JPH0794657A - Lead frame and resin-sealed semiconductor device using the lead frame - Google Patents
Lead frame and resin-sealed semiconductor device using the lead frameInfo
- Publication number
- JPH0794657A JPH0794657A JP5238143A JP23814393A JPH0794657A JP H0794657 A JPH0794657 A JP H0794657A JP 5238143 A JP5238143 A JP 5238143A JP 23814393 A JP23814393 A JP 23814393A JP H0794657 A JPH0794657 A JP H0794657A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- lead frame
- resin
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はリ−ドフレ−ム及びその
リ−ドフレ−ムを用いた樹脂封止型半導体装置に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame and a resin-sealed semiconductor device using the lead frame.
【０００２】[0002]
【従来の技術】電子機器の小型・薄型化に伴い要求され
る半導体装置は、高密度化、小型・薄型化等が必要とな
っている。現在、最も一般的に用いられている半導体装
置は樹脂封止型半導体装置であり、以下、図３乃至図４
を参照して説明する。2. Description of the Related Art As semiconductor devices are required to be smaller and thinner in electronic equipment, higher density, smaller size and thinner thickness are required. Currently, the most commonly used semiconductor device is a resin-encapsulated semiconductor device.
Will be described with reference to.
【０００３】樹脂封止型半導体装置はリ−ドフレ−ムの
アイランド３１にマウントされた半導体チップ３２と、
リ−ドフレ−ムのリ−ド３３と、半導体チップ３２の表
面に設けられたパッド電極（図示せず）とリ−ド３３と
を接続するボンディングワイヤ３４と、それらを封止す
る樹脂３５とからなる。また、図４によれば、リ−ドフ
レ−ムは吊りリ−ド３６に支持されたアイランド３１
と、アイランド３１に対し放射状に配置された複数のリ
−ド３３とから構成されている。The resin-sealed semiconductor device includes a semiconductor chip 32 mounted on an island 31 of a lead frame,
A lead 33 of a lead frame, a bonding wire 34 for connecting a pad electrode (not shown) provided on the surface of the semiconductor chip 32 to the lead 33, and a resin 35 for sealing them. Consists of. According to FIG. 4, the lead frame is an island 31 supported by a suspension lead 36.
And a plurality of leads 33 arranged radially with respect to the island 31.
【０００４】このような樹脂封止型半導体装置のパッケ
−ジ厚は薄いものでも１．０ｍｍ程度であり、より薄型
化を図るにはワイヤボンディング高さやモ−ルド成形等
の高度な技術が要求されるため困難である。The package thickness of such a resin-encapsulated semiconductor device is about 1.0 mm even if it is thin, and advanced techniques such as wire bonding height and mold molding are required in order to make the package thinner. It is difficult to do.
【０００５】また、樹脂封止型半導体装置には、プリン
ト基板やＭＣＭ等の実装側の要求により、固有の設計が
求められることがある。例えば、リ−ドピッチ等を変更
するにしても、リ−ドフレ−ムの設計を変更することか
ら始まり、種々の設計変更が必要である。その結果、製
造期間の短縮を図ることを妨げており、製造コストの増
大に繋がっている。In addition, the resin-encapsulated semiconductor device may be required to have a unique design depending on the requirements of the mounting side such as a printed circuit board or MCM. For example, even if the lead pitch or the like is changed, various design changes are necessary starting with changing the design of the lead frame. As a result, it is difficult to shorten the manufacturing period, which leads to an increase in manufacturing cost.
【０００６】[0006]
【発明が解決しようとする課題】上述のように、樹脂封
止型半導体装置にはより薄型化が求めれているが、技術
的に困難であり、また、多品種少量生産用の樹脂封止型
半導体装置を短期間かつ低コストに提供することも難し
い問題であった。それ故に、本発明は多品種少量生産に
適したリ−ドフレ−ムとそのリ−ドフレ−ムを用いかつ
薄型の樹脂封止型半導体装置を提供することが目的であ
る。As described above, the resin-encapsulated semiconductor device is required to be thinner, but it is technically difficult and the resin-encapsulated semiconductor device for high-mix low-volume production is required. It was also a difficult problem to provide a semiconductor device in a short period of time and at low cost. Therefore, an object of the present invention is to provide a lead frame suitable for high-mix low-volume production and a thin resin-sealed semiconductor device using the lead frame.
