JPH0778266B2 - High strength and high conductivity copper base alloy - Google Patents
High strength and high conductivity copper base alloyInfo
- Publication number
- JPH0778266B2 JPH0778266B2 JP63261236A JP26123688A JPH0778266B2 JP H0778266 B2 JPH0778266 B2 JP H0778266B2 JP 63261236 A JP63261236 A JP 63261236A JP 26123688 A JP26123688 A JP 26123688A JP H0778266 B2 JPH0778266 B2 JP H0778266B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- based alloy
- conductivity
- strength
- resistance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910045601 alloy Inorganic materials 0.000 title claims description 34
- 239000000956 alloy Substances 0.000 title claims description 34
- 239000010949 copper Substances 0.000 title claims description 33
- 229910052802 copper Inorganic materials 0.000 title claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 26
- 239000000203 mixture Substances 0.000 claims description 11
- 229910052790 beryllium Inorganic materials 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 229910000765 intermetallic Inorganic materials 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 5
- 239000012535 impurity Substances 0.000 claims description 4
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052797 bismuth Inorganic materials 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 description 16
- 230000000694 effects Effects 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 7
- 238000005266 casting Methods 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005098 hot rolling Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000002305 electric material Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Description
【発明の詳細な説明】 （イ）技術分野 本発明は、自動車部品の電装品等に用いられるワイヤー
ハーネスのターミナル用材料として好適な高強度・高導
電性銅基合金に関するものである。Description: (a) Technical Field The present invention relates to a high-strength, high-conductivity copper-based alloy suitable as a material for a terminal of a wire harness used for electrical components of automobile parts and the like.
（ロ）従来技術 今日、自動車産業は周知の通り日本の基幹産業として大
きな役割を果すに至っており、その生産台数の増加は著
しく、また近時ではカーエレクトロニクスの発達によ
り、これに使用される伸銅品材料がますます増加してい
る。(B) Conventional technology As is well known, the automobile industry has come to play a major role as a key industry in Japan today, and the number of vehicles produced has increased remarkably. The number of copper materials is increasing.
従って、自動車の電装品の一翼を担うワイヤーハーネス
もこれにもれず、１台当り約1Kmの長さ，重量で約20Kg
が使用されるまでになった。Therefore, the wire harness that plays a role in the electrical components of automobiles is also perfect, and the length of each unit is about 1 km and the weight is about 20 kg.
Until it was used.
しかしながら、近時の自動車に対する要求は軽量化，高
信頼性および低コスト化とますます厳しいものになり、
従ってワイヤーハーネスも軽量化，高信頼性および低コ
スト化が要求されるようになって来ている。However, the recent demands for automobiles are becoming more and more stringent with weight reduction, high reliability, and cost reduction.
Therefore, wire harnesses are also required to be lightweight, highly reliable and low cost.
ここで、ワイヤーハーネスは電線とターミナルが一体と
なったものであり、軽量化と配線の高密度化のために
は、ターミナル材料の材料特性および信頼性の向上が必
要かつ不可欠である。Here, the wire harness is one in which an electric wire and a terminal are integrated, and in order to reduce the weight and increase the density of wiring, it is necessary and indispensable to improve the material characteristics and reliability of the terminal material.
上記のような背景の下に、具体的にターミナル材料は薄
肉化され、また複雑な形状にプレス成形されることか
ら、強度，弾性，導電性およびプレス成形性が良好なこ
とが必要である。Under the above background, since the terminal material is thinned and press-formed into a complicated shape, it is necessary to have good strength, elasticity, conductivity and press-formability.
更に、耐食性，耐応力腐食割れ性が良いことは勿論のこ
とで、エンジンルーム周辺や排ガス系統周辺では熱的な
負荷も加わることから、耐応力緩和特性にも優れていな
ければならない。Further, not only the corrosion resistance and the stress corrosion cracking resistance are good, but also a thermal load is applied around the engine room and around the exhaust gas system, so that the stress relaxation resistance must be excellent.
しかしながら、従来において上記のような諸特性を同時
に兼備し、かつ安価な材料は得られなかった。However, it has not been possible to obtain an inexpensive material which simultaneously has the above-mentioned various properties at the same time.
