JPH075645Y2 - Full color light emitting element - Google Patents

Full color light emitting element

Info

Publication number
JPH075645Y2
JPH075645Y2 JP1989087764U JP8776489U JPH075645Y2 JP H075645 Y2 JPH075645 Y2 JP H075645Y2 JP 1989087764 U JP1989087764 U JP 1989087764U JP 8776489 U JP8776489 U JP 8776489U JP H075645 Y2 JPH075645 Y2 JP H075645Y2
Authority
JP
Japan
Prior art keywords
light emitting
color light
full
led chip
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989087764U
Other languages
Japanese (ja)
Other versions
JPH0327058U (en
Inventor
芳紀 桂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989087764U priority Critical patent/JPH075645Y2/en
Publication of JPH0327058U publication Critical patent/JPH0327058U/ja
Application granted granted Critical
Publication of JPH075645Y2 publication Critical patent/JPH075645Y2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/536Shapes of wire connectors the connected ends being ball-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Description

【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、例えばLEDカラーテレビにおける発光表示用
に使用されるフルカラー発光素子に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a full-color light emitting device used for light emitting display in an LED color television, for example.

〈従来の技術〉 以下、図面を参照して従来のフルカラー発光素子を説明
する。第9図〜第11図は従来のフルカラー発光素子を説
明するための図面であって、第9図は縦断正面説明図、
第10図は電気等価回路図、第11図は第9図に示したフル
カラー発光素子に相当する集合型の発光素子の縦断正面
説明図である。
<Prior Art> A conventional full-color light emitting device will be described below with reference to the drawings. 9 to 11 are drawings for explaining a conventional full-color light emitting device, and FIG. 9 is a vertical sectional front view,
FIG. 10 is an electrical equivalent circuit diagram, and FIG. 11 is a vertical sectional front view of a collective type light emitting device corresponding to the full-color light emitting device shown in FIG.

従来のフルカラー発光素子は、第9図に示すように、そ
れぞれ赤色、緑色、青色の発光色を持つ3個のLEDチッ
プ1a、1b、1cと、これらLEDチップのそれぞれのN型導
電層7が導電性接着剤2によって取り付けられているリ
ード端子3dと、リード端子3a、3b、3cと、LEDチップ1
a、1b、1cのP型導電層8をそれぞれリード端子3a、3
b、3cに接続する導電性ワイヤ4と、リード端子3a、3
b、3c、3dの上部、LEDチップ1a、1b、1c、および導電性
ワイヤ4を封止しているエポキシ樹脂等の透光性の封止
材5とを備えている。このようなフルカラー発光素子を
構成するLEDチップ1a、1b、1cは、第10図に示すよう
に、並列に接続されている。
As shown in FIG. 9, a conventional full-color light emitting device has three LED chips 1a, 1b, and 1c each having red, green, and blue emission colors and an N-type conductive layer 7 of each of these LED chips. Lead terminal 3d attached by conductive adhesive 2, lead terminals 3a, 3b, 3c, and LED chip 1
The P-type conductive layers 8 of a, 1b, and 1c are connected to the lead terminals 3a and 3 respectively.
Conductive wire 4 connected to b, 3c and lead terminals 3a, 3
It is provided with an upper part of b, 3c, 3d, LED chips 1a, 1b, 1c, and a light-transmissive encapsulant 5 such as an epoxy resin encapsulating the conductive wire 4. The LED chips 1a, 1b, 1c forming such a full-color light emitting element are connected in parallel as shown in FIG.

