JPH0766169A - Wet treatment equipment - Google Patents

Abstract

PURPOSE:To enhance efficiency in the substitution of pure water by providing a pure water supply pipe having a larger number of water supply holes disposed immediately below a wafer carrier, and a bottom plate having elongated holes matching in profile with that of the pure water supply pipe. CONSTITUTION:A pure water supply pipe 5 is fixed as a pure water supply port of a water washing tank 1. It is provided with a large number of water supply holes 5a immediately below a carrier 3 mounting a wafer 2. The water supply hole 5a of the pure water supply pipe 5 is inclined so that the pure water is jetted toward the center of the wafer 2. A bottom plate 4 is disposed entirely thereon and an elongated hole 4a is made therein so that the pure water flow from the pure water supply pipe 5 is collected smoothly to the carrier 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deionized water supply structure in a washing tank of a wet processing apparatus for washing a chemical-treated wafer with water.

[0002]

2. Description of the Related Art Conventionally, the washing tank of this type of wet processing apparatus is shown in a side sectional view of FIG. 2a, a plan view of the bottom plate of FIG. 2b, and a bottom view of the bottom plate of FIG. 2c. Pure water is supplied from a pure water supply hole in the center, and the bottom plate 4 on which the carrier 3 is mounted has a large number of round holes 4a through which pure water passes.

[0003]

In the conventional pure water supply method, water is supplied from the center of the tank, but since there is a bottom plate 4 having a round hole 4a on it, pure water to the wafer 2 is not supplied. This impedes the flow, and most of the pure water flows along the side wall 6 and the water near the wafer 2 stagnates.
There is a drawback that the efficiency of replacing pure water becomes poor.

[0004]

SUMMARY OF THE INVENTION According to the present invention, in a washing tank of a wet processing apparatus for washing a chemically treated wafer with water, a large number of water supply holes provided directly under the wafer carrier are provided in the pure water supply pipe and the shape of the wafer carrier. It is characterized by having a bottom plate having an elongated hole adapted to.

[0005]

According to the above construction, since the pure water supplied from the pure water supply pipe hits the surface of the wafer and flows, the pure water replacement efficiency in the vicinity of the wafer is improved.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings.

FIG. 1a is a side sectional view of the same, FIG. 1b is a plan view of a state in which the bottom plate is removed, and FIG. 1c is a plan view of the bottom plate 4.
A pure water supply pipe 5 is attached as a pure water supply port of the washing tank 1. This has a large number of water supply holes 5a located directly below the carrier 3 on which the wafer 2 is placed. The water supply hole 5a of the pure water supply pipe 5 is inclined so that the pure water is ejected to the center of the wafer 2. Further, a bottom plate 4 is provided over the entire surface, and a long hole 4a is provided on the bottom plate so that the flow of pure water supplied from a pure water supply pipe 5 is concentrated on the carrier 3 and does not hinder the flow.

The elongated hole 4a formed in the bottom plate 4 of this embodiment shown in FIG. 1c has an outer size slightly larger than the carrier 3 of the wafer, and two bars 4b are provided on both sides to prevent the carrier 3 from falling. There is.

However, the long hole 4a can be formed by accurately placing the carrier 3 (positioning a stopper or the like).
Can also be adapted to the size of the carrier.

According to this embodiment, since pure water can be supplied from directly under the wafer 2, there is an advantage that the flow of pure water in the vicinity of the wafer becomes active and the pure water replacement efficiency is improved.

[0011]

As described above, according to the present invention, the efficiency of replacing pure water in the vicinity of the wafer is improved, so that the removal rate of dust on the front and back surfaces of the wafer is increased and dust defects can be reduced.

[Brief description of drawings]

FIG. 1A is a side sectional view showing an embodiment of the present invention. b
Is a plan view with the bottom plate removed. c is a plan view of the bottom plate.

FIG. 2A is a side sectional view of a conventional water washing device. b is the top view of the state which looked at the bottom plate. c is a plan view of the bottom plate.

[Explanation of symbols]

 1 Water Wash Tank 2 Wafer 3 Carrier 4 Bottom Plate 5 Pure Water Supply Pipe 6 Water Supply Hole 7 Oblong Hole

Claims (2)

[Claims] 1. A wet processing apparatus for rinsing a wafer with water, comprising a pure water supply pipe having a large number of water supply holes just below the wafer, and a bottom plate on which a carrier containing a wafer is mounted, having an elongated hole adapted to the carrier. Wet processing equipment characterized by. 2. The wet processing apparatus according to claim 1, wherein the water supply hole is provided so as to eject pure water toward the wafer.