JPH0745975Y2 - Multi-sided board - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-layered printed circuit board which facilitates the division of the printed wiring board from the multi-layered board.

[0002]

2. Description of the Related Art In order to improve productivity, a printed wiring board is printed on both sides of a printed wiring board by a printing machine in a state where the printed wiring board is placed on a multi-sided board of a required standard size. The mounting of electronic components by the mounting machine, the soldering by the reflow furnace, and the cleaning of the mounting board by the cleaning machine are carried out in units of multi-sided boards, and each printed wiring board is divided after the above steps are completed.

7 and 8 show a conventional method for dividing a printed wiring board.

The printed wiring board 2 is cut into multiple pieces on the multiple cut-out board 1, and a V-shaped groove 3 is formed along each printed wiring board 2.
The printed wiring board 2 is divided by dividing the printed wiring board 2 by applying a jig having a blade to the groove 3 of the multi-sided board 1 and bending the groove along the groove 3.

FIG. 9 shows another conventional example.

In the conventional example, the printed wiring board 2 is cut into multiple pieces on the multiple cut-out board 1, and perforations are punched along each printed wiring board 2.

This die-cutting process is carried out by setting a male type and a female type on the multi-sided printed circuit board 1 to obtain a printed wiring board 2
For the division, the die was punched with a mold, bent and cut along the perforations, or the joint was cut with a tool such as a nipper to separate it.

[0008]

In recent years, the printed wiring board has been made thinner by reducing the thickness of the printed wiring board, increasing the number of layers, increasing the density of pattern wiring, and reducing the size of electronic components, fine lead pitch, and surface mounting. The high-density mounting is progressing, and the area of the unmounted portion around the printed wiring board is significantly reduced. For this reason, there is a problem that the jig interferes with the mounted parts during bending or die cutting, and the bending line and the mounting position of the parts are closer to each other.
Or, because the die and the mounting parts come close to each other, the bending stress at the time of bending, or the shear stress at the time of die cutting causes the pattern destruction of the printed wiring board, the destruction of the soldered joint, and the destruction of electronic parts. Very dangerous. Further, when divided, burrs may be generated at the cut portions, and the protruding burrs may not be cured by the set of electronic devices.

The present invention has been made in view of the above circumstances, and is such that it can be easily divided by a simple construction method and no burr is projected.

[0010]

SUMMARY OF THE INVENTION According to the present invention, a printed wiring board is multi-faced on a multi-sided board and each printed wiring board is
Slit holes are formed along the four sides of the slit, and the ends of the slit holes project inside the printed wiring board from the width of the slit holes.
Protruding protrusion is formed, and it is opposed to the protrusion of the adjacent slit hole.
Make sure that the protrusion is placed inside the outline of the printed wiring board.
A ridge is formed and the protrusion is for cutting the bridge.
The feature is that a notch is formed .

[0011]

When the printed wiring board is divided, the bridge portion is cut. This cutting causes a burr, but the burr fits within the outline of the printed wiring board.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

The printed wiring board 2 is multi-chambered on the multi-sided board 1, and slit holes 4 are formed in a perforated shape along each printed wiring board 2. The slit hole 4
And the printed wiring board 2 between the slit hole 4 and
The bridge portions 5, 6 and 7 for supporting the are appropriately provided at corners of the printed wiring board 2 and in the middle of each side.

Next, the bridge portions 5, 6, 7 will be described.

The bridge portion 5 located at the corner of the printed wiring board 2 will be described with reference to FIG.

Protrusions 8 and 9 are formed at the ends of the slit holes 4 so as to cut off a part of the corners of the printed wiring board 2. Therefore, the bridge portion 5 is formed at a position that is closer to the printed wiring board 2 side than the apex formed by the adjacent sides of the printed wiring board 2 , and the protrusions 8 and 9 are not connected to each other.
It functions as a notch for cutting.

The bridge portion 6 located at the corner of the adjacent printed wiring board 2 will be described with reference to FIG.