第11図は、LEDチップ1a、1b、1cをそれぞれ別個に封止
した場合のフルカラー発光素子を示しており、赤色、緑
色および青色発光素子6a、6b、6cから構成されている。
赤色発光素子6aは、赤色の発光色を持つLEDチップ1a
と、このLEDチップ1aのN型導電層7が導電性接着剤2
によって取り付けられているリード端子31dと、LEDチッ
プ1aのP型導電層8に導電性ワイヤ4によって接続され
ているリード端子3aと、リード端子31d、3aの上部、LED
チップ1aおよび導電性ワイヤ4aを封止しているエポキシ
樹脂等の透光性の封止材5aとを備えている。緑色および
青色発光素子6b、6cも赤色発光素子6aと同様の構造であ
って、緑色発光素子6bは緑色を発光するLEDチップ1b、
リード端子32d、リード端子3bおよび封止材5bを、青色
発光素子6cは青色を発光するLEDチップ1c、リード端子3
3d、リード端子3bおよび封止材5cを備えている。リード
端子31d、32d、33dを接続点3dで接続し、発光素子6a、6
b、6cを一組のフルカラー発光素子として使用する。な
お、電気回路的には第10図に示した電気等価回路図と同
等になる。
FIG. 11 shows a full-color light emitting element in the case where the LED chips 1a, 1b, 1c are individually sealed, and is composed of red, green and blue light emitting elements 6a, 6b, 6c.
The red light emitting element 6a is an LED chip 1a having a red light emission color.
And the N-type conductive layer 7 of this LED chip 1a is a conductive adhesive 2
Attached to the P-type conductive layer 8 of the LED chip 1a by the conductive wire 4 and the lead terminal 31d, the top of the lead terminal 31d, LED
It is provided with a translucent sealing material 5a such as an epoxy resin which seals the chip 1a and the conductive wire 4a. The green and blue light emitting elements 6b and 6c have the same structure as the red light emitting element 6a, and the green light emitting element 6b emits green light LED chip 1b,
The lead terminal 32d, the lead terminal 3b and the sealing material 5b, the blue light emitting element 6c is an LED chip 1c that emits blue light, the lead terminal 3
3d, a lead terminal 3b and a sealing material 5c. The lead terminals 31d, 32d, 33d are connected at the connection point 3d, and the light emitting elements 6a, 6
b and 6c are used as a set of full color light emitting devices. The electrical circuit is the same as the electrical equivalent circuit diagram shown in FIG.

〈考案が解決しようとする課題〉 しかしながら、上記した従来のフルカラー発光素子には
以下に述べる欠点がある。即ち、第9図で説明したフル
カラー発光素子は、リード端子の本数が4本も有るの
で、フルカラー発光素子としてのサイズが大きくなる。
また、第11図で説明したフルカラー発光素子も、それぞ
れ単独に封止した赤色、緑色、青色の3個の発光素子を
寄せ集めて1単位としたフルカラー発光素子であるか
ら、フルカラー発光単位としては占有面積が大きくなっ
てしまう。カラーテレビ等において、映像の鮮明度を向
上させるためにフルカラー発光素子の集積度を大きくす
ることが望まれるが、フルカラー発光素子のサイズが大
きいと、その集積度を大きくすることが困難になる。
<Problems to be Solved by the Invention> However, the above-described conventional full-color light emitting device has the following drawbacks. That is, the full-color light-emitting device described in FIG. 9 has four lead terminals, and therefore the size of the full-color light-emitting device is large.
Further, the full-color light-emitting element described in FIG. 11 is also a full-color light-emitting element in which three light-emitting elements of red, green, and blue, which are individually sealed, are gathered into one unit, and therefore, as a full-color light-emitting unit, The occupied area becomes large. In a color television or the like, it is desired to increase the degree of integration of the full-color light emitting elements in order to improve the sharpness of the image. However, if the size of the full-color light emitting elements is large, it is difficult to increase the degree of integration.

また、フルカラー発光素子の駆動方式に関して言えば、
従来のフルカラー発光素子はCD駆動か、一般的なパルス
電流によるダイナミック駆動に適している。しかし、産
業用テレビ等の設置を行う場合に利用可能な電源である
3相交流を、フルカラー発光素子の直接駆動電源として
使用することは不可能である。
Also, regarding the driving method of the full-color light emitting element,
Conventional full-color light emitting devices are suitable for CD drive or dynamic drive by general pulse current. However, it is impossible to use a three-phase alternating current, which is a power source that can be used when installing an industrial television or the like, as a direct drive power source for a full-color light emitting element.

本考案は上記事情に鑑みて創案されたものであって、サ
イズが小さく、且つ3相交流を直接駆動電源として使用
することができるフルカラー発光素子を提供することを
目的としている。
The present invention has been made in view of the above circumstances, and an object thereof is to provide a full-color light emitting device that is small in size and can use a three-phase alternating current directly as a driving power supply.

