JPH077291A - Component supply method and component mounting apparatus - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a component supply method and a component mounting apparatus capable of reliably suppressing generation of unnecessary vibration and noise. [Structure] Component supply unit 1 according to the moving speed of the mounting head
The maximum moving distance of the component supply unit 1 within the movable time and the moving distance of the component supply unit 1 when the component to be sucked is positioned at the suction position, the moving speed and the acceleration of the component supply unit 1 are calculated. Means 12 and means 13 for driving and controlling the component supply unit 1 by the moving speed and acceleration thereof are provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component supply method and a component mounting apparatus which can be used when an electronic component is sucked by a component supply section and mounted on a circuit board.

[0002]

2. Description of the Related Art Generally, as shown in FIG. 5, an electronic component mounting apparatus includes a component supply unit 2 which accommodates electronic components to be mounted among a plurality of component supply units 2 mounted on a component supply unit 1. The electronic component of the component supply unit 2 positioned at the component suction position 5 is picked up by the suction nozzle 3 attached to the mounting head 4, and the mounting head 4 is rotated to the component mounting position 8. The sheet is conveyed toward and stopped at the recognition station 6 on the way to recognize the position and posture of the electronic component, the correction position and the posture of the recognized electronic component are corrected at the correction station 7, and the component mounting position 8 is set. It is configured to be mounted on the circuit board 9 positioned by the section 10.

By the way, it is necessary for the component supply unit 1 to start moving at a predetermined timing of the mounting operation, complete the movement within a predetermined movable time, and position the desired component supply unit 2 at the component suction position 5. is there. The movable time of the component supply unit 1 is determined by the mechanical configuration and the mounting speed of the electronic component mounting apparatus, but since the mechanical configuration does not change, it is mainly determined by the mounting speed, that is, the rotation speed of the mounting head 4. The rotation speed of the mounting head 4 is
Generally, it depends on the type (shape, mass) of the electronic component to be adsorbed, and as the rotation speed of the mounting head 4 is higher, the component supply unit
Is short, and the slower the rotation speed of the mounting head 4, the longer the movable time of the component supply unit 1.

Therefore, the moving speed and the acceleration of the component supply unit 1 are the movable time when the rotation speed of the mounting head 4 is the highest, considering the vibration, noise, damage to electronic components, etc. of the component supply unit 1. It is set to a value that allows you to move the required maximum distance within.

[0005]

However, as described above, the moving speed and acceleration of the component supply unit 1 are set within the movable time when the rotation speed of the mounting head 4 shown in FIG. Since the setting is made so that the necessary maximum distance corresponding to the shaded area in FIG. 6B can be moved,
When the movement distance is short as shown in (c), the rotation speed of the mounting head 4 is slow, and the movable time is long,
In both cases, the parts supply unit 1 has the same speed and acceleration.
If you move, there is extra time to move. On the other hand, since the moving speed and the acceleration of the component supply unit 1 are high, there is a problem that the component supply unit 1 causes a large amount of vibration and noise, which causes unnecessary vibration and noise.

In view of the above conventional problems, it is an object of the present invention to provide a component supply method and a component mounting apparatus which can surely suppress the generation of unnecessary vibration and noise.

[0007]

A component supply method of the present invention is a component supply method in which a component of a movable component supply section having a plurality of components mounted thereon is sucked by a suction nozzle of a movable head at a predetermined position. The maximum distance that the component supply unit can move within the movable time of the component supply unit according to the moving speed of the movable head when picking up the component, and when the component supply unit positions the component to be attracted next at the component pickup position. The moving speed and the acceleration of the component supply unit are obtained from the moving distance of the component supply unit, and the movement of the component supply unit is controlled by the moving speed and the acceleration.

Further, the component mounting apparatus of the present invention mounts a predetermined component by suctioning a movable component supply unit on which a plurality of components are mounted and a component of the component supply unit at a predetermined component suction position by a suction nozzle. In a component mounting apparatus including a mounting head that conveys toward a position and a positioning unit that positions a position on a mounted member where a component should be mounted at a component mounting position,
Next, the maximum distance that the component supply unit can move within the movable time of the component supply unit according to the moving speed of the mounting head when picking up the component, and the component supply unit positions the component to be sucked next at the pickup position. From the moving distance of the parts supply unit at that time,
It is characterized in that it is provided with means for calculating the moving speed and acceleration of the component supply unit and means for driving and controlling the component supply unit at the moving speed and acceleration.

[0009]

According to the component supply method and component mounting apparatus of the present invention, the component supply unit moves within the movable time of the component supply unit according to the moving speed of the movable head or the mounting head when the component is next picked up. Calculate the moving speed and acceleration of the component supply unit from the maximum possible distance and the moving distance of the component supply unit when the component supply unit positions the next component to pick up at the suction position, and supply the component at the calculated moving speed and acceleration. By moving the parts, the parts supply part moves by fully utilizing its movable time and the moving speed and acceleration can be made as low as possible, so that low vibration and low noise can be realized.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting apparatus according to an embodiment of the present invention will be described below with reference to FIGS. In addition,
For the overall configuration and operation of the electronic component mounting device,
This is the same as the one described with reference to FIG. 5 in the conventional example, and the description thereof will be omitted to omit the description here.

