JPH0786780A - Cooling structure for heating element mounting board - Google Patents
Cooling structure for heating element mounting boardInfo
- Publication number
- JPH0786780A JPH0786780A JP23142293A JP23142293A JPH0786780A JP H0786780 A JPH0786780 A JP H0786780A JP 23142293 A JP23142293 A JP 23142293A JP 23142293 A JP23142293 A JP 23142293A JP H0786780 A JPH0786780 A JP H0786780A
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- fin
- cooling
- air flow
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は発熱素子を搭載した発熱
素子搭載基板を空冷方式によって冷却する発熱素子搭載
基板の冷却構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating element mounting substrate cooling structure for cooling a heating element mounting substrate on which a heating element is mounted by an air cooling method.
【０００２】[0002]
【従来の技術】図４は従来の発熱素子搭載基板の冷却構
造を示す模式的側断面図、図５は一般素子のみを搭載し
た標準基板の冷却構造を示す模式的側断面図である。2. Description of the Related Art FIG. 4 is a schematic side sectional view showing a conventional cooling structure for a heating element mounting substrate, and FIG. 5 is a schematic side sectional view showing a cooling structure for a standard substrate mounting only general elements.
【０００３】図４は従来から広く用いられている空冷方
式による発熱素子搭載基板の冷却構造を示す図である。
この冷却構造は、吸気ファン91と排気ファン92によって
発生させた空気流20を発熱素子１と一般素子２に接触さ
せてこれらから熱を奪うというものである。なお、特に
発熱量の多い発熱素子１には放熱フィン88を装着して冷
却効率を高めている（空気流20のみで冷却可能な一般素
子２には放熱フィン88を装着していない）。図中、85Ａ
は発熱素子搭載基板81を全体的に覆って空気流20の流通
路を形成するカバー（このカバー85Ａは、図示しないネ
ジ等を用いて発熱素子搭載基板81に取り付けられる）、
96は吸気ダクト、97は排気ダクト、をそれぞれ示す。FIG. 4 is a view showing a cooling structure for a heating element mounting substrate by an air cooling system which has been widely used in the past.
In this cooling structure, the airflow 20 generated by the intake fan 91 and the exhaust fan 92 is brought into contact with the heating element 1 and the general element 2 to remove heat from them. It should be noted that the heat-dissipating fins 1 that generate a particularly large amount of heat are mounted with the heat-dissipating fins 88 to enhance the cooling efficiency (the heat-dissipating fins 88 are not mounted on the general element 2 that can be cooled only by the air flow 20). 85A in the figure
Is a cover that entirely covers the heating element mounting substrate 81 and forms a passage for the airflow 20 (this cover 85A is attached to the heating element mounting substrate 81 by using screws or the like not shown),
Reference numeral 96 indicates an intake duct, and 97 indicates an exhaust duct.
【０００４】なお、この従来の冷却構造において、特に
吸気ファン91と排気ファン92を大型化しているのは空気
流20の風量（流量）に余裕を持たせるためで、これは従
来形式の放熱フィン88の冷却能力をカバーするためには
不可欠である。In this conventional cooling structure, the size of the intake fan 91 and the exhaust fan 92 is increased in order to allow a sufficient amount of airflow (flow rate) for the airflow 20. It is essential to cover 88's cooling capacity.
【０００５】図５は一般素子２のみを搭載した標準基板
80Ａの冷却構造を示す図であって、この場合は基板（標
準基板80Ａ）に搭載されている素子の全てが空気流20の
みで冷却が可能な一般素子２であることから発熱量が小
さい。このため、一般素子２のみを搭載した標準基板80
Ａの場合は空気流20の流量を特に増加させる必要がない
ことから、このような時は、図５に示すように、普通サ
イズ（標準基板80Ａと同じサイズ）の吸気ファン91と排
気ファン92が用いられる。FIG. 5 is a standard substrate on which only the general element 2 is mounted.
