JPH0773493A - Optical pickup and optical disk device equipped with the same - Google Patents

Abstract

(57) [Summary] [Purpose] To provide a simple and inexpensive optical pickup that is downsized and prevents displacement of each component. [Structure] A light emitting element 3 and a reflection mirror 5 are mounted on a semiconductor substrate 1 on which a photodetector 6 is formed. The semiconductor substrate 1 is mounted on the substrate supporting member 33, and these are sealed in the transparent resin package 13. The light beam separated by the diffraction grating 9 provided in the hologram element 7 is made incident on the photodetector 6 to detect a signal.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical pickup for reproducing an information signal recorded on an optical information recording medium and an optical disk device equipped with the same.

[0002]

2. Description of the Related Art In an optical disk device for recording a digital audio signal, a video signal or the like as an information signal on a disk-shaped optical information recording medium and reproducing the information signal, the means for reproducing the information signal is used. An optical pickup is used.

In general, an optical pickup includes a light emitting element such as a semiconductor laser which is a light source, a focusing optical system for irradiating an information recording medium with a light beam emitted from the light emitting element, and a reflected light beam from the information recording medium. And a beam splitter for separating the light beam from the return optical path connecting the information recording medium and the light emitting element, and a photodetector for detecting a focus error signal, a tracking error signal, and an information signal from the returned reflected light beam. It has and.

If such an optical pickup is constructed by using individual parts, there is a limit to the size reduction.
In addition, there is a problem that the positional deviation of each component, which causes performance deterioration, is likely to occur due to temperature change, vibration, shock, and the like. On the other hand, a light-emitting element and a photodetector are installed on the same substrate to form a kind of hybrid element, and this element is housed in a package such as metal or ceramic to reduce the size and stabilize the performance. Various configurations have been proposed.

FIG. 11 is a perspective view showing the construction of a hybrid element for an optical pickup disclosed in Japanese Patent Laid-Open No. 52487/1990 as one of the proposed examples. In the optical pickup shown in FIG. 11, the semiconductor laser element 93 is a light source of the optical pickup. Also, the silicon substrate 90
Photodetectors 91 and 92 provided on the upper surface of are for detecting the reflected light flux from the information recording medium. That is, in this optical pickup, by providing the semiconductor laser element 93 on the upper surface of the silicon substrate 90 via the intermediate silicon substrate 2, the light source and the photodetector are integrated into a hybrid element, and this hybrid element is a metal package. (Can) 94 is attached and configured.

The intermediate silicon substrate 2 supporting the semiconductor laser device 93 is attached to a metal pad 95 provided on the upper surface of the silicon substrate 90, and the metal pad 95 is connected to a bonding pad 97 by a metal wire 96. . The bonding pad 97 is the bonding wire 9
It is connected to the pin 99 by 8.

[0007]

However, in the optical pickup in the above-mentioned proposed example, the metal package 94 to which the hybrid element is attached has a large number of pins 9.
Since 9 is required, there is a problem that the configuration becomes complicated. Further, since a cap (not shown) for hermetically sealing the hybrid element is required together with the metal package 94, there is a problem that the cap becomes expensive as a whole.

In view of the above, the present invention provides an optical pickup in which the light source and the photodetector are installed on the same substrate to reduce the size and prevent the displacement of each component.
An object of the present invention is to provide a simple and inexpensive optical pickup in which a hybrid element is sealed without using a complicated structure and an expensive metal package or cap.

[0009]

In order to achieve the above object, in an optical pickup of the present invention, a light emitting element is mounted on a semiconductor substrate on which a photodetector is formed, and this substrate is mounted on a lead frame. Then, the entire device was sealed with a transparent resin. Generally, since the light emitting point of the semiconductor laser element has a high energy density, the temperature rises and the sealing resin is easily deteriorated. Therefore, a protective layer is provided to prevent deterioration of the resin.