（ハ）発明の開示 本発明は、カーエレクトロニクスの発達に伴なって、ワ
イヤーナーネスのターミナル材料に要求される上記のよ
うな諸特性を兼備した銅基合金、さらに詳しくは強度，
弾性および電気伝導性に優れ、かつプレス成形性，耐応
力緩和特性等に優れたワイヤーハーネスのターミナル用
材料として好適な銅基合金を提供するものである。(C) Disclosure of the Invention The present invention relates to a copper-based alloy having the above-mentioned various characteristics required for a terminal material for wireness, along with the development of car electronics.
Provided is a copper-based alloy which is excellent in elasticity and electric conductivity, and is excellent in press formability and stress relaxation resistance, and is suitable as a terminal material for a wire harness.
即ち、まず第１の発明は、Ni:0.05〜5.0wt％,Be:0.005
〜1.5wt％,Zn:0.01〜5.0wt％を含み、Ni/Beの成分組成
比率が重量比で２〜20の範囲で残部Cuおよび不可避不純
物からなり、マトリックス中にNi−Be系金属間化合物が
分散析出した組織を有する銅基合金であって、引張強さ
が60Kgf/mm2以上，導電率が45％IACS以上であることを
特徴とする高強度高導電性銅基合金である。That is, firstly, the first invention is Ni: 0.05 to 5.0 wt%, Be: 0.005
〜1.5wt%, Zn: 0.01〜5.0wt%, Ni / Be composition composition ratio is in the range of 2-20 by weight, consisting of balance Cu and unavoidable impurities, Ni-Be based intermetallic compound in the matrix. Is a copper-based alloy having a dispersed and precipitated structure, having a tensile strength of 60 Kgf / mm 2 or more and an electrical conductivity of 45% IACS or more.
また、第２の発明は、Ni:0.05〜5.0wt％,Be:0.005〜1.5
wt％,Zn:0.01〜5.0wt％を含み、Ni/Beの成分組成比率が
重量比で２〜20の範囲で更に、Ti,Zr,Co,Sn,Pb,Al,Bi,P
から成る群より選ばれた１種または２種以上を合計で0.
005〜2.0wt％含み、残部がCuおよび不可避不純物からな
り、マトリックス中にNi−Be系金属間化合物が分散析出
した組織を有する銅基合金であって、引張強さが60Kgf/
mm2以上，導電率が45％IACS以上であることを特徴とす
る高強度高導電性銅基合金である。The second invention is Ni: 0.05-5.0 wt%, Be: 0.005-1.5.
wt%, Zn: 0.01 to 5.0 wt% and the composition ratio of Ni / Be is in the range of 2 to 20 by weight. Furthermore, Ti, Zr, Co, Sn, Pb, Al, Bi, P
1 or 2 or more selected from the group consisting of 0 in total.
005 ~ 2.0 wt%, the balance consisting of Cu and unavoidable impurities, a copper-based alloy having a structure in which Ni-Be intermetallic compound is dispersed and precipitated in the matrix, the tensile strength is 60 Kgf /
It is a high-strength, high-conductivity copper-based alloy characterized by a mm 2 or higher and a conductivity of 45% IACS or higher.
本発明に係る銅基合金は、Ni,Be,Znの適量を添加し、Ni
/Beの成分比率を重量比で２〜20の範囲とすることによ
りにより、ワイヤーナーネスのターミナル用材料として
好適な銅基合金に必要な上記諸特性を発現せしめた点に
基本的な特徴がある。Copper-based alloy according to the present invention, Ni, Be, by adding an appropriate amount of Zn, Ni
By setting the component ratio of / Be in the range of 2 to 20 by weight, the basic characteristic is that the above-mentioned various properties required for a copper-based alloy suitable as a material for terminals of wireness are exhibited. is there.
次に、本発明に係る銅基合金の成分組成範囲を上記の通
りに限定した理由について説明する。Next, the reason why the component composition range of the copper-based alloy according to the present invention is limited as described above will be described.
（１）Ni Niは、Beと化合物を形成し、強度，弾性，耐熱性および
耐応力緩和特性等の向上に寄与する元素である。(1) Ni Ni is an element that forms a compound with Be and contributes to improvement in strength, elasticity, heat resistance, stress relaxation resistance, and the like.
