JPH0748590B2 - Method for manufacturing multilayer board for printed wiring board - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method for producing a multilayer board for a printed wiring board. More specifically, the present invention uses a prepreg having a high resin content, and when manufacturing a multilayer printed wiring board by mass lamination molding by a large-scale press, enables multilayer lamination molding without causing slipping, The present invention relates to a new method for manufacturing a multilayer board for a printed wiring board.

(Prior Art) With the increasing demand for high-density mounting of printed wiring boards, the development and improvement of multilayer printed wiring boards have been actively pursued, and various proposals have been made for improving the manufacturing method thereof. It has been made and put into practical use.

It is considered desirable to manufacture this multilayer laminated plate by mass lamination from the viewpoint of improving productivity, and various measures have been taken for that purpose.

Usually, this multilayer board has an inner layer material obtained by forming a circuit on a double-sided or single-sided metal-clad laminated board which is previously molded with a base material layer and a metal foil, on which a prepreg and / or a resin sheet and a metal foil are integrally laminated. It is manufactured by chemical molding.

(Problems to be Solved by the Invention) However, in these conventional methods for manufacturing a multilayer board, in order to improve heat resistance during printed wiring board processing and reflow processing after component mounting, a prepreg containing a large amount of resin is used. If a mass lamination molding is attempted using, the flow of resin causes slippage of molding deviation, which makes it difficult to manufacture a multilayer board.

For this reason, it is usually impossible to handle with a large press,
Since a small press is used to mold the sheets one by one in a plate, it is the actual situation that the production of a multilayer board is extremely poor in productivity.

The present invention has been made in view of the circumstances as described above, and when a multilayer printed wiring board is manufactured by a prepreg having a high resin content, the mass produced by a large press does not cause slipping of the inner layer material. An object of the present invention is to provide a new method for manufacturing a multilayer board for a printed wiring board, which enables lamination.

(Means for Solving the Problems) As a solution to the above problems, the present invention is an inner layer material for a multilayer printed wiring board, which is obtained by laminating a resin-impregnated prepreg and a metal foil, and cutting them into a predetermined size. Are arranged in a predetermined number, abutted against each other without overlapping their edges, and tightly bonded to each other to form a flat plate and fixed, and thereafter, the flat plate-shaped inner layer material is multilayer-molded to form a multilayer board for a printed wiring board. A manufacturing method, wherein the adjacent edges of the inner layer materials arranged side by side at a temperature of 100 to 150 ° C. to a bonding area of 0.8 kg /
It has a tensile strength of cm ² or more, the adhesive material has a heat resistance of about 180 to 200 ° C, and the tape base material has at least one of the vertical and horizontal center lines for even attachment to the adjacent inner layer material. A method for manufacturing a multilayer board for a printed wiring board, characterized in that a heat-resistant tape provided with is attached to bond the inner layer material.

That is, in the method of the present invention, a predetermined number of inner layer materials having a predetermined size are aligned and tightly bonded to each other to be fixed as a single flat plate. In this case, a heat-resistant tape having the above-mentioned specific requirements is used. To do. Of course, other than this heat-resistant tape, as a binding means, adhesive, welding, thread, metal needle-like binding such as table, plastic binding,
Alternatively, a measure such as a hook may be considered, but the heat-resistant tape has a selective requirement as having the best effect, and is extremely useful in this respect.

To further explain in the present invention, as illustrated in FIG. 1, a predetermined number of inner layer materials (1) having a predetermined cut size are formed by laminating and molding a prepreg and a metal foil and forming a circuit on the surface of the metal foil. , Abutting each other so that their edges do not overlap each other, and tape the predetermined surface of the edges (2)
Be tied up by.

As the tape (2), for example, as shown in an enlarged view in FIG. ^2, a tensile strength of about 0.8 kg / cm ² or more (in the direction of an arrow in the figure) with respect to an adhesive area at a temperature of about 100 to 150 ° C. A heat resistant tape having is used. That is, for example, an impregnated paper such as glucine paper or Kapton, which has a tensile strength of about 0.8 kg / cm ² or more, and a pressure-sensitive adhesive on the back surface that has a heat resistance of about 180 to 200 ° C., and has an overall thickness of It is preferable to use a heat resistant tape having a thickness of 0.15 mm or less.