Further, in the optical pickup having the structure for detecting the tracking error signal by the so-called 3-spot method,
The transparent resin package has a shape such that at least a part of its outer shape becomes a part of the circumference, and this is inserted into a guide hole provided in the chassis of the optical pickup to be rotatable, and at the same time, it is fired from the element. By making the optical axis of the light beam substantially coincide with the center of the circumference, the position of the optical axis of the light beam toward the focusing optical system does not move even if the substrate is rotated, and tracking adjustment is easily performed. I was able to do it.

[0011]

In the optical pickup of the present invention, the luminous flux emitted from the light emitting element is irradiated onto the information recording medium by the converging optical system. The reflected light flux from the information recording medium is separated from the optical path connecting the medium and the light emitting element by the beam splitter,
It is incident on the photodetector. In the present invention, since the light emitting element is installed on the semiconductor substrate on which the photodetector is formed, the positional relationship between the light emitting element and the photodetector is long-term compared to the case where the light emitting element and the photodetector are configured by combining them. It is stable even when crossing. Furthermore, since the entire device is sealed by a method such as transfer molding and injection molding using a transparent resin, the structure is inexpensive and suitable for mass production.Because a protective layer is provided near the light emitting point of the light emitting device, Deterioration of the transparent resin due to the temperature rise of the spot is prevented.

Further, in the configuration using the three-spot method as the tracking error signal detection method, the light flux emitted from the light emitting element is separated into one main light flux and two sub-light fluxes by the diffraction grating, and these light fluxes are separated. By irradiating the information recording medium as three light spots by using a focusing optical system including an objective lens, and irradiating the spots of the two sub-beams to predetermined positions on the track on the information recording medium, Get the tracking error signal. Since the diffraction grating also rotates by rotating the substrate, it is possible to easily adjust the positions of the spots of the two sub-beams with respect to the track. At this time, since the position of the optical axis of the light beam toward the focusing optical system does not move even if the substrate is rotated, the optical axis of the light beam passing through the focusing optical system does not shift, and the light spot of the main light beam does not occur. Has no effect on

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical pickup which is an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram showing the configuration of an optical pickup as a first embodiment of the present invention. Of which, Figure 1
1A is a front view of the optical pickup according to the present embodiment, and FIG. 1B is a side view showing components on the semiconductor substrate 1 in FIG. 1 (c) is the package 1 in FIG. 1 (a).
It is the top view which showed the components in 3 from the upper side.

First, the configuration of this embodiment will be described.
In FIG. 1, a light emitting element 3 such as a semiconductor laser chip is mounted on a semiconductor substrate 1 such as silicon on a submount 2
Is attached through. The submount 2 has a photodiode 24 for detecting the light output of the light emitting element 3.
Are formed. In addition to the reflection mirror 5 being mounted on the semiconductor substrate 1, a photodetector 6 as a light receiving element is formed. The semiconductor substrate 1 is attached to the substrate supporting member 33, and one of the electrodes of the semiconductor substrate 1 is electrically connected to the substrate supporting member 33 through a lead wire or a back surface electrode of the semiconductor substrate 1. The other electrode of the semiconductor substrate 1, the light emitting element 3, and each electrode of the photodiode 24 are electrically connected to the terminals 25 to 32, respectively.

The light emitting element 3, the submount 2, the semiconductor substrate 1, the reflection mirror 5, the substrate supporting member 33 and the terminals 25 to 32 are placed in the transparent resin package 13.
They are collectively sealed by methods such as transfer molding and injection molding. The substrate supporting member 33 and the terminals 25 to 32 are manufactured from a metal plate by a method such as pressing in the form of a so-called lead frame integrally connected at the peripheral portion, and after being sealed in the package 13, The peripheral portion is cut and separated into individual terminals. By this method, a large number of packages 13 can be manufactured at low cost.

On the other hand, the hologram element 7 is fixed to the package 13. The hologram element 7 includes a light transmission medium such as glass or resin, a first diffraction grating 8 and a second diffraction grating.
This is an optical element provided with the diffraction grating 9 of FIG. The hologram element 7 may be formed integrally with the package 13.