また、鋳造組織および熱間加工組織を微細化し、かつ溶
体化処理時の結晶粒の粗大化を防止する効果がある。Further, it has an effect of making the casting structure and the hot working structure finer and preventing the crystal grains from becoming coarse during the solution treatment.
このような効果を発揮させるためには、Ni含有量が0.05
wt％未満では所望の効果が得られず、一方5.0wt％を超
えて含有させると電気伝導性の低下が顕著となり、また
経済的にも不利となることから、その含有量は0.05wt％
〜5.0wt％の範囲とする。In order to exert such effects, the Ni content is 0.05
If the content is less than wt%, the desired effect cannot be obtained. On the other hand, if the content exceeds 5.0% by weight, the electrical conductivity is significantly decreased and it is economically disadvantageous. Therefore, the content is 0.05 wt%.
~ 5.0 wt% range.
（２）Be Beは、その含有量が0.005wt％未満ではNiとの共存下で
も強度，弾性，耐熱性および耐応力緩和特性等について
所望の効果が得られず、一方Be含有量が1.5wt％を超え
ると電気伝導性が低下すると共に、プレス成形性が著し
く低下し、また経済的にも不利となることから、その含
有量は0.005〜1.5wt％の範囲とする。(2) Be When Be content is less than 0.005wt%, desired effects such as strength, elasticity, heat resistance and stress relaxation characteristics cannot be obtained even when coexisting with Ni, while Be content is 1.5wt%. %, The electric conductivity is lowered, the press formability is remarkably lowered, and it is economically disadvantageous, so the content is made 0.005 to 1.5 wt%.
（３）Zn Znは、Cuマトリックス中に固溶して加工性および電気伝
導性を大きく損なうことなしに強度および弾性を向上さ
せる。また、熱処理時の溶着を効果的に防止する元素で
あり、更に溶解，鋳造時には脱酸剤として機能し、熱間
圧延や熱処理後の酸洗時の酸化膜除去についても効果的
に作用する。加えて、本発明に係る銅基合金のハンダメ
ッキの耐候性にも効果がある。また、ワイヤーハーネス
のターミナル材料は塩水に暴露される可能性が大きく、
このようなときはターミナル材料である銅合金からCuイ
オンが溶出し、回路の短絡を起こす欠点があるが、Znを
含有することによって、Cuイオンの溶出を効果的に抑制
する。従って、短絡現象も抑制される。(3) Zn Zn improves the strength and elasticity without forming a solid solution in the Cu matrix and significantly impairing the workability and electrical conductivity. Further, it is an element that effectively prevents welding during heat treatment, functions as a deoxidizing agent during melting and casting, and also effectively acts on oxide film removal during hot rolling and pickling after heat treatment. In addition, the copper-based alloy according to the present invention is also effective for the weather resistance of solder plating. In addition, the terminal material of the wire harness is highly likely to be exposed to salt water,
In such a case, there is a drawback that Cu ions are eluted from the copper alloy that is the terminal material and a short circuit occurs in the circuit. However, the inclusion of Zn effectively suppresses the elution of Cu ions. Therefore, the short circuit phenomenon is also suppressed.
このような効果を発揮させるためには、0.01wt％以上の
含有量が必要であるが、一方5.0wt％を超えて含有する
と、電気伝導性の低下が顕著となり、また耐応力腐食割
れ性が低下する。In order to exert such an effect, a content of 0.01 wt% or more is required, while if it exceeds 5.0 wt%, the electrical conductivity will be significantly reduced, and the stress corrosion cracking resistance will increase. descend.
（４）Ni:Beの成分組成比率 Ni,BeはNi−Be系金属間化合物として析出して、上記の
本発明の基本的な特徴が達成される。(4) Ni: Be component composition ratio Ni and Be are precipitated as a Ni-Be intermetallic compound to achieve the above-mentioned basic features of the present invention.
このNi−Be系金属間化合物による特性強化をより充分に
発揮させるためには、Ni/Beの成分組成比率（重量比）
を２〜20の範囲とする。In order to more fully enhance the characteristics of this Ni-Be intermetallic compound, the composition ratio of Ni / Be (weight ratio)
Is in the range of 2 to 20.
Ni/Beの成分組成比率が上記範囲外の場合には、マトリ
ックス中に固溶したNi,Beの量が多くなり電気伝導性が
低下する。When the composition ratio of Ni / Be is out of the above range, the amount of Ni and Be solid-dissolved in the matrix increases and the electrical conductivity decreases.
