JPH0773768A - Electric contact material and manufacturing method thereof - Google Patents
Electric contact material and manufacturing method thereofInfo
- Publication number
- JPH0773768A JPH0773768A JP5217455A JP21745593A JPH0773768A JP H0773768 A JPH0773768 A JP H0773768A JP 5217455 A JP5217455 A JP 5217455A JP 21745593 A JP21745593 A JP 21745593A JP H0773768 A JPH0773768 A JP H0773768A
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- pure
- layer
- contact
- alloy
- organic coating
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Abstract
(57)【要約】
【構成】 Au合金の表面に純Au層を厚さ0.01〜
0.5μmで形成し、更に有機被膜層を形成した電気接
点材料。
【効果】 優れた耐蝕性を有する電気接点材料が得られ
る。(57) [Summary] [Structure] A pure Au layer with a thickness of 0.01 to
An electrical contact material having a thickness of 0.5 μm and further having an organic coating layer formed thereon. [Effect] An electrical contact material having excellent corrosion resistance can be obtained.
Description
【0001】[0001]
【産業上の利用分野】本発明は硬度が高く耐摩耗性に優
れるAu合金製の電気接点材料に関し、Au合金の耐摩
耗性を損なうことなく耐蝕性を向上させた電気接点材料
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric contact material made of an Au alloy having high hardness and excellent wear resistance, and to an electric contact material having improved corrosion resistance without impairing the wear resistance of the Au alloy.
【0002】[0002]
【従来の技術】従来Au合金は導電性が高く、電気接続
性や半田濡れ性がよいため電気接点材料に用いられるこ
とが多かった。純Auも電気接点材料に用いられること
が多いが、純Auからなる電気接点材料とAu合金から
なる電気接点材料とは用途対象が異なっている。即ちA
u合金は純Auに比べ耐蝕性が劣るものの、硬度が高く
耐摩耗性に優れるため摺動用電気接点材料や高荷重が掛
かる電気接点材料に適している。2. Description of the Related Art Conventionally, Au alloys are often used as electrical contact materials because of their high conductivity and good electrical connection and solder wettability. Pure Au is also often used as an electric contact material, but an electric contact material made of pure Au and an electric contact material made of an Au alloy have different applications. That is, A
Although u alloy is inferior in corrosion resistance to pure Au, it is suitable for sliding electric contact materials and electric contact materials to which heavy load is applied because of its high hardness and excellent abrasion resistance.
【0003】ところでAuはイオン化傾向が極めて小さ
いが、Au合金を構成する合金成分は通常Auよりイオ
ン化傾向が大きく、Au合金は純Auに比べ耐蝕性が著
しく低くなる。このため摺動接点材料等、Au合金から
なる電気接点材料の場合、接点表面に防錆処理を施こす
必要があった。Although Au has an extremely small ionization tendency, the alloy components constituting the Au alloy usually have a larger ionization tendency than Au, and the Au alloy has a remarkably lower corrosion resistance than pure Au. Therefore, in the case of an electrical contact material made of Au alloy such as a sliding contact material, it is necessary to apply rustproofing treatment to the contact surface.
【0004】この防錆処理は通常、接点表面に有機被膜
層を形成する方法で行われていた。その方法としては、
防錆処理前の電気接点材料を防錆処理剤からなる溶液中
に浸漬することでAu合金の表面に有機被膜層を形成さ
せる方法が一般的である。このような防錆処理が施され
た電気接点材料は、接点の使用のごく初期において、接
点表面の有機被膜層が破れればAu合金が露出するため
所定の接点特性(電気接続性、耐摩耗性)が実現する、
というものである。This rustproofing treatment is usually carried out by a method of forming an organic coating layer on the contact surface. As a method,
A general method is to form an organic coating layer on the surface of the Au alloy by immersing the electrical contact material before rustproofing in a solution containing a rustproofing agent. Such an electrical contact material that has been subjected to anticorrosion treatment has predetermined contact characteristics (electrical connectivity and wear resistance) because the Au alloy is exposed if the organic coating layer on the contact surface is broken at the very beginning of use of the contact. Sex) is realized,
That is.