It is a diagram showing a cooling structure of 80A. In this case, since all of the elements mounted on the substrate (standard substrate 80A) are general elements 2 which can be cooled only by the air flow 20, the heat generation amount is small. Therefore, the standard board 80 with only the general element 2 mounted
In the case of A, it is not necessary to particularly increase the flow rate of the air flow 20, so in such a case, as shown in FIG. 5, a normal size (the same size as the standard board 80A) intake fan 91 and exhaust fan 92 Is used.
【０００６】[0006]
【発明が解決しようとする課題】以上述べた２種類の冷
却構造中、図４に示す従来構造のものは、吸気ファン91
と排気ファン92の容量とサイズが大きいことから、吸気
音Ｓ1 と排気音Ｓ2 による騒音が極めて大きい。また、
これら吸気ファン91と排気ファン92が大型化するという
ことは装置の大型化につながる。Of the two types of cooling structures described above, the conventional structure shown in FIG.
Since the exhaust fan 92 has a large capacity and size, the noise due to the intake sound S 1 and the exhaust sound S 2 is extremely large. Also,
The increase in size of the intake fan 91 and the exhaust fan 92 leads to increase in size of the device.
【０００７】本発明は、ヒートパイプと放熱フィンの相
乗効果を利用した特殊放熱フィンを使用することによっ
て冷却効率を格段に向上させた発熱素子搭載基板の冷却
構造を実現しようとするものである。The present invention is intended to realize a cooling structure for a heating element mounting substrate in which the cooling efficiency is remarkably improved by using a special radiating fin utilizing the synergistic effect of the heat pipe and the radiating fin.
【０００８】[0008]
【課題を解決するための手段】本発明による発熱素子搭
載基板の冷却構造は、図１に示すように、発熱素子１に
装着される特殊放熱フィン８のフィン９を保持するフィ
ン保持部11をヒートパイプ化するとともに、前記発熱素
子１及び一般素子２が配置される素子配置ゾーンαと前
記フィン９が配置されるフィン配置ゾーンβを仕切板30
で仕切ることによって前記フィン９を特定的に冷却する
空気流20Ａの中に一般素子２を冷却した空気流20Ｂが混
入しない構造になっている。As shown in FIG. 1, a cooling structure for a heating element mounting substrate according to the present invention includes a fin holding portion 11 for holding a fin 9 of a special heat radiation fin 8 mounted on the heating element 1. A partition plate 30 is formed into a heat pipe, and an element arrangement zone α where the heat generating element 1 and the general element 2 are arranged and a fin arrangement zone β where the fin 9 is arranged.
The structure is such that the air flow 20A for cooling the general element 2 is not mixed with the air flow 20A for specifically cooling the fin 9 by partitioning with.
【０００９】[0009]
【作用】この発熱素子搭載基板の冷却構造（以下基板冷
却構造と称する）は、ヒートパイプと放熱フィンの相乗
効果によって冷却効率の向上を図ると共に、フィン９を
特定的に冷却する空気流20Ａの中に一般素子２を冷却し
た空気流20Ｂが混入しない構造になっていることから、
極めて冷却効率が良い。This cooling structure for the substrate on which the heating element is mounted (hereinafter referred to as "substrate cooling structure") improves the cooling efficiency by the synergistic effect of the heat pipe and the heat radiating fins, and at the same time, the air flow 20A for cooling the fins 9 specifically Since the structure is such that the airflow 20B that has cooled the general element 2 does not enter,
Extremely good cooling efficiency.