（５）副成分 更に、副成分としてTi,Zr,Co,Sn,Pb,Al,Bi,Pからなる群
より選ばれた１種または２種以上をNi,Be,Znを含有する
第１発明の銅基合金に含有させることにより、第１発明
の合金の加工性および電気伝導性を大きく損なうことな
しに、第１発明の銅基合金の強度，弾性，耐熱性及び耐
応力緩和特性等の諸特性をより一層向上させることがで
きる。また、上記の副成分は、鋳造，熱間圧延，熱処理
時の結晶の微細化にも寄与するものである。(5) Subcomponents Further, the first invention containing one or more selected from the group consisting of Ti, Zr, Co, Sn, Pb, Al, Bi and P as subcomponents Ni, Be, Zn. When the copper-based alloy of the first invention is contained in the copper-based alloy, the strength, elasticity, heat resistance and stress relaxation resistance of the copper-based alloy of the first invention can be improved without significantly impairing the workability and electrical conductivity of the alloy of the first invention. Various characteristics can be further improved. Further, the above subcomponents also contribute to the refinement of crystals during casting, hot rolling and heat treatment.
このような効果を充分に発揮させるためには、上記副成
分から選ばれた１種または２種以上を合計で0.005wt％
以上を含有させる必要があり、一方2.0wt％を超えて含
有すると、加工性および電気伝導性の低下が顕著とな
り、鋳造時の湯流れ性の低下や、熱処理時に強固な酸化
被膜を生成するなど、製造上の問題も生じ、経済的にも
不利となる。In order to fully exert such effects, one or more selected from the above-mentioned subcomponents are added in a total amount of 0.005% by weight.
On the other hand, if the content exceeds 2.0 wt%, the workability and electrical conductivity will be significantly reduced, the flowability of molten metal during casting will be reduced, and a strong oxide film will be formed during heat treatment. However, manufacturing problems also occur, which is economically disadvantageous.
したがって、上記副成分の含有量の範囲は、１種あるい
は２種以上を合計で0.005〜2.0wt％とする。Therefore, the range of the content of the above subcomponents is 0.005 to 2.0 wt% in total of one kind or two kinds or more.
次に、本発明を実施例により具体的に説明する。Next, the present invention will be specifically described with reference to examples.
（ニ）実施例 実施例１ 第１表に化学成分値（重量％）を示す銅基合金No.1〜N
o.14を高周波誘導溶解炉を用いて溶製し、20×50×220
（mm）の鋳塊に鋳造した。(D) Example Example 1 Copper-based alloy No. 1 to N whose chemical composition values (% by weight) are shown in Table 1
O.14 was smelted using a high frequency induction melting furnace, 20 × 50 × 220
It was cast into a (mm) ingot.
ただし、溶解鋳造時の雰囲気はArガスシールとし、鋳造
後直ちに水冷した。各鋳塊を面削後、冷間圧延と焼鈍を
繰返し、厚さ0.6mmまで冷間圧延した。However, the atmosphere at the time of melt casting was sealed with Ar gas, and water cooling was performed immediately after casting. Each ingot was faced, cold rolled and annealed repeatedly, and cold rolled to a thickness of 0.6 mm.
その後、815℃の温度で10分間熱処理後、水急冷を行な
い、さらに酸洗を施した。After that, heat treatment was performed at a temperature of 815 ° C. for 10 minutes, followed by water quenching and further pickling.
上記のようにして得られた熱処理材を厚さ0.3mmまで冷
間圧延し、500℃の温度で30分間の熱処理を施し、試験
材とした。The heat-treated material obtained as described above was cold-rolled to a thickness of 0.3 mm and heat-treated at a temperature of 500 ° C. for 30 minutes to obtain a test material.
得られた試験材を用いて、各所定の試験片を作成し、引
張強さ、導電率およびハンダ耐候性を測定した。その結
果を第１表に示す。Each predetermined test piece was prepared using the obtained test material, and the tensile strength, conductivity and solder weather resistance were measured. The results are shown in Table 1.
測定法としては、引張強さ，導電率の測定はJIS−Ｚ−2
241,JIS−Ｈ−0505に従って行なった。As a measuring method, JIS-Z-2 is used for measuring tensile strength and conductivity.