〈課題を解決するための手段〉 上記問題点を解決するために本考案のフルカラー発光素
子は、それぞれ赤色、緑色および青色を発光し、デルタ
接続された第1、第2および第3LEDチップを有し、前記
第1、第2および第3LEDチップのそれぞれに3相交流の
第1、第2および第3相の電圧を印加し、且つ前記電圧
を各相ごとに変化させて所望の色を発光させるようにし
ている。
<Means for Solving the Problems> In order to solve the above problems, the full-color light emitting device of the present invention emits red, green, and blue light, respectively, and has first, second, and third LED chips connected in delta. Then, the first, second, and third LED chips are respectively applied with the voltages of the first, second, and third phases of a three-phase alternating current, and the voltages are changed for each phase to emit a desired color. I am trying to let you.

〈作用〉 第1、第2および第3LEDチップのそれぞれに3相交流の
第1、第2および第3相の電圧を印加し、且つこの電圧
を各相ごとに変化させて所望の色を発光させる。
<Operation> A desired color is emitted by applying a voltage of the first, second and third phases of a three-phase alternating current to each of the first, second and third LED chips and changing the voltage for each phase. Let

〈実施例〉 以下、図面を参照して本考案の実施例を説明する。第1
図〜第5図は本考案の第1の実施例を説明するための図
面であって、第1図は縦断正面図、第2図は平面図、第
3図は第1図の一部拡大図、第4図は電気的等価回路
図、第5図はフルカラー発光素子の駆動状態における印
加電圧の説明図である。第6図〜第8図は本考案の第2
の実施例を説明するための図面であって、第6図、第7
図および第8図は、それぞれ第1の実施例の第3図、第
2図および第4図に対応する図面である。従来の技術で
説明したものと同一或いは類似のものには同一の符号を
付して説明する。
<Embodiment> An embodiment of the present invention will be described below with reference to the drawings. First
1 to 5 are drawings for explaining a first embodiment of the present invention, wherein FIG. 1 is a longitudinal front view, FIG. 2 is a plan view, and FIG. 3 is a partially enlarged view of FIG. FIG. 4 and FIG. 4 are electrical equivalent circuit diagrams, and FIG. 5 is an explanatory diagram of applied voltage in a driving state of the full-color light emitting element. 6 to 8 show the second of the present invention.
FIGS. 6 and 7 are views for explaining the embodiment of FIG.
FIG. 8 and FIG. 8 are drawings corresponding to FIG. 3, FIG. 2 and FIG. 4 of the first embodiment, respectively. The same or similar components as those described in the related art will be designated by the same reference numerals.

第1図に示すように、第1の実施例のフルカラー発光素
子100は、赤色を発光するLEDチップ1a(第1LEDチッ
プ)、緑色を発光するLEDチップ1b(第2LED発光チッ
プ)および青色を発光するLEDチップ1c(第3LEDチッ
プ)を備えている。そして、第3図に示すように、これ
らLEDチップ1a、1b、1cのそれぞれは、積層された第1
導電層であるN型導電層7と、第2導電層であるP型導
電層8とを有している。また、フルカラー発光素子100
は、LEDチップ1aのN型導電層7が銀ペースト等の導電
性接着剤2によって上端(第1図上で上方)に取り付け
られたリード端子3a(第1リード端子)、LEDチップ1b
のN型導電層7が導電性接着剤2によって上端に取り付
けられたリード端子3b(第2リード端子)およびLEDチ
ップ1cのN型導電層7が導電性接着剤2によって上端に
取り付けられたリード端子3c(第3リード端子)とを備
えている。そして、LEDチップ1aのP型導電層8とリー
ド端子3c間、LEDチップ1bのP型導電層8とリード端子3
a間およびLEDチップ1cのP型導電層8とリード端子3b間
は、それぞれ金等の導電性のワイヤ4で接続されてい
る。更に、リード端子3a、3b、3cの上部、LEDチップ1
a、1b、1cおよびワイヤ4は、第1図および第2図に示
すように、エポキシ樹脂等の透光性の封止材5で封止さ
れている。なお、リード端子3a、3bおよび3cは互いに長
手方向がほぼ平行で、且つLEDチップ1a、1b、1cがほぼ
同一高さで一直線上にあるように配置されている。この
ような構造を有するフルカラー発光素子100の電気回路
は、第4図に示すように、デルタ接続となっている。
As shown in FIG. 1, the full-color light emitting device 100 of the first embodiment has an LED chip 1a (first LED chip) that emits red light, an LED chip 1b (second LED light emitting chip) that emits green light, and a blue light emission device. It has an LED chip 1c (third LED chip). Then, as shown in FIG. 3, each of the LED chips 1a, 1b, and 1c has a laminated first
It has an N-type conductive layer 7 which is a conductive layer and a P-type conductive layer 8 which is a second conductive layer. In addition, the full-color light emitting device 100
Is a lead terminal 3a (first lead terminal) having the N-type conductive layer 7 of the LED chip 1a attached to the upper end (upper side in FIG. 1) by a conductive adhesive 2 such as silver paste, the LED chip 1b.
Lead terminal 3b (second lead terminal) having the N-type conductive layer 7 attached to the upper end with the conductive adhesive 2 and the lead having the N-type conductive layer 7 of the LED chip 1c attached to the upper end with the conductive adhesive 2. And a terminal 3c (third lead terminal). Then, between the P-type conductive layer 8 of the LED chip 1a and the lead terminal 3c, between the P-type conductive layer 8 of the LED chip 1b and the lead terminal 3c.
The wires a and the P-type conductive layer 8 of the LED chip 1c and the lead terminals 3b are connected by conductive wires 4 such as gold. Furthermore, the upper part of the lead terminals 3a, 3b, 3c, the LED chip 1
The a, 1b, 1c and the wire 4 are sealed with a translucent sealing material 5 such as an epoxy resin as shown in FIGS. 1 and 2. The lead terminals 3a, 3b and 3c are arranged such that their longitudinal directions are substantially parallel to each other and the LED chips 1a, 1b and 1c are substantially at the same height and aligned. The electric circuit of the full-color light emitting device 100 having such a structure is in a delta connection as shown in FIG.