In FIG. 1, the movement control section 11 of the component supply section 1 is composed of a movement speed / acceleration calculating means 12 and a drive control means 13. Moving speed / acceleration calculation means 1
2 is the maximum distance that the component supply unit 1 can move within the movable time of the component supply unit 1 according to the moving speed of the mounting head 6 (see FIG. 5) when the electronic component is next suctioned, and the next suction. It is configured to calculate the moving speed and the acceleration of the component supply unit 1 from the moving distance of the component supply unit 1 when the component supply unit 1 positions the component supply unit 2 containing the electronic component to be positioned at the component suction position 5. The drive control unit 13 is configured to drive and control the drive unit 1a of the component supply unit 1 at the calculated moving speed and acceleration.

Next, the process of calculating the moving speed and acceleration by the moving speed / acceleration calculating means 12 will be described with reference to FIGS.

Assuming that the maximum movement speed of the component supply unit 1 is Vha, the acceleration is Aha, and the maximum movement distance of the component supply unit 1 at that time is Lha when the mounting head 4 is rotating at the rotation speed Ha, FIG. As shown in a), after the suction nozzle 3 of No. 1 sucks the electronic components of the component supply unit 2,
As shown in (b), the suction nozzle 3 of No. 2 can suction is within the distance of Lha from the component supply unit 2 of
, Electronic components of the component supply unit 2.

Here, after sucking the electronic components of the component supply unit 2 as shown in FIG. 3A, the distance l (l <Lha- from the component supply unit 2 as shown in FIG. 3C).
For example, when an electronic component of the component supply unit 2 is adsorbed, the moving speed Vha ′ and the acceleration Aha ′ of the component supply unit 1 are Vha ′ = Vha · l / ( Lha-Δl) Aha '= Aha · l / (Lha-Δl). It should be noted that the margin of Δl is for completing with a certain time margin within the movable time of the component supply unit 1, and is set to an appropriate value.

Thus, the moving speed / acceleration calculating means 12
, The next moving distance l is
<Lha-Δl is determined, and if so, the moving speed Vha ′ and acceleration Aha ′ are calculated by the above equations, and if not, that is, the maximum moving distance Lha minus the margin Δl If it is larger than Aha, the maximum moving speed Vha and the acceleration are Aha.

By setting the moving speed and acceleration of the component supply unit 1 as described above, if the moving distance is large within the movable time shown in FIG.
As shown in FIG. 4B, the moving speed and the acceleration are set to be large, and the moving distance and the moving distance are small. When the moving distance is small, as shown in FIG. The acceleration is set to be small, and a small distance corresponding to the shaded area is moved using the entire movable time. As a result, when the moving distance of the component supply unit 1 is small, the moving speed and acceleration can be reduced, the vibration and noise of the component supply unit 1 can be reduced, and the generation of vibration and noise can be reliably suppressed.

[0017]

As described above, according to the component supply method and component mounting apparatus of the present invention, the movable time of the component supply unit according to the moving speed of the movable head or the mounting head when the component is next picked up. The moving speed and acceleration of the component supply unit were calculated from the maximum distance that the component supply unit can move within and the moving distance of the component supply unit when the component supply unit positions the next component to be sucked at the suction position. By moving the parts supply unit at the moving speed and acceleration, the parts supply unit moves by fully utilizing its movable time, and the moving speed and acceleration can be made as low as possible, so low vibration and low noise are realized. can do.

[Brief description of drawings]

FIG. 1 is a block diagram showing a configuration of a control device in a component supply unit according to an embodiment of the present invention.

FIG. 2 is a flowchart of a moving speed and acceleration calculation process in the embodiment.

FIG. 3 is an operation timing chart of the component supply unit in the embodiment.

FIG. 4 is an operation explanatory diagram of a component supply unit and a mounting head in the embodiment.

FIG. 5 is a plan view showing a schematic configuration of a conventional electronic component mounting apparatus.

FIG. 6 is an operation timing chart of the component supply unit in the conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component supply unit 3 Suction nozzle 4 Mounting head 5 Component suction position 8 Component mounting position 9 Circuit board 10 Positioning unit 11 Movement control unit 12 Movement speed / acceleration calculation unit 13 Drive control unit

Claims (2)

[Claims] 1. A component supply method in which a component of a movable component supply section having a plurality of components mounted thereon is sucked by a suction nozzle of a movable head at a predetermined position, and a moving speed of the movable head when the component is next sucked. Depending on the maximum distance that the component supply unit can move within the movable time of the component supply unit, and the movement distance of the component supply unit when the component supply unit positions the next component to be sucked at the pickup position, A component supply method, characterized in that the moving speed and acceleration of a component are obtained, and the component supply unit is controlled to move by the moving velocity and acceleration. 2. A movable component supply section on which a plurality of components are mounted, and a mounting head which conveys the components of the component supply section by a suction nozzle at a predetermined component suction position and conveys them toward a predetermined component mounting position. And a positioning unit that positions the position on the mounted member where the component should be mounted to the component mounting position, in the component mounting apparatus according to the moving speed of the mounting head when the component is next picked up. The maximum movement distance of the component supply unit within the movable time and the movement distance of the component supply unit when the component supply unit next positions the component to be suctioned at the pickup position. And a means for driving and controlling the component supply unit with the calculated moving speed and acceleration.