【００１０】[0010]
【実施例】以下実施例図に基づいて本発明を詳細に説明
する。図１は本発明の一実施例を示す模式的側断面図、
図２(a) と(b) は本発明に用いる特殊放熱フィンの一構
造例を示す模式的斜視図とその実装例を示す要部側断面
図、図３は本発明による発熱素子搭載基板と標準基板の
一実装例を示す斜視図であるが、前記図４，図５と同一
部分にはそれぞれ同一符号を付している。The present invention will be described in detail below with reference to the drawings of the embodiments. FIG. 1 is a schematic side sectional view showing an embodiment of the present invention,
2 (a) and 2 (b) are a schematic perspective view showing one structural example of a special heat dissipation fin used in the present invention and a side sectional view of a main part showing its mounting example, and FIG. 3 shows a heating element mounting substrate according to the present invention. FIG. 6 is a perspective view showing one mounting example of a standard board, and the same parts as those in FIGS. 4 and 5 are denoted by the same reference numerals.
【００１１】本発明による基板冷却構造は、図１に示す
ように、発熱素子１に装着される特殊放熱フィン８のフ
ィン９を保持するフィン保持部11と台座部12をヒートパ
イプ化する（細部構造は図２を用いて説明する）と共
に、前記発熱素子１及び一般素子２が配置されている素
子配置ゾーンαと前記特殊放熱フィン８のフィン９が配
置されているフィン配置ゾーンβを仕切板30で仕切るこ
とによって空気流20を二つに分離し、これによって前記
フィン９を特定的に冷却する空気流20Ａの中に一般素子
２を冷却した空気流20Ｂが混入しないようにしている。In the substrate cooling structure according to the present invention, as shown in FIG. 1, the fin holding portion 11 for holding the fin 9 of the special heat radiation fin 8 mounted on the heating element 1 and the pedestal portion 12 are heat pipes (details). The structure will be described with reference to FIG. 2), and a partition plate for partitioning an element placement zone α where the heating element 1 and the general element 2 are placed and a fin placement zone β where the fin 9 of the special heat radiation fin 8 is placed. The air stream 20 is divided into two by partitioning by 30 so that the air stream 20B for cooling the general element 2 is not mixed with the air stream 20A for specifically cooling the fin 9.
【００１２】このように、本発明による基板冷却構造
は、前記フィン９を保持するフィン保持部11と、このフ
ィン保持部11を保持して発熱素子１に密接する台座部12
をヒートパイプ化した特殊放熱フィン８（この特殊放熱
フィン８の構造は図２を用いて詳しく説明する）を配置
すると共に、素子配置ゾーンαとフィン配置ゾーンβを
仕切板30で仕切ることによってフィン９を特定的に冷却
する空気流20Ａの中に一般素子２を冷却することによっ
て温度上昇した空気流20Ｂが混入しない構造になってい
るので発熱素子１の冷却効率が極めて高い。前記仕切板
30は図示しないスペーサ（間隔制御部材）を介して発熱
素子搭載基板80に取り付けられる。なお、前記空気流20
Ａと20Ｂの流量は前記スペーサによって制御されること
になる。As described above, in the substrate cooling structure according to the present invention, the fin holding portion 11 for holding the fin 9 and the pedestal portion 12 for holding the fin holding portion 11 and closely contacting the heating element 1.
By disposing the special heat dissipating fins 8 which are heat pipes (the structure of the special heat dissipating fins 8 will be described in detail with reference to FIG. 2), the element disposition zone α and the fin disposition zone β are partitioned by the partition plate 30. The cooling efficiency of the heat generating element 1 is extremely high because the air flow 20A that specifically cools 9 has a structure in which the air flow 20B whose temperature has risen by cooling the general element 2 is not mixed. The partition plate
30 is attached to the heating element mounting substrate 80 via a spacer (space control member) not shown. The air flow 20
The flow rates of A and 20B will be controlled by the spacer.
【００１３】本発明によるこの基板冷却構造は、発熱素
子１の冷却効率が特に高いので風量（空気流20の流量）
が少なくても充分な冷却効果が得られる。このため、吸
気ファン91と排気ファン92を小型化できるので吸気音Ｓ
1 と排気音Ｓ2 による騒音も必然的に小さくなる。In this substrate cooling structure according to the present invention, since the cooling efficiency of the heating element 1 is particularly high, the air volume (flow rate of the air flow 20) is increased.