次に本実施例のフルカラー発光素子100の動作を説明す
る。
Next, the operation of the full-color light emitting device 100 of this embodiment will be described.

フルカラー発光素子100は、前記のように、デルタ接続
となっているので、フルカラー発光素子100を駆動する
には、リード端子3a、3bおよび3cに3相交流電圧の印加
を行う。すると、LEDチップ1a、1b、1cは厳密には同時
に点灯することはないが、高周波数で点滅するので、人
間の目には連続点灯に見えるという視覚上の錯覚を利用
して、具体的には以下に述べるような駆動方法を用いる
ことによってフルカラーの発光を行うことができる。
Since the full-color light-emitting device 100 is in the delta connection as described above, in order to drive the full-color light-emitting device 100, a three-phase AC voltage is applied to the lead terminals 3a, 3b and 3c. Then, the LED chips 1a, 1b, and 1c do not light up at the same time in a strict sense, but since they blink at high frequency, the visual illusion that they appear to be continuous lighting up to the human eye is used. Can emit full-color light by using the driving method described below.

リード端子3c、3a間にLEDチップ1aに順方向の電流が流
れるように電圧を印加すると、ダイオードの特性上LED
チップ1b、1cには逆向きの電圧が印加されて電流が流れ
ないからLEDチップ1aのみが点灯する。リード端子3a、3
b間にLEDチップ1bに順方向の電流が流れるように電圧を
印加すると、LEDチップ1c、1aには電流が流れないからL
EDチップ1bのみが点灯する。また、リード端子3b、3c間
にLEDチップ1cに順方向の電流が流れるように電圧を印
加すると、LEDチップ1a、1bには電流が流れないからLED
チップ1cのみが点灯する。
When a voltage is applied between the lead terminals 3c and 3a so that a forward current flows in the LED chip 1a, the LED characteristics cause the LED
Since a reverse voltage is applied to the chips 1b and 1c and no current flows, only the LED chip 1a lights up. Lead terminals 3a, 3
If a voltage is applied between b so that a forward current flows through the LED chip 1b, no current will flow through the LED chips 1c and 1a.
Only the ED chip 1b lights up. If a voltage is applied between the lead terminals 3b and 3c so that a forward current flows through the LED chip 1c, no current will flow through the LED chips 1a and 1b.
Only chip 1c lights up.