Next, the operation of this embodiment will be described.
In FIG. 1A, a light beam 4 emitted from a light emitting element 3 which is a light source travels in a transparent resin, is reflected by a reflection mirror 5, and is reflected by a first diffraction grating 8 into one main light beam 15 and two main light beams 15. It is separated into sub-beams 16 and 17 of the book. These light beams pass through the second diffraction grating 9 and enter the objective lens 10, and are condensed on the information recording medium 11. Information recording medium 1
The reflected light flux from 1 again passes through the objective lens 10,
Is diffracted by the diffraction grating 9. Diffracted light flux 35
Enters the photodetector 6 and is converted into an electric signal. As the information recording medium 11, an optical disk, an optical card or the like can be used. In addition, a part of the luminous flux emitted from the light emitting element 3 is part of the photodiode 24 provided on the submount 2.
As a result, the electric signal proportional to the light output of the light emitting element 3 can be detected. It is possible to control the light output of the light emitting element 3 using this signal.

FIG. 2 is an enlarged plan view showing the signal recording surface of the information recording medium 11 in FIG. 2, on the signal recording surface of the information recording medium 11, pit rows 19 of information signals are spirally, concentrically or linearly recorded at a predetermined track pitch p. The one main light beam 15 and the two sub light beams 16 and 17 form light spots 21, 22 and 23 on the signal recording surface, respectively. At this time, the light spots 22 and 23 of the two sub-beams are irradiated so as to be shifted by a quarter of the track pitch p, that is, p / 4, with respect to the light spot 21 of the main beam. , 23, a tracking error signal of the three-spot method is obtained.

The structure of the diffraction grating 9 and the photodetector 6 and the signal detection method will be described in detail with reference to FIG.

FIG. 3 is a configuration diagram showing the configurations of the diffraction grating 9 and the photodetector 6 in FIG. Among them, FIG. 3A shows the hologram element 7 in FIG.
FIG. 4 is a detailed plan view of the diffraction grating 9 when viewed from the position 0, and FIG. 3B is a detailed plan view of the light receiving portion of the photodetector 6 in FIG. 1.

As shown in FIG. 3A, the diffraction grating 9 formed on the hologram element 7 has two different grating pitches.
It consists of two areas 9a and 9b. On the other hand, as shown in FIG. 3B, the photodetector 6 has five light receiving regions 6
It is divided into a, 6b, 6c, 6d and 6e.

The reflected light beams of the light spots 21, 22, 23 are divided into approximately half by the two regions 9a, 9b of the diffraction grating 9 and are incident on the photodetector 6. That is, the light spots 21, 22, 23 diffracted by the region 9a
The reflected light fluxes of the
The reflected light fluxes of the light spots 21, 22, and 23 that image the light spots 1, 102, and 103 and are diffracted by the region 9b form the light spots 104, 105, and 106, respectively.

When the light spot 101 is focused on the photodetector 6, the light spot 101 converges to almost one point on the boundary line between the light receiving regions 6a and 6b, and becomes a semicircular shape as it moves away from the focus, resulting in defocusing. The light enters the region 6a or 6b corresponding to the direction of. Therefore, the focus error signal can be detected by taking the difference between the detection signals of the regions 6a and 6b. Since the tracking error signal is the difference in the light intensity between the light spot 22 and the light spot 23, the areas 6d and 6
It is obtained by taking the difference of the detection signal from e. Further, the sum of the detection signals of the areas 6a, 6b and 6c is the reproduction signal from the information recording medium 11.

FIG. 4 is a detailed sectional view of the light emitting element 3, the reflection mirror 5 and the package 13 in FIG. The hologram element 7 fixed to the package 13 is omitted in this figure. Generally, the size of the light emitting point of the light emitting element is about several μm, and the energy density is high. Therefore, when sealed with a transparent resin, the temperature rises and the transparent resin is apt to deteriorate. Therefore, in this embodiment, the protective layer 41 is provided in order to prevent the deterioration of the transparent resin. That is, as shown in FIG. 4A, the protective layer 41 is provided on the light emitting surface of the light emitting element 3. A heat resistant resin is used for the protective layer 41. Alternatively, a dielectric multilayer film may be provided to increase the distance from the light emitting surface of the light emitting element 3 to the transparent resin. Further, as shown in FIG. 4B, the protective layer 41 may be provided so as to cover the light emitting element 3, the submount 2 and the reflection mirror 5 together.