At the end of the slit hole 4 which forms the boundary between the peripheral portion of the multi-layered substrate 1 and the printed wiring board 2, the printed wiring board 2 has the same width as the slit hole 4 as described above.
The protrusions 8 and 9 that bulge inward are formed, and the ends of the slit holes 4 that form the boundary between the adjacent printed wiring boards 2 are symmetrical to the protrusions 8 and 9 on both width sides. The protrusion 10 is formed. Thus, the bridge portion 6 is formed between the protruding portions 8 and 9 and the protruding portion 10, and the bridge portion 6 is the apex formed by the adjacent sides of the printed wiring board 2 like the bridge portion 5. Is formed at a position that is closer to the printed wiring board 2 side than the above, and the protrusions 8, 9 and 10 are
Functions as a notch for cutting the bridge.

The bridge portion 7 located on the side of the printed wiring board 2 will be described with reference to FIG.

At the end of the slit hole 4 which forms the boundary between the peripheral portion of the multi-layered substrate 1 and the printed wiring board 2, a protrusion 11 which is inserted closer to the printed wiring board 2 than the side of the printed wiring board 2 is. The slits 4 are formed symmetrically at the ends of the slit holes 4 facing each other, and the protrusions 11 have a shape projecting from the ends of the slit holes 4 on the opposite side. Also in this embodiment,
The protrusion 11 functions as a notch for cutting the bridge.

Thus, the bridge portion 7 is formed inside the printed wiring board 2 with respect to the outline of the printed wiring board 2.

The printed wiring board 2 is divided by cutting the bridge portions 5, 6, 7 with a cutting tool such as a nipper. After cutting, burrs 12 are generated, but as described above, the bridge portions 5, 6, and 7 are formed on the printed wiring board 2.
Since it is located inside the outer contour line, the burr does not protrude beyond the outer contour line and does not hinder the mounting of the printed wiring board 2 (FIGS. 5A, 5B, 6). (See (A) and (B)). Further, the protrusions 8, 9, 10,
11 forms a space where a cutting edge such as a nipper can easily enter
Both are notches with a guide function that determines the cutting position.
Since it has all the functions, it can be easily cut.

In the above-described embodiment, the bridge portion is provided at the corner of the printed wiring board 2 or the middle of the side. However, the middle of the side may be omitted depending on the shape, or the corner may be a hook-shaped slit hole. Needless to say, various modifications can be made without departing from the gist of the present invention, such as omitting the bridge portions at the corners or providing two or more bridge portions in the middle.

[0024]

As described above, according to the present invention, it is possible to easily divide a printed wiring board from a multi-chambered board without projecting burrs with a simple tool, and to divide the printed wiring board into a peripheral pattern or It is possible to improve workability and reliability without affecting mounted components.

[Brief description of drawings]

FIG. 1 is an explanatory view of a multi-sided board according to an embodiment of the present invention.

FIG. 2 is an enlarged view of part A in FIG.

FIG. 3 is an enlarged view of part B in FIG.

FIG. 4 is an enlarged view of part C in FIG.

FIG. 5 is an explanatory view of the operation of the present embodiment.

FIG. 6 is an explanatory view of the operation of the present embodiment.

FIG. 7 is an explanatory diagram of a conventional example. .

FIG. 8 is an enlarged view taken along the line DD of FIG.

FIG. 9 is an explanatory diagram of another conventional example.

[Explanation of symbols]

 1 Multi-Chamfering Board 2 Printed Wiring Board 4 Slit Hole 5 Bridge Part 6 Bridge Part 7 Bridge Part 8 Projection 9 Projection 10 Projection 11 Projection

Continuation of front page (72) Creator Hironori Yoshimoto 2-3-13 Toranomon, Minato-ku, Tokyo Kokusai Electric Co., Ltd. (56) References (JP, U)

Claims (1)

[Scope of utility model registration request] 1. A printed wiring board is multi-chambered on a multi-chamfered board , slit holes are formed along four sides of each printed wiring board, and the width of the slit hole is larger than the width of the slit hole at the end portion.
Form a protrusion that protrudes inside the printed wiring board
The protrusions of the slit holes are made to face each other, and the print
A bridge is formed inside the outline of the wire board.
A multi-chamfered substrate, wherein the protrusion forms a notch for cutting a bridge .