JPH0760962B2 - Planar dielectric filter - Google Patents
Planar dielectric filterInfo
- Publication number
- JPH0760962B2 JPH0760962B2 JP2295310A JP29531090A JPH0760962B2 JP H0760962 B2 JPH0760962 B2 JP H0760962B2 JP 2295310 A JP2295310 A JP 2295310A JP 29531090 A JP29531090 A JP 29531090A JP H0760962 B2 JPH0760962 B2 JP H0760962B2
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- dielectric
- end faces
- side end
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 239000000758 substrate Substances 0.000 claims description 24
- 238000000605 extraction Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 description 11
- 238000007747 plating Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- 238000009966 trimming Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
Landscapes
- Non-Reversible Transmitting Devices (AREA)
- Waveguides (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Description
【発明の詳細な説明】 （発明の属する技術分野） 本発明はマイクロ波帯の通信機器に用いられる小形で量
産性に富む平面形誘電体フィルタに関する。Description: TECHNICAL FIELD The present invention relates to a small-sized planar dielectric filter used for microwave band communication equipment and having high mass productivity.
（従来の技術） マイクロ波帯フィルタの一つとしてストリップ導体を利
用した小型で軽量な平面形誘導体フィルタがある。図６
は従来の平面形誘電体フィルタの一部切欠斜視図であ
り、図７は外部接続用の端子のあるフィルタの斜視図で
ある。(Prior Art) As one of microwave band filters, there is a compact and lightweight planar dielectric filter using a strip conductor. Figure 6
Is a partially cutaway perspective view of a conventional planar dielectric filter, and FIG. 7 is a perspective view of a filter having terminals for external connection.
図６に示すように、従来の平面形誘電体フィルタは、一
つの誘電体基板１の一方主表面に一端短絡他端開放の1/
4波長ストリップ導体３及び４がメタライズあるいはエ
ッチングにより並列配置され、これに入出力端子５及び
６が設けられている。この誘電体基板１の他方主表面に
は接地導体７が設けられており、もう一つの誘電体基板
２の一方主表面を残した他の面に接地導体８が設けられ
たものとを図示のように重ね合わせてガラス等で融着固
着させるか、機械的に固定してつくられている。As shown in FIG. 6, in the conventional planar dielectric filter, one short-circuit on one main surface of one dielectric substrate 1 with one short circuit and the other end open
Four-wavelength strip conductors 3 and 4 are arranged in parallel by metallizing or etching, and input / output terminals 5 and 6 are provided on them. A grounding conductor 7 is provided on the other main surface of the dielectric substrate 1, and a grounding conductor 8 is provided on the other surface of the other dielectric substrate 2 which remains one main surface. It is made by fusing and fixing it with glass or by mechanically fixing it.
かかる従来の平面形誘導体フィルタは次のような欠点が
ある。The conventional planar dielectric filter has the following drawbacks.
（１）ストリップ導体３及び４が、銀ペーストや銅ペー
ストを印刷，焼成するメタライズ法で形成された場合、
その導体断面は図５のように厚みが一定とならず、この
ため対向する誘導体基板２とストリップ導体３及び４の
間に隙間ができ、共振周波数が大幅にばらつくことにな
る。このため、フィルタとして所要の特性を出すため
に、大幅なトリミングを必要とし、量産を効果的に行う
ことが困難であった。(1) When the strip conductors 3 and 4 are formed by a metallizing method of printing and firing a silver paste or a copper paste,
The cross section of the conductor does not have a constant thickness as shown in FIG. 5, so that a gap is created between the dielectric substrate 2 and the strip conductors 3 and 4 which face each other, and the resonance frequency greatly varies. For this reason, in order to obtain the required characteristics as a filter, a large amount of trimming is required, which makes it difficult to effectively perform mass production.
（２）ストリップ導体３及び４が、誘電体基板1,2に全
面めっきで導体をつけ、その後エッチングにより所望の
導体パターンを形成する方法の場合は、メタライズ法の
ように導体の厚みの均一性がなくなることはない。しか
し、誘電体基板1,2に金属めっきする場合は、密着強度
を高めるため、まず下地としてニッケルやクロムなど比
較的電気抵抗の大きい金属を無電解めっきをし、その後
銅，金，銀のような電気抵抗の小さい金属を電解めっき
で付けることになる。このため、高周波電流密度の高い
基板面側の導体抵抗が大きくなり、メタライズ法に比べ
損失が増加する。われわれの試作結果では、メタライズ
法に比べ、めっき・エッチング法は1GHzにおいて１〜２
割のＱの低下が確認された。このため、損失の少ないフ
ィルタの用途に使うことが困難であった。(2) In the case of a method in which the strip conductors 3 and 4 are formed by plating the entire surface of the dielectric substrates 1 and 2 and then forming a desired conductor pattern by etching, the thickness uniformity of the conductor is the same as in the metallizing method. Never disappears. However, in the case of metal plating on the dielectric substrates 1 and 2, in order to increase the adhesion strength, first electroless plating a metal with a relatively high electric resistance such as nickel or chromium as a base, and then using copper, gold, silver or the like. A metal with a low electrical resistance will be attached by electrolytic plating. Therefore, the conductor resistance on the substrate surface side where the high frequency current density is high becomes large, and the loss increases as compared with the metallization method. Our trial results show that the plating / etching method is 1 to 2 at 1 GHz compared to the metallization method.
A decrease in Q was confirmed. For this reason, it has been difficult to use it for a filter with low loss.
（３）フィルタとして無線機器に用いる場合は入出力の
引出線が必要である。従来は図７（Ａ）に示すように誘
電体基板１と２の間に薄い板を入れて引出線９としてい
た。ところがこの方法では引出線９の板厚分誘電体基板
１と２の間に隙間ができるため、実効誘電率が下がり小
形化への障害となる。この対策として同図（Ｂ）に示す
ように、誘電体基板の寸法を換えたものを組合わせて引
出線10を露出させる方法もあるが、誘電体基板を製造す
る際の抜型が２種類になり、初期投資が大きいこと、誘
電体基板１に引出線10を電気的機械的に接続するための
スペースが必要なため、小形化への障害となるという難
点がある。(3) When used as a filter in a wireless device, input / output leader lines are required. Conventionally, as shown in FIG. 7 (A), a thin plate is inserted between the dielectric substrates 1 and 2 to form the leader line 9. However, in this method, a gap is formed between the dielectric substrates 1 and 2 corresponding to the plate thickness of the leader line 9, so that the effective permittivity is lowered and it becomes an obstacle to downsizing. As a countermeasure against this, as shown in FIG. 2B, there is a method of exposing the leader line 10 by combining the dielectric substrates having different dimensions, but there are two types of die removal when manufacturing the dielectric substrate. However, the initial investment is large, and a space for electrically and mechanically connecting the leader line 10 to the dielectric substrate 1 is required, which is an obstacle to miniaturization.
以上まとめると次のようになる。The above is summarized as follows.
（１）メタライズ法による導体形成＝導体厚の不均一＝
トリミング量大＝量産性に問題あり （２）めっき・エッチングによる導体形成＝導体損失の
増加＝特性の劣化 （３）外部引出線＝実効誘電率の低下＝接続スペースが
必要＝形状大 （発明が解決しようとする課題） 本発明の目的は、以上述べた従来例にあった導体形成
法，外部引出線の課題を解消し、小形でトリミング量が
少なく量産性に優れ、経済的な平面形誘導体フィルタを
提供することにある。(1) Conductor formation by metallization method = non-uniform conductor thickness =
Large amount of trimming = problem in mass productivity (2) Formation of conductor by plating / etching = Increase of conductor loss = Deterioration of characteristics (3) External lead wire = Reduction of effective dielectric constant = Connection space required = Large shape (invention An object of the present invention is to solve the problems of the conductor forming method and the external lead wire in the conventional examples described above, and to be compact, have a small trimming amount, have excellent mass productivity, and be an economical planar derivative. To provide a filter.
（課題を解決しようとする手段） 図１は本発明の実施例の構成を示す分解斜視図である。
誘電体基板11,12の一方主表面及び一対の側端面には全
面メタライズ導体16,17が形成されている。フィルタを
形成するために必要な共振用電極13a〜13e及び入出力電
極15a,15bはこれらを保持する部分と共に１枚の金属板2
0に板金プレス加工やフォトエッチングによって作られ
る。基板11と12の他方主表面を対向させ、その間に金属
板20を挟んで重ね、側端面電極16,17と金属板20の側端
面をろう付けにより電気的接続及び機械的固定を行う。
次にプレスガイド穴14を基準として、不要な金属板部分
をプレス加工により破線で示した部分を切断して図２の
ごとく、フィルタ完成品が得られる。18a〜18dは電気的
には接地端子となり、15a,15bは入出力用のホット端子
となる。接地端子18aと18d間の金属板は、安定な挟着固
定状態を保つと共に電磁シールドの役割を果たしてい
る。(Means for Solving the Problem) FIG. 1 is an exploded perspective view showing the configuration of an embodiment of the present invention.
Full-surface metallized conductors 16 and 17 are formed on one main surface and a pair of side end surfaces of the dielectric substrates 11 and 12. The resonance electrodes 13a to 13e and the input / output electrodes 15a and 15b necessary for forming the filter are provided on one metal plate 2 together with the portions holding them.
Made by sheet metal stamping and photo etching to 0. The other main surfaces of the substrates 11 and 12 are opposed to each other, the metal plate 20 is sandwiched therebetween, and the side end face electrodes 16 and 17 and the side end faces of the metal plate 20 are electrically connected and mechanically fixed by brazing.
Next, using the press guide hole 14 as a reference, an unnecessary metal plate portion is pressed to cut a portion indicated by a broken line to obtain a finished filter product as shown in FIG. 18a to 18d electrically serve as ground terminals, and 15a and 15b serve as hot terminals for input / output. The metal plate between the ground terminals 18a and 18d maintains a stable sandwiched and fixed state and also serves as an electromagnetic shield.
表面実装部品としての端子形状を要求される場合は、こ
の後さらに端子成形をし、図３の側面図に示す形にする
こともできる。When a terminal shape as a surface mount component is required, the terminal may be further molded after this to obtain the shape shown in the side view of FIG.
導体として、１枚の金属板20を用いているので、厚みは
均一であり、従来の印刷・焼成によるメタライズ法の表
面あらさが３μｍであるのに対し、0.3μｍの表面あら
さの金属板が一般品で入手することができる。このため
メタライズ品に比べ10倍の均一性を得ることができ、従
来のメタライズ電極の厚みの不均一により生じる電気的
特性のバラツキをおさえることができ、量産においてト
リミング量が格段に少なくてすみ、歩留向上をはかるこ
とができる。Since one metal plate 20 is used as the conductor, the thickness is uniform, and a metal plate having a surface roughness of 0.3 μm is generally used, whereas the surface roughness of the conventional metallizing method by printing and firing is 3 μm. It can be obtained as a product. For this reason, it is possible to obtain 10 times more uniformity than metalized products, it is possible to suppress variations in electrical characteristics caused by uneven thickness of conventional metallized electrodes, and the trimming amount can be significantly reduced in mass production. It is possible to improve the yield.
さらに、金属板材料として機械的強度の大きい鉄系の材
料を用いることができ、表面処理として機械的強度は弱
いが導電性にすぐれた銅，銀，金などのめっきをするこ
とにより、このめっき部分にのみ高周波電流を流すこと
ができ、Ｑの高い共振回路を得ることができる。さらに
入出力引出電極はそのまま入出力端子となるので、従来
例の図７（Ａ）（Ｂ）で述べた問題点が一切なくなり、
小形で経済的なフィルタを実現することができる。Further, an iron-based material having a high mechanical strength can be used as the metal plate material, and the surface treatment is performed by plating copper, silver, gold, or the like, which has a low mechanical strength but is excellent in conductivity, so that the plating can be performed. A high-frequency current can be passed only through the portion, and a high Q resonant circuit can be obtained. Furthermore, since the input / output extraction electrode directly serves as the input / output terminal, the problems described in FIGS. 7A and 7B of the conventional example are eliminated,
A compact and economical filter can be realized.
