JPH0749794Y2 - Gold bump for wireless bonding - Google Patents
Gold bump for wireless bondingInfo
- Publication number
- JPH0749794Y2 JPH0749794Y2 JP1989029563U JP2956389U JPH0749794Y2 JP H0749794 Y2 JPH0749794 Y2 JP H0749794Y2 JP 1989029563 U JP1989029563 U JP 1989029563U JP 2956389 U JP2956389 U JP 2956389U JP H0749794 Y2 JPH0749794 Y2 JP H0749794Y2
- Authority
- JP
- Japan
- Prior art keywords
- bump
- bumps
- gold
- ball
- wireless bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
Landscapes
- Wire Bonding (AREA)
Description
【考案の詳細な説明】 「産業上の利用分野」 本考案は、半導体のワイヤレスボンデイングにおけるバ
ンプに係わり、特に、バンプの形状を改良したものに関
する。DETAILED DESCRIPTION OF THE INVENTION "Industrial Application Field" The present invention relates to a bump in wireless bonding of semiconductors, and more particularly to an improved bump shape.
「従来の技術」 近年、ICチツプの多極化に伴い、ICチツプをリードに接
続する方法として、経済性および接続の信頼性の要請か
らこれまで用いられていたワイヤーボンデイング方式に
代えて、金属細線を使用しないワイヤレスボンデイング
方式が採用されつつある。“Prior art” In recent years, with the increase in the number of poles of IC chips, as a method of connecting IC chips to leads, metal wire has been used instead of the wire bonding method that has been used until now due to the demand for economy and reliability of connection. A wireless bonding method that is not used is being adopted.
このワイヤレスボンデイング方式においては、ICチツプ
上の電極部に、リードと接続するためのバンプ（金属突
起部）を形成する必要がある。このバンプを形成する方
法として以下に示すようなものが提供されている。In this wireless bonding method, it is necessary to form bumps (metal projections) for connecting to leads on the electrode parts on the IC chip. The following is provided as a method for forming the bumps.
すなわち、第４図に示すように、金合金細線１の端部に
電気トーチによりボール２を形成して、このボール２
を、第５図に示すように、ICチツプ３の電極部に圧着し
た後、第６図に示すように、ワイヤ部分をクランパで把
持してボール２から引きちぎり、その後、ICチツプ３上
に残されたボール（バンプ）２とリードとを接合する方
式である。That is, as shown in FIG. 4, a ball 2 is formed on the end of the gold alloy thin wire 1 by an electric torch, and the ball 2
As shown in FIG. 5, after crimping to the electrode part of the IC chip 3, as shown in FIG. 6, the wire part is grasped by the clamper and torn off from the ball 2, and then on the IC chip 3. This is a method of joining the remaining balls (bumps) 2 and leads.
「考案が解決しようとする課題」 しかしながら、上記のような方式においては、ワイヤ部
分をクランパで把持してボール２から引きちぎる際に、
ボール（バンプ）２のネツク部2a上にテイル５が残るの
で、リードとの接合部の信頼性が十分ではない。そこ
で、接合部の信頼性を高める手段として、上記テイル５
を押し付けて、第７図に示すように、バンプ２の頭頂部
を平坦に成形した後、この頭頂部に、第８に示すよう
に、導電性ペースト７を塗布したうえで、第９に示すよ
うに、リード８を接合する方式が提供されている。とこ
ろが、このような方式においても、第10図に示すよう
に、導電性ペースト７がバンプ２の頭頂部からたれ落ち
たりして、接合部の不良を皆無にするには至っていな
い。[Problems to be solved by the invention] However, in the above method, when the wire portion is gripped by the clamper and is torn off from the ball 2,
Since the tail 5 remains on the neck portion 2a of the ball (bump) 2, the reliability of the joint portion with the lead is not sufficient. Therefore, as a means for increasing the reliability of the joint portion, the tail 5 is used.