Further, as shown in FIGS. 4A and 4B, a reflecting film 42 is provided on the reflecting surface of the reflecting mirror 5 in order to efficiently reflect the luminous flux emitted from the light emitting element 3. Is also good. As the reflective film 42, for example, a dielectric multilayer film can be used. The characteristics of the reflective film 42 are set according to the characteristics of the transparent resin of the package 13 in the configuration of FIG. 4A, and are set to the characteristics of the protective layer 41 in the configuration of FIG. 4B. Make sure to set them together.

In this embodiment, a mirror, a prism or the like may be provided between the second diffraction grating 9 and the objective lens 10 to bend the optical path.

Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a configuration diagram showing a configuration of an optical pickup as a second embodiment of the present invention. Of which, Figure 5
5A is a plan view showing the components inside the package 13 of the optical pickup according to the present embodiment as seen from above, and FIG. 5B is the semiconductor substrate 1 shown in FIG.
It is the side view which showed the upper part from the direction of the arrow B.
Also in this embodiment, the hologram element 7 is fixed to the package 13 as in the configuration shown in FIG. 1, but it is not shown for simplicity.

By the way, in the optical pickup for detecting the tracking error by the three-spot method, it is necessary to adjust so as to irradiate the track with the light spot for detecting the tracking error. Therefore, in this embodiment, as shown in FIG.
Of the four side surfaces, the two side surfaces facing each other are circular as viewed from above, and the circular side surface 13a is a guide hole into which the circular side surface 13a provided in the chassis (not shown) of the optical pickup can fit. Then, by rotating the entire package 13, the light spot can be adjusted to irradiate the track with a predetermined position. At this time, even if the package 13 is rotated, the objective lens 10 is rotated by making the center of the circle formed by the circular side surface 13a of the package 13 substantially coincide with the optical axis 18 of the light flux reflected by the reflection mirror 5. The optical axis center of the light beam incident on the optical axis and the optical axis of the objective lens 10 can be always matched.

Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 6 is a configuration diagram showing a configuration of an optical pickup as a third embodiment of the present invention. Of which, Figure 6
6A is a plan view showing the components inside the package 13 in the optical pickup according to the present embodiment as viewed from above, and FIG. 6B is the semiconductor substrate 1 in FIG.
It is the side view which showed the upper part from the direction of the arrow C.
Also in this embodiment, the hologram element 7 is fixed to the package 13 as in the configuration shown in FIG. 1, but it is not shown for simplicity.

In this embodiment, as shown in FIGS. 6A and 6B, of the four side surfaces of the package 13, two upper side surfaces of two side surfaces facing each other are made circular when viewed from above, and The circular portion 13b is inserted into a guide hole provided in a chassis (not shown) of the optical pickup and into which the circular portion 13b can be fitted, so that the entire package 13 can be rotated. At this time, the package 13
Even if is rotated, the center of the optical axis of the light beam incident on the objective lens 10 and the optical axis of the objective lens 10 always match.
The circular center formed by the circular portion 13b of the package 13 and the optical axis of the light flux reflected by the reflection mirror 5 are substantially aligned with each other. As a result, also in this embodiment,
As in the second embodiment, the light spot can be adjusted to irradiate the track at a predetermined position.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. 7 and 8. FIG. 7 is a configuration diagram showing a configuration of an optical pickup as a fourth embodiment of the present invention. 7A is a front view of the optical pickup according to the present embodiment, and FIG. 7B is a plan view showing the components inside the package 13 in FIG. Is.