In this case, the heat-resistant tape has a shape as shown in FIGS. 3 (a), (b) and (c), and has a shape that can be easily attached to the blank part as a whole so that it can be evenly attached when attaching two or more sheets. In addition, the center line (3) is provided on the back surface of the base material of the tape in at least one of the vertical and horizontal directions.

(Operation) In the present invention, using a heat-resistant tape having the above-mentioned specific requirements, a resin-impregnated prepreg and a metal foil are laminated and molded, and the multilayer printed wiring board is cut into a predetermined size. A predetermined number of inner layer materials are arranged, tightly bound together without overlapping the edges of each other, fixed into a flat plate, and then the flat plate-shaped inner layer material is laminated in multiple layers. When manufacturing a multi-layer laminated board using, the inner layer material does not slip due to resin flow. Mass lamination with a large press is possible.

(Example) Hereinafter, an example is shown and the manufacturing method of the multilayer board for printed wiring boards of this invention is demonstrated still in detail.

First, as an inner layer material, a double-sided copper-clad laminate was manufactured by laminating and molding a prepreg made of an epoxy resin-impregnated glass mat and a copper foil, and a copper foil surface was etched to form a circuit.

The inner layer materials were lined up, and as shown in FIG. 1, heat-resistant tapes were used to tightly bond them to each other to form a single sheet and fix it. This heat-resistant tape has vertical and horizontal centerlines, and a gulcine paper base material (tensile strength at 100 to 150 ° C: 1.5 kg / cm ² ) and 1
A 90 ° C. heat-resistant adhesive layer having a total thickness of 0.13 mm was used.

The inner layer material tightly bound with the heat-resistant tape was mass-laminated by a large press using a prepreg made of an epoxy resin-impregnated glass mat and a copper foil, and integrally molded by heating and pressing.

Even when a prepreg with a large amount of resin impregnation was used, slipping of the inner layer material due to resin flow did not occur. A high quality multilayer board could be manufactured with good productivity.

On the other hand, in the case of molding with a large press without binding with heat-resistant tape, the inner layer material (1) is displaced in the vertical direction as shown in Fig. 4 (Fig. 4 (a), or in the lateral and lateral directions). It was inevitable to slip such as slippage and overlap (Fig. 4 (b)).

Of course, the present invention is not limited to the above examples. It goes without saying that there are various aspects regarding details such as the structure and structure of the inner layer material and the type of resin impregnated in the prepreg.

(Effects of the Invention) As described in detail above, according to the present invention, even when a prepreg having a high resin content is used, which has been conventionally impossible due to the occurrence of molding deviation, a plurality of inner layer materials can be used to form a large size. Mass lamination can be performed with a press.
Therefore, the productivity of manufacturing the multilayer board is greatly improved.

[Brief description of drawings]

FIG. 1 is a perspective view illustrating a method for manufacturing a multilayer board for a printed wiring board according to the present invention, and FIG. 2 is an enlarged perspective view of a heat-resistant tape sticking portion. 3 (a), (b), and (c) are plan views showing the shape of the heat-resistant tape. FIGS. 4A and 4B are perspective views showing the occurrence of slipping in the case of the conventional method. 1 …… Inner layer material 2 …… Tape 3 …… Center line

Claims (1)

[Claims] 1. A resin-impregnated prepreg and a metal foil are laminated and formed, and a predetermined number of inner layer materials for a multilayer printed wiring board cut into a predetermined size are lined up and abutted against each other without overlapping their edges. A method for manufacturing a multilayer board for a printed wiring board in which the flat plate-shaped inner layer material is laminated in a multilayer manner after being tightly bonded and fixed to one flat plate, and the inner layer materials are arranged on adjacent edges of the inner layer material. It has a tensile strength of 0.8 kg / cm ² or more with respect to the adhesive area at a temperature of 100 to 150 ℃, the adhesive shows heat resistance of about 180 to 200 ℃, and the inner layer material adjacent to the tape base material. A method for manufacturing a multilayer board for a printed wiring board, characterized in that a heat-resistant tape provided with at least one of vertical and horizontal center lines for even attachment is attached to bind the inner layer material.