example of the present invention.
１ 熱硬化性樹脂を含浸した基材 ２ 銅箔 ４ 絶縁基板 ５ 接着層 １０ 硬化炉 1 Base Material Impregnated with Thermosetting Resin 2 Copper Foil 4 Insulating Substrate 5 Adhesive Layer 10 Curing Furnace
───────────────────────────────────────────────────── フロントページの続き (72)発明者 牧野 秀志 大阪府門真市大字門真1048番地松下電工株 式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideshi Makino 1048, Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Works Co., Ltd.
Claims (2)
ロール圧で積層する積層工程とこの積層工程で得られた
積層帯を硬化炉内において無圧で硬化する硬化工程を含
む銅張り積層板の製法において、上記積層工程における
熱硬化性樹脂を含浸した基材が積層された絶縁基板と銅
箔との間に水酸化アルミニウムが粒径１０μｍ以下でか
つ基材に含浸させた上記熱硬化性樹脂と同種の熱硬化性
樹脂１００重量部に対して水酸化アルミニウムが５０重
量部以下の割合で含有する熱硬化性樹脂の接着層を形成
することを特徴とする金属箔張り積層板の製造方法。1. A laminating step of laminating a base material impregnated with a thermosetting resin and a copper foil under roll pressure, and a curing step of curing the laminated band obtained in this laminating step in a curing furnace without pressure. In the method for producing a copper-clad laminate, aluminum hydroxide having a particle size of 10 μm or less is impregnated into a base material and an insulating substrate on which a base material impregnated with a thermosetting resin in the lamination step is laminated. A metal foil-clad laminate characterized by forming an adhesive layer of a thermosetting resin containing aluminum hydroxide in an amount of 50 parts by weight or less based on 100 parts by weight of the thermosetting resin of the same type as the thermosetting resin. Method of manufacturing a plate.
ル樹脂、エポキシ樹脂、ビニルエステル樹脂、フェノー
ル樹脂、ポリイミド樹脂、ポリフェニレンエーテル樹
脂、フッ素樹脂のいずれかを用いたことを特徴とする請
求項１に記載の金属箔張り積層板の製造方法。2. The thermosetting resin is an unsaturated polyester resin, an epoxy resin, a vinyl ester resin, a phenol resin, a polyimide resin, a polyphenylene ether resin, or a fluororesin. The method for producing a metal foil-clad laminate according to.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18540193A JP3182989B2 (en) | 1993-07-27 | 1993-07-27 | Manufacturing method of metal foil-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18540193A JP3182989B2 (en) | 1993-07-27 | 1993-07-27 | Manufacturing method of metal foil-clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0740507A true JPH0740507A (en) | 1995-02-10 |
| JP3182989B2 JP3182989B2 (en) | 2001-07-03 |
Family
ID=16170153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18540193A Expired - Fee Related JP3182989B2 (en) | 1993-07-27 | 1993-07-27 | Manufacturing method of metal foil-clad laminate |
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| Country | Link |
|---|---|
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100919971B1 (en) * | 2007-11-13 | 2009-10-14 | 삼성정밀화학 주식회사 | Metal foil laminate and printed wiring board with liquid crystal polymer prepreg and liquid crystal polymer correction layer |
| KR101064647B1 (en) * | 2009-07-17 | 2011-09-15 | 아주스틸 주식회사 | Metal printed circuit board manufacturing method and apparatus |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6250303B2 (en) | 2013-02-15 | 2017-12-20 | 雅弘 星野 | Clasp |
-
1993
- 1993-07-27 JP JP18540193A patent/JP3182989B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100919971B1 (en) * | 2007-11-13 | 2009-10-14 | 삼성정밀화학 주식회사 | Metal foil laminate and printed wiring board with liquid crystal polymer prepreg and liquid crystal polymer correction layer |
| KR101064647B1 (en) * | 2009-07-17 | 2011-09-15 | 아주스틸 주식회사 | Metal printed circuit board manufacturing method and apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3182989B2 (en) | 2001-07-03 |
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