Even if the amount is small, a sufficient cooling effect can be obtained. Therefore, the intake fan 91 and the exhaust fan 92 can be downsized, so that the intake sound S
The noise caused by 1 and the exhaust noise S 2 is inevitably reduced.
【００１４】以下図２(a) と(b) に基づいて本発明に用
いる特殊放熱フィンの構造を説明する。図２(a) と(b)
に示すように、本発明に用いる特殊放熱フィン８は、複
数枚のフィン９を保持するフィン保持部11と台座部12の
内部を中空にして排気し、そこに揮発性の液体（作動液
10）を封入することによってこれをヒートパイプ化した
構造になっている。熱パイプとも呼ばれるヒートパイプ
は、蒸発，凝縮による潜熱の吸収，放出を利用した熱輸
送を目的とするもので、低損失の熱伝達ができることか
ら、この特殊放熱フィン８を使用することによって発熱
素子１を効率的に冷却することができる。なお、この特
殊放熱フィン８は、フィン保持部11と台座部12をヒート
パイプ化した構造であることから、従来の放熱フィン88
と同じ大きさである。The structure of the special heat radiation fin used in the present invention will be described below with reference to FIGS. 2 (a) and 2 (b). Figures 2 (a) and (b)
As shown in FIG. 4, the special heat dissipation fin 8 used in the present invention is evacuated by hollowing out the inside of the fin holding part 11 holding a plurality of fins 9 and the pedestal part 12 and volatile liquid (operating liquid)
By encapsulating 10), it has a heat pipe structure. The heat pipe, which is also called a heat pipe, is for the purpose of heat transfer utilizing absorption and release of latent heat due to evaporation and condensation, and can transfer heat with low loss. 1 can be cooled efficiently. Since the special heat radiation fin 8 has a structure in which the fin holding portion 11 and the pedestal portion 12 are heat pipes, the conventional heat radiation fin 88
Is the same size as.
【００１５】図３は本発明による発熱素子搭載基板と標
準基板の一実装例を示す模式的斜視図である。図３に示
すように、本発明による発熱素子搭載基板80と標準基板
80Ａは、図示しない装置側に設けられているマザーボー
ド60に対してそれぞれ矢印Ａ−Ａ’方向に挿抜可能に実
装される。図３に開示されている実装例は、複数の標準
基板80Ａと一つの発熱素子搭載基板80を並列的にマザー
ボード60に実装した場合を示している。なお、これら発
熱素子搭載基板80と標準基板80Ａはそれぞれ図示しない
コネクタを介してマザーボード60に実装される。FIG. 3 is a schematic perspective view showing one mounting example of the heating element mounting substrate and the standard substrate according to the present invention. As shown in FIG. 3, a heating element mounting substrate 80 and a standard substrate according to the present invention are provided.
80A is mounted so that it can be inserted into and removed from a mother board 60 provided on the device side (not shown) in the direction of arrow AA '. The mounting example disclosed in FIG. 3 shows a case where a plurality of standard boards 80A and one heating element mounting board 80 are mounted in parallel on the mother board 60. The heating element mounting substrate 80 and the standard substrate 80A are mounted on the mother board 60 via connectors (not shown).
【００１６】図３から明らかなように、発熱素子搭載基
板80に供給された空気流20は仕切板30によって空気流20
Ａと20Ｂに分かれて矢印方向に上昇し、標準基板80Ａに
供給された空気流20は各標準基板80Ａ内を経通してその
まま矢印方向に上昇する。なお、図３では発熱素子搭載
基板80をマザーボード60の最端部分に配置した形になっ
ているが、その配置位置については特定しない。但しこ
の発熱素子搭載基板80は仕切板30を装備している関係か
ら、標準基板80Ａの実装スペースのほぼ２倍の実装スペ
ースが必要である。As is apparent from FIG. 3, the air flow 20 supplied to the heating element mounting substrate 80 is supplied by the partition plate 30.
The air flow 20 is divided into A and 20B and rises in the arrow direction, and the airflow 20 supplied to the standard substrate 80A passes through each standard substrate 80A and rises in the arrow direction as it is. Although the heating element mounting substrate 80 is arranged at the endmost portion of the mother board 60 in FIG. 3, its arrangement position is not specified. However, since the heating element mounting substrate 80 is equipped with the partition plate 30, a mounting space that is almost twice the mounting space of the standard substrate 80A is required.
【００１７】本発明による基板冷却構造は、ヒートパイ
プと放熱フィンの相乗効果によって冷却効率を高めた特
殊放熱フィン８を使用すると共に、一般素子２を冷却す
ることで温度上昇した空気流20Ｂが発熱素子１を冷却す
る空気流20Ａの中に混入しない構造とすることによって
発熱素子搭載基板80の冷却効率を高めたことをその特徴
とするものである。The substrate cooling structure according to the present invention uses the special heat radiation fin 8 whose cooling efficiency is increased by the synergistic effect of the heat pipe and the heat radiation fin, and the airflow 20B whose temperature is raised by cooling the general element 2 generates heat. The feature is that the cooling efficiency of the heating element mounting substrate 80 is improved by adopting a structure that does not mix into the airflow 20A for cooling the element 1.
【００１８】[0018]
【発明の効果】以上の説明から明らかなように、本発明
による発熱素子搭載基板の冷却構造は、ヒートパイプと
放熱フィンの相乗効果によって冷却効率を高めた特殊放
熱フィンを使用すると共に、一般素子を冷却することで
温度上昇した空気流が発熱素子を冷却する空気流の中に
混入しない構造になっていることから、発熱素子搭載基
板の冷却効率が極めて高い。As is apparent from the above description, the cooling structure for a heating element mounting substrate according to the present invention uses a special heat dissipation fin whose cooling efficiency is enhanced by the synergistic effect of the heat pipe and the heat dissipation fin, and a general element. Since the structure is such that the airflow whose temperature has risen by cooling the heating element does not mix into the airflow for cooling the heating element, the cooling efficiency of the heating element mounting substrate is extremely high.
【図１】 本発明の一実施例を示す模式的側断面図、FIG. 1 is a schematic side sectional view showing an embodiment of the present invention,
【図２】 本発明に用いる特殊放熱フィンの一構造例を
示す模式的斜視図とその実装例を示す要部側断面図、FIG. 2 is a schematic perspective view showing one structural example of a special heat dissipation fin used in the present invention and a side sectional view of a main part showing its mounting example;
【図３】 本発明による発熱素子搭載基板と標準基板の
一実装例を示す斜視図、FIG. 3 is a perspective view showing one mounting example of a heating element mounting substrate and a standard substrate according to the present invention,
【図４】 従来の発熱素子搭載基板の冷却構造を示す模
式的側断面図、FIG. 4 is a schematic side sectional view showing a conventional cooling structure for a heating element mounting substrate,
【図５】 一般素子のみを搭載した標準基板の冷却構造
を示す模式的側断面図、FIG. 5 is a schematic side sectional view showing a cooling structure of a standard substrate on which only general elements are mounted,
１ 発熱素子 ２ 一般素子 ８ 特殊放熱フィン ９ フィン 10 作動液 11 フィン保持部 12 台座部 20，20Ａ，20Ｂ 空気流 30 仕切板 60 マザーボード 80，81 発熱素子搭載基板 80Ａ 標準基板 85，85Ａ カバー 91 吸気ファン 92 排気ファン 96 吸気ダクト 97 排気ダクト Ｓ1 吸気音 Ｓ2 排気音 α 素子配置ゾーン β フィン配置ゾーン1 Heat generating element 2 General element 8 Special radiating fin 9 Fin 10 Hydraulic fluid 11 Fin holding part 12 Base part 20, 20A, 20B Airflow 30 Partition plate 60 Mother board 80, 81 Heat generating element mounting board 80A Standard board 85, 85A Cover 91 Intake Fan 92 Exhaust fan 96 Intake duct 97 Exhaust duct S 1 Intake sound S 2 Exhaust sound α Element placement zone β Fin placement zone
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 23/467 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI technical display location H01L 23/467
Claims (1)
板(80)を空冷方式によって冷却する発熱素子搭載基板の
冷却構造であって、 前記発熱素子(1) に装着される放熱フィン(8) のフィン
(9) を保持するフィン保持部(11)をヒートパイプ化する
とともに、前記発熱素子(1) 及び一般素子(2)が配置さ
れる素子配置ゾーン（α）と前記フィン(9) が配置され
るフィン配置ゾーン（β）を仕切板(30)で仕切ることに
よって前記フィン(9) を特定的に冷却する空気流(20A)
の中に一般素子(2) を冷却した空気流(20B) が混入しな
い構造にしたことを特徴とする発熱素子搭載基板の冷却
構造。1. A cooling structure of a heating element mounting substrate for cooling a heating element mounting substrate (80) mounting the heating element (1) by an air cooling method, comprising: a radiation fin (1) mounted on the heating element (1). 8) The fin
The fin holding part (11) holding (9) is made into a heat pipe, and the fin (9) is arranged with the element arrangement zone (α) in which the heating element (1) and the general element (2) are arranged. An air flow (20A) for specifically cooling the fins (9) by partitioning the fin arrangement zone (β) with a partition plate (30)
The cooling structure for the heating element mounting substrate is characterized in that the air flow (20B) that has cooled the general element (2) is not mixed in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23142293A JP3261820B2 (en) | 1993-09-17 | 1993-09-17 | Heating element mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23142293A JP3261820B2 (en) | 1993-09-17 | 1993-09-17 | Heating element mounting board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0786780A true JPH0786780A (en) | 1995-03-31 |
| JP3261820B2 JP3261820B2 (en) | 2002-03-04 |
Family
ID=16923339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23142293A Expired - Fee Related JP3261820B2 (en) | 1993-09-17 | 1993-09-17 | Heating element mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3261820B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210767A (en) * | 1999-11-16 | 2001-08-03 | Matsushita Electric Ind Co Ltd | Heat sink device |
| JP2007116055A (en) * | 2005-10-24 | 2007-05-10 | Fujitsu Ltd | Electronics and cooling modules |
| JP2009200144A (en) * | 2008-02-20 | 2009-09-03 | Mitsubishi Electric Corp | Cooling apparatus |
| CN109892314A (en) * | 2017-12-07 | 2019-06-18 | 马库斯·克雷斯 | Equipment for thermal weeding |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3106797U (en) | 2004-07-27 | 2005-01-20 | 千恵 深谷 | Underwear-like sweat absorption pad |
-
1993
- 1993-09-17 JP JP23142293A patent/JP3261820B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001210767A (en) * | 1999-11-16 | 2001-08-03 | Matsushita Electric Ind Co Ltd | Heat sink device |
| JP2007116055A (en) * | 2005-10-24 | 2007-05-10 | Fujitsu Ltd | Electronics and cooling modules |
| JP2009200144A (en) * | 2008-02-20 | 2009-09-03 | Mitsubishi Electric Corp | Cooling apparatus |
| CN109892314A (en) * | 2017-12-07 | 2019-06-18 | 马库斯·克雷斯 | Equipment for thermal weeding |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3261820B2 (en) | 2002-03-04 |
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| A01 | Written decision to grant a patent or to grant a registration (utility model) |
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| LAPS | Cancellation because of no payment of annual fees |