【0005】[0005]
【発明が解決しようとする課題】ところで接点の使用時
の開閉動作や摺動において、電気接点材料が相手材(他
方の接点材)と実際に接触する部分は接点表面のごく一
部分に過ぎない場合が通常である。その部分(以下、真
の接触部分と称する)の有機被膜層は接点の使用の初期
において消耗、脱落する必要がある。しかしその他の部
分では有機被膜層が残存していた方がむしろ望ましい。
なぜなら真の接触部分で腐蝕が発生しても、相手材との
摩擦の繰り返しにより、その腐蝕の発生のごく初期にお
いて除去されるため腐蝕が進行しにくいからである。By the way, in the opening / closing operation and sliding when the contact is used, the part where the electric contact material actually contacts the mating material (the other contact material) is only a small part of the contact surface. Is normal. The organic coating layer in that portion (hereinafter referred to as the true contact portion) needs to be consumed and dropped at the initial stage of use of the contact. However, it is rather desirable that the organic coating layer remains in other portions.
This is because even if corrosion occurs at the true contact portion, it is removed at a very early stage of the corrosion due to repeated friction with the mating material, so that the corrosion is unlikely to proceed.
【0006】一方、真の接触部分以外で発生した腐蝕の
場合、相手材との摩擦がないため除去されにくい。そし
て真の接触部分以外で発生した腐蝕は時間の経過と共に
成長して、遂には真の接触部分に進行してしまう(クリ
ープ現象といわれる)。このように真の接触部分以外で
有機被膜層が脱落した部分が多くなると、結果として真
の接触部分の腐蝕が進行しやすくなる。On the other hand, in the case of corrosion that occurs outside the true contact portion, it is difficult to remove it because there is no friction with the mating material. Corrosion that occurs outside the true contact portion grows over time and eventually progresses to the true contact portion (called a creep phenomenon). As described above, when the portion where the organic coating layer has fallen off other than the true contact portion is increased, as a result, the corrosion of the true contact portion is likely to proceed.
【0007】ところで防錆処理剤はAu合金に対して吸
着性が悪い。このためAu合金上に形成した有機被膜層
はAu合金の表面を十分に覆ってはいない場合が多い。
また電気接点材料の運搬時や電気機器への取り付け時等
における振動等により有機被膜層がAu合金から脱落し
てしまうことも多かった。更に接点の使用における振動
その他により相手材との真の接触部分以外の有機被膜層
も脱落することも多かった。このように従来の防錆処理
が施された電気接点材料の場合、真の接触部分以外でA
u合金が露出した部分が多くなり、これが耐蝕性の劣化
の原因になっていた。By the way, the anticorrosive agent has poor adsorptivity to the Au alloy. Therefore, the organic coating layer formed on the Au alloy often does not sufficiently cover the surface of the Au alloy.
In addition, the organic coating layer often comes off from the Au alloy due to vibration during transportation of the electrical contact material or attachment to electrical equipment. Furthermore, the organic coating layer other than the true contact portion with the mating material often fell off due to vibration or the like during use of the contact. In the case of the conventional electrical contact material that has been subjected to rust prevention treatment in this way, A
The exposed portion of the u alloy was increased, and this was a cause of deterioration in corrosion resistance.
【0008】[0008]
【課題を解決するための手段】本発明はかかる状況に鑑
み、鋭意研究を行った結果なされたもので、その目的
は、Au合金の耐摩耗性を損なうことなく耐蝕性を向上
させた電気接点材料とその製造方法を提供しようとする
ものである。即ち請求項1記載の発明は、Au合金から
なる接点基材と、該接点基材に被覆して形成され、厚さ
0.01〜0.5μmの純Au層と、該純Au層の表面
に被覆して形成された有機被膜層とからなることを特徴
とする電気接点材料である。また請求項2記載の発明
は、前記純Au層を電気めっきまたは置換めっきにより
形成することを特徴とする電気接点材料である。更に請
求項3記載の発明として、前記接点基材に純Au層を形
成した後、脂肪族アミンまたは/およびメルカプタンを
含む有機被膜溶液中に浸漬することで脂肪族アミンまた
は/およびメルカプタンからなる有機被膜層を形成する
ことを特徴とする電気接点材料の製造方法である。SUMMARY OF THE INVENTION The present invention has been made as a result of intensive studies in view of such a situation, and its purpose is to provide an electrical contact having improved corrosion resistance without impairing the wear resistance of the Au alloy. It is intended to provide a material and a manufacturing method thereof. That is, the invention according to claim 1 is a contact base material made of an Au alloy, a pure Au layer having a thickness of 0.01 to 0.5 μm formed by coating the contact base material, and a surface of the pure Au layer. And an organic coating layer formed by coating the above. The invention according to claim 2 is the electrical contact material, wherein the pure Au layer is formed by electroplating or displacement plating. Further, as an invention according to claim 3, after forming a pure Au layer on the contact base material, it is immersed in an organic coating solution containing an aliphatic amine or / and a mercaptan to form an organic compound containing the aliphatic amine or / and the mercaptan. A method for producing an electrical contact material, which comprises forming a coating layer.