First, the configuration of this embodiment will be described.
In FIG. 7, a light emitting element 3 such as a semiconductor laser chip is mounted on a semiconductor substrate 51 such as silicon via a submount 2. The submount 2 has a photodiode 2 for detecting the light output of the light emitting element 3.
4 are formed. In addition to the trapezoidal prism 52 being mounted on the semiconductor substrate 51, a photodetector 53 as a light receiving element is formed. The trapezoidal prism 52 has a half mirror film 54 on the slope, a half mirror film 55 on the bottom, and a reflection film 56 on the top. The semiconductor substrate 51 is attached to the substrate supporting member 33, and one of the electrodes of the semiconductor substrate 51 is electrically connected to the substrate supporting member 33 through a lead wire or a back surface electrode of the semiconductor substrate 51. The other electrodes of the semiconductor substrate 51 and the electrodes of the light emitting element 3 and the photodiode 24 are electrically connected to the terminals 25 to 32, respectively.

The light emitting element 3, the submount 2, the semiconductor substrate 51, the trapezoidal prism 52, the substrate supporting member 33 and the terminals 25 to 32 are the transparent resin package 13.
Inside, they are collectively sealed by methods such as transfer molding and injection molding.

Next, the operation of this embodiment will be described.
In FIG. 7A, the light flux 4 emitted from the light emitting element 3 which is the light source travels in the transparent resin and is trapezoidal prism 52.
The light is reflected by the half mirror film 54 on the inclined surface, exits the package 13, enters the objective lens 10, and is condensed on the information recording medium 11. The reflected light flux from the information recording medium 11 passes through the objective lens 10 again, and the half mirror film 54
Through.

Of the light flux transmitted through the half mirror film 54, a light flux having a half intensity passes through the half mirror film 55 on the bottom surface of the trapezoidal prism 52 and enters the photodetector 53a, and the other half is a half mirror. The light is reflected by the film 55, further reflected by the reflective film 56 on the upper surface of the trapezoidal prism 52, and enters the photodetector 53b. Photodetectors 53a and 53b
Are each divided into two or more light receiving regions, and an electric signal corresponding to the size and intensity distribution of the incident light spot can be obtained. Therefore, for example, the photodetector 53
The focus error signal can be detected from the size of the light spots incident on a and 53b, and the tracking error signal by the push-pull method can be detected from the intensity distribution. In addition, since a part of the light flux emitted from the light emitting element 3 is incident on the photodiode 24 provided on the submount 2,
Thereby, an electric signal proportional to the light output of the light emitting element 3 can be detected. It is possible to control the light output of the light emitting element 3 using this signal.

FIG. 8 is a sectional view showing in detail the light emitting element 3, the trapezoidal prism 52 and the package 13 in FIG. Also in this embodiment, the protective layer 41 is provided in order to prevent the deterioration of the transparent resin due to the temperature rise of the light emitting point of the light emitting element 3. That is, as shown in FIG. 8A, the protective layer 41 is provided on the light emitting surface of the light emitting element 3. A heat resistant resin is used for the protective layer 41. Alternatively, a dielectric multilayer film may be provided to increase the distance from the light emitting surface of the light emitting element 3 to the transparent resin. Further, as shown in FIG. 8B, the protective layer 41 may be provided so as to cover the light emitting element 3, the submount 2 and the trapezoidal prism 52 together.

In the present embodiment, the trapezoidal prism 5
The characteristics of the half mirror film 54 provided on the slope 2 are set according to the characteristics of the transparent resin of the package 13 in the configuration of FIG. 8A, and are set in the protective layer 41 in the configuration of FIG. 8B. Set according to the characteristics of.

Further, in this embodiment, the package 13
A mirror, a prism, or the like may be provided between the lens and the objective lens 10 to bend the optical path.

Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view showing the components inside the package 13 of the optical pickup as the fifth embodiment of the present invention as seen from above. 9A shows a configuration using the reflection mirror 5, and FIG. 9B shows a configuration using the trapezoidal prism 52.