【０００７】[0007]
【課題を解決するための手段】本発明によるリ−ドフレ
−ムは、半導体チップを載置するアイランドと複数のリ
−ドとからなり、上記各リ−ドは、長手方向に放射状に
延びた放射状部分と長手方向に平行に延びた平行部分と
を有し、上記放射状部分と上記平行部分とは連続かつ交
互に配置され、同時に上記複数のリ−ドは長さに比例し
てピッチが異なる。A lead frame according to the present invention comprises an island on which a semiconductor chip is mounted and a plurality of leads, each of the leads extending radially in a longitudinal direction. It has a radial portion and a parallel portion extending parallel to the longitudinal direction, the radial portions and the parallel portions are arranged continuously and alternately, and at the same time, the plurality of leads have different pitches in proportion to the length. .
【０００８】上記リ−ドフレ−ムを用いた樹脂封止型半
導体装置は、上記リ−ドフレ−ムのアイランドに載置さ
れた半導体チップと、上記半導体チップ表面に設けられ
た表面電極と上記リ−ドフレ−ムのリ−ドとを電気的に
接続するボンディングワイヤと、上記アイランド及び上
記複数のリ−ドの裏面を露出させかつ上記複数のリ−ド
を所望のピッチを示す長さまで封止する封止樹脂とから
なり、上記複数のリ−ドは上記所望のピッチの長さに切
断されている。A resin-encapsulated semiconductor device using the lead frame has a semiconductor chip mounted on an island of the lead frame, a surface electrode provided on the surface of the semiconductor chip, and the lead. -Bonding wires for electrically connecting the leads of the d-frame, exposing the back surfaces of the island and the plurality of leads, and sealing the plurality of leads to a length indicating a desired pitch. And a plurality of leads are cut into the desired pitch length.
【０００９】[0009]
【作用】上記リ−ドフレ−ムは上記リ−ドの長さに比例
してピッチが異なるため、実装側のピッチに容易に対応
することが可能である。また、上記樹脂封止型半導体装
置は上部のみを封止しており、裏面から上記リ−ドが露
出されている。上記リ−ドは上記封止樹脂に沿って上記
リ−ドフレ−ムから切断されており、上記リ−ドは上記
裏面の露出部分から外部電極に接続される。上記樹脂封
止型半導体装置は上部のみを封止するため、容易に薄型
化が図れる。Since the lead frame has a different pitch in proportion to the length of the lead, it is possible to easily cope with the pitch on the mounting side. Further, the resin-encapsulated semiconductor device only seals the upper part, and the leads are exposed from the back surface. The lead is cut from the lead frame along the sealing resin, and the lead is connected to an external electrode from the exposed portion of the back surface. Since only the upper part of the resin-sealed semiconductor device is sealed, it is possible to easily reduce the thickness.
【００１０】[0010]
【実施例】以下、本発明の一実施例を図面を用いて説明
する。図１よれば、リ−ドフレ−ムは、吊りリ−ド１２
に支持されたアイランド１１と、複数のリ−ド１３とか
らなる。各リ−ド１３は、長手方向に放射状に延びた放
射状部分α１〜３と長手方向に平行に延びた平行部分β
１〜３とからなり、放射状部分αと平行部分βとは交互
にかつ連続している。リ−ド１３の長さに比例してリ−
ドピッチは異なっており、例えば線分ＡＡ´、ＢＢ´、
ＣＣ´におけるリ−ドピッチは序々に大きくなってい
る。そのため、プリント配線板やＭＣＭ等の実装側の仕
様に合わせて各リ−ドピッチを選択することが可能であ
る。つまり、所望のリ−ドピッチに応じて、例えば線分
ＡＡ´、ＢＢ´、ＣＣ´にて各リ−ド１３を切断するこ
とがでる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. According to FIG. 1, the lead frame is a suspension lead 12
The island 11 supported by the plurality of leads 13 and a plurality of leads 13. Each lead 13 has a radial portion α1 to 3 extending radially in the longitudinal direction and a parallel portion β extending in parallel to the longitudinal direction.