【0009】[0009]
【作用】本発明の請求項1、2記載の電気接点材料は、
接点基材であるAu合金の表面にAu合金に比べ遙に耐
蝕性がよい純Au層が形成されている。純Au層は柔ら
かく、このため接点としての使用の初期において、真の
接触部分で純Au層は消耗、脱落してAu合金が露出す
る。しかし純Au層はAu合金の表面に強固に密着する
ため、有機被膜層の場合のように接点使用時の振動その
他により真の接触部分以外でも脱落する、という現象は
起きにくい。このように、本発明の電気接点材料は真の
接触部分以外ではAu合金が露出せず、真の接触部分以
外で発生した腐蝕が真の接触部分に進行する上記クリー
プ現象が防止できる。なお、接点基材はその全体がAu
合金であっても、他の材料(例えばステンレス等)にA
u合金がめっきされたものであってもよい。The electrical contact material according to claims 1 and 2 of the present invention comprises:
A pure Au layer having much better corrosion resistance than the Au alloy is formed on the surface of the Au alloy as the contact base material. Since the pure Au layer is soft, the pure Au layer is consumed and drops off at the true contact portion to expose the Au alloy in the initial use as a contact. However, since the pure Au layer firmly adheres to the surface of the Au alloy, it is unlikely that the pure Au layer will fall off other than the true contact portion due to vibration or the like when the contact is used, as in the case of the organic coating layer. As described above, in the electrical contact material of the present invention, the Au alloy is not exposed except in the true contact portion, and the above-mentioned creep phenomenon in which the corrosion generated in the portion other than the true contact portion progresses to the true contact portion can be prevented. The contact base material is entirely Au.
Even if it is an alloy, A
The u alloy may be plated.
【0010】ところで純Auは電気接続性や耐蝕性に優
れた材料であるものの、耐摩耗性は悪く、相手材との摩
擦係数は大きくなる。このため純Auを摺動接点として
使用した場合、真の接触部分で純Au層が消耗、脱落す
る前においては相手材との動摩擦係数を高める原因とな
っている。この問題の対策として、純Au層の表面に有
機被膜層を形成させれば、接点の使用の初期において相
手材との動摩擦係数を低くさせることができる。By the way, although pure Au is a material excellent in electrical connectivity and corrosion resistance, it has poor wear resistance and a large coefficient of friction with the mating material. Therefore, when pure Au is used as a sliding contact, it causes the coefficient of kinetic friction with the mating material to increase before the pure Au layer is consumed and drops off at the true contact portion. As a measure against this problem, if an organic coating layer is formed on the surface of the pure Au layer, the coefficient of dynamic friction with the mating material can be lowered in the initial stage of use of the contact.
【0011】この有機被膜層は接点の使用の初期におい
て、真の接触部分で有機被膜層が消耗、脱落する。この
際、有機被膜層は純Auに対し吸着性がよいため、純A
u層も有機被膜層と共に脱落する場合が多い。このよう
に純Au層の表面に有機被膜層を形成させれば、接点の
使用の初期において相手材との動摩擦係数を低くさせる
と共に、真の接触部分において純Au層の脱落を促進す
る。このため純Au層が真の接触部分で露出して相手材
との動摩擦係数が高まることが防止できる。The organic coating layer is consumed and comes off at the true contact portion in the initial use of the contact. At this time, since the organic coating layer has a good adsorptivity for pure Au, pure A
In many cases, the u layer also falls off together with the organic coating layer. When the organic coating layer is formed on the surface of the pure Au layer in this manner, the coefficient of dynamic friction with the mating material is lowered at the initial stage of use of the contact, and the pure Au layer is promoted to drop off at the true contact portion. Therefore, it is possible to prevent the pure Au layer from being exposed at the true contact portion and increasing the dynamic friction coefficient with the mating material.