7, the top of the bump 2 is flattened as shown in FIG. 7, and then the conductive paste 7 is applied to the top of the bump 2 as shown in FIG. Thus, a method of joining the leads 8 is provided. However, even in such a system, as shown in FIG. 10, the conductive paste 7 drips off from the top of the bump 2 and the defect of the joint is not completely eliminated.
「考案の目的」 本考案は、上記事情に鑑みてなされたものであり、リー
ドとの接合部の信頼性が高いワイヤレスボンデイング用
金バンプを提供することを目的としている。"Purpose of Invention" The present invention has been made in view of the above circumstances, and an object thereof is to provide a gold bump for wireless bonding, which has a highly reliable joint with a lead.
「課題を解決するための手段」 上記目的を達成するために、本考案者等が鋭意研究した
ところ、バンプ（ボール）の頭頂部に残るテイルの長さ
を適当に調整すれば、このテイルに導電性ペーストが引
っ掛かり、たれ落ちを防止できることが判明した。本考
案は、上記知見に基づいてなされたものであり、ボール
の頭頂部に残るテイルの長さを、金合金細線の直径の１
〜２倍にしたものである。"Means for Solving the Problem" In order to achieve the above-mentioned object, the inventors of the present invention have conducted diligent research and found that if the tail length remaining at the top of the bump (ball) is adjusted appropriately, this tail It was found that the conductive paste could be caught and prevented from dripping. The present invention was made on the basis of the above findings, and the length of the tail remaining on the top of the ball is determined by the diameter of the gold alloy wire.
~ Doubled.
「作用」 本考案のワイヤレスボンデイング用金バンプにあって
は、第１図および第２図（ａ），（ｂ）に示すように、
バンプ２の頭頂部に導電性ペースト７を塗布すると、こ
のペースト７がバンプ２の頭頂部に残るテイル５に引っ
掛かって、たれ落ちが皆無になる。したがって、バンプ
２にリード８を確実に接合することができ、接合部の信
頼性が著しく向上する。導電性ペーストはバンプの頭頂
部に塗布してもよく、また、第３図に示すように、頭頂
部に接合されるリード８の部位に塗布してもよい。[Operation] In the gold bump for wireless bonding of the present invention, as shown in FIGS. 1 and 2 (a) and (b),
When the conductive paste 7 is applied to the top of the bump 2, the paste 7 is caught by the tail 5 remaining on the top of the bump 2 and there is no drop. Therefore, the lead 8 can be reliably bonded to the bump 2, and the reliability of the bonded portion is significantly improved. The conductive paste may be applied to the top of the bump or, as shown in FIG. 3, it may be applied to the portion of the lead 8 bonded to the top of the bump.
本考案のワイヤレスボンデイング用金バンプにおいて、
テイルの長さを、金合金細線の直径の１〜２倍にした理
由は、テイルの長さが金合金細線の直径に満たないと、
導電性ペーストのたれ落ちが生じ、また、２倍を越える
と、導電性ペーストが着きすぎるとともに、ICチツプと
リードとの間隔が広くなり、できる限り薄くしたいとい
うICチツプが装填されたフラットパッケージの特徴に反
するからである。In the gold bump for wireless bonding of the present invention,
The reason for making the length of the tail 1 to 2 times the diameter of the fine gold alloy wire is that the length of the tail is less than the diameter of the fine gold alloy wire.
If the conductive paste drips down, and if it exceeds 2 times, the conductive paste will stick too much and the distance between the IC chip and the lead will become wider, so that the flatness of the flat package loaded with the IC chip is desired. This is because it goes against the characteristics.
「実施例」 次に、本考案のワイヤレスボンデイング用金バンプにつ
いて、実施例に基づき具体的に説明する。[Examples] Next, the gold bumps for wireless bonding of the present invention will be specifically described based on Examples.