ところで、一般に誘電体の材料としては、アルミナ（Al
2O3）や低損失高誘電率セラミックスが用いられる。こ
れらの材料と金属板を接合するときは、線膨張係数の違
いにより機械的歪みによる電気的特性の劣化が問題とな
る。これらセラミックスの線膨張係数はおよそ５〜11pp
m/℃であるが、金属板として鉄ニッケル合金を用いるこ
とによって両者の線膨張係数の整合をとることができ
る。鉄ニッケル合金はニッケルの含有率によって0.9〜2
0ppm/℃の範囲で線膨張係数をコントロールすることが
できるので、使用するセラミックスに応じて最適の材料
を選定することができる。このように、電気的特性は表
面処理のめっきで決定し、機械的，熱的に最適な材料を
選択できることも本発明の大きな特徴である。By the way, in general, alumina (Al
2 O 3 ) and low loss ceramics with high dielectric constant are used. When these materials and metal plates are joined, deterioration of electrical characteristics due to mechanical strain becomes a problem due to the difference in linear expansion coefficient. The linear expansion coefficient of these ceramics is about 5-11pp
Although it is m / ° C, by using an iron-nickel alloy as the metal plate, the linear expansion coefficients of both can be matched. Iron-nickel alloy is 0.9 to 2 depending on the nickel content.
Since the linear expansion coefficient can be controlled in the range of 0 ppm / ° C, the optimum material can be selected according to the ceramics used. As described above, the electrical characteristics are determined by the plating of the surface treatment, and a mechanically and thermally optimum material can be selected, which is a great feature of the present invention.
図４は使用周波数が低く複数の共振器電極13が共通接続
される短絡端だけでは機械的に支えきれない場合に適用
した金属板20の例を示す部分平面図とそのＸ−Ｙ断面図
である。共振器電極13の開放端の一部に保持部分21を設
け、この部分をハーフエッチング処理して薄くしてあ
る。組立の直前にこの部分を軽くたたくと、この部分が
はずれるようになっている。金属板にフォトエッチング
でこれらの電極を形成した場合、フォトエッチングは金
属板の両面からエッチング処理されるので、レジスト版
を変えるだけであり、ハーフエッチングしたからといっ
てコストの上昇はない。FIG. 4 is a partial plan view and an XY cross-sectional view showing an example of the metal plate 20 applied when the operating frequency is low and the plurality of resonator electrodes 13 cannot be mechanically supported only by the short-circuited end commonly connected. is there. A holding portion 21 is provided at a part of the open end of the resonator electrode 13, and this portion is half-etched to be thin. If you tap this part just before assembling, this part will come off. When these electrodes are formed on the metal plate by photo-etching, the photo-etching is performed from both sides of the metal plate, so that only the resist plate is changed, and half-etching does not increase the cost.
以上本発明をバンドパスフィルタを例に説明したが、本
発明によりローパスフィルタ，バンドエリミネーション
フィルタなどにも応用構成できることは自明である。Although the present invention has been described by taking the bandpass filter as an example, it is obvious that the present invention can be applied to a lowpass filter, a band elimination filter and the like.
（発明の効果） 以上詳細に説明したように、本発明を実施することによ
り次の効果がある。(Effect of the Invention) As described in detail above, the following effects can be obtained by implementing the present invention.
（１） トリミング量を少なくでき、量産性が向上し、
この結果経済的にフィルタが構成できる。(1) The trimming amount can be reduced, mass productivity is improved,
As a result, the filter can be constructed economically.
（２） 外部接続のための特別な端子を付加する必要が
ないため小形となる。(2) The size is small because there is no need to add a special terminal for external connection.
（３） 高周波電流密度の高い誘電体板側のめっき電極
金属に導電率の良い金属を選定することができるので共
振回路のＱが向上し、低損失化が図られる。(3) Since a metal having a high conductivity can be selected as the plating electrode metal on the side of the dielectric plate having a high high-frequency current density, the Q of the resonance circuit is improved and the loss is reduced.
（４） 誘電体板と金属板の線膨張係数の整合をとった
材料を選ぶことができるので、耐環境特性，信頼性の優
れたフィルタを構成することができる。(4) Since a material that matches the linear expansion coefficient of the dielectric plate and the metal plate can be selected, it is possible to construct a filter having excellent environmental resistance and reliability.