従って、リード端子3a、3bおよび3cを高周波の3相交流
電源に接続すると、即ち、リード端子3c、3a間、リード
端子3a、3b間およびリード端子3b、3c間に、第5図
(a)に示すように、各相の電圧の大きさが等しい3相
交流電圧の各相電圧をそれぞれ印加すると、LEDチップ1
aの赤色の発光、LEDチップ1bの緑色の発光およびLEDチ
ップ1cの青色の発光を、高速度で繰り返すから、結果と
して、視覚上白色の発光を得ることができる。
Therefore, when the lead terminals 3a, 3b and 3c are connected to a high frequency three-phase AC power supply, that is, between the lead terminals 3c and 3a, between the lead terminals 3a and 3b and between the lead terminals 3b and 3c, FIG. As shown in, when the voltage of each phase of the three-phase AC voltage with the same voltage of each phase is applied, the LED chip 1
The red light emission of a, the green light emission of the LED chip 1b, and the blue light emission of the LED chip 1c are repeated at high speed, and as a result, visually white light emission can be obtained.

また、リード端子3c、3a間、リード端子3a、3b間および
リード端子3b、3c間に印加する電圧に、図示しない変調
回路を通して、第5図(b)に示すように、大小の差を
つれると、LEDチップ1a、1b、1cの通電電流の大きさ、
即ち波形が、それぞれのLEDチップによって異なる。そ
して、LEDチップ1aの点灯、LEDチップ1bの点灯およびLE
Dチップ1cの点灯が順次繰り返えられるから、このよう
に通電電流の大きさをLEDチップ毎に調節すると、LEDチ
ップ1a、1b、1cの輝度バランスによって所望の色の発光
を得ることができる。
In addition, as shown in FIG. 5 (b), a voltage applied between the lead terminals 3c and 3a, between the lead terminals 3a and 3b, and between the lead terminals 3b and 3c is passed through a modulation circuit (not shown) to generate large and small differences. Then, the magnitude of the current flowing through the LED chips 1a, 1b, 1c,
That is, the waveform is different for each LED chip. And LED chip 1a lighting, LED chip 1b lighting and LE
Since the lighting of the D chip 1c is sequentially repeated, it is possible to obtain light emission of a desired color by adjusting the luminance of the LED chips 1a, 1b, 1c by adjusting the magnitude of the energizing current for each LED chip in this way. .

次に第2の実施例を説明する。第1の実施例で説明した
ものと同等のものには同一の符号を付している。第6図
および第7図に示すように、第2の実施例のフルカラー
発光素子200は、第1の実施例のフルカラー発光素子100
と同様に、赤色を発光するLEDチップ1a(第1LEDチッ
プ)と、緑色を発光するLEDチップ1b(第2LEDチップ)
と、青色を発光するLEDチップ1c(第3LEDチップ)とを
備え、且つこれらLEDチップ1a、1b、1cのそれぞれは積
層されたN型導電層7とP型導電層8とを有している。
Next, a second embodiment will be described. The same components as those described in the first embodiment are designated by the same reference numerals. As shown in FIGS. 6 and 7, the full color light emitting device 200 of the second embodiment is the full color light emitting device 100 of the first embodiment.
Similarly, LED chip 1a (first LED chip) that emits red light and LED chip 1b (second LED chip) that emits green light
And an LED chip 1c (third LED chip) that emits blue light, and each of these LED chips 1a, 1b, 1c has an N-type conductive layer 7 and a P-type conductive layer 8 that are stacked. .

また、フルカラー発光素子200はLEDチップ1aのN型導電
層7が導電性接着剤2によって上端に取り付けられたリ
ード端子3a(第1リード端子)、LEDチップ1bのN型導
電層7とLEDチップ1cのP型導電挿8とが導電性接着剤
2によって上端に取り付けられたリード端子3d(第2リ
ード端子)およびリード端子3e(第3リード端子)とを
備えている。そして、LEDチップ1aのP型導電層8とリ
ード端子3e間、LEDチップ1bのP型導電層8とリード端
子3a間およびLEDチップ1cのN型導電層7とリード端子3
e間は、それぞれ金等の導電性のワイヤ4で接続されて
いる。更に、リード端子3a、3d、3eの上部、LEDチップ1
a、1b、1cおよびワイヤ4は、エポキシ樹脂等の透光性
の封止材5で封止されている。なお、LEDチップ1a、1
b、1cがほぼ同一高さで、且つ平面視でほぼ正三角形の
頂点にあるように、リード端子3a、3dおよび3eが配置さ
れている。このような構造を有するフルカラー発光素子
200の電気回路も、第8図に示すように、デルタ接続と
なっている。第2の実施例のフルカラー発光素子200の
動作については、第1の実施例と同様であるので、説明
は省略する。
In addition, the full-color light-emitting device 200 has a lead terminal 3a (first lead terminal) in which the N-type conductive layer 7 of the LED chip 1a is attached to the upper end by the conductive adhesive 2, the N-type conductive layer 7 of the LED chip 1b and the LED chip. The P-type conductive insert 8 of 1c is provided with a lead terminal 3d (second lead terminal) and a lead terminal 3e (third lead terminal) attached to the upper end by a conductive adhesive 2. Then, between the P-type conductive layer 8 of the LED chip 1a and the lead terminal 3e, between the P-type conductive layer 8 of the LED chip 1b and the lead terminal 3a, and between the N-type conductive layer 7 and the lead terminal 3 of the LED chip 1c.
The portions e are connected by a conductive wire 4 such as gold. Furthermore, the upper part of the lead terminals 3a, 3d, 3e, the LED chip 1
The a, 1b, 1c and the wire 4 are sealed with a translucent sealing material 5 such as an epoxy resin. LED chips 1a, 1
The lead terminals 3a, 3d, and 3e are arranged so that b and 1c have substantially the same height and are located at the vertices of a substantially equilateral triangle in a plan view. Full-color light emitting device having such a structure
The electric circuit of 200 also has a delta connection as shown in FIG. The operation of the full-color light emitting device 200 of the second embodiment is similar to that of the first embodiment, so its explanation is omitted.

なお、上記の第1および第2の実施例ともに、LEDチッ
プ1a、1b、1cの第1導電層がN型導電層、第2導電層が
P型導電層であるとして説明したが、これにこだわるも
のではなく、第1導電層がP型導電層、第2導電層がN
型導電層であっても同等の効果を得ることができる。ま
た、N型導電層7およびP型導電層8共に、N型導電層
7とP型導電層8との接合面と反対側の面に、それぞれ
N型導電層7およびP型導電層8の一部を構成するもの
として図示しない電極が形成されており、実際には、こ
の電極にワイヤ4がワイヤボンディングによって接続さ
れたり、或いはこの電極が導電性接着剤2によってリー
ド端子に取り付けられる。
In the first and second embodiments described above, the first conductive layer of the LED chips 1a, 1b, 1c is described as the N-type conductive layer and the second conductive layer is the P-type conductive layer. The first conductive layer is a P-type conductive layer, and the second conductive layer is N.
The same effect can be obtained even with the type conductive layer. Further, both the N-type conductive layer 7 and the P-type conductive layer 8 are formed on the surface opposite to the joint surface between the N-type conductive layer 7 and the P-type conductive layer 8, respectively. An electrode (not shown) is formed as a part of the electrode. In practice, the wire 4 is connected to the electrode by wire bonding, or the electrode is attached to the lead terminal by the conductive adhesive 2.

〈考案の効果〉 以上説明したように本考案のフルカラー発光素子は、赤
色を発光するLEDチップと、緑色を発光するLEDチップ
と、青色を発光するLEDチップとがデルタ接続されてお
り、且つ、これらLEDチップに電圧を印加するためのリ
ード端子の数は、従来のフルカラー発光素子のリード端
子の数より1個少なくなっている。
<Effect of Device> As described above, the full-color light emitting device of the present invention is such that the LED chip that emits red light, the LED chip that emits green light, and the LED chip that emits blue light are connected in delta, and The number of lead terminals for applying a voltage to these LED chips is one less than the number of lead terminals of a conventional full-color light emitting device.

従って、本考案のフルカラー発光素子はコンパクトな外
形寸法であるから、多数個のフルカラー発光素子を一枚
の基板上に高密度で実装可能であり、このフルカラー発
光素子をテレビ画面等に使用する場合には、画質を向上
して鮮明な映像を取り出すことができる。また、これら
LEDチップがデルタ接続されているから、各LEDチップに
3相交流の各相の電圧を印加し、この電圧を各相ごとに
変化させて各LEDチップの通電電流を異ならせ、LEDチッ
プ間の輝度バランスによって所望の色を発光させること
ができる。即ち、高速の3相交流を直接駆動電源として
使用することができる利点をも有している。
Therefore, since the full-color light-emitting device of the present invention has a compact external size, it is possible to mount a large number of full-color light-emitting devices on a single substrate with high density. In addition, the image quality can be improved and a clear image can be taken out. Also these
Since the LED chips are connected in delta, the voltage of each phase of the three-phase alternating current is applied to each LED chip, and this voltage is changed for each phase to make the conduction current of each LED chip different and A desired color can be emitted depending on the brightness balance. That is, there is also an advantage that high-speed three-phase alternating current can be directly used as a driving power source.