241, JIS-H-0505.
また、ハンダ耐候性は試験片に溶融ハンダメッキ（Sn−
40wt％Pb,ディップ,260℃×5sec,弱活性ロジンフラック
ス使用）を行ない、150℃の温度で300時間大気中に保持
後、試験片を90°Ｗ曲げし、曲げ部の観察を行なった。
観察の結果、メッキが密着しているものは○印、剥離し
ているものは×印として、第１表に示した。The weather resistance of the solder is measured by hot-dip solder plating (Sn-
40 wt% Pb, dip, 260 ° C. × 5 sec, weakly active rosin flux was used), and after holding in the air at a temperature of 150 ° C. for 300 hours, the test piece was bent 90 ° W and the bent portion was observed.
As a result of the observation, those in which the plating is in close contact are marked with a circle, and those in which the plating is peeled off are marked with a x, which are shown in Table 1.
第１表に示した結果から、本発明に係るNo.1〜９の銅基
合金は、引張強さ、導電率のバランスに優れ、かつハン
ダ耐候性も良好である。従って、ワイヤーハーネスのタ
ーミナル等の電気電子用材料として好適な非常に優れた
特性を有する銅基合金である。From the results shown in Table 1, the copper-based alloys Nos. 1 to 9 according to the present invention are excellent in balance of tensile strength and conductivity, and also have good solder weather resistance. Therefore, it is a copper-based alloy having extremely excellent properties suitable as a material for electric and electronic use such as terminals of wire harnesses.
これに対して、Znを含まない比較合金No.10および本発
明の成分組成範囲よりNi量の多い比較合金No.14ではハ
ンダ耐候性が劣化している。On the other hand, in Comparative Alloy No. 10 containing no Zn and in Comparative Alloy No. 14 in which the amount of Ni is larger than the component composition range of the present invention, the solder weather resistance is deteriorated.
また、本発明の成分組成範囲よりZn量が多い比較合金N
o.13やNi量が多いNo.14では導電率が低く、引張強さの
向上も認められない。Further, the comparative alloy N having a larger Zn content than the compositional range of the present invention
o.13 and No.14 with a large amount of Ni have low conductivity and no improvement in tensile strength is observed.
更に、Niを含まない比較合金No.12では引張強度が本発
明合金に比して低く、Beを含まない比較合金No.11は、
引張強さ，導電率共に低い。Furthermore, in Comparative Alloy No. 12 containing no Ni, the tensile strength is lower than that of the alloy of the present invention, Comparative Alloy No. 11 containing no Be,
Both tensile strength and conductivity are low.
実施例２ 実施例１の第１表中に示す本発明合金No.1と市販のリン
青銅２種（C5191−Ｈ）について、硬度，引張強さ，ば
ね限界値，導電率，耐応力緩和特性及び耐熱性を試験測
定した。その結果を第２表に示す。 Example 2 With respect to alloy No. 1 of the present invention shown in Table 1 of Example 1 and commercially available phosphor bronze type 2 (C5191-H), hardness, tensile strength, spring limit value, conductivity, stress relaxation resistance property And the heat resistance was tested and measured. The results are shown in Table 2.
引張強さ，導電率の測定試験は実施例１と同様の測定法
であり、硬度およびばね限界値の測定はそれぞれJIS−
Ｚ−2244およびJIS−Ｈ−3130に従って行なった。The tensile strength and conductivity measurement tests are the same as in Example 1, and the hardness and spring limit values are measured according to JIS-
It carried out according to Z-2244 and JIS-H-3130.
また、応力緩和試験は試験片の中央部の応力が40Kgf/mm
2になるようにＵ字曲げを行ない、150℃の温度で200時
間保持後の曲げぐせを応力緩和率として、次式により算
出した。In the stress relaxation test, the stress at the center of the test piece was 40 Kgf / mm.
A U-shaped bending was performed so as to be 2, and the bending behavior after holding for 200 hours at a temperature of 150 ° C. was calculated as the stress relaxation rate by the following formula.