図１は本発明の構成例を示す分解斜視図、図２は本発明
の実施例を示す斜視図、図３は本発明の入出力端子を整
形したフィルタの側面図、図４は本発明の他の金属板電
極構成を示す図、図５はメタライズ導体の厚さを示す断
面図、図６は従来例を示す一部切欠斜視図、図７（Ａ）
（Ｂ）は従来の実施例で入出力端子をつけたフィルタの
斜視図である。 1,2……誘電体基板、3,4……ストリップ導体、5,6……
入出力端子、7,8……接地導体、9,10……引出線、11,12
……誘電体基板、13a〜13e……共振用電極、14……ガイ
ド穴、15a,15b……入出力引出電極、16,17……全面メタ
ライズ導体、18a〜18d……接地端子、20……金属板、21
……保持部分。1 is an exploded perspective view showing a configuration example of the present invention, FIG. 2 is a perspective view showing an embodiment of the present invention, FIG. 3 is a side view of a filter having an input / output terminal shaped according to the present invention, and FIG. FIG. 5 is a view showing another metal plate electrode structure, FIG. 5 is a sectional view showing the thickness of a metallized conductor, FIG. 6 is a partially cutaway perspective view showing a conventional example, and FIG.
FIG. 7B is a perspective view of a filter having an input / output terminal according to the conventional example. 1,2 …… Dielectric substrate, 3,4 …… Strip conductor, 5,6 ……
I / O terminals, 7,8 ... Ground conductor, 9,10 ... Leader wire, 11,12
...... Dielectric substrate, 13a to 13e ...... Resonance electrode, 14 ...... Guide hole, 15a, 15b …… I / O extraction electrode, 16,17 …… Full metallized conductor, 18a to 18d …… Grounding terminal, 20… … Metal plate, 21
…… Holding part.
Claims (1)
１の誘電体基板と、該第１の誘電体基板と等しい形状を
なし一方の主表面の全面に電極が設けられた第２の誘電
体基板と、該第１及び第２の誘電体基板の他方の主表面
間に挟持され、複数の共振電極のそれぞれ一端が共通接
続され初段と最終段の共振電極に外部引出電極が設けら
れた導体板とを備えた平面形誘電体フィルタにおいて、 前記第１及び第２の誘電体基板のそれぞれは、前記一方
の主表面の電極が延長されて対向する一対の側端面の全
面にまで連続して配置され、 前記導体板は、前記初段と最終段の共振電極に設けられ
た外部引出電極が延長され露出した部分が外部引出端子
部となるように形成され、かつ前記複数の共振電極の共
通接続部分が前記第１及び第２の誘電体基板の前記側端
面の一方に沿って配置されるとともに延長され該共通接
続部分の両端部分が露出して接地端子となるように形成
され導電性の良いめっきが施された第１の金属板と、前
記複数の共振電極の開放端側と所定の間隔をおいて前記
側端面の他方に沿って配置され両端部分が露出して接地
端子となるように形成され導電性の良いめっきが施され
た第２の金属板とからなり、 前記第１及び第２の誘電体基板の前記一対の側端面をそ
れぞれ対応させて他方の主表面間に前記導体板を挟持し
た状態で、前記一対の側端面の電極と前記第１及び第２
の金属板の端面とがそれぞれ溶接されたことを特徴とす
る平面形誘電体フィルタ。1. A first dielectric substrate having an electrode provided on the entire surface of one main surface, and a first dielectric substrate having the same shape as the first dielectric substrate and having an electrode provided on the entire surface of one main surface. It is sandwiched between the second dielectric substrate and the other main surface of the first and second dielectric substrates, one end of each of the plurality of resonance electrodes is commonly connected, and external extraction electrodes are provided at the first-stage and last-stage resonance electrodes. In a planar dielectric filter having a conductor plate provided, each of the first and second dielectric substrates has a pair of side end faces that are opposed to each other by extending the electrodes on the one main surface. The conductor plate is formed so that the exposed portions of the external extraction electrodes provided on the resonance electrodes of the first stage and the final stage are extended and become the external extraction terminal portions, and the plurality of resonances are formed. The common connection portion of the electrodes is the first and second dielectric substrates. A first metal plate which is arranged along one of the side end faces and which is extended and formed so that both end portions of the common connection portion are exposed to serve as a ground terminal and which is plated with good conductivity, A plurality of resonance electrodes are arranged along the other of the side end faces at a predetermined distance from the open end sides of the plurality of resonance electrodes so that both end portions are exposed to serve as ground terminals and plated with good conductivity. And a pair of side end faces of the pair of side end faces of the first and second dielectric substrates, with the pair of side end faces corresponding to each other and the conductor plate being sandwiched between the other main surfaces. Electrode and the first and second