【0012】本発明の請求項1記載の電気接点材料にお
いて、前記純Au層の厚さが0.01〜0.5μmであ
るのは次の理由による。先ず0.01μm未満である
と、Au合金上に純Au層を形成する際、該純Au層に
ピンホールが発生しやすいという問題がある。一方0.
5μmを越えると接点の使用の初期において、有機被膜
層が脱落しても、純Au層は速やかに脱落しにくく、こ
のため相手材との動摩擦係数が高くなってしまうという
問題があるからである。加えて純Au層が厚いとコスト
上昇も招き望ましくない。In the electric contact material according to claim 1 of the present invention, the thickness of the pure Au layer is 0.01 to 0.5 μm for the following reason. First, when the thickness is less than 0.01 μm, there is a problem that pinholes are easily generated in the pure Au layer when the pure Au layer is formed on the Au alloy. On the other hand, 0.
This is because if the thickness exceeds 5 μm, even if the organic coating layer falls off in the initial stage of use of the contact, the pure Au layer is difficult to fall off quickly, and therefore the coefficient of dynamic friction with the mating material increases. . In addition, if the pure Au layer is thick, the cost increases, which is not desirable.
【0013】本発明の請求項3記載の電気接点材料の製
造方法において、前記脂肪族アミンやメルカプタンとし
ては、例えばドデシルアミン、アイコシルアミン、ノニ
ルアミン、ドデシルメルカプタン、オクタデシルメルカ
プタン、アイコシルメルカプタン、ノニルメルカプタン
等が使用できる。これらが1種または2種以上混合され
た溶液中に、前記純Au層が形成された接点基材を浸漬
することで前記有機被膜層が形成できる。また前記純A
u層が形成された接点基材に前記溶液を塗布したり、吹
きつけることによっても有機被膜層を形成させることが
できる。また前記溶液にトルエン、アセトン、トリクロ
ロエタン等の溶剤を混ぜて用いてもよい。また有機被膜
層が脂肪族アミンまたは/およびメルカプタンからなる
のは、これらがAu材料に吸着しやすいからである。In the method for producing an electric contact material according to claim 3 of the present invention, examples of the aliphatic amine or mercaptan include dodecylamine, aicosylamine, nonylamine, dodecylmercaptan, octadecylmercaptan, aicosylmercaptan, nonylmercaptan. Etc. can be used. The organic coating layer can be formed by immersing the contact base material on which the pure Au layer is formed in a solution in which one or more of these are mixed. In addition, the pure A
The organic coating layer can also be formed by applying or spraying the solution onto the contact base material on which the u layer is formed. Further, a solvent such as toluene, acetone or trichloroethane may be mixed with the above solution and used. The organic coating layer is made of aliphatic amine and / or mercaptan because these are easily adsorbed on the Au material.
【0014】[0014]
本発明例 表1に示す組成のAu合金片(厚さ5mmで20mm×
100mm)に次に記す条件で電解脱脂した。 液:NaOH(50g/l)+界面活性剤(10g/
l) 液温度:60℃ 直流電流:2A/dm2 時間:30秒Inventive Examples Au alloy pieces having the composition shown in Table 1 (20 mm × 5 mm thick)
100 mm) was electrolytically degreased under the following conditions. Liquid: NaOH (50g / l) + surfactant (10g /
l) Liquid temperature: 60 ° C DC current: 2 A / dm 2 hours: 30 seconds
【0015】次いで水洗後、次に記す条件でAu合金片
の表面を活性化させた。 液:KCN(100g/l) 液温度:20℃ 時間:60秒After washing with water, the surface of the Au alloy piece was activated under the following conditions. Liquid: KCN (100g / l) Liquid temperature: 20 ° C Time: 60 seconds
【0016】次に表1に示す厚さの純Au層を電気めっ
き法、または置換めっき法により形成した。電気めっき
法に用いた液と電流値、そして置換めっき法に用いた液
をそれぞれ次に記す。 電気めっき液:シアン化金カリウム(濃度3g/l)+
KCN(60g/l) 置換めっき液:シアン化金カリウム(濃度0.5g/
l) +Na2 Co3 (5g/l) +NaCN(4g/l)Next, a pure Au layer having a thickness shown in Table 1 was formed by electroplating or displacement plating. The solutions and current values used in the electroplating method and the solutions used in the displacement plating method are described below. Electroplating solution: potassium gold cyanide (concentration 3g / l) +
KCN (60 g / l) displacement plating solution: potassium gold cyanide (concentration 0.5 g /
l) + Na 2 Co 3 (5 g / l) + NaCN (4 g / l)
【0017】次いで水洗、乾燥後、表1に示す有機処理
剤をトルエン中に0.5%濃度で加えた有機被膜溶液に
室温で30秒浸漬して、その後乾燥させて有機被膜層を
形成した。なお表1に示す各条件で製造したサンプルを
各々10個ずつ用意した。Then, after washing with water and drying, the organic treating agent shown in Table 1 was immersed in an organic coating solution containing toluene at a concentration of 0.5% for 30 seconds at room temperature and then dried to form an organic coating layer. . In addition, 10 samples each prepared under each condition shown in Table 1 were prepared.
【0018】こうして製造したサンプルに摺動試験およ
び耐蝕性の試験を行った。摺動試験は純Au棒の頭部
(径5mm)を摺動させることで行った。摺動試験にお
ける荷重は50g、摺動距離は10mmで摺動回数は1
0000回まで行った。摺動試験中、動摩擦係数を測定
した。測定箇所はサンプル1個につき1箇所である。A sliding test and a corrosion resistance test were performed on the sample thus manufactured. The sliding test was performed by sliding the head (diameter 5 mm) of a pure Au rod. The load in the sliding test is 50 g, the sliding distance is 10 mm, and the number of sliding times is 1
It went up to 0000 times. The dynamic friction coefficient was measured during the sliding test. The number of measurement points is one for each sample.
【0019】耐蝕性の試験は以下のようにして行った。
先ず上記サンプル(摺動試験前のサンプル)に加速試験
として、次に示す条件で硫化試験をした。 ガス雰囲気:H2 S(3ppm.) 温度:30℃ 時間:24時間 こうして硫化試験をした後、接触抵抗を測定した。測定
箇所は各々のサンプル1個につき10箇所である。The corrosion resistance test was conducted as follows.
First, the above sample (sample before the sliding test) was subjected to a sulfurization test as an acceleration test under the following conditions. Gas atmosphere: H 2 S (3 ppm.) Temperature: 30 ° C. Time: 24 hours After the sulfidation test was performed in this way, the contact resistance was measured. There are 10 measurement points for each sample.
【0020】上記の試験結果を表3に示す。表3には摺
動回数が1〜10回までにおける動摩擦係数の最大値、
同じく11〜20回、21〜50回までにおける動摩擦
係数の最大値、および摺動回数が100回、1000
回、10000回になったそれぞれの時点での動摩擦係
数を示す。また接触抵抗の測定値の平均値と、最大値、
最小値を表3に示しておく。Table 3 shows the above test results. Table 3 shows the maximum value of the dynamic friction coefficient when the number of slides is 1 to 10,
Similarly, the maximum value of the dynamic friction coefficient from 11 to 20 times, 21 to 50 times, and the number of sliding times are 100 times and 1000 times.
The dynamic friction coefficient at each time when the number of times reaches 10,000 times is shown. Also, the average and maximum of the measured contact resistance,
The minimum values are shown in Table 3.
【0021】従来例および比較例 従来例および比較例として、表2に示すサンプルを用意
した。従来例はAu合金の表面に純Au層を形成せず有
機被膜層のみを形成させた。比較例No24は純Au層
のみで、有機被膜層は形成させていない。またNo21
〜23は純Au層の厚さが表2に示す値である点以外は
本発明例の場合と同様である。測定した動摩擦係数と接
触抵抗を表4に示す。Conventional Example and Comparative Example As a conventional example and a comparative example, the samples shown in Table 2 were prepared. In the conventional example, the pure Au layer was not formed on the surface of the Au alloy, and only the organic coating layer was formed. Comparative Example No. 24 has a pure Au layer only and no organic coating layer is formed. No21
Nos. 23 to 23 are the same as the case of the present invention example except that the thickness of the pure Au layer is the value shown in Table 2. Table 4 shows the measured dynamic friction coefficient and contact resistance.
【0022】[0022]
【表1】 [Table 1]
【0023】[0023]
【表2】 [Table 2]
【0024】[0024]
【表3】 [Table 3]
【0025】[0025]
【表4】 [Table 4]
【0026】表4に示す従来例No19は純Au層と有
機被膜層がなく、摺動試験の当初から接点表面にAu合
金が露出したものであるため、摺動回数が10〜100
00回まで動摩擦係数には実質的に変化はなかった。対
して従来例No20はAu合金の上に有機被膜層がある
ため、摺動回数が1〜10回までの動摩擦係数の最大値
はNo19の場合より低くなった。これは10回までの
時点では未だ有機被膜層が消耗しきれず残存していたた
めと思われる。しかしNo20においても摺動回数が2
0回以上になれば動摩擦係数には実質変化はなく、これ
は少なくとも相手材(Au棒)との真の接触部分で有機
被膜層が消耗、脱落しAu合金が露出したことを示して
いる。Conventional Example No. 19 shown in Table 4 has no pure Au layer and no organic coating layer, and the Au alloy is exposed on the contact surface from the beginning of the sliding test.
The coefficient of kinetic friction did not substantially change until 00 times. On the other hand, in Conventional Example No. 20, since the organic coating layer was formed on the Au alloy, the maximum value of the dynamic friction coefficient when the sliding frequency was 1 to 10 times was lower than that in No. 19. It is considered that this is because the organic coating layer was not completely consumed and remained at the time of 10 times. However, even in No. 20, the number of sliding times is 2
When it was 0 times or more, there was substantially no change in the dynamic friction coefficient, which means that the organic coating layer was consumed and dropped at least at the true contact portion with the counterpart material (Au rod), and the Au alloy was exposed.
【0027】有機被膜層がない比較例No24は、純A
u層が露出しているため、1〜10回までの時点の動摩
擦係数の最大値は1.2と高い値を示した。しかし、1
1〜20回までの動摩擦係数の最大値は0.4となり、
以後安定していた。これは1〜10回までの何れかの時
点まで純Au層が脱落せず残存していたことを示してい
る。また1〜10回までの時点の動摩擦係数の最大値が
1.2と高い値を示したのは、相手材と純Au層が摺動
したからである。Comparative Example No 24 having no organic coating layer is pure A
Since the u layer was exposed, the maximum value of the dynamic friction coefficient at the time of 1 to 10 times was as high as 1.2. But 1
The maximum value of the dynamic friction coefficient from 1 to 20 times is 0.4,
It was stable after that. This indicates that the pure Au layer did not fall off and remained at any time from 1 to 10 times. Further, the maximum value of the dynamic friction coefficient at the time of 1 to 10 times was as high as 1.2 because the mating material and the pure Au layer slid.
【0028】本発明例の殆どは表3に示すように摺動回
数が1〜10回までの時点では、動摩擦係数の最大値が
従来例No19に比べ低くなった。これは10回の時点
ではまだ有機被膜層は脱落していなかったことを示して
いる。しかし摺動回数が21〜50回の間、および10
0回、1000回、10000回の時点では動摩擦係数
は安定していた。これは摺動回数が少なくとも20回ま
での間に有機被膜層および純Au層が脱落しAu合金層
が露出したからである。また摺動回数が1〜20回まで
の間において、動摩擦係数の最大値があまり大きくなら
なかったのは、有機被膜層のみ脱落し、純Au層が残存
していた状態が実質上なかったからであると思われる。As shown in Table 3, in most of the examples of the present invention, the maximum value of the dynamic friction coefficient was lower than that of the conventional example No. 19 when the number of sliding times was 1 to 10 times. This indicates that the organic coating layer had not been removed yet at the time of 10 times. However, the number of sliding times is between 21 and 50 times, and 10
The dynamic friction coefficient was stable at 0, 1000, and 10,000 times. This is because the organic coating layer and the pure Au layer fell off and the Au alloy layer was exposed during at least 20 slides. In addition, the maximum value of the dynamic friction coefficient did not become so large during the sliding times of 1 to 20 times because there was substantially no state in which only the organic coating layer fell off and the pure Au layer remained. It appears to be.
【0029】一方、比較例No22、23は、摺動回数
が1〜10までの時点での最大値は0.2と低くなった
ものの、11〜20回までの時点での最大値は1.2と
高くなった。これは1〜10回までの何れかの時点まで
は有機被膜層が残存していたが、その時点以後も純Au
が残存し相手材と摺動したからであると思われる。また
摺動回数が100回以上になっても依然として動摩擦係
数が高い値を示したのは、純Au層が厚いため純Au層
が脱落しにくかったことを示している。一方、純Au層
が薄いNo21は11〜20回までの時点での最大値が
0.4となり、既にこの時点では純Au層は脱落してい
たと思われる。On the other hand, in Comparative Examples Nos. 22 and 23, the maximum value at the time when the number of sliding times was 1 to 10 was as low as 0.2, but the maximum value at the time from 11 to 20 times was 1. It was as high as 2. In this, the organic coating layer remained until any one of the times 1 to 10 times, but after that time, pure Au was used.
Is believed to have remained and slid with the mating material. Further, the fact that the coefficient of kinetic friction was still high even after the number of sliding times was 100 or more indicates that the pure Au layer was hard to fall off because of the thick pure Au layer. On the other hand, No21 having a thin pure Au layer had a maximum value of 0.4 at 11 to 20 times, and it is considered that the pure Au layer had already fallen off at this point.
【0030】サンプルを硫化試験し、その後に測定した
接触抵抗については、表3と表4を見れば明らかなよう
に、本発明例は従来例に比べ著しく低い値を示してい
た。これは本発明例は従来例に比べ腐蝕(硫化)の進行
が少なかったためである。その理由として、従来例No
19は有機被膜層がないため、またNo20は有機被膜
層が密着性の悪いAu合金の上に形成されており、その
ために十分にAu合金の表面を覆ってはいなかったから
であると思われる。それに対し本発明例は、Au合金の
表面を覆った純Au層は脱落しにくく、耐蝕性が悪いA
u合金が露出していなかったからであると思われる。With respect to the contact resistance measured after the sample was subjected to the sulfidation test, as apparent from Tables 3 and 4, the inventive examples showed significantly lower values than the conventional examples. This is because the example of the present invention caused less progress of corrosion (sulfurization) than the conventional example. The reason is that the conventional example No.
It is considered that No. 19 did not have an organic coating layer, and No. 20 had an organic coating layer formed on an Au alloy having poor adhesion and therefore did not sufficiently cover the surface of the Au alloy. On the other hand, in the example of the present invention, the pure Au layer covering the surface of the Au alloy is hard to fall off and has a poor corrosion resistance.
This is probably because the u alloy was not exposed.
【0031】また純Au層が厚過ぎる比較例No22、
23は本発明例と純Au層の厚さが同等であるNo24
とほぼ同等の接触抵抗の値を示した。一方、比較例No
21は接触抵抗が大きくなった。この原因として純Au
層が薄過ぎてピンホールが多くなったからであると考え
られる。このため耐蝕性の向上が不十分であった。Comparative example No. 22, in which the pure Au layer was too thick,
No. 23 is No 24 in which the thickness of the pure Au layer is the same as that of the present invention
The contact resistance value was almost the same as On the other hand, Comparative Example No
No. 21 had a large contact resistance. Pure Au is the cause
This is probably because the layers were too thin and pinholes increased. Therefore, the improvement in corrosion resistance was insufficient.