応力緩和率（％）＝［（L1−L2）／（L1−L0）］×100 L0：治具の長さ（mm） L1：開始時の試料長さ（mm） L2：処理後の試料端間の水平距離（mm） 更に耐熱性試験は、試料の硬度が初期硬度の80％になる
ときの温度（30分間保持）とした。Stress relaxation rate (%) = [(L 1 −L 2 ) / (L 1 −L 0 )] × 100 L 0 : Jig length (mm) L 1 : Starting sample length (mm) L 2 : Horizontal distance between sample ends after treatment (mm) Further, in the heat resistance test, the temperature (holding for 30 minutes) was taken when the hardness of the sample reached 80% of the initial hardness.
第２表に示す結果から、本発明の銅基合金は、従来の代
表的なワイヤーハーネスのターミナル等の電気電子用材
料であるリン青銅に比較して、導電率，耐応力緩和特性
ならびに耐熱性が格段に向上していることが分る。従っ
て、本発明銅基合金は高度な耐環境性を有し、信頼性に
極めて優れていることが明らかである。 From the results shown in Table 2, the copper-based alloy of the present invention has conductivity, stress relaxation resistance and heat resistance as compared with phosphor bronze, which is a material for electrical and electronic use such as terminals of conventional typical wire harnesses. It turns out that has improved markedly. Therefore, it is clear that the copper-based alloy of the present invention has a high degree of environment resistance and is extremely excellent in reliability.
（ホ）発明の効果 以上の実施例から明らかなように、本発明に係る銅基合
金は、高強度，高弾性，高電気伝導性を有し、かつ耐応
力緩和特性および耐熱性に優れており、更に充分なハン
ダ耐候性を有しているので、ワイヤーハーネスのターミ
ナル等の電気電子用材料として最適なものである。(E) Effect of the Invention As is clear from the above examples, the copper-based alloy according to the present invention has high strength, high elasticity, high electrical conductivity, and excellent stress relaxation resistance and heat resistance. In addition, since it has sufficient solder weather resistance, it is optimal as an electric / electronic material for terminals of wire harnesses and the like.
しかも、本発明合金は、近年の自動車用電装品の小型軽
量化と配線の高密度化に充分対応できるターミナル用と
して好適な画期的な銅基合金である。Moreover, the alloy of the present invention is an epoch-making copper-based alloy suitable for terminals, which can sufficiently cope with the recent trend toward smaller and lighter electric components for automobiles and higher wiring density.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−168831（ＪＰ，Ａ) 特開 昭63−109132（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References Japanese Patent Laid-Open No. 1-168831 (JP, A) Japanese Patent Laid-Open No. 63-109132 (JP, A)
Claims (2)
で残部Cuおよび不可避不純物からなり、マトリックス中
にNi−Be系金属間化合物が分散析出した組織を有する銅
基合金であって、引張強さが60Kgf/mm2以上，導電率が4
5％IACS以上であることを特徴とする高強度高導電性銅
基合金。1. Ni: 0.05 to 5.0 wt% Be: 0.005 to 1.5 wt% Zn: 0.01 to 5.0 wt% and the balance Cu and unavoidable when the composition ratio of Ni / Be is 2 to 20 by weight. A copper-based alloy that is composed of impurities and has a structure in which a Ni-Be intermetallic compound is dispersed and precipitated in a matrix, and has a tensile strength of 60 Kgf / mm 2 or more and an electrical conductivity of 4
High strength and high conductivity copper base alloy characterized by 5% IACS or more.
で、更にTi,Zr,Co,Sn,Pb,Al,Bi,Pからなる群より選ばれ
た１種または２種以上を合計で0.005〜2.0wt％含み、残
部がCuおよび不可避不純物からなり、マトリックス中に
Ni−Be系金属間化合物が分散析出した組織を有する銅基
合金であって、引張強さが60Kgf/mm2以上，導電率が45
％IACS以上であることを特徴とする高強度高導電性銅基
合金。2. Ni: 0.05 to 5.0 wt% Be: 0.005 to 1.5 wt% Zn: 0.01 to 5.0 wt%, the composition ratio of Ni / Be is in the range of 2 to 20 by weight, and Ti, 0.005 to 2.0 wt% of one or more selected from the group consisting of Zr, Co, Sn, Pb, Al, Bi, and P is contained in total, and the balance is Cu and inevitable impurities.