A planar dielectric filter, characterized in that the end faces of the metal plate of 1 are welded to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295310A JPH0760962B2 (en) | 1990-11-02 | 1990-11-02 | Planar dielectric filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295310A JPH0760962B2 (en) | 1990-11-02 | 1990-11-02 | Planar dielectric filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04170202A JPH04170202A (en) | 1992-06-17 |
| JPH0760962B2 true JPH0760962B2 (en) | 1995-06-28 |
Family
ID=17818954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2295310A Expired - Fee Related JPH0760962B2 (en) | 1990-11-02 | 1990-11-02 | Planar dielectric filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0760962B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940704070A (en) * | 1992-10-14 | 1994-12-12 | 모리시다 요오이찌 | FILTER AND METHOD OF MANUFACTURING THE SAME |
| JPH08172302A (en) * | 1994-12-20 | 1996-07-02 | Goyo Denshi Kogyo Kk | Plane filter made of synthetic resin with high dielectric constant |
| JP2002198719A (en) * | 2000-12-25 | 2002-07-12 | Furukawa Electric Co Ltd:The | Small antenna |
| JP4501291B2 (en) * | 2001-03-02 | 2010-07-14 | パナソニック株式会社 | Dielectric filter and antenna duplexer and communication device using the same |
| JP2010199790A (en) * | 2009-02-24 | 2010-09-09 | Nec Wireless Networks Ltd | Mounting structure of dielectric resonator, manufacturing method thereof, and filter device |
| JP6674684B2 (en) * | 2016-03-31 | 2020-04-01 | 学校法人 龍谷大学 | Low pass filter |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5724964B2 (en) * | 1974-08-20 | 1982-05-27 | ||
| JPS5196710A (en) * | 1975-02-21 | 1976-08-25 | Shoketsugokinnyori seisakusuru baransueito | |
| JPS5924166Y2 (en) * | 1979-12-25 | 1984-07-18 | 株式会社村田製作所 | strip line filter |
-
1990
- 1990-11-02 JP JP2295310A patent/JPH0760962B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04170202A (en) | 1992-06-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5396201A (en) | Dielectric filter having inter-resonator coupling including both magnetic and electric coupling | |
| CA1320006C (en) | Package for integrated circuit | |
| EP1265312B1 (en) | Dielectric laminated band elimination filters with electromagnetic coupling between resonators | |
| US5239280A (en) | Dielectric filter having inductive input/output coupling | |
| WO1994009528A1 (en) | Filter and method for its manufacture | |
| JPS62263702A (en) | Strip line filter | |
| JPH0760962B2 (en) | Planar dielectric filter | |
| JP2793685B2 (en) | Derivative filter | |
| JPH0191502A (en) | Dielectric resonator | |
| US6064283A (en) | Dielectric filter | |
| JP4360534B2 (en) | Lead terminals, resonators and electronic components | |
| JP3173230B2 (en) | Manufacturing method of filter | |
| JP2589597B2 (en) | Dielectric resonator and band rejection filter using the same | |
| CN219534844U (en) | Ceramic plate cross-coupled cavity filter | |
| JP2732150B2 (en) | Dielectric band stop filter | |
| JP2907010B2 (en) | Dielectric filter | |
| JP2778432B2 (en) | Dielectric filter | |
| JP2985938B2 (en) | LC type low pass filter | |
| KR100213374B1 (en) | Small dielectric filter | |
| JP2661004B2 (en) | Dielectric filter | |
| JPH04103201A (en) | Dielectric band stop filter | |
| JPH08172302A (en) | Plane filter made of synthetic resin with high dielectric constant | |
| JP2906828B2 (en) | Surface mount type dielectric filter | |
| JPH06169201A (en) | Lamination type dielectric polar filter | |
| JPS61289701A (en) | high frequency filter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |