JPH0780871A - Hot-pressing device and hot plate therefor - Google Patents
Hot-pressing device and hot plate thereforInfo
- Publication number
- JPH0780871A JPH0780871A JP23342993A JP23342993A JPH0780871A JP H0780871 A JPH0780871 A JP H0780871A JP 23342993 A JP23342993 A JP 23342993A JP 23342993 A JP23342993 A JP 23342993A JP H0780871 A JPH0780871 A JP H0780871A
- Authority
- JP
- Japan
- Prior art keywords
- hot
- plate
- airtight chamber
- movable plate
- press device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007731 hot pressing Methods 0.000 title claims description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 230000006837 decompression Effects 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 abstract description 6
- 229920002379 silicone rubber Polymers 0.000 abstract description 3
- 239000004945 silicone rubber Substances 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 29
- 239000007789 gas Substances 0.000 description 10
- 239000003921 oil Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000010720 hydraulic oil Substances 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 230000003584 silencer Effects 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/06—Platens or press rams
- B30B15/062—Press plates
- B30B15/064—Press plates with heating or cooling means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Press Drives And Press Lines (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、例えば積層プリント配
線板などの多層基板のプレス成形に用いられるホットプ
レス装置および該装置に使用される熱板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot press machine used for press molding of a multilayer substrate such as a laminated printed wiring board and a hot plate used in the machine.
【0002】[0002]
【従来の技術】従来、相対位置を固定された固定盤、固
定盤に相対向して配され上下動により固定盤に近接、離
隔する可動盤、固定盤と可動盤との間に配設されて熱
油、電気ヒータ等で加熱される複数の熱板及びこれらを
収納する容器とを備えたホットプレス装置が知られてお
り、例えばプリント配線板などの多層基板のプレス成形
に使用されていた。2. Description of the Related Art Conventionally, a fixed platen whose relative position is fixed, a movable platen opposed to the fixed platen and moved toward and away from the fixed platen by vertical movement, and arranged between the fixed platen and the movable platen. A hot press device is known that includes a plurality of hot plates heated by hot oil, an electric heater, etc., and a container that houses these, and was used for press molding of a multilayer substrate such as a printed wiring board. .
【0003】[0003]
【発明が解決しようとする課題】しかしながら、従来の
ホットプレス装置では被加工物を加熱するための熱板が
例えば鋼製等のため、その熱容量が大きくこれを加熱す
るために多量の熱エネルギーを必要とし、熱エネルギー
の利用効率に問題があった。このため被加工物を効率よ
く加熱できる熱板およびそのような熱板を装着したホッ
トプレス装置が求められていた。However, in the conventional hot pressing apparatus, the hot plate for heating the work piece is made of, for example, steel, so that its heat capacity is large and a large amount of heat energy is required to heat it. It was necessary and there was a problem in the utilization efficiency of heat energy. For this reason, there has been a demand for a hot plate capable of efficiently heating a workpiece and a hot press machine equipped with such a hot plate.
【0004】[0004]
【課題を解決するための手段】かかる課題を解決するた
めの手段として、本発明は以下の構成を採用した。すな
わち、本願の第1の発明としてのホットプレス装置用の
熱板は、熱板間に挟持された被加工物をプレス加工する
ホットプレス装置用の熱板であって、いずれも伸縮自在
な上面膜部材および下面膜部材間に形成される気密室
と、該気密室内に配された遠赤外線ヒータと、上記気密
室内に所望圧力の気体を供給する気体供給口と、上記気
密室内から気体を排出する気体排出口とを設けたことを
特徴とする。As a means for solving the above problems, the present invention adopts the following configurations. That is, the hot plate for the hot press device according to the first invention of the present application is a hot plate for a hot press device that presses a workpiece sandwiched between the hot plates, and both are expandable and contractible. An airtight chamber formed between the face film member and the bottom film member, a far infrared heater arranged in the airtight chamber, a gas supply port for supplying a gas of a desired pressure into the airtight chamber, and a gas exhausted from the airtight chamber. And a gas discharge port for
【0005】また第2の発明のホットプレス装置は、固
定盤と、該固定盤に相対向して配され上昇および下降可
能な可動盤と、該可動盤を上下駆動する可動盤駆動機構
と、前記固定盤と可動盤との間に配されて前記可動盤の
上昇および下降に応じて互いの相対距離を近接および離
隔させる複数の熱板とを備え、被加工物をプレス加工す
るホットプレス装置において、前記熱板として第1の発
明のホットプレス装置用の熱板を装着したことを特徴と
する。The hot pressing apparatus of the second invention comprises a fixed plate, a movable plate which is arranged facing the fixed plate so as to be able to move up and down, and a movable plate drive mechanism which drives the movable plate up and down. A hot press device that is provided between the fixed plate and the movable plate and that has a plurality of hot plates that make the relative distance between the movable plate and the movable plate move closer to and away from each other according to ascent and descent of the movable plate. In the above, the hot plate for the hot press device of the first invention is mounted as the hot plate.
【0006】[0006]
【作用】上記構成のホットプレス装置用の熱板は、従来
の熱板と同様にホットプレス装置の固定盤および可動盤
に各1枚、固定盤と可動盤との間に例えば段板を介して
適宜の枚数が設置される。The hot plate for the hot press device having the above-mentioned structure has one fixed plate and one movable plate of the hot press device, like the conventional hot plate. For example, a step plate is interposed between the fixed plate and the movable plate. And an appropriate number is installed.
【0007】以下ホットプレスの手順に従って述べる
と、まず可動盤を下降位置に保持して各熱板を互いに離
隔した状態で、熱板の上面膜部材上に被加工物を載置す
る。ただし、固定盤に装着された熱板は、上面膜部材側
が固定盤によって覆われるのでこの熱板には被加工物は
載置されない。In the following, according to the procedure of hot pressing, the work is first placed on the upper surface film member of the hot plate in a state where the movable plate is held in the lowered position and the hot plates are separated from each other. However, since the upper plate member side of the hot plate mounted on the fixed platen is covered with the fixed platen, the workpiece is not placed on the hot plate.
【0008】次に可動盤を上昇させて各熱板を近接させ
ると、被加工物は隣接する熱板間において、下方の熱板
の上面膜部材と上方の熱板の下面膜部材との間に挟持さ
れる。上面および下面膜部材は伸縮自在であるので、被
加工物の形状に応じて凹陥し、被加工物を包囲するごと
くに収納することになる。上記被加工物の上面膜部材上
への載置に際して、気密室から気体を排出し減圧状態と
して上面および下面膜部材を気密室内側に凹陥させてお
くと、被加工物を良好に包囲できる。Next, when the movable platen is raised to bring the respective heat plates close to each other, the work piece is placed between the upper film member of the lower heat plate and the lower film member of the upper heat plate between the adjacent hot plates. Sandwiched between. Since the upper surface film and the lower surface film member are expandable and contractible, they are recessed according to the shape of the workpiece and are housed as if they surround the workpiece. When the above-mentioned work piece is placed on the upper surface film member, if the gas is discharged from the airtight chamber and the upper surface and the lower surface film member are recessed to the airtight chamber side in a depressurized state, the work piece can be surrounded well.
【0009】なお、請求項2記載の熱板を使用すると、
各熱板の近接と併せて外周部材は上下方向に密に連接し
て一連の枠体を形成する。この際、被加工物は上記のよ
うに上面および下面膜部材の凹陥部内に収納されている
ので、熱板間の被加工物によって各熱板の近接を妨げら
れることはない。この枠体は固定盤および可動盤と共
に、その内部に気密室並びに被加工物を収容する密閉室
を形成する。ここで減圧手段にて密閉室から空気を排出
すれば、密閉室を所望の真空度まで減圧できる。When the hot plate according to claim 2 is used,
Along with the proximity of each hot plate, the outer peripheral members are closely connected in the vertical direction to form a series of frames. At this time, since the workpieces are housed in the recesses of the upper and lower film members as described above, the workpieces between the hot plates do not prevent the hot plates from approaching each other. The frame body, together with the fixed platen and the movable platen, forms therein an airtight chamber and a closed chamber for accommodating a workpiece. If air is discharged from the closed chamber by the pressure reducing means, the closed chamber can be depressurized to a desired vacuum degree.
【0010】続いて気密室に所望圧力の気体、例えば空
気を供給し気密室を昇圧すると、上面膜部材および下面
膜部材が膨出する。上面膜部材および下面膜部材は、被
加工物の表面に沿って密着変形して被加工物を包囲する
とともに、被加工物に気密室内の圧力に応じたプレス力
を及ぼす。なお、この気密室の昇圧は、上記密閉室の減
圧を実施する場合には、これと並行的に行なって差し支
えない。Subsequently, when gas having a desired pressure, for example, air is supplied to the airtight chamber to raise the pressure in the airtight chamber, the upper surface film member and the lower surface film member swell. The upper surface film member and the lower surface film member closely deform along the surface of the workpiece to surround the workpiece, and exert a pressing force on the workpiece according to the pressure in the airtight chamber. The pressure in the airtight chamber may be increased in parallel with the pressure in the closed chamber.
【0011】さらに気密室を所望の圧力に保持してお
き、遠赤外線ヒータで被加工物を加熱する。遠赤外線ヒ
ータから放射される熱は、気密室内の空気および上面ま
たは下面膜部材を経て被加工物に至るが、これらに吸収
される熱量は鋼製の熱板と比較してきわめて少ない。し
たがって、遠赤外線ヒータから放射される熱エネルギー
はきわめて効率よく被加工物の加熱に費やされることに
なる。このように第1の発明の熱板は被加工物を効率よ
く加熱できる。Further, the airtight chamber is kept at a desired pressure, and the workpiece is heated by the far infrared heater. The heat radiated from the far-infrared heater reaches the object to be processed through the air in the airtight chamber and the upper or lower film member, but the amount of heat absorbed by them is extremely smaller than that of the hot plate made of steel. Therefore, the thermal energy radiated from the far infrared heater is consumed very efficiently for heating the workpiece. Thus, the hot plate of the first invention can efficiently heat the workpiece.
【0012】また、外周部材にて密閉室を形成してこの
内部のみを減圧すると、ホットプレス装置の容器全体を
減圧する場合と比較して減圧容積はきわめて少なくなる
ので、減圧に要する時間が短縮されてホットプレス装置
の稼働効率は向上する。しかも、容器自体を耐圧構造と
する必要もなくなるので、ホットプレス装置を簡素化、
小型化できる。Further, when a closed chamber is formed by the outer peripheral member and only the inside thereof is depressurized, the depressurized volume becomes extremely small as compared with the case where the entire container of the hot press machine is depressurized, so the time required for depressurization is shortened. As a result, the operating efficiency of the hot press machine is improved. Moreover, since it is not necessary to make the container itself a pressure resistant structure, the hot press device is simplified,
Can be miniaturized.
【0013】第2の発明のホットプレス装置は、上記第
1の発明の熱板を装着しているので、上述のとおりの作
用を奏する。Since the hot pressing apparatus of the second invention is equipped with the hot plate of the first invention, it exhibits the above-described operation.
【0014】[0014]
【実施例】次に、本発明を一層明らかにするために、好
適な一実施例を図面を参照して説明する。図1に示すよ
うに、本実施例のホットプレス装置10の最下部には、
基盤12が配されており、この基盤12は図示省略する
架台を介して床に固定される。基盤12には複数のステ
ー14が立設、固定されており、これらステー14の他
端には基盤12と相対向する固定盤16が固着されてい
る。また基盤12の中央部にはシリンダ18が穿設され
ており、シリンダ18と外部とを連通する給排孔18a
にはシリンダ18に作動油を給排するための給排管20
が接続されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, in order to further clarify the present invention, a preferred embodiment will be described with reference to the drawings. As shown in FIG. 1, at the bottom of the hot press device 10 of the present embodiment,
A base 12 is arranged, and the base 12 is fixed to the floor via a mount (not shown). A plurality of stays 14 are erected and fixed to the base 12, and a fixing plate 16 facing the base 12 is fixed to the other ends of the stays 14. A cylinder 18 is bored in the center of the base 12, and a supply / discharge hole 18a for communicating the cylinder 18 with the outside is provided.
A supply / discharge pipe 20 for supplying / discharging hydraulic oil to / from the cylinder 18.
Are connected.
【0015】この給排管20は供給用逆止弁22を介し
てポンプ24の吐出側24aに接続されており、ポンプ
24の吸入側24bはストレーナ26を介して油タンク
28に接続されている。またポンプ24の吐出側24a
から分岐する管路30にはリリーフ弁32が介装され、
リリーフ弁32のドレン側32aは油タンク28に接続
されている。このリリーフ弁32のベント側には設定圧
切換用の電磁弁34が接続されており、電磁弁34のオ
ン/オフに応じてリリーフ弁32の設定圧を切換えでき
る。他方、給排管20から分岐する排出路36にはパイ
ロット方式の排出用逆止弁38が介装されており、排出
用逆止弁38の2次側はドレン管38bとして油タンク
28に接続されている。この排出用逆止弁38のパイロ
ットポート38pは2位置4ポート型の電磁弁40に接
続され、電磁弁40のポジションに応じて排出路36あ
るいはドレン管38bに連通される。周知のように、こ
の排出用逆止弁38は、パイロットポート38pが排出
路36と連通され排出路36の油圧を導入された際には
閉鎖状態となる。こうした構成により、ポンプ24を稼
動させ、電磁弁34および電磁弁40のポジションを切
換操作することにより、シリンダ18への作動油の給排
を操作できる。The supply / discharge pipe 20 is connected to a discharge side 24a of a pump 24 via a supply check valve 22, and a suction side 24b of the pump 24 is connected to an oil tank 28 via a strainer 26. . Also, the discharge side 24a of the pump 24
A relief valve 32 is interposed in the pipe 30 branched from
The drain side 32 a of the relief valve 32 is connected to the oil tank 28. A solenoid valve 34 for switching the set pressure is connected to the vent side of the relief valve 32, and the set pressure of the relief valve 32 can be switched according to ON / OFF of the solenoid valve 34. On the other hand, a pilot type check valve 38 for discharge is installed in the discharge path 36 branched from the supply / discharge pipe 20, and the secondary side of the check valve 38 for discharge is connected to the oil tank 28 as a drain pipe 38b. Has been done. The pilot port 38p of the discharge check valve 38 is connected to a 2-position 4-port solenoid valve 40 and communicates with the discharge passage 36 or the drain pipe 38b depending on the position of the solenoid valve 40. As is well known, the discharge check valve 38 is closed when the pilot port 38p communicates with the discharge passage 36 and the hydraulic pressure of the discharge passage 36 is introduced. With such a configuration, the pump 24 can be operated and the positions of the solenoid valve 34 and the solenoid valve 40 can be switched to operate the supply and discharge of the hydraulic oil to and from the cylinder 18.
【0016】さらにシリンダ18には、ラム42が摺動
自在に挿通されている。このラム42の一端には固定盤
16と相対向して可動盤44が固着されており、シリン
ダ18への作動油の給排に応じてラム42と共に可動盤
44を上昇および下降駆動できる。Further, a ram 42 is slidably inserted in the cylinder 18. A movable plate 44 is fixed to one end of the ram 42 so as to face the fixed plate 16, and the movable plate 44 can be driven up and down together with the ram 42 in accordance with supply and discharge of hydraulic oil to and from the cylinder 18.
【0017】可動盤44には可動盤側熱板46が装着さ
れている。また可動盤44と対向する固定盤16には固
定盤側熱板48が装着され、可動盤44と固定盤16と
の間には、図示するのは1枚のみであるが、複数枚の中
間熱板50が周知の段板(図示略)を介して所定の間隔
で配されている。A movable plate side heating plate 46 is mounted on the movable platen 44. A fixed plate side heating plate 48 is attached to the fixed plate 16 facing the movable plate 44, and only one sheet is shown between the movable plate 44 and the fixed plate 16, but a plurality of intermediate plates are provided. The heat plates 50 are arranged at predetermined intervals via well-known step plates (not shown).
【0018】ここで図2および図3を参照して中間熱板
50の構造を説明し、併せて可動盤側熱板46および固
定盤側熱板48の構造についても説明する。図2および
図3に示すように、中間熱板50は上下に開口する矩形
枠状で上下の縁部にパッキン52aを備えた外周部材5
2とその内側に収容された気密室54との二重構造とな
っている。The structure of the intermediate heating plate 50 will be described with reference to FIGS. 2 and 3, and the structures of the movable platen-side heat plate 46 and the fixed platen-side heat plate 48 will also be described. As shown in FIGS. 2 and 3, the intermediate heating plate 50 is a peripheral frame member 5 having a rectangular frame shape having upper and lower openings and packings 52a at upper and lower edges.
2 and the airtight chamber 54 accommodated inside thereof have a double structure.
【0019】気密室54は、上下に開口する矩形の中枠
56の開口をシリコーンゴム製で伸縮自在の上面膜部材
58および下面膜部材60で閉鎖した形状であり、上面
および下面膜部材58、60は、上下の押え枠62a、
62bを介して、中枠56の上下の縁部にボルト締めに
て気密に密着されている。また上側の押え枠62aに
は、各辺の中央付近に、それぞれ1本の連通溝64が設
けられている。このようにして装着されている上面およ
び下面膜部材58、60は、その交換が容易である。The airtight chamber 54 has a shape in which the opening of a rectangular middle frame 56 that opens up and down is closed by a stretchable upper surface film member 58 and a lower surface film member 60 made of silicone rubber. 60 is an upper and lower presser frame 62a,
The upper and lower edges of the middle frame 56 are airtightly attached to each other via bolts 62b. The upper holding frame 62a is provided with one communication groove 64 near the center of each side. The upper and lower film members 58 and 60 thus mounted are easy to replace.
【0020】中枠56の相対向する一対の辺部にそれぞ
れ1本の空気通路66、66が穿設されており、各空気
通路66、66は複数の連通路68を介して気密室54
内の空間と連通している。また各空気通路66、66に
は空気給排路70a、70bが設けられており、この空
気給排路70a、70bは外周部材52を貫通して外部
と連通している。One air passage 66, 66 is provided in each of a pair of opposite side portions of the middle frame 56, and each air passage 66, 66 is provided with a plurality of communication passages 68 through an airtight chamber 54.
It communicates with the inner space. Further, air supply / discharge passages 70a, 70b are provided in the respective air passages 66, 66, and the air supply / discharge passages 70a, 70b penetrate the outer peripheral member 52 and communicate with the outside.
【0021】気密室54の内部には、上面膜部材58に
沿って格子状の受け枠72が設置されている。この受け
枠72は上面膜部材58上に載置される被加工物を支承
し、被加工物の荷重で上面膜部材58が凹陥変形するの
を防止するために設置されている。気密室54内には気
密室54内を横断して一対のサポート74、74が配さ
れ、サポート74、74の両端は中枠56の相対向する
辺にボルト締めにて固定されている。これらサポート7
4、74の上方には上側遠赤外線ヒータ76aが、下方
には下側遠赤外線ヒータ76bが、それぞれ受け枠72
とほぼ平行に配設され、サポート74、74にボルト締
めにて固定されている。なお図示を省略しているが、気
密室54単位で上側および下側遠赤外線ヒータ76a、
76bの温度コントローラが設けられており、各気密室
54毎に温度調節可能となっている。Inside the airtight chamber 54, a lattice-shaped receiving frame 72 is installed along the upper surface film member 58. The receiving frame 72 supports the workpiece to be placed on the upper surface film member 58, and is installed to prevent the upper surface film member 58 from being concavely deformed by the load of the workpiece. A pair of supports 74, 74 are arranged in the airtight chamber 54 so as to traverse the airtight chamber 54, and both ends of the supports 74, 74 are fixed to opposite sides of the middle frame 56 by bolting. These support 7
An upper far infrared heater 76a is provided above the reference numerals 4 and 74, and a lower far infrared heater 76b is provided below the receiving frame 72.
Are arranged substantially in parallel with and are fixed to the supports 74, 74 by bolting. Although not shown, the upper and lower far-infrared heaters 76a for each airtight chamber 54,
A temperature controller 76b is provided, and the temperature of each airtight chamber 54 can be adjusted.
【0022】以上、中間熱板50の構造について説明し
たが、可動盤側熱板46は中間熱板50の構造から下側
遠赤外線ヒータ76bを取り除いた構造であり、固定盤
側熱板48は中間熱板50から受け枠72および上側遠
赤外線ヒータ76aを取り除いた構造である。それ故、
可動盤側熱板46および固定盤側熱板48については、
中間熱板50と共通する部材については同品番を付し
て、詳細の図示および説明を省略する。Although the structure of the intermediate hot plate 50 has been described above, the movable plate side hot plate 46 is a structure in which the lower far infrared heater 76b is removed from the structure of the intermediate hot plate 50, and the fixed plate side hot plate 48 is. This is a structure in which the receiving frame 72 and the upper far infrared heater 76a are removed from the intermediate heating plate 50. Therefore,
Regarding the movable platen side heat plate 46 and the fixed platen side heat plate 48,
Members common to the intermediate heating plate 50 are given the same part numbers, and detailed illustration and description thereof are omitted.
【0023】図1に示すように、各熱板46、48、5
0の空気給排路70a、70bは、それぞれヘッダ78
およびヘッダ80に接続されている。ただし、図1にお
いては、空気給排路70a、70bを相互に区別するた
めに、本来平行に配されている両者を対向する位置に図
示している。As shown in FIG. 1, each heating plate 46, 48, 5
The air supply / exhaust passages 70a and 70b of 0 are respectively the header 78
And the header 80. However, in FIG. 1, in order to distinguish the air supply / exhaust passages 70a and 70b from each other, the air supply / exhaust passages 70a and 70b, which are originally arranged in parallel with each other, are shown at positions facing each other.
【0024】ヘッダ78は両端に接続部82a、82b
を備えている。接続部82aに接続されている空気供給
管84は2経路に分岐しており、一方の経路はクーラ8
6および2ポート2位置型の電磁弁88を介して空気供
給管85に接続され、他方は2ポート2位置型の電磁弁
94を介して空気供給管85に接続され、さらに空気供
給管85はリリーフ付の減圧弁92を介してコンプレッ
サ90に接続されている。ヘッダ78の他の接続部82
bは、リリーフ付きの減圧弁96および2ポート2位置
型の電磁弁98を介して真空ポンプ100に接続されて
いる。さらに、真空ポンプ100には、2位置4ポート
型の電磁弁102が接続されている。この電磁弁102
には、固定盤16を貫通して穿設された吸引孔16aお
よびサイレンサ104とが接続されており、電磁弁10
2のポジション切換により吸引孔16aとサイレンサ1
04または真空ポンプ100とを択一的に連通状態とで
きる。The header 78 has connecting portions 82a and 82b at both ends.
Is equipped with. The air supply pipe 84 connected to the connecting portion 82a is branched into two paths, one path of which is the cooler 8
The 6-port and 2-port 2-position solenoid valve 88 is connected to the air supply pipe 85, and the 2-port 2-position solenoid valve 94 is connected to the air supply pipe 85. It is connected to the compressor 90 via a pressure reducing valve 92 with a relief. Other connection portion 82 of header 78
b is connected to a vacuum pump 100 via a pressure reducing valve 96 with a relief and a 2-port 2-position solenoid valve 98. Further, the vacuum pump 100 is connected to a 2-position 4-port solenoid valve 102. This solenoid valve 102
A suction hole 16 a and a silencer 104, which are formed by penetrating the fixed plate 16, are connected to the solenoid valve 10.
By switching the position of 2, the suction hole 16a and the silencer 1
04 or the vacuum pump 100 can be alternatively placed in a communication state.
【0025】一方、空気給排路70bに連通するヘッダ
80には、絞り弁109および2ポート2位置型の電磁
弁106を介してサイレンサ108が接続されている。
上記構成により、コンプレッサ90から吐出される空気
を各熱板46、48、50の気密室54に導入できる。
この際クーラ86側のラインを使用して気密室54に冷
却空気を供給し、電磁弁106を開放すれば気密室54
を加圧しながら冷却できる。また、減圧弁92と電磁弁
94側のラインを使用して気密室54に設定圧力の空気
を供給すると共に電磁弁106を遮断すれば、気密室5
4内を設定圧力に加圧できる。さらに、電磁弁98を開
放として真空ポンプ100を稼動させれば、気密室54
の空気を吸引、排出可能である。なお、吸引孔16aに
連なるラインの役割については後述する。On the other hand, a silencer 108 is connected to the header 80 communicating with the air supply / discharge passage 70b via a throttle valve 109 and a 2-port 2-position solenoid valve 106.
With the above configuration, the air discharged from the compressor 90 can be introduced into the airtight chamber 54 of each of the heating plates 46, 48, 50.
At this time, if the cooling air is supplied to the airtight chamber 54 using the line on the cooler 86 side and the electromagnetic valve 106 is opened, the airtight chamber 54 is closed.
Can be cooled while pressurizing. Further, if air of a set pressure is supplied to the airtight chamber 54 using the pressure reducing valve 92 and the line on the electromagnetic valve 94 side and the electromagnetic valve 106 is shut off, the airtight chamber 5 will be closed.
The inside of 4 can be pressurized to the set pressure. Further, if the electromagnetic valve 98 is opened and the vacuum pump 100 is operated, the airtight chamber 54
The air can be sucked in and discharged. The role of the line connected to the suction hole 16a will be described later.
【0026】次に各熱板46、48、50の昇降移動に
ついて説明する。まずラム42に作動油を供給して可動
盤44を上昇駆動すると、可動盤44は可動盤側熱板4
6と共に上昇し、中間熱板50を順次押し上げてゆき、
図4に示すように、可動盤44と固定盤16とで、各熱
板46、48、50を挟持、押圧することになる。この
際、固定盤16と固定盤側熱板48の外周部材52、可
動盤44と可動盤側熱板46の外周部材52および上下
に接触する各熱板46、48、50の外周部材52同士
は、パッキン52aを介して互いに密接する。これによ
り、各外周部材52は一連の枠体Cを形成すると共に、
この枠体C、固定盤16および可動盤44で閉鎖された
密閉室Rを形成することになる。Next, the vertical movement of the heating plates 46, 48 and 50 will be described. First, when hydraulic oil is supplied to the ram 42 to drive the movable platen 44 upward, the movable platen 44 moves to the movable platen-side heat plate 4.
Ascends along with 6 and sequentially pushes up the intermediate hot plate 50,
As shown in FIG. 4, the movable plate 44 and the fixed plate 16 sandwich and press the heat plates 46, 48, 50. At this time, the outer peripheral member 52 of the fixed platen 16 and the fixed plate-side heat plate 48, the outer peripheral member 52 of the movable plate 44 and the movable plate-side heat plate 46, and the outer peripheral member 52 of each of the heat plates 46, 48, and 50 contacting vertically. Are in close contact with each other via the packing 52a. Thereby, each outer peripheral member 52 forms a series of frame bodies C, and
A closed chamber R closed by the frame C, the fixed plate 16 and the movable plate 44 is formed.
【0027】このようにして密閉室Rを形成した状態
で、吸引孔16aと真空ポンプ100とを連通させるべ
く電磁弁102のポジションを調整して真空ポンプ10
0を稼動させれば、密閉室R内の空気を吸引、排出して
減圧できる。また、上下の外周部材52同士が密接して
も中枠56同士は接触しない寸法となっている上に、各
中枠56に連通溝64が設けられている。このため、上
述の密閉室Rの減圧に際しては、例えば固定盤側熱板4
8の下面膜部材60と中間熱板50の上面膜部材58と
の間等の中枠56の内側の空間も十分に減圧できる。With the closed chamber R thus formed, the position of the electromagnetic valve 102 is adjusted so that the suction hole 16a and the vacuum pump 100 are communicated with each other, and the vacuum pump 10 is adjusted.
If 0 is operated, the air in the closed chamber R can be sucked and discharged to reduce the pressure. Further, even if the upper and lower outer peripheral members 52 are in close contact with each other, the inner frames 56 are not in contact with each other, and a communication groove 64 is provided in each of the inner frames 56. Therefore, when decompressing the closed chamber R described above, for example, the fixed plate side hot plate 4
The space inside the middle frame 56 such as between the lower surface film member 60 of FIG. 8 and the upper surface film member 58 of the intermediate heating plate 50 can be sufficiently depressurized.
【0028】次に、上記構成のホットプレス装置10を
使用して、被加工物をホットプレスする場合について図
5〜図7を参照して説明する。ただし、図5〜図7に
は、1組の中間熱板50a、50b(区別のために添え
字a、bを付す)の要部のみを模式的に図示し、これら
中間熱板50、50の細部、他の中間熱板50、固定盤
側熱板48および可動盤側熱板46の図示は省略する。
また図1と同様に、空気給排路70a、70bを対向位
置に図示している。Next, a case of hot pressing an object to be processed by using the hot pressing device 10 having the above-mentioned structure will be described with reference to FIGS. However, in FIG. 5 to FIG. 7, only a main part of one set of intermediate hot plates 50a and 50b (subscripts a and b are attached for distinction) is schematically illustrated. Of the intermediate heating plate 50, the fixed plate side heating plate 48, and the movable plate side heating plate 46 are omitted.
Further, as in the case of FIG. 1, the air supply / discharge passages 70a and 70b are shown at opposing positions.
【0029】まず、図1に示す状態から、電磁弁98を
開放位置にした後(他の電磁弁34、40、88、9
4、102、106は図示の状態)、真空ポンプ100
を稼動させて各熱板46、48、50の気密室54内を
減圧する。これにより、上面膜部材58および下面膜部
材60が凹陥変形する。ただし、上面膜部材58は受け
枠72にて支承されるのでわずかに凹陥するのみである
(図5参照)。ここで、被加工物Hを上面膜部材58上
に載置する。なお、下側の中間熱板50b上の被加工物
Hのみ図示する。この被加工物Hの荷重は受け枠72に
て支承されるので、正確に水平に載置されることにな
る。First, from the state shown in FIG. 1, the solenoid valve 98 is set to the open position (other solenoid valves 34, 40, 88, 9).
4, 102 and 106 are shown in the drawing), the vacuum pump 100
Is operated to reduce the pressure in the airtight chamber 54 of each hot plate 46, 48, 50. As a result, the upper surface film member 58 and the lower surface film member 60 are concavely deformed. However, since the upper surface film member 58 is supported by the receiving frame 72, it is only slightly recessed (see FIG. 5). Here, the workpiece H is placed on the upper surface film member 58. Only the workpiece H on the lower intermediate heating plate 50b is shown. Since the load of the workpiece H is supported by the receiving frame 72, it can be accurately placed horizontally.
【0030】被加工物Hを上面膜部材58上に載置した
後、電磁弁34を遮断位置に切り換えてシリンダ18に
作動油を供給し、ラム42を介して可動盤44を上昇さ
せる。これにより、各熱板46、48、50の外周部材
は互いに上下方向に接合され一連の枠体Cを形成すると
共に、この枠体C、固定盤16および可動盤44で閉鎖
された密閉室Rを形成する(図4および図6参照)。After the workpiece H is placed on the upper surface film member 58, the solenoid valve 34 is switched to the shut-off position to supply hydraulic oil to the cylinder 18, and the movable platen 44 is raised via the ram 42. As a result, the outer peripheral members of the respective heat plates 46, 48, 50 are vertically joined to each other to form a series of frame bodies C, and the closed chamber R closed by the frame bodies C, the fixed plate 16 and the movable plate 44. Are formed (see FIGS. 4 and 6).
【0031】続いて電磁弁102のポジションを切り換
えて固定盤16の吸引孔16aと真空ポンプ100とを
連通させると共に、電磁弁98のポジションを遮断位置
にする。これにより、密閉室Rは、内部の空気を真空ポ
ンプ100によって排出されて設定された真空度まで減
圧される。さらに、上記操作と併行して、電磁弁94を
開放位置に切り換え、気密室54内にコンプレッサ90
からの加圧空気を供給し、気密室54内を設定圧力に加
圧する。これらの操作によって、上面膜部材58および
下面膜部材60が外側に向かって膨出変形し、被加工物
Hを、その外面に沿って密着、被覆する(図7参照)。
なお、中間熱板50aの上方、中間熱板50bの下方に
配された被加工物Hも、同様に上面膜部材58および下
面膜部材60によって被覆される。Subsequently, the position of the solenoid valve 102 is switched to connect the suction hole 16a of the fixed board 16 to the vacuum pump 100, and the position of the solenoid valve 98 is set to the shut-off position. As a result, the air inside the sealed chamber R is exhausted by the vacuum pump 100 and is depressurized to the set degree of vacuum. Further, in parallel with the above operation, the solenoid valve 94 is switched to the open position, and the compressor 90 is placed in the airtight chamber 54.
The compressed air is supplied to pressurize the airtight chamber 54 to the set pressure. By these operations, the upper surface film member 58 and the lower surface film member 60 are bulged and deformed outward, and the workpiece H is adhered and covered along the outer surface thereof (see FIG. 7).
The workpieces H arranged above the intermediate heating plate 50a and below the intermediate heating plate 50b are also covered by the upper surface film member 58 and the lower surface film member 60 in the same manner.
【0032】図7に示す状態に保持したまま、上側およ
び下側遠赤外線ヒータ76a、76bを発熱させ、その
放射熱によって被加工物Hを設定温度に加熱し、設定時
間保持する。被加工物Hは気密室54の内圧に応じた圧
力でプレスされているので、該加熱時間内にホットプレ
ス加工されることになる。被加工物Hの上下両側から加
熱するので、被加工物Hは均等に加熱される。また、被
加工物Hに上面膜部材58および下面膜部材60が密着
し、被加工物Hの表面に沿って均等に加圧するので、被
加工物Hは均一にプレスされる。ただし、上面膜部材5
8および下面膜部材60は、少なくとも被加工物Hの上
下表面の略全域にわたって密着されればよく、必ずしも
被加工物Hの側面に密着しなくともよい。さらに、該加
熱時間を通じて密閉室Rが減圧状態に保持されるので、
被加工物Hからの揮発性成分の除去は良好に行われる。While maintaining the state shown in FIG. 7, the upper and lower far infrared heaters 76a and 76b are caused to generate heat, and the radiant heat heats the workpiece H to a set temperature and holds it for a set time. Since the workpiece H is pressed at a pressure corresponding to the internal pressure of the airtight chamber 54, it is hot-pressed within the heating time. Since the workpiece H is heated from both upper and lower sides, the workpiece H is heated uniformly. Further, since the upper surface film member 58 and the lower surface film member 60 are in close contact with the work piece H and uniformly press along the surface of the work piece H, the work piece H is uniformly pressed. However, the upper surface film member 5
8 and the lower surface film member 60 need only be in close contact with at least substantially the entire upper and lower surfaces of the workpiece H, and need not necessarily be in close contact with the side surface of the workpiece H. Furthermore, since the closed chamber R is maintained in a reduced pressure state throughout the heating time,
Removal of volatile components from the work piece H is performed well.
【0033】設定時間を経過した後、上側および下側遠
赤外線ヒータ76a、76bによる加熱を停止する。併
せて、電磁弁94を遮断位置に、電磁弁88および電磁
弁106を開放位置に切り換えて、気密室54内へ加圧
空気を給排する。この加圧空気はクーラ86を通過する
際に冷却されているので、気密室54への加圧空気の給
排によって被加工物Hは効率よく冷却される。After the set time has elapsed, heating by the upper and lower far infrared heaters 76a and 76b is stopped. At the same time, the solenoid valve 94 is switched to the shut-off position and the solenoid valves 88 and 106 are switched to the open position to supply and discharge the pressurized air into the airtight chamber 54. Since the pressurized air is cooled when passing through the cooler 86, the workpiece H is efficiently cooled by supplying / discharging the pressurized air to / from the airtight chamber 54.
【0034】被加工物Hを所定の温度まで冷却した後、
電磁弁102のポジション切換によってサイレンサ10
4と吸引孔16aとを連通し、密閉室R内を略大気圧ま
で昇圧する。続いて電磁弁88、106を遮断位置に、
電磁弁98を開放位置に切り換えて、真空ポンプ100
によって気密室54内を減圧し、被加工物Hを上面膜部
材58および下面膜部材60による被覆状態から解除し
て、図6に示す状態とする。After cooling the workpiece H to a predetermined temperature,
The silencer 10 is operated by switching the position of the solenoid valve 102.
4 and the suction hole 16a are communicated with each other, and the pressure in the sealed chamber R is increased to about atmospheric pressure. Next, the solenoid valves 88 and 106 are set to the shutoff position
Switching the solenoid valve 98 to the open position, the vacuum pump 100
The inside of the airtight chamber 54 is decompressed by, and the workpiece H is released from the covering state by the upper surface film member 58 and the lower surface film member 60, and the state shown in FIG. 6 is obtained.
【0035】その後、電磁弁34を開放位置に切り換え
ると共に、電磁弁40のポジション切換によって排出用
逆止弁38のパイロットポート38pをドレン管38b
に連通させることにより、シリンダ18から作動油を排
出して可動盤44を下降させる。これにより各熱板4
6、48、50の相互間隔は拡大され、図5に示す状態
となる。さらに電磁弁34、40、88、94、98、
102、106を図1の状態として、ホットプレスされ
た被加工物Hをホットプレス装置10から取り出す。Thereafter, the solenoid valve 34 is switched to the open position, and the pilot valve 38p of the discharge check valve 38 is connected to the drain pipe 38b by switching the position of the solenoid valve 40.
The hydraulic fluid is discharged from the cylinder 18 and the movable platen 44 is lowered. As a result, each hot plate 4
The mutual intervals of 6, 48 and 50 are enlarged to reach the state shown in FIG. Furthermore, the solenoid valves 34, 40, 88, 94, 98,
With the states 102 and 106 shown in FIG. 1, the hot-pressed workpiece H is taken out from the hot press device 10.
【0036】上述のように、本実施例のホットプレス装
置10では、上面膜部材58、下面膜部材60を備える
気密室54を所望の圧力に保持しておき、上側および下
側遠赤外線ヒータ76a、76bで被加工物を加熱す
る。このため、上側および下側遠赤外線ヒータ76a、
76bから放射される熱は、気密室54内の空気および
上面膜部材58または下面膜部材60を経て被加工物H
に至るが、この経路途中で吸収される熱量は従来の鋼製
の熱板と比較してきわめて少ない。したがって、上側お
よび下側遠赤外線ヒータ76a、76bから放射される
熱エネルギーはきわめて効率よく被加工物Hの加熱に費
やされることになり、被加工物Hは効率よく加熱され
る。しかも被加工物Hは、上下両面から均等に加熱され
る。As described above, in the hot press apparatus 10 of this embodiment, the airtight chamber 54 including the upper surface film member 58 and the lower surface film member 60 is kept at a desired pressure, and the upper and lower far infrared heaters 76a. , 76b to heat the workpiece. Therefore, the upper and lower far infrared heaters 76a,
The heat radiated from 76 b passes through the air in the airtight chamber 54 and the upper surface film member 58 or the lower surface film member 60, and the workpiece H.
However, the amount of heat absorbed in the middle of this route is extremely small compared to the conventional steel hot plate. Therefore, the thermal energy radiated from the upper and lower far-infrared heaters 76a and 76b is consumed very efficiently for heating the workpiece H, and the workpiece H is efficiently heated. Moreover, the workpiece H is uniformly heated from both upper and lower surfaces.
【0037】また、外周部材52にて密閉室Rを形成し
てこの内部のみを減圧するので、減圧容積はきわめて少
なくなる。このため、減圧に要する時間が短縮されてホ
ットプレス装置10の稼働効率は向上する。また、容器
自体を耐圧構造とする必要もなくなるので、ホットプレ
ス装置10は簡素化、小型化される。Further, since the closed chamber R is formed by the outer peripheral member 52 and only the inside thereof is depressurized, the depressurized volume becomes extremely small. Therefore, the time required for depressurization is shortened and the operation efficiency of the hot press device 10 is improved. Further, since the container itself does not need to have a pressure resistant structure, the hot pressing device 10 can be simplified and downsized.
【0038】しかも、加熱、冷却媒体として水や油等を
使用しないので、このような熱媒を循環させるための配
管やポンプ等は不要となる。なお、上側および下側遠赤
外線ヒータ76a、76bを、気密室54毎に温度調節
すれば、それぞれのプレスステージ毎に異なった温度で
被加工物Hをホットプレスすることも可能である。Moreover, since water, oil, etc. are not used as the heating / cooling medium, pipes, pumps, etc. for circulating such a heating medium are unnecessary. By adjusting the temperature of the upper and lower far-infrared heaters 76a and 76b for each airtight chamber 54, it is possible to hot press the workpiece H at different temperatures for each press stage.
【0039】以上本発明の実施例を説明したが、本発明
はこのような実施例に限定されるものではなく、その要
旨を逸脱しない範囲内で種々なる態様にて実現できる。
例えば、上記実施例では圧力流体および冷却媒体として
空気を用いているが、窒素、二酸化炭素、アルゴン等の
空気以外の気体を使用してもよい。膜部材の材質も、上
記シリコーンゴムに限らず、フッ素ゴム等の柔軟性と強
度を併せ持つ素材を使用できる。上記の実施例では、空
気給排路70aを空気供給用および減圧用に使用し、空
気給排路70bを空気排出用に使用しているが、両者は
相互に入れ換え可能である。Although the embodiments of the present invention have been described above, the present invention is not limited to such embodiments and can be implemented in various modes without departing from the scope of the invention.
For example, although air is used as the pressure fluid and the cooling medium in the above embodiments, gases other than air such as nitrogen, carbon dioxide, and argon may be used. The material of the membrane member is not limited to the above silicone rubber, but a material having both flexibility and strength such as fluororubber can be used. In the above embodiment, the air supply / exhaust passage 70a is used for air supply and decompression, and the air supply / exhaust passage 70b is used for air discharge, but both can be interchanged.
【0040】また、実施例の熱板を従来のホットプレス
装置に装着すれば、既設の装置の熱効率の向上、稼動効
率の向上が可能であり、既設装置の有効利用となる。さ
らに、上記実施例では特に設置していないが、ホットプ
レス装置の外周に遮蔽物を設置すると保温効果を向上で
きると共に、万一気密室が破裂するなどの事故が発生し
ても、外部に及ぼす損害を低減することができる。If the hot plate of the embodiment is attached to a conventional hot press machine, the thermal efficiency and operating efficiency of the existing equipment can be improved, and the existing equipment can be effectively used. Further, although not particularly installed in the above-mentioned embodiment, if a shield is installed on the outer periphery of the hot press device, the heat retention effect can be improved, and even if an accident such as rupture of the airtight chamber occurs, it will affect the outside. The damage can be reduced.
【0041】[0041]
【発明の効果】以上説明した様に、本発明のホットプレ
ス装置用の熱板およびこれを装着したホットプレス装置
では、上面膜部材、下面膜部材を備える気密室を所望の
圧力に保持しておき、遠赤外線ヒータで被加工物を加熱
する。このため、遠赤外線ヒータから放射される熱は、
気密室内の気体および上面膜部材または下面膜部材を経
て被加工物に至るが、この経路途中で吸収される熱量は
従来の鋼製の熱板と比較してきわめて少ない。したがっ
て、遠赤外線ヒータから放射される熱エネルギーはきわ
めて効率よく被加工物の加熱に費やされることになり、
被加工物は効率よく加熱される。As described above, in the hot plate for the hot press apparatus of the present invention and the hot press apparatus equipped with the hot plate, the airtight chamber including the upper surface film member and the lower surface film member is maintained at a desired pressure. Then, the far-infrared heater heats the workpiece. Therefore, the heat radiated from the far infrared heater is
Although it reaches the workpiece through the gas in the hermetic chamber and the upper surface film member or the lower surface film member, the amount of heat absorbed in the middle of this path is extremely smaller than that of the conventional steel hot plate. Therefore, the thermal energy radiated from the far infrared heater will be consumed very efficiently to heat the workpiece,
The work piece is efficiently heated.
【0042】また、外周部材にて密閉室を形成してこの
内部のみを減圧するので、減圧容積はきわめて少なくな
る。このため、減圧に要する時間が短縮されてホットプ
レス装置の稼働効率は向上する。また、容器自体を耐圧
構造とする必要もなくなるので、ホットプレス装置は簡
素化、小型化される。Further, since the closed chamber is formed by the outer peripheral member and only the inside thereof is depressurized, the depressurized volume becomes extremely small. Therefore, the time required for depressurization is shortened and the operation efficiency of the hot press machine is improved. Further, since the container itself does not need to have a pressure resistant structure, the hot pressing device can be simplified and downsized.
【0043】しかも、加熱、冷却媒体として水や油等を
使用しないので、このような熱媒を循環させるための配
管やポンプ等は不要となる。Moreover, since water, oil, etc. are not used as the heating and cooling medium, pipes, pumps, etc. for circulating such a heating medium are unnecessary.
【図1】 実施例のホットプレス装置の構成図である。FIG. 1 is a configuration diagram of a hot pressing apparatus according to an embodiment.
【図2】 実施例のホットプレス装置の熱板の一部断面
図である。FIG. 2 is a partial cross-sectional view of a hot plate of the hot pressing apparatus according to the embodiment.
【図3】 実施例のホットプレス装置の熱板の平面図で
あり、右半部は上面膜部材を撤去した状態を表す。FIG. 3 is a plan view of a hot plate of the hot pressing apparatus according to the embodiment, in which the right half shows a state in which the upper surface film member is removed.
【図4】 実施例のホットプレス装置において、可動盤
を上昇させた際の可動盤〜固定盤間の熱板の説明図であ
る。FIG. 4 is an explanatory diagram of a hot plate between the movable platen and the fixed platen when the movable platen is raised in the hot pressing apparatus of the embodiment.
【図5】 実施例のホットプレス装置において気密室を
減圧して上面膜部材および下面膜部材を凹陥させた状態
の熱板の説明図である。FIG. 5 is an explanatory diagram of a hot plate in a state where the airtight chamber is depressurized and the upper surface film member and the lower surface film member are recessed in the hot pressing apparatus of the embodiment.
【図6】 図5の状態から熱板を近接させた際の熱板の
説明図である。FIG. 6 is an explanatory diagram of a hot plate when the hot plates are brought close to each other from the state of FIG.
【図7】 図6の状態から気密室を加圧した際の熱板の
説明図である。FIG. 7 is an explanatory diagram of a hot plate when the airtight chamber is pressurized from the state of FIG.
10・・・ホットプレス装置、16・・・固定盤、16
a・・・吸引孔(減圧手段)、18・・・シリンダ(可
動盤駆動機構)、42・・・ラム(可動盤駆動機構)、
44・・・可動盤、46・・・可動盤側熱板(熱板)、
48・・・固定盤側熱板(熱板)、50、50a、50
b・・・中間熱板(熱板)、52・・・外周部材、54
・・・気密室、58・・・上面膜部材、60・・・下面
膜部材、70a、70b・・・空気給排路(気体供給
口、気体排出口) 76a・・・上側遠赤外線ヒータ、76b・・・下側遠
赤外線ヒータ、100・・・真空ポンプ(減圧手段)、
102・・・電磁弁(減圧手段)、C・・・枠体、H・
・・被加工物、R・・・密閉室。10 ... Hot press device, 16 ... Fixed platen, 16
a ... suction hole (pressure reducing means), 18 ... cylinder (movable plate drive mechanism), 42 ... ram (movable plate drive mechanism),
44: movable plate, 46: movable plate side heating plate (heating plate),
48 ... Fixed plate side hot plate (hot plate), 50, 50a, 50
b ... Intermediate hot plate (hot plate), 52 ... Peripheral member, 54
... Airtight chamber, 58 ... Top film member, 60 ... Bottom film member, 70a, 70b ... Air supply / discharge path (gas supply port, gas discharge port) 76a ... Upper far infrared heater, 76b ... Lower far infrared heater, 100 ... Vacuum pump (pressure reducing means),
102 ... Solenoid valve (pressure reducing means), C ... Frame, H ...
..Workpiece, R ... closed chamber
Claims (5)
熱板間に被加工物を挟持してプレス加工するホットプレ
ス装置用の熱板であって、 いずれも伸縮自在な上面膜部材および下面膜部材間に形
成される気密室と、 該気密室内に配された遠赤外線ヒータと、 上記気密室内に所望圧力の気体を供給する気体供給口
と、 上記気密室内から気体を排出する気体排出口とを設けた
ことを特徴とするホットプレス装置用の熱板。1. A hot plate for a hot press device for sandwiching and pressing a workpiece between a plurality of hot plates arranged between a fixed platen and a movable platen, both of which are expandable and contractible. An airtight chamber formed between the surface film member and the lower film member, a far-infrared heater arranged in the airtight chamber, a gas supply port for supplying a gas of a desired pressure into the airtight chamber, and a gas exhausted from the airtight chamber. A hot plate for a hot press device, which is provided with a gas discharge port.
り囲む枠状の外周部材であって、 複数の上記ホットプレス装置用の熱板を軸方向に沿って
近接させた際に相互に密に連接して一連の枠体を形成す
る外周部材を設けたことにより、 上記固定盤と可動盤とを近接させた際には、上記枠体と
上記固定盤および可動盤とで区画される密閉室を形成可
能とした請求項1記載のホットプレス装置用の熱板。2. A frame-shaped outer peripheral member that surrounds the airtight chamber along the outer periphery of the airtight chamber, wherein when a plurality of hot plates for the hot press device are brought close to each other along the axial direction, By providing the outer peripheral member that is closely connected to form a series of frames, when the fixed plate and the movable plate are brought close to each other, the frame and the fixed plate and the movable plate are divided. The hot plate for a hot press device according to claim 1, wherein a closed chamber can be formed.
上昇および下降可能な可動盤と、該可動盤を上下駆動す
る可動盤駆動機構と、前記固定盤と可動盤との間に配さ
れて前記可動盤の上昇および下降に応じて互いの相対距
離を近接および離隔させる複数の熱板とを備え、被加工
物をプレス加工するホットプレス装置において、 前記熱板として請求項1記載のホットプレス装置用の熱
板を装着したことを特徴とするホットプレス装置。3. A fixed plate, a movable plate that is arranged opposite to the fixed plate and can be moved up and down, a movable plate drive mechanism that drives the movable plate up and down, and between the fixed plate and the movable plate. And a plurality of hot plates that are arranged in the hot plate to move the movable plate closer and farther relative to each other according to ascent and descent of the movable plate, wherein the hot press device presses a workpiece. A hot press device, characterized in that a hot plate for the hot press device described above is mounted.
上昇および下降可能な可動盤と、該可動盤を上下駆動す
る可動盤駆動機構と、前記固定盤と可動盤との間に配さ
れて前記可動盤の上昇および下降に応じて互いの相対距
離を近接および離隔させる複数の熱板とを備え、被加工
物をプレス加工するホットプレス装置において、 前記熱板として請求項2記載のホットプレス装置用の熱
板を装着したことを特徴とするホットプレス装置。4. A fixed plate, a movable plate that is arranged opposite to the fixed plate and is capable of moving up and down, a movable plate drive mechanism that vertically drives the movable plate, and between the fixed plate and the movable plate. And a plurality of hot plates that are arranged in a plurality of positions so that their relative distances approach and separate from each other according to ascent and descent of the movable plate, wherein the hot press device presses a workpiece. A hot press device, characterized in that a hot plate for the hot press device described above is mounted.
に挿入された被加工物を含む領域を減圧する減圧手段を
設けたことを特徴とする請求項4記載のホットプレス装
置。5. The hot pressing apparatus according to claim 4, further comprising decompression means for decompressing a region including a workpiece inserted between the hot plates for the plurality of hot pressing apparatuses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23342993A JP3205443B2 (en) | 1993-09-20 | 1993-09-20 | Hot plate and hot press equipment for hot press equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23342993A JP3205443B2 (en) | 1993-09-20 | 1993-09-20 | Hot plate and hot press equipment for hot press equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0780871A true JPH0780871A (en) | 1995-03-28 |
| JP3205443B2 JP3205443B2 (en) | 2001-09-04 |
Family
ID=16954908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23342993A Expired - Fee Related JP3205443B2 (en) | 1993-09-20 | 1993-09-20 | Hot plate and hot press equipment for hot press equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3205443B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008296280A (en) * | 2007-05-30 | 2008-12-11 | Robert Buerkle Gmbh | Multi-level laminating press |
| EP2189276A1 (en) * | 2008-11-25 | 2010-05-26 | Hueck Rheinische GmbH | Plate press and pressed sheet-pressed cushion unit |
| WO2016013714A1 (en) * | 2014-07-25 | 2016-01-28 | 제일 이엔에스 주식회사 | Hot plate structure of press molding device and continuous molding method using same |
| WO2018016824A1 (en) * | 2016-07-18 | 2018-01-25 | 엘지전자 주식회사 | Material molding device |
| CN107718646A (en) * | 2017-11-23 | 2018-02-23 | 济南中正金码科技有限公司 | The drum type friction die circulation multigroup multi-daylight press of formula straight line |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102086560B1 (en) * | 2018-08-16 | 2020-03-09 | 김만경 | Mold apparatus of a plurality of horizontal plates type for hot press forming |
| KR102086561B1 (en) * | 2018-08-16 | 2020-03-09 | 김만경 | Mold apparatus of a plurality of horizontal plates type for hot press forming |
| KR102086559B1 (en) * | 2018-08-16 | 2020-03-09 | 신광정공(주) | Mold apparatus of a plurality of vertical plates type for hot press forming |
-
1993
- 1993-09-20 JP JP23342993A patent/JP3205443B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008296280A (en) * | 2007-05-30 | 2008-12-11 | Robert Buerkle Gmbh | Multi-level laminating press |
| EP2189276A1 (en) * | 2008-11-25 | 2010-05-26 | Hueck Rheinische GmbH | Plate press and pressed sheet-pressed cushion unit |
| CN101733949A (en) * | 2008-11-25 | 2010-06-16 | 胡克莱茵有限责任公司 | Plate press and pressed sheet-pressed cushion unit |
| US8261803B2 (en) | 2008-11-25 | 2012-09-11 | Hueck Rheinische Gmbh | Plate press |
| WO2016013714A1 (en) * | 2014-07-25 | 2016-01-28 | 제일 이엔에스 주식회사 | Hot plate structure of press molding device and continuous molding method using same |
| WO2018016824A1 (en) * | 2016-07-18 | 2018-01-25 | 엘지전자 주식회사 | Material molding device |
| KR20180009070A (en) * | 2016-07-18 | 2018-01-26 | 엘지전자 주식회사 | Apparatus for fabricating materials |
| CN107718646A (en) * | 2017-11-23 | 2018-02-23 | 济南中正金码科技有限公司 | The drum type friction die circulation multigroup multi-daylight press of formula straight line |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3205443B2 (en) | 2001-09-04 |
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