【図面の簡単な説明】[Brief description of drawings]

第1図〜第5図は本考案の第1の実施例を説明するため
の図面であって、第1図は縦断正面図、第2図は平面
図、第3図は第1図の一部拡大図、第4図は電気的等価
回路図、第5図はフルカラー発光素子の駆動状態におけ
る印加電圧の説明図であって、(a)は各相の電圧が等
しい場合、(b)は各相の電圧が異なっている場合を示
す。第6図〜第8図は本考案の第2の実施例を説明する
ための図面であって、第6図、第7図および第8図は、
それぞれ第1の実施例の第3図、第2図および第4図に
対応する図面である。 第9図〜第11図は従来のフルカラー発光素子を説明する
ための図面であって、第9図は縦断正面説明図、第10図
は電気等価回路図、第11図は第9図に示したフルカラー
発光素子に相当する集合型の発光素子の縦断正面説明図
である。 1a、1b、1c……LEDチップ、3a、3b、3c、3d、3e……リ
ード端子、4……ワイヤ、5……封止材、7……N型導
電層、8……P型導電層、100、200……フルカラー発光
素子。
1 to 5 are drawings for explaining a first embodiment of the present invention, in which FIG. 1 is a longitudinal front view, FIG. 2 is a plan view, and FIG. 3 is one of FIG. 4 is an electrically equivalent circuit diagram, FIG. 5 is an explanatory diagram of an applied voltage in a driving state of a full-color light emitting device, FIG. 5A is a case where voltages of respective phases are equal, and FIG. The case where the voltage of each phase is different is shown. FIGS. 6 to 8 are drawings for explaining the second embodiment of the present invention, and FIGS. 6, 7 and 8 are
5 is a drawing corresponding to FIG. 3, FIG. 2 and FIG. 4 of the first embodiment, respectively. 9 to 11 are drawings for explaining a conventional full-color light emitting device. FIG. 9 is a vertical sectional front view, FIG. 10 is an electrical equivalent circuit diagram, and FIG. 11 is shown in FIG. FIG. 3 is a vertical sectional front view of a collective type light emitting element corresponding to a full-color light emitting element. 1a, 1b, 1c ... LED chip, 3a, 3b, 3c, 3d, 3e ... Lead terminal, 4 ... Wire, 5 ... Sealing material, 7 ... N-type conductive layer, 8 ... P-type conductivity Layer, 100, 200 ... Full color light emitting device.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】それぞれ赤色、緑色および青色を発光し、
デルタ接続された第1、第2および第3LEDチップを有
し、前記第1、第2および第3LEDチップに、それぞれ、
3相交流の第1、第2および第3相の電圧を印加し、且
つ前記電圧を各相ごとに変化させて所望の色を発光させ
ることを特徴とするフルカラー発光素子。
1. A red light emitting device, a green light emitting device, and a blue light emitting device, respectively.
Delta-connected first, second and third LED chips, said first, second and third LED chips respectively,
A full-color light-emitting device, characterized in that first, second, and third-phase voltages of three-phase alternating current are applied, and the voltages are changed for each phase to emit a desired color.
JP1989087764U 1989-07-25 1989-07-25 Full color light emitting element Expired - Fee Related JPH075645Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989087764U JPH075645Y2 (en) 1989-07-25 1989-07-25 Full color light emitting element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989087764U JPH075645Y2 (en) 1989-07-25 1989-07-25 Full color light emitting element

Publications (2)

Publication Number Publication Date
JPH0327058U JPH0327058U (en) 1991-03-19
JPH075645Y2 true JPH075645Y2 (en) 1995-02-08

Family

ID=31637404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989087764U Expired - Fee Related JPH075645Y2 (en) 1989-07-25 1989-07-25 Full color light emitting element

Country Status (1)

Country Link
JP (1) JPH075645Y2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101015188B1 (en) * 2008-07-07 2011-02-17 주식회사 마스테코 Pressure supply valve for portable fire extinguisher

Also Published As

Publication number Publication date
JPH0327058U (en) 1991-03-19

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