In this embodiment, as shown in FIG. 9A, the radiation fin 61 is provided integrally with the substrate supporting member 33. Since the light emitting element 3 is generally used by applying a current of several tens mA, it generates heat during operation. According to this embodiment, the generated heat is radiated to the air from the radiation fin 61 through the submount 2, the semiconductor substrate 1, and the substrate supporting member 33, so that the temperature rise of the light emitting element 3 can be suppressed. The radiating fin 61 can be fixed or contacted with a radiator, a circuit board, or the like to enhance the heat radiating effect.

Further, as shown in FIG. 9B, the substrate supporting member 33 is also formed in the structure using the trapezoidal prism 52.
A heat radiation fin 61 can be provided integrally with the heat radiation fin 61.

Next, a sixth embodiment of the present invention will be described with reference to FIG. FIG. 10 is a configuration diagram showing a configuration of an optical disk device as a sixth embodiment of the present invention. Of which
10A is a partially cutaway plan view of the optical disk device according to the present embodiment, and FIG. 10B is a sectional view showing a cross section of the optical disk device according to the present embodiment. . However, the turntable 6 is shown in FIG.
5 is not shown.

The present embodiment is an optical disk device equipped with the optical pickup of the first embodiment described above. In FIG. 10, the package 13 described in the first embodiment and the hologram element 7 fixed to the package 13 are installed in the chassis 62 of the optical pickup together with the reflection mirror 66, the objective lens 10, and the actuator 63. Chassis 62
Is supported by a shaft 64 and is movable in the radial direction of the information recording medium 11.

The information recording medium 11 includes a turntable 65.
And is rotated in a predetermined direction by a motor (not shown). The actuator 63 has a focus actuator (not shown) and a tracking actuator (not shown), and moves the objective lens 10 in the optical axis direction and the radial direction of the information recording medium 11 based on the focus and tracking error signals. To drive. The objective lens 1
Instead of driving only 0 with the actuator 63,
The package 13, the hologram element 7, and the reflection mirror 66 may be driven. A plurality of reflection mirrors 66 for bending the optical path may be used, and the reflection mirror 66 may be used.
A configuration not using is also possible.

The light beam emitted from the hologram element 7 is reflected by the reflection mirror 66, and is condensed and irradiated on the information recording medium 11 by the objective lens 10. Information recording medium 1
The reflected light flux from 1 is the objective lens 10 and the reflection mirror 66.
Then, the light enters the hologram element 7 and is converted into an electric signal by the photodetector in the package 13 to be processed.

In this embodiment, the optical pickup of the first embodiment described above is mounted, but the optical pickups of other embodiments may be mounted.

According to the present embodiment, by mounting the optical pickup of each of the above-mentioned embodiments, a compact, thin and inexpensive optical disk device can be constructed.

[0049]

According to the present invention, in an optical pickup which reproduces an information signal recorded on an optical information recording medium, a light emitting element and a photodetector are installed on the same supporting member, thereby reducing the size. In addition, it is possible to prevent the positional deviation of each component. Further, by sealing the light emitting element, the photodetector, and the supporting member with transparent resin, a simple and inexpensive optical pickup can be realized.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a configuration of an optical pickup as a first embodiment of the present invention.

FIG. 2 is an enlarged plan view showing a signal recording surface of the information recording medium 11 in FIG.

3 is a configuration diagram showing configurations of a diffraction grating 9 and a photodetector 6 in FIG.

4 is a sectional view showing in detail a light emitting element 3, a reflection mirror 5 and a package 13 in FIG.

FIG. 5 is a configuration diagram showing a configuration of an optical pickup as a second embodiment of the present invention.

FIG. 6 is a configuration diagram showing a configuration of an optical pickup as a third embodiment of the present invention.

FIG. 7 is a configuration diagram showing a configuration of an optical pickup as a fourth embodiment of the present invention.

8 is a cross-sectional view showing in detail the light emitting element 3, the trapezoidal prism 52 and the package 13 in FIG.

FIG. 9 is a plan view showing components inside a package 13 in an optical pickup as a fifth embodiment of the present invention as seen from above.

FIG. 10 is a configuration diagram showing a configuration of an optical disc device as a sixth embodiment of the present invention.

FIG. 11 is a perspective view showing a configuration of a conventional optical pickup.

[Explanation of symbols]

1 ... Semiconductor substrate, 2 ... Submount, 3 ... Light emitting element, 5
... reflection mirror, 6 ... photodetector, 7 ... hologram element, 8
... Diffraction grating, 9 ... Diffraction grating, 10 ... Objective lens, 13 ...
Package, 33 ... Substrate support member, 41 ... Protective layer, 51
... semiconductor substrate, 52 ... trapezoidal prism, 67 ... optical disk device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masayuki Inoue 292 Yoshida-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture

Claims (9)

[Claims] 1. A light emitting element which emits a laser beam, a light beam emitted from the light emitting element, which is focused on an optical information recording medium and is irradiated, and a light beam which is reflected by the optical information recording medium. A lens for passing the light, a light beam separating means for separating the light beam reflected by the optical information recording medium and passing through the lens from an optical path connecting the lens and the light emitting element to a photodetector, and the light beam separating means. An optical pickup comprising at least the photodetector for detecting a signal from a light beam guided by means, wherein the light emitting element and the photodetector are installed on the same supporting member, An optical pickup characterized in that a member, the light emitting element, and the photodetector are all sealed in a transparent resin. 2. The optical pickup according to claim 1, wherein a heat-resistant member is formed between the luminous flux emission surface of the light emitting element and the transparent resin that seals the light emitting element. pick up. 3. The optical pickup according to claim 1 or 2, wherein the light beam splitting means comprises a diffraction grating. 4. The optical pickup according to claim 1 or 2, wherein the light beam splitting means comprises an optical thin film having a predetermined light reflectance and a predetermined light transmittance. 5. The optical pickup according to claim 1, further comprising a heat dissipation member protruding from the inside of the transparent resin to the outside in order to dissipate heat generated by the light emitting element to the outside. And an optical pickup. 6. A light emitting element that emits a laser beam, a reflecting mirror that reflects the beam emitted from the light emitting element in a predetermined direction, and a first beam splitting the light beam reflected by the reflecting mirror into a plurality of light beams. And a lens for converging and irradiating the light beam separated by the first diffraction grating on the optical information recording medium, and passing the light beam reflected by the optical information recording medium, A second diffraction grating that guides the light beam reflected by the information recording medium and passed through the lens to the photodetector by separating it from the optical path connecting the lens and the light emitting element, and the second diffraction grating. An optical pickup comprising at least the photodetector for detecting a signal from the emitted light flux, wherein the light emitting element, the reflecting mirror, and the photodetector are installed on the same support member, Support member and the above An optical pickup, characterized in that the optical element and the reflector wherein the light detector is sealed all the transparent resin. 7. The optical pickup according to claim 6, wherein at least a part of the outer shape of the transparent resin forms a part of a circle, and the center of the circle and the optical axis of the light beam reflected by the reflecting mirror. An optical pickup characterized by matching. 8. A light beam separating surface which has a predetermined light reflectance and a predetermined light transmittance, separates an incident light beam by reflecting and transmitting it, and emits a laser light beam to enter the light beam separating surface. And a light beam emitted from the light emitting device, the light beam reflected and separated by the light beam separating surface is condensed and irradiated on the optical information recording medium, and the optical information recording medium is also irradiated. A lens that allows the light beam reflected by the lens to pass through and is incident on the light beam splitting surface, and a light beam that is reflected by the optical information recording medium and that has passed through the lens, the light beam that is transmitted through the light beam splitting surface and separated. And a photodetector for detecting a signal from the optical pickup, wherein the light emitting element, the light beam splitting surface, and the photodetector are installed on the same support member, and From the above An optical pickup, characterized in that element and the light beam splitting surface and said light detector is sealed all the transparent resin. 9. An optical disk device comprising the optical pickup according to claim 1, 2, 3, 4, 5, 6, 7 or 8.