【0032】[0032]
【発明の効果】以上のように本発明の電気接点材料はA
u合金の表面に形成した純Au層によって、Au合金の
腐蝕が防げる。更に純Au層の表面に設けた有機被膜層
によって、接点の使用のごく初期の時点で、真の接触部
分で純Au層および有機被膜層が速やかに脱落し、耐摩
耗性に優れ、相手材との動摩擦係数も低くなるAu合金
が露出する。また接点の真の接触部分以外では純Au層
は脱落しにくく、真の接触部分以外でAu合金が露出し
た部分が少なくなるので、優れた耐蝕性を有する電気接
点材料になる。このように本発明の電気接点材料は優れ
た特性を有し、各種電気機器の信頼性を向上させる等、
産業上著しい貢献をなすものである。As described above, the electric contact material of the present invention is A
The pure Au layer formed on the surface of the u alloy prevents corrosion of the Au alloy. Furthermore, due to the organic coating layer provided on the surface of the pure Au layer, the pure Au layer and the organic coating layer are quickly removed at the true contact portion at the very early stage of use of the contact, and the wear resistance is excellent. The Au alloy having a low dynamic friction coefficient with is exposed. Further, the pure Au layer is less likely to fall off except the true contact portion of the contact, and the exposed portion of the Au alloy is less than the true contact portion, resulting in an electrical contact material having excellent corrosion resistance. As described above, the electric contact material of the present invention has excellent properties, and improves the reliability of various electric devices.
It makes a significant contribution to the industry.
Claims (3)
に被覆して形成され、厚さ0.01〜0.5μmの純A
u層と、該純Au層の表面に被覆して形成された有機被
膜層とからなることを特徴とする電気接点材料。1. A contact base material made of an Au alloy, and pure A having a thickness of 0.01 to 0.5 μm formed by coating the contact base material.
An electrical contact material comprising a u layer and an organic coating layer formed by coating the surface of the pure Au layer.
きにより形成することを特徴とする請求項1記載の電気
接点材料。2. The electrical contact material according to claim 1, wherein the pure Au layer is formed by electroplating or displacement plating.
肪族アミンまたは/およびメルカプタンを含む有機被膜
溶液中に浸漬することで脂肪族アミンまたは/およびメ
ルカプタンからなる有機被膜層を形成することを特徴と
する請求項1または2記載の電気接点材料の製造方法。3. A pure Au layer is formed on the contact base material and then immersed in an organic coating solution containing an aliphatic amine or / and a mercaptan to form an organic coating layer made of an aliphatic amine or / and a mercaptan. The method for producing an electric contact material according to claim 1 or 2, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5217455A JPH0773768A (en) | 1993-09-01 | 1993-09-01 | Electric contact material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5217455A JPH0773768A (en) | 1993-09-01 | 1993-09-01 | Electric contact material and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0773768A true JPH0773768A (en) | 1995-03-17 |
Family
ID=16704504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5217455A Pending JPH0773768A (en) | 1993-09-01 | 1993-09-01 | Electric contact material and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0773768A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008084858A1 (en) * | 2007-01-12 | 2008-07-17 | The Furukawa Electric Co., Ltd. | Electrical contact member, method for producing the same, and electrical contact |
| WO2008123460A1 (en) * | 2007-04-03 | 2008-10-16 | The Furukawa Electric Co., Ltd. | Electric contact material, method for manufacturing the electric contact material, and electric contact |
-
1993
- 1993-09-01 JP JP5217455A patent/JPH0773768A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008084858A1 (en) * | 2007-01-12 | 2008-07-17 | The Furukawa Electric Co., Ltd. | Electrical contact member, method for producing the same, and electrical contact |
| US8002595B2 (en) | 2007-01-12 | 2011-08-23 | Furukawa Electric Co., Ltd. | Electrical contact material, method of manufacturing the same, and electrical contact |
| EP2117022A4 (en) * | 2007-01-12 | 2012-03-07 | Furukawa Electric Co Ltd | Electrical contact member, method for producing the same, and electrical contact |
| WO2008123460A1 (en) * | 2007-04-03 | 2008-10-16 | The Furukawa Electric Co., Ltd. | Electric contact material, method for manufacturing the electric contact material, and electric contact |
| JP2008273189A (en) * | 2007-04-03 | 2008-11-13 | Furukawa Electric Co Ltd:The | Electrical contact material, manufacturing method thereof, and electrical contact |
| US8283032B2 (en) | 2007-04-03 | 2012-10-09 | Furukawa Electric Co., Ltd. | Electric contact material, method for manufacturing the electric material, and electric contact |
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