直径が23μｍ、25μｍ、30μｍの３種類の金合金細線を
用意し、それぞれの金合金細線を用いて、多数のバンプ
を形成した。このとき、ワイヤ部分をクランパで把持し
てバンプから引きちぎる条件を変えて、テイルの長さの
異なるバンプを形成し、それぞれのテイル長さを顕微鏡
により測定した。そして、これらを同程度の長さのテイ
ルを有しかつ同径の金合金細線から形成されたバンプ20
0個からなるバンプ群に分け、それぞれのバンプ群の平
均のテイル長さをＬ、金合金細線の直径をＤとして、L/
Dを求めた。このL/D値が１〜２のバンプが本考案に係わ
るバンプであり、これらを実施例１〜９に示した。一
方、L/D値が１〜２以外のバンプを比較例１〜12に示し
た。Three kinds of gold alloy fine wires having diameters of 23 μm, 25 μm, and 30 μm were prepared, and a large number of bumps were formed using each gold alloy fine wire. At this time, the conditions for gripping the wire portion with the clamper and tearing it off from the bumps were changed to form bumps having different tail lengths, and the respective tail lengths were measured by a microscope. Then, the bumps 20 formed from gold alloy fine wires having tails of the same length and the same diameter are used.
It is divided into 0 bump groups, and the average tail length of each bump group is L and the diameter of the gold alloy thin wire is D, and L /
I asked for D. The bumps having L / D values of 1 to 2 are the bumps according to the present invention, and they are shown in Examples 1 to 9. On the other hand, bumps having L / D values other than 1 and 2 are shown in Comparative Examples 1 to 12.
そして、実施例および比較例のバンプの頭頂部に導電性
ペーストを塗布し、ペーストのたれ落ちや付きすぎのバ
ンプの数をカウントし、その結果を表に示す。Then, a conductive paste was applied to the tops of the bumps of the examples and the comparative examples, and the number of bumps with the paste dripping or excessive sticking was counted, and the results are shown in the table.
表に示す結果から、本考案に係わるワイヤレスボンデイ
ング用金バンプ１〜９はいずれもペーストのたれ落ちや
付きすぎがないことが判るとともに、比較例に示すよう
に、L/D値が１に満たない場合、ペーストがたれ落ちた
バンプが生じ、またL/D値が２を越えると、ペーストの
付きすぎのバンプが生じることが判る。From the results shown in the table, it can be seen that none of the wireless bonding gold bumps 1 to 9 according to the present invention has a drop or excessive sticking of the paste, and as shown in the comparative example, the L / D value is less than 1. It can be seen that when there is no paste, bumps in which the paste drips off are produced, and when the L / D value exceeds 2, bumps with too much paste are produced.
「考案の効果」 以上説明したように、本考案のワイヤレスボンデイング
用金バンプによれば、金合金細線の端部に形成されたボ
ールを半導体チツプに圧着して該ボールと上記金合金細
線とを切断することにより形成されるワイヤレスボンデ
イング用金バンプにおいて、上記ボールの頭頂部に残る
テイルの長さを、上記金合金細線の直径の１〜２倍にし
たので、導電性ペーストがテイルに引っ掛かって、たれ
落ちが皆無になるとともに付きすぎも皆無になる。した
がって、バンプにリードを確実に接合することができ、
接合部の信頼性を著しく向上させることができる。 [Advantages of the Invention] As described above, according to the gold bump for wireless bonding of the present invention, the ball formed at the end of the gold alloy thin wire is pressure-bonded to the semiconductor chip to separate the ball and the gold alloy thin wire. In the gold bump for wireless bonding formed by cutting, the length of the tail remaining on the crown of the ball was set to be 1 to 2 times the diameter of the gold alloy thin wire, so that the conductive paste was caught on the tail. , There will be no drop, and no too much sticking. Therefore, the lead can be securely bonded to the bump,
The reliability of the joint can be significantly improved.