A copper-based alloy having a structure in which a Ni-Be intermetallic compound is dispersed and precipitated, having a tensile strength of 60 Kgf / mm 2 or more and an electrical conductivity of 45.
A high-strength, high-conductivity copper-based alloy characterized by having a% IACS or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63261236A JPH0778266B2 (en) | 1988-10-17 | 1988-10-17 | High strength and high conductivity copper base alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63261236A JPH0778266B2 (en) | 1988-10-17 | 1988-10-17 | High strength and high conductivity copper base alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02107732A JPH02107732A (en) | 1990-04-19 |
| JPH0778266B2 true JPH0778266B2 (en) | 1995-08-23 |
Family
ID=17359031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63261236A Expired - Lifetime JPH0778266B2 (en) | 1988-10-17 | 1988-10-17 | High strength and high conductivity copper base alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0778266B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105750759A (en) * | 2016-03-29 | 2016-07-13 | 华中科技大学 | Copper-based solder as well as preparation method and application thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6001196A (en) * | 1996-10-28 | 1999-12-14 | Brush Wellman, Inc. | Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys |
| SG152056A1 (en) * | 2002-05-17 | 2009-05-29 | Idemitsu Kousan Co Ltd | Wiring material and wiring board using the same |
| CN120464903B (en) * | 2025-06-04 | 2025-09-30 | 河北战豪新材料有限公司 | High-conductivity copper alloy material for cables and preparation process and application thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63109132A (en) * | 1986-10-28 | 1988-05-13 | Furukawa Electric Co Ltd:The | High-strength conductive copper alloy and its production |
| JPH01168831A (en) * | 1987-12-25 | 1989-07-04 | Nippon Mining Co Ltd | Electric conductive material |
-
1988
- 1988-10-17 JP JP63261236A patent/JPH0778266B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105750759A (en) * | 2016-03-29 | 2016-07-13 | 华中科技大学 | Copper-based solder as well as preparation method and application thereof |
| CN105750759B (en) * | 2016-03-29 | 2018-02-27 | 华中科技大学 | A kind of copper base solder and preparation method and application |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02107732A (en) | 1990-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3550233B2 (en) | Manufacturing method of high strength and high conductivity copper base alloy | |
| KR950004935B1 (en) | Copper alloy for electronic instruments | |
| US6136104A (en) | Copper alloy for terminals and connectors and method for making same | |
| JP3383615B2 (en) | Copper alloy for electronic materials and manufacturing method thereof | |
| JP2593107B2 (en) | Manufacturing method of high strength and high conductivity copper base alloy | |
| JP2844120B2 (en) | Manufacturing method of copper base alloy for connector | |
| JPH036341A (en) | High strength and high conductivity copper-base alloy | |
| JPH0478704B2 (en) | ||
| JP2002266042A (en) | Copper alloy sheet having excellent bending workability | |
| JP2521880B2 (en) | Copper alloy for electronic and electrical equipment and its manufacturing method | |
| JPS6231059B2 (en) | ||
| JPH04311544A (en) | Electrically conductive material | |
| JPS62182240A (en) | Conductive high-tensile copper alloy | |
| JPS63149345A (en) | High strength copper alloy having high electrical conductivity and improved heat resistance | |
| JP3807475B2 (en) | Copper alloy plate for terminal and connector and manufacturing method thereof | |
| JPH0718356A (en) | Copper alloy for electronic equipment, its manufacturing method and IC lead frame | |
| JP4043118B2 (en) | High strength and high conductivity Cu-Fe alloy plate for electric and electronic parts with excellent heat resistance | |
| JPH0778266B2 (en) | High strength and high conductivity copper base alloy | |
| JPS6231060B2 (en) | ||
| US4871399A (en) | Copper alloy for use as wiring harness terminal material and process for producing the same | |
| JPH0565571B2 (en) | ||
| JP2000129377A (en) | Copper base alloy for terminals | |
| JPS60152646A (en) | Material for lead frame for semiconductor | |
| JPH0525568A (en) | Easy-to-machine high-strength copper alloy and its manufacturing method | |
| JP2514234B2 (en) | Copper alloy for terminals and connectors with excellent strength and conductivity |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080823 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080823 Year of fee payment: 13 |
|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313115 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080823 Year of fee payment: 13 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080823 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090823 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090823 Year of fee payment: 14 |