1 to 3, and the radial portions α and the parallel portions β are alternately and continuously formed. Reed in proportion to the length of the lead 13
The pitches are different, such as line segments AA ', BB',
The lead pitch in CC 'is gradually increasing. Therefore, each lead pitch can be selected according to the specifications of the printed wiring board, MCM, or other mounting side. That is, each lead 13 can be cut along the line segments AA ', BB', and CC 'in accordance with the desired lead pitch.
【００１１】また、このようなリ−ドフレ−ムを用いた
樹脂封止型半導体装置を図２より説明する。樹脂封止型
半導体装置は、アイランド１１上にマウントされた半導
体チップ２１と、複数のリ−ド１３と、半導体チップ２
１の表面に設けられたパッド電極（図示せず）とリ−ド
１３とを接続するボンディングワイヤ２２と、アイラン
ド１１及びリ−ド１３とを露出させかつ半導体チップ２
１を含む上部のみを封止する封止樹脂２３とからなる。A resin-sealed type semiconductor device using such a lead frame will be described with reference to FIG. The resin-sealed semiconductor device includes a semiconductor chip 21 mounted on an island 11, a plurality of leads 13, and a semiconductor chip 2.
1. The bonding wire 22 for connecting the pad electrode (not shown) provided on the surface of 1 to the lead 13 and the island 11 and the lead 13 are exposed and the semiconductor chip 2
1 and a sealing resin 23 that seals only the upper part.
【００１２】リ−ド１３は樹脂封止型半導体装置内部
（裏面は露出）のみ存在し、封止樹脂２３の縁部に沿っ
てリ−ドフレ−ムから切断されている。つまり、半導体
チップ２１を封止する際にはリ−ドを所望のリ−ドピッ
チ部分、例えば線分ＡＡ´まで封止した後、線分ＡＡ´
の部分からリ−ドを切断する。プリント配線板やＭＣＭ
等に実装する際には、樹脂封止型半導体装置裏面に露出
するリ−ド１３を直接接続する。尚、本実施例のリ−ド
フレ−ムは、３通りのリ−ドピッチを有する構造である
が、３通りに限ることがないのはいうまでもない。The lead 13 exists only inside the resin-sealed semiconductor device (the back surface is exposed), and is cut from the lead frame along the edge of the sealing resin 23. That is, when the semiconductor chip 21 is sealed, the lead is sealed to a desired lead pitch portion, for example, the line segment AA ′, and then the line segment AA ′.
Cut the lead from the part. Printed wiring board and MCM
When it is mounted on a semiconductor device or the like, the lead 13 exposed on the back surface of the resin-sealed semiconductor device is directly connected. The lead frame of this embodiment has a structure having three types of lead pitches, but needless to say, the number is not limited to three.
【００１３】[0013]
【発明の効果】本発明のリ−ドフレ−ムによれば、１枚
のリ−ドフレ−ムを用いて数種のリ−ドピッチの場合に
適用できる。多品種少量生産に適したリ−ドフレ−ムで
あり、大幅に開発期間の短縮や製造コストの低減に繋が
る。また、本発明の樹脂封止型半導体装置では、上部の
みを樹脂封止しているため、容易にパッケ−ジ厚を薄型
にすることが可能である。更に、リ−ドは樹脂封止型半
導体装置裏面に露出しており、裏面から実装基板等に直
接接続される。そのため、従来の樹脂封止型半導体装置
の周辺に配置されたアウタ−リ−ド等がなく、樹脂封止
型半導体装置を小型化することができる。According to the lead frame of the present invention, one lead frame can be used for several kinds of lead pitches. This lead frame is suitable for high-mix low-volume production, which leads to a significant reduction in development time and manufacturing costs. Further, in the resin-sealed semiconductor device of the present invention, only the upper portion is resin-sealed, so that the package thickness can be easily made thin. Further, the lead is exposed on the back surface of the resin-sealed semiconductor device, and is directly connected to the mounting board or the like from the back surface. Therefore, there is no outer lead or the like arranged around the conventional resin-sealed semiconductor device, and the resin-sealed semiconductor device can be miniaturized.
【図１】本発明によるリ−ドフレ−ムを模式的に示す平
面図である。FIG. 1 is a plan view schematically showing a lead frame according to the present invention.
【図２】本発明によるリ−ドフレ−ムを用いた樹脂封止
型半導体装置を示す断面図である。FIG. 2 is a cross-sectional view showing a resin-sealed semiconductor device using a lead frame according to the present invention.
【図３】従来の樹脂封止型半導体装置を示す断面図であ
る。FIG. 3 is a cross-sectional view showing a conventional resin-sealed semiconductor device.
【図４】従来のリ−ドフレ−ムを模式的に示す平面図で
ある。FIG. 4 is a plan view schematically showing a conventional lead frame.
１１…アイランド、１２…吊りリ−ド、１３…リ−ド ２１…半導体チップ、２２…ボンディングワイヤ、２３
…封止樹脂11 ... Island, 12 ... Suspension lead, 13 ... Lead 21 ... Semiconductor chip, 22 ... Bonding wire, 23
... Sealing resin
Claims (2)
少なくとも上記アイランドの対向する辺に隣接して配置
された複数のリ−ドとからなり、 上記各リ−ドは長手方向に放射状に延びた放射状部分と
長手方向に平行に延びた平行部分とが交互にかつ連続し
ており、上記複数のリ−ドのうち隣接するリ−ドは互い
に上記平行部分で同一のリ−ドピッチが得られるように
配置されており、かつ上記複数のリ−ドは長さに比例し
てリ−ドピッチが大きくなるように配列されたことを特
徴とするリ−ドフレ−ム。1. An island on which a semiconductor chip is mounted,
At least a plurality of leads arranged adjacent to the opposite sides of the island, each of the leads having a radial portion extending in the longitudinal direction and a parallel portion extending in parallel to the longitudinal direction. Alternating and continuous, adjacent leads of the plurality of leads are arranged so that the same lead pitch can be obtained in the parallel portions, and the plurality of leads are A lead frame is arranged so that the lead pitch is increased in proportion to the length.
するように配列されたリ−ド群を有するリ−ドフレ−ム
を用いた樹脂封止型半導体装置において、 上記リ−ドフレ−ムのアイランドに載置された半導体チ
ップと、上記半導体チップ上のパッド電極と上記リ−ド
群とをそれぞれ電気的に接続するボンディングワイヤ
と、上記アイランド及び上記リ−ド群の裏面とを露出さ
せると共に上記半導体チップ及び上記ボンディングワイ
ヤ及び上記リ−ド群を所望のリ−ドピッチ部分まで封止
する封止樹脂部とからなり、上記リ−ド群は上記封止樹
脂部に沿って上記リ−ドフレ−ムから切断されているこ
とを特徴とする樹脂封止型半導体装置。2. A resin-sealed semiconductor device using a lead frame having a lead group arranged to have at least two lead pitches, wherein the island of the lead frame is provided. The semiconductor chip mounted on the semiconductor chip, the bonding wires for electrically connecting the pad electrodes on the semiconductor chip and the lead group, the island and the back surface of the lead group, and The semiconductor chip, the bonding wire, and the encapsulating resin portion for encapsulating the lead group up to a desired lead pitch portion. The lead group extends along the encapsulating resin portion. A resin-encapsulated semiconductor device, which is cut from a frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5238143A JPH0794657A (en) | 1993-09-24 | 1993-09-24 | Lead frame and resin-sealed semiconductor device using the lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5238143A JPH0794657A (en) | 1993-09-24 | 1993-09-24 | Lead frame and resin-sealed semiconductor device using the lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0794657A true JPH0794657A (en) | 1995-04-07 |
Family
ID=17025830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5238143A Pending JPH0794657A (en) | 1993-09-24 | 1993-09-24 | Lead frame and resin-sealed semiconductor device using the lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0794657A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8110913B2 (en) * | 2007-06-29 | 2012-02-07 | Stats Chippac Ltd. | Integrated circuit package system with integral inner lead and paddle |
-
1993
- 1993-09-24 JP JP5238143A patent/JPH0794657A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8110913B2 (en) * | 2007-06-29 | 2012-02-07 | Stats Chippac Ltd. | Integrated circuit package system with integral inner lead and paddle |
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