第１図ないし第３図は本考案のワイヤレスボンデイング
用金バンプの一実施例を示すものであり、第１図はバン
プの断面図、第２図（ａ）はバンプに導電性ペーストを
塗布した状態を示す断面図、第２図（ｂ）はバンプにリ
ードを接合した状態を示す断面図、第３図は導電性ペー
ストが塗布されたリードをバンプに接合する状態を示す
断面図、第４図ないし第６図はバンプを形成する過程を
示す断面図、第７図は頭頂部が平坦にされたバンプの断
面図、第８図は導電性ペーストが塗布されたバンプを示
す断面図、第９図はバンプにリードを接合した状態を示
す断面図、第10図は導電性ペーストがバンプ頭頂部から
たれ落ちている状態を示す断面図である。 １……金合金細線、２……ボール（バンプ）、３……IC
チツプ（半導体チツプ）、５……テイル、７……半導体
ペースト、８……リード。1 to 3 show an embodiment of a gold bump for wireless bonding according to the present invention. FIG. 1 is a sectional view of the bump, and FIG. 2 (a) is a bump coated with a conductive paste. FIG. 2 (b) is a sectional view showing a state in which leads are joined to bumps, and FIG. 3 is a sectional view showing a state in which leads coated with a conductive paste are joined to bumps. 6 to 6 are sectional views showing a process of forming a bump, FIG. 7 is a sectional view of a bump having a flat top portion, and FIG. 8 is a sectional view showing a bump coated with a conductive paste. FIG. 9 is a cross-sectional view showing a state in which leads are bonded to the bumps, and FIG. 10 is a cross-sectional view showing a state in which the conductive paste is dripping from the tops of the bumps. 1 ... Gold alloy fine wire, 2 ... Ball (bump), 3 ... IC
Chip (semiconductor chip), 5 ... tail, 7 ... semiconductor paste, 8 ... lead.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭60−134444（ＪＰ，Ａ) 特開 昭62−152142（ＪＰ，Ａ) 特開 昭64−37038（ＪＰ，Ａ) ─────────────────────────────────────────────────── --- Continuation of the front page (56) References JP-A-60-134444 (JP, A) JP-A-62-152142 (JP, A) JP-A-64-37038 (JP, A)
Claims (1)
導体チツプに圧着して該ボールと上記金合金細線とを切
断することにより形成されるワイヤレスボンデイング用
金バンプにおいて、上記ボールの頭頂部に残るテイルの
長さを、上記金合金細線の直径の１〜２倍にしたことを
特徴とするワイヤレスボンデイング用金バンプ。1. In a gold bump for wireless bonding, which is formed by pressing a ball formed at an end of a gold alloy thin wire to a semiconductor chip and cutting the ball and the gold alloy thin wire, the head of the ball. A gold bump for wireless bonding, characterized in that the length of the tail remaining on the top is set to be 1 to 2 times the diameter of the gold alloy thin wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029563U JPH0749794Y2 (en) | 1989-03-15 | 1989-03-15 | Gold bump for wireless bonding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989029563U JPH0749794Y2 (en) | 1989-03-15 | 1989-03-15 | Gold bump for wireless bonding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02120836U JPH02120836U (en) | 1990-09-28 |
| JPH0749794Y2 true JPH0749794Y2 (en) | 1995-11-13 |
Family
ID=31253886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989029563U Expired - Lifetime JPH0749794Y2 (en) | 1989-03-15 | 1989-03-15 | Gold bump for wireless bonding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0749794Y2 (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4952973A (en) * | 1972-09-22 | 1974-05-23 | ||
| JPS5282183A (en) * | 1975-12-29 | 1977-07-09 | Nec Corp | Connecting wires for semiconductor devices |
| NL184184C (en) * | 1981-03-20 | 1989-05-01 | Philips Nv | METHOD FOR APPLYING CONTACT INCREASES TO CONTACT PLACES OF AN ELECTRONIC MICROCKETES |
| JPS60134444A (en) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | Formation for bump electrode |
| JPS62152143A (en) * | 1985-12-26 | 1987-07-07 | Toshiba Corp | Formation of bump |
| JPS63173345A (en) * | 1987-01-12 | 1988-07-16 | Nec Kansai Ltd | Formation of bump electrode |
| JPH0750726B2 (en) * | 1987-05-07 | 1995-05-31 | 松下電器産業株式会社 | Semiconductor chip mounting body |
-
1989
- 1989-03-15 JP JP1989029563U patent/JPH0749794Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02120836U (en) | 1990-09-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |