JPH08107023A - Inductance element - Google Patents

Abstract

PURPOSE: To reduce the number of parts and a cost by integrally forming a first magnetic core provided corresponding to a first coil part and a second magnetic core provided corresponding to a second coil part by one set of magnetic cores. CONSTITUTION: A magnetic core 41 is comprised of a magnetic core 42 corresponding to a coil part 11 and a magnetic core 42a corresponding to a coil part 11a. The magnetic core 42 is constituted by fitting one set of an upper magnetic core 43 and a lower magnetic core 44 each of which has E-shaped side part, and the magnetic core 42a also is constituted by fitting one set of an upper magnetic core 43a and a lower magnetic core 44a each of which has an E-shaped side part. The upper magnetic cores 43, 43a communicate side legs 46, 46a, respectively and are integrally formed as an upper magnetic member 48, and lower magnetic cores 44, 44a are also integrally formed as a lower magnetic member 49 similarly. The integrated side legs 46, 46a are inserted to a through hole 3 and each of plating through-holes 5 to 10, 5a to 10a is exposed from the magnetic core 41 for electrical connection with the magnetic core 41 mounted the coil main body 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inductance element used in an inverter transformer or a smoothing choke coil of a power supply device.

[0002]

2. Description of the Related Art Conventionally, as an inductance element of this type, for example, in Japanese Patent Laid-Open No. 64-30463, a conductive metal wire is wound around an insulating bobbin, and an EE type or A transformer in which the main leg of an EI type magnetic core is inserted and abutted is disclosed. However, in the transformer having such a structure, it is difficult to reduce the man-hours and the automatic production because it is necessary to uniformly wind the metal wire around the bobbin, and it is difficult to reduce the thickness by the bobbin.

To solve these problems, for example, Japanese Utility Model Publication No. 6-24985 or Japanese Unexamined Patent Publication No. 5-1.
Japanese Patent Publication No. 59933 discloses a thin transformer in which a plurality of insulating thin-layer substrates having a spiral conductive pattern are laminated, and an EE-type or EI-type magnetic core is abutted on a coil portion formed by the laminated thin-layer substrates. Has been done.

[0004]

The conventional structure in which the above-mentioned thin layer substrates are laminated has the following problems. When at least two or more inductance elements are installed in the device, if the inductance elements having the conventional structure are individually arranged, a core and a thin layer substrate are required for each inductance, and the number of parts is remarkably increased and the cost is increased. Will result in.

A coil circuit of another system (for example,
When providing an auxiliary winding on either the primary or secondary winding of the transformer. ) Is provided as a means for providing
Japanese Patent Publication No. 294508 discloses a laminated body in which thin layer substrates having different circuit patterns for each system are sequentially stacked. However, in such a structure, when the number of turns of the auxiliary winding increases, the thin layer substrate as a whole becomes thicker accordingly.

In the conventional technique, the conductive patterns are formed to have the same thickness regardless of the current capacity flowing through each conductive pattern. In this case, even a conductive pattern that originally does not allow a large current to flow is formed with a conductive pattern having an unnecessary thickness, so that the entire thin layer substrate cannot be formed to an optimum thickness according to the current capacity of each conductive pattern.

In the prior art, it is necessary to interpose an insulator between the conductive pattern and the magnetic core in order to avoid contact between the conductive pattern formed on the outermost surface of the laminated thin layer substrates and the magnetic core. is there. However, in such a structure, there is a risk that the insulator may peel off on the way and the conductive pattern and the magnetic core may come into contact with each other. Moreover, the entire thickness is increased by the thickness of the intervening insulator.

The present invention has been made to solve the above problems, and an object thereof is to provide an inductance element which can reduce the number of parts and the cost even if the number of elements increases. .

Another object of the present invention is to provide an inductance element in which the entire thin layer substrate does not become thick even if a circuit pattern to be a winding circuit of another system is provided.

Another object of the present invention is to provide an inductance element capable of forming the entire thin layer substrate to an optimum thickness according to the current capacity of each conductive pattern.

Another object of the present invention is to provide an inductance element which can avoid contact between each conductive pattern and the magnetic core without interposing an insulator.

[0012]

According to another aspect of the present invention, there is provided an inductance element comprising: a first magnetic core provided corresponding to a first coil portion; and a first magnetic core provided corresponding to a second coil portion. Two
The above magnetic core is integrally formed with a set of magnetic cores.

According to another aspect of the inductance element, the first coil portion and the second coil portion are
A first conductive pattern and a second conductive pattern are respectively formed on a common insulating thin layer substrate, a plurality of the thin layer substrates are laminated to form the first conductive pattern and the second conductive pattern in a winding shape. It is arranged and configured.

According to a third aspect of the present invention, the first conductive pattern or the second conductive pattern has at least two system circuit patterns on the same thin layer substrate.

According to a fourth aspect of the present invention, the inductance element is formed such that the first conductive pattern and the second conductive pattern have different thicknesses depending on the thin layer substrates.

The inductance element according to a fifth aspect of the present invention is configured such that the first conductive pattern and the second conductive pattern are not formed on the outermost surface of the laminated thin layer substrates.

[0017]

According to the structure of claim 1, the first magnetic core and the second magnetic core, which are originally separate components, are integrated, and a magnetic circuit for the first and second coil portions is formed by a set of magnetic cores. By forming, the number of required magnetic members can be halved.

According to the second aspect of the invention, the two coil portions are simultaneously obtained by forming the first and second conductive patterns on the same thin layer substrate and laminating a plurality of the thin layer substrates. be able to.

According to the third aspect of the invention, the first or second circuit board having different system circuit patterns on the same thin layer substrate.
Since the conductive pattern is formed, the overall shape of the thin layer substrate can be made thinner than that in which thin layer substrates having different pattern modes are laminated for each winding circuit.

Further, according to the structure of claim 4, the first and second conductive patterns can be changed to the optimum thickness according to the flowing current capacity.

Furthermore, according to the structure of claim 5, the magnetic core is the first core even if an insulator is not interposed between the thin layer substrate and the magnetic core.
And the risk of contacting the second conductive pattern is eliminated.

[0022]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 to 7 show a first embodiment of the present invention, in which reference numeral 1 denotes a coil body formed by laminating a plurality of thin layer substrates 2 having the same shape. A pair of main leg through holes 4 and 4a are provided in the left-right direction of the hole 3. In common with this thin layer substrate 2, a plurality of plated through holes 5, 6, 7 and 8 which are conductive connecting portions are provided in front of the one main leg through hole 4, and the other one is correspondingly provided. A plurality of plated through holes 5a, 6a, 7a, 8a which are conductive connecting portions are provided in front of the main leg through hole 4a. Further, a plurality of plated through holes 9 and 9a as connecting portions are provided behind the main leg through holes 4 and 4a, respectively, and a plated through hole 10 as a connecting portion is provided also behind the central through hole 3. These plated through holes 5 to 10 and 5a to 10a allow the external and thin layer substrates 2 to be formed.
Electrical connection between them is achieved.

The coil body 1 is composed of a first coil portion 11 and a second coil portion 11a. That is, as viewed from the center of the central through hole 3, the first coil portion 11 is provided on one main leg through hole 4 side, and the second coil portion 11a is provided on the other main leg through hole 4a side. These first and second coil portions 11 and 11a are formed by forming a first conductive pattern 12 and a second conductive pattern 12a on a common thin layer substrate 2, respectively. The thin layer substrate 2 is made of a resin insulating material such as a glass epoxy type or a polyimide type, and a copper foil having a thickness of 105 μm is etched on each surface of the thin layer substrate 2 to form first and second conductive patterns. 12, 12
I am trying to get a.

The first conductive pattern 12 is the primary circuit pattern 14 which finally becomes the primary winding of the first transformer 13.
And a secondary circuit pattern 15 serving as a secondary winding of the first transformer 13, which are formed on different thin layer substrates 2. The second conductive pattern 12a is also the primary circuit pattern 14 that serves as the primary winding of the second transformer 13a.
a and a secondary circuit pattern 15a serving as a secondary winding of the second transformer 13a, which are also formed on different thin layer substrates 2. The primary circuit patterns 14 and 14a are formed on the common thin layer substrate 2, and the secondary circuit patterns 15 and 15a are also formed on the common thin layer substrate 2. The circuit boards 16 and the secondary circuit boards 17 on which the secondary circuit patterns 15 and 15a are formed are alternately laminated. In this embodiment, the secondary circuit board 17 shown in FIG. 6 has a first layer (uppermost layer), a third layer, and a fifth layer.
Layers, seventh layer, and ninth layer (bottom layer), between which the respective primary circuit boards 16 shown in FIGS.
The fourth layer, the sixth layer, and the eighth layer are sequentially provided. In addition,
An insulating layer (not shown) is formed on the outer surfaces of the primary circuit board 16 and the secondary circuit board 17, and an adhesive such as an epoxy resin is interposed between the thin layer boards 2 to form the laminated coil shown in FIG. The body 1 is obtained.

Next, the structure of the primary circuit board 16 will be described in more detail with reference to FIGS. First, focusing on the first conductive pattern 12, the square-shaped winding portion 21 surrounding the outer circumference of the main leg through hole 4 is formed in the same shape in common to each layer of the primary circuit board 16. The formation positions of the starting end portion 22 and the terminating end portion 23 extending forward from both ends of the portion 21 are different for each layer. That is, the second layer primary circuit board 16 shown in FIG.
Then, the start end 22 is connected to the outermost plated through hole 5, and the end 23 is connected to the adjacent plated through hole 6. Further, in the fourth layer primary circuit board 16 shown in FIG. 3, the starting end 22 is connected to the plated through hole 6 and the terminal end 23 is connected to the plated through hole 7. Below, FIG.
In the primary circuit board 16 of the sixth layer shown in FIG. 5, the starting end 22 is connected to the plated through hole 7, the terminal end 23 is connected to the plated through hole 8, and the primary circuit board 16 of the eighth layer shown in FIG. Then, the starting end 22 is connected to the plated through hole 8 and the terminal end 23 is formed further inward than the plated through hole 8.

Therefore, when the respective primary circuit boards 16 are laminated, the terminal end portion 23 of the second layer primary circuit board 16 and the starting end portion 22 of the fourth layer primary circuit board 16 are connected by the plated through hole 6. Similarly, the terminal end portion 23 of the primary circuit board 16 of the fourth layer and the starting end portion 22 of the primary circuit board 16 of the sixth layer are connected by the plated through hole 7, and the primary circuit board 16 of the sixth layer is also formed. End portion 23 and the eighth layer primary circuit board 16
The starting ends 22 of the are connected by the plated through holes 8. At this time, the primary circuit patterns 14 formed by the first conductive patterns 12 are arranged in a winding state, that is, in a spiral shape in a stacked state, and the primary circuit board 16 of the second layer starts from the starting end portion 22 of the eighth layer. The path to the termination 23 of the primary circuit board 16 is
It is formed as a primary winding of the first transformer 13.

Next, paying attention to the second conductive pattern 12a, it is formed symmetrically with the one conductive pattern 12 about the central through hole 3. That is, the second
The conductive pattern 12a has a starting end 22a and a terminating end 23a at both ends of a common square-shaped winding part 21a.
The formation positions of the start end portion 22a and the end portion 23a are different for each layer of the primary circuit board 16. The starting end 22a is
The second layer of the primary circuit board 16 is connected to the plated through holes 5a, and hereinafter, the fourth layer of the primary circuit board 16 has the plated through holes 6a, and the sixth layer of the primary circuit board 16 has the plated through holes 7a and the eighth layer. The primary circuit board 16 is connected to the plated through hole 8a. The terminal portion 23a is connected to the plated through hole 6a in the second layer primary circuit board 16, and hereinafter, the plated through hole 7a in the fourth layer primary circuit board 16 and the plated through hole 6a in the sixth layer primary circuit board 16. It is connected to the through hole 8a and is formed further inward than the plated through hole 8a in the primary circuit board 16 of the eighth layer.

Therefore, when the respective primary circuit boards 16 are laminated, the primary circuit patterns 14a formed by the second conductive patterns 12a are also wound in a laminated state, that is, spiral, by the plated through holes 5a, 6a, 7a, 8a. Are arranged in a rectangular shape, and the path from the start end portion 22a of the second layer primary circuit board 16 to the end portion 23a of the eighth layer primary circuit board 16 is the second
Is formed as the primary winding of the transformer 13a.

In this embodiment, in the primary circuit board 16 of the eighth layer shown in FIG. 5, the terminal end portion 23 of the first conductive pattern 12 is formed.
And the terminal portion 23a of the second conductive pattern 12a is connected in front of the central through hole 3. As a result, the primary sides of both transformers 13 and 13a are internally connected in series.

Next, the structure of the secondary circuit board 17 shown in FIG. 6 will be described in detail. The secondary circuit board 17 is common to the first layer, the third layer, the fifth layer, the seventh layer and the ninth layer. Used. First
The conductive pattern 12 has a square-shaped circumferential portion 31 that surrounds the outer periphery of the main leg through-hole 4, and a rear end extending from both ends of the circumferential portion 31 to connect to the plated through hole 9 A part 32 and a terminal part 33 connected to the plated through hole 10 are respectively formed. Also, the second conductive pattern
12a also has a square-shaped circumferential portion 31 surrounding the outer circumference of the main leg through hole 4a.
a is formed and is connected to the plated through hole 9a so as to extend rearward from both ends of the circling portion 31a.
32a and a terminal portion 33a connected to the plated through hole 10 are formed respectively.

Therefore, when the secondary circuit boards 17 are laminated, the starting ends 32 of the first conductive patterns 12 are connected to each other through the plated through holes 9 and the starting ends of the second conductive patterns 12a are connected. The parts 32a are also connected to each other through the plated through holes 9a. In addition, the end portion 33 of the first conductive pattern 12 and the end portion of the second conductive pattern 12a
33a are also connected to each other through the common plated through hole 10. In this case, the secondary winding of the first transformer 13 in which the secondary circuit patterns 15 of the respective secondary circuit boards 17 are connected in parallel is formed using the plated through holes 9 and 10 as a common connection point. The secondary circuit pattern 15a of each secondary circuit board 17 using the holes 9a and 10a as a common connection point.
To form a secondary winding of the second transformer 13a. Moreover, the terminal end portion 33 of the first conductive pattern 12 and the terminal end portion 33a of the second conductive pattern 12a are connected behind the central through hole 3, whereby both transformers 13,
The secondary side of 13a is internally connected in series.

Next, the structure of the magnetic core 41 mounted on the coil body 1 will be described with reference to FIG. The magnetic core 41 includes a first magnetic core 42 provided corresponding to the first coil portion 11 and a second magnetic core 42a provided corresponding to the second coil portion 11a. The first magnetic core 42 is formed by abutting a pair of upper magnetic core 43 and lower magnetic core 44, each of which has an E-shaped side portion, and the second magnetic core 42a also has a side portion. Each of them is composed of a pair of E-shaped upper magnetic cores 43a and lower magnetic cores 44a butted against each other. Each of the upper magnetic core 43 and the lower magnetic core 44 is provided with a main leg 45 inserted into the main leg through hole 4 and side legs 46 and 47 located on both sides of the main leg 45. Similarly, the upper magnetic core 43a and the lower magnetic core 44a are also formed with a main leg 45a inserted into the main leg through hole 4a and side legs 46a and 47a located on both sides of the main leg 45a. The upper magnetic cores 43 and 43a are integrally formed as the upper magnetic member 48 by connecting the one side leg 46 and 46a, respectively. Also, the lower magnetic cores 44, 44a
Also, the lower magnetic member 49 is integrally formed by connecting one of the side legs 46, 46a. The side legs 46, 46a of the integrated first and second magnetic cores 42, 42a are inserted into the central through hole 3 and the magnetic core 41 is mounted on the coil body 1, and the plated through holes 5 are formed. ~ 10,5a ~ 10a
A magnetic core 41 for electrical connection between the external and the thin layer substrate 2
More exposed. In the first and second transformers 13 and 13a, if the first and second conductive patterns 12 and 12a are formed so that the magnetic fluxes of the side legs 46 and 46a are generated in the same direction, the first and second transformers 13 and 13a are formed. There is no magnetic influence when the second magnetic cores 42, 42a are integrally formed.

In this embodiment, the common thin-layer substrates 2 have the first
And the first and second coil portions 1 obtained by forming the second conductive patterns 12 and 12a and stacking the thin layer substrates 2.
By mounting a set of magnetic cores 41 on the terminals 1 and 11a, two first and second transformers 13 and 13a each having a primary side and a secondary side connected in series are manufactured. The circuit diagram in this case is shown in Fig. 7.
This is particularly suitable for the inverter transformer of the two-transformer partial resonance type converter. That is, magnetic flux is generated in the first and second magnetic cores 42, 42a by the current flowing through the primary circuit patterns 14, 14a, and the magnetic flux induces a voltage in the secondary circuit patterns 15, 15a. And, this secondary circuit pattern 15,15
The voltage induced in a is between the plated through holes 9 and 10,
And between the plated through holes 9a and 10 respectively.

As described above, in the present embodiment, the first and second magnetic cores 42, 42a, which are originally separate components, are integrated, and a pair of magnetic members consisting of the upper magnetic member 48 and the lower magnetic member 49 is formed. By forming the magnetic circuit for the two coils 11 and 11a by the core 41, the number of required magnetic members can be halved as compared with the conventional one, and the cost can be reduced. In this case, the first and second magnetic cores 42, 42a
May be other than the EE type. However, as in the present embodiment, vertically symmetrical EE type first and second magnetic cores 42,
42a has the further advantage that the upper magnetic member 48 and the lower magnetic member 49 can be shared. Thus, the first magnetic core 42 provided corresponding to the first coil portion 11,
A second magnetic core 42 provided corresponding to the second coil portion 11a.
By integrally forming a and a magnetic core 41, the main object of the present invention is to reduce the number of parts and the cost.

Further, conventionally, when manufacturing two inductance elements, a conductive pattern corresponding to each element is formed on an independent thin layer substrate 2, and the conductive patterns are separately laminated to form first and second coils. Although the parts 11 and 11a are obtained, in the case of this embodiment, after forming the first and second conductive patterns 12 and 12a on the same thin layer substrate 2, respectively, a plurality of thin layer substrates 2 are laminated. By doing so, the two coil portions 11 and 11a forming the transformers 13 and 13a can be obtained at the same time, and the first and second coil portions 11 and 11 as well as the magnetic core 41 can be obtained.
The thin-layer substrate 2 forming a can also have common parts. That is, in the inductance element of the present embodiment, the first and second conductive patterns 12 and 12a are respectively formed on the common insulating thin layer substrate 2, and a plurality of thin layer substrates 2 are laminated to form the first and second conductive layers. First conductive patterns 12 and 12a are arranged in a winding shape and are magnetically coupled to the magnetic core 41.
By configuring the second coil portions 11 and 11a, the number of parts and the cost can be further reduced.

Next, actions and effects other than the above in the inductance element of the present embodiment will be listed. Conventionally, when two inductance elements are connected in series or in parallel, the terminals of each element are once soldered to a land such as a printed board, and the inductance elements are connected to each other through a conductive pattern on the printed board. However, in this case, the contact resistance at the soldering portion between each element and the printed board increases, which adversely affects the characteristics of the element. However, in this embodiment, for example, as is clear from FIG. 5 showing the primary circuit board 16 of the eighth layer, the terminal portions 23 and 23a of the first and second conductive patterns 12 and 12a of the eighth layer are provided. By pattern-connecting each other, the first and second inductance elements, which are inductance elements, can be formed without external soldering connection.
The primary side of the transformers 13 and 13a can be connected in series, and the contact resistance between these elements can be made zero.
That is, by pattern-connecting the first and second conductive patterns 12 and 12a inside the same thin layer substrate 2,
The first and second coil portions 11 and 11a can be connected in series or in parallel without being affected by the contact resistance between the elements. On the other hand, if the terminal portions 23, 23a of the first and second conductive patterns 12, 12a of the eighth layer are not pattern-connected, circuit-independent inductance elements can be obtained from the same thin layer substrate 2. Will be done.

On the other hand, paying attention to the side of the first coil 11 of the secondary circuit board 17, in this embodiment, the start end portion 32 and the end portion 33 of the first conductive pattern 12 formed on each thin layer board 2 are arranged. ,
The common through holes 9 and 10 are connected to each other to obtain a secondary winding in which the first conductive pattern 12 is connected in parallel and has one winding, and the first conductive pattern connected in parallel is obtained. 12, the current capacity of the secondary side of the first transformer 13 is increased. With respect to this point, in the conventional thin laminated transformer, a method of increasing the width of the first conductive pattern 12 has been considered as a means for increasing the current capacity, but the shape of the thin layer substrate 2 becomes large. Not only that, but there is a problem that the entire pattern needs to be redesigned. However, in this embodiment, by connecting both ends of the first or second conductive patterns 12 and 12a formed on each thin layer substrate 2 to each other by the plated through holes 9 and 10 which are the connection portions, the thin layer By changing the number of laminated thin-layer substrates 2 without changing the shape of the substrate 2, an inductance element corresponding to the current capacity can be easily obtained. Further, as in each of the primary circuit boards 16 shown in FIGS. 2 to 5, the terminal end portion 23 of the first conductive pattern 12 formed on the upper thin layer substrate 2 is formed on the next thin layer substrate 2. By connecting to the starting end portion 22 of the first conductive pattern 12 and connecting the first conductive pattern 12 as a whole in series, the number of turns of the first coil portion 11 can be simplified according to the number of laminated layers of the thin layer substrate 2. Can be changed to These actions and effects can be selectively applied to the second conductive pattern 12a.

In this embodiment, the first and second coil parts are
The first and second conductive patterns 12, 11a.
12a are formed symmetrically in the same shape for each thin layer substrate 2. This is to obtain the first and second transformers 13 and 13a having the same characteristics. However, in order to obtain the inductance elements having different characteristics, the first and second conductive patterns 12 and 12a may be formed in different shapes. In addition, the first and second conductive patterns 12, 12a are
It may be formed on both sides of the thin layer substrate 2. In this case, a plurality of glass epoxy-based or polyimide-based resin insulating materials may be used between the thin layer substrates 2 to stack them.

According to this embodiment, the first conductive pattern 12
The first primary circuit pattern 14 and the secondary circuit pattern 15
And a second conductive pattern 12a is divided into a second primary circuit pattern 14a and a secondary circuit pattern 15a, and each primary circuit pattern 14, 14a is formed on the thin layer substrate 2, and By stacking the secondary circuit board 17 in which the respective secondary circuit patterns 15 and 15a are formed on the thin layer board 2, the two first and second transformers 13 and 13a are integrated on the same thin layer board 2. You can get it. In this case, if the secondary circuit board 17 is removed, two choke coils without a secondary circuit formed by the primary circuit board 16 and the magnetic core 41 can be obtained. In addition, one of the conductive patterns is the secondary circuit pattern.
When the thin-layer substrate 2 is formed with only 15, it is possible to integrally obtain an element in which the first transformer 13 and the choke coil are combined, and thus, for example, an inverter transformer of a switching power supply device and a smoothing choke. The coil and the coil can be configured by one component. In this configuration, one or both of the secondary circuit patterns 15 and 15a are
This can be easily achieved by selectively not forming the thin layer substrate 2.

The first and second magnetic cores 42, 42a are also
The shapes may be different depending on the characteristics of the first and second coil portions 11 and 11a. In this case, one can be integrated as the magnetic core 41 for the transformer and the other for the choke coil. Further, the first and second
To one or both main legs 45, 45a of the magnetic cores 42, 42a of
Center gap as a means of energy storage
It is also possible to provide.

Further, as in this embodiment, the primary circuit board 16
By alternately arranging a plurality of and secondary circuit boards 17, magnetic coupling between the primary side and the secondary side of the first and second transformers 13 and 13a can be enhanced. In particular, the secondary circuit board 17 is arranged on the uppermost layer and the lowermost layer, and the primary circuit board 16 and the secondary circuit board 17 are alternately arranged on the intermediate layer between them, and the number of layers of the secondary circuit board 17 is increased. If possible, the magnetic coupling between the primary side and the secondary side of the transformers 13 and 13a can be maximized.

Also, the first and second conductive patterns 12,
The thickness of 12a is preferably 70 μm or more. In particular, the first and second transformers 13 and 13a in the embodiment
When used as an inverter transformer of a switching power supply device, if the thickness is 70 μm or more, the allowable amount of current flowing through the first and second conductive patterns 12 and 12a can be satisfied.

Further, the shape of the main legs 45, 45a is not limited to the rectangular shape as in the embodiment, but may be circular. in this case,
The winding portions 21 and 31 of the first conductive pattern 12 and the winding portions 21a and 31a of the second conductive pattern 12a may be formed in a substantially annular shape accordingly.

Next, a second embodiment of the present invention will be described with reference to FIGS. The same parts as those in the first embodiment are designated by the same reference numerals, and detailed description of the common parts will be omitted. In this embodiment, as shown in FIG. 8, 11 layers of thin layer substrates 2 are laminated, and each of the four layers of primary circuit board 16 is formed.
In the secondary circuit board 17, the upper circuit board 51 arranged in the uppermost layer (n = 1), the lower circuit board 52 arranged in the lowermost layer (n = 11), and the intermediate sixth layer (n =). A shield substrate 53 arranged in 6) is provided. The first and second conductive patterns 12 and 12a formed on the upper circuit board 51 and the lower circuit board 52 and the thickness d1 of the similarly conductive shield layer 54 formed on the shield board 53 are all 1
8 μm, other primary circuit board 16 and secondary circuit board
First and second conductive patterns 12, 12a formed on 17
It should be noted that the thickness d2 is different from the thickness d2 = 105 μm. In addition, the first and second conductive patterns 12 on the uppermost layer,
Only 12a is formed on the lower surface of the upper circuit board 51, whereby the uppermost surface portion 55 and the lowermost surface portion of the laminated thin layer boards 2 are formed.
56 has a structure in which the first and second conductive patterns 12 and 12a are not formed.

Next, the structures of the upper circuit board 51 and the lower circuit board 52 will be described with reference to FIGS. 9 and 10. In the figure, 60 is formed on the same thin layer substrate 2 independently of the secondary circuit pattern 31. It is an auxiliary circuit pattern. This auxiliary circuit pattern 60
Finally becomes the auxiliary winding of the transformer 13 which constitutes the auxiliary power supply circuit of the switching power supply device.
The conductive pattern 12 has a two-system circuit pattern including an auxiliary circuit pattern 60 and a secondary circuit pattern 15. The auxiliary circuit pattern 60 is common to the upper circuit board 51 and the lower circuit board 52, and is a circling portion that surrounds the main leg through hole 4.
61, and a starting end portion 62 and a terminating end portion 63 formed at both ends of the winding portion 61, the pattern width of which is the secondary circuit pattern.
It is formed to be narrower than the pattern width of 31. Further, as the connection portion of the auxiliary circuit pattern 60, the plated through holes 64 and 65 are provided in common to each thin layer substrate 2.

The starting end portion 62 of the auxiliary circuit pattern 60 formed on the upper circuit board 51 is connected to the starting end portion 62 of the secondary circuit pattern 15, and the terminal end portion 63 is connected to the plated through hole 64. Further, the starting end portion 62 of the auxiliary circuit pattern 60 formed on the lower circuit board 52 is connected to the plated through hole 64,
The terminal portion 63 is connected to the plated through hole 65. Therefore, when laminating each thin layer substrate 2, a plated through hole is formed.
64 are connected to each other, and the auxiliary circuit pattern 60 is arranged in a winding shape. In this case, the upper circuit board 51 and the lower circuit board 52
With the laminated structure of and, an auxiliary winding having two turns can be obtained.

Next, the structure of the shield substrate 53 will be described. The shield layer 54 which is the same member as the first and second conductive patterns is formed over the entire upper surface of the thin layer substrate 2.
The shield layer 54 includes the primary circuit board 16 and the secondary circuit board 17
It is provided in order to reduce the stray capacitance between them, and in this embodiment, it is pattern-connected to the plated through hole 5 to maintain the same potential as the starting end portion 22 on the primary side of the transformer 13.

The circuit diagram in this embodiment is as shown in FIG. 12, and two transformers 13 and 13a in which one end of the secondary winding of the transformer 13 is connected to one end of the auxiliary winding are obtained.

As described above, the upper circuit board 51 and the lower circuit board 52 are formed on the same thin layer board 2 by the two conductive circuit patterns of the secondary circuit pattern 31 and the auxiliary circuit pattern 60, and the first conductive pattern is formed. By forming the pattern 12, an auxiliary winding different from the secondary winding can be obtained in the first transformer 13. The auxiliary circuit pattern 60 may be independently provided on the other secondary circuit pattern 31a side, or may be provided on the primary circuit patterns 14 and 14a side shown in FIGS. 2 to 5. In this case, two or more auxiliary circuit patterns 60 and the primary circuit patterns 14, 14a or the secondary circuit patterns 15,
15a, the first or second conductive pattern 12, 12
a may be formed. As a result, the inductance element has at least two winding circuits on the same thin layer substrate 2.

In the above structure, since winding circuits of different systems are provided on the same thin layer substrate 2, as compared with the conventional structure in which the thin layer substrates 2 having different patterns are laminated for each winding circuit. There is an advantage that the overall shape of the laminated thin layer substrates 2 can be significantly reduced. That is, the same thin layer substrate 2
By forming the first or second conductive patterns 12 and 12a having circuit patterns of at least two systems in the same, even if a circuit pattern to be a winding circuit of another system is provided, the entire thin layer substrate 2 is thickened. It is possible to obtain an inductance element that does not occur.

Further, in this embodiment, the secondary circuit pattern 31 having a large current capacity is the auxiliary circuit pattern having a small current capacity.
The pattern width is wider than that of 60. That is, by appropriately changing the pattern widths of the secondary circuit pattern 31 and the auxiliary circuit pattern 60 according to the current capacity, it is possible to efficiently form a plurality of circuit patterns within the limited space of the thin layer substrate 2. Becomes

Further, conventionally, the thickness was formed to be constant regardless of the current capacity flowing through the first and second conductive patterns 12 and 12a, but in the present embodiment, the first and second conductive patterns are formed.
Of the conductive patterns 12, 12a and the shield layer 54 of
By changing according to the flowing current capacity, the pattern thickness of a portion where a large current does not need to flow is formed as thin as possible, and the thin layer substrate 2 as a whole is thinned. That is, if the thicknesses of the first and second conductive patterns 12 and 12a including the shield layer 54 are formed to be different depending on each thin layer substrate 2,
The entire thin layer substrate 2 is formed with the first and second conductive patterns 12, 12.
It can be formed to have an optimum thickness according to the current capacity of a and the shield layer 54.

Further, in this embodiment, the first and second uppermost surface portions 55 and the lowermost surface portions 56 of the laminated thin layer substrates 2, that is, the outermost surfaces of the thin layer substrates 2 contacting the magnetic core 41, are provided with the first and second layers. The structure is such that the conductive patterns 12 and 12a are not formed. Therefore, an insulator such as a bobbin or an insulating sheet interposed between the thin layer substrate 2 and the magnetic core 41 is unnecessary, and the magnetic core 41 does not have to have the insulator, and the magnetic core 41 has the first and second conductive patterns 12, 12a. There is no risk of contact with. That is, the outermost surface of the laminated thin layer substrate 2 has the first and second conductive patterns 1
Since the second and the second conductive patterns 12 and 12a are not formed, it is possible to avoid the contact between the magnetic core 41 and the first and second conductive patterns 12 and 12a without interposing an insulator.

By the way, in the coil body 1 having the structure in which the thin layer substrates 2 are laminated, the areas of the primary circuit patterns 14, 14a and the secondary circuit patterns 15, 15a formed on the respective thin layer substrates 2 are large, and moreover, The distance between the primary circuit patterns 14 and 14a and the secondary circuit patterns 15 and 15a is short. Therefore, the stray capacitance between the primary circuit board 16 and the secondary circuit board 17 becomes so large that it cannot be ignored, and this adversely affects the characteristics of the transformers 13 and 13a. In this regard, in this embodiment, since the shield substrate 53 is provided in the intermediate sixth layer, it is possible to reduce the stray capacitance existing between the primary circuit board 16 and the secondary circuit board 17. The shield substrate 53 is not limited to a single layer, but may be selectively arranged in a plurality of layers between the layers of the thin layer substrate 2 in consideration of the characteristics of the transformer bodies 13 and 13a.

Further, in this embodiment, the shield substrate 53
The shield layer 54 is pattern-connected to the starting end portion 22 on the primary side of the transformer 13 and the plated through hole 5 having an equipotential.
As described above, by connecting the shield layer 54 to any of the plated through holes 5 to 10 and 5a to 9a provided on the shield substrate 53, the shield layer 54 need not be connected outside the shield substrate 53. The potential of the transformer 13,
It can be fixed to any one of the ends of 13a. On the other hand, the shield layer 54 is set to which plating through hole 5-10, 5
In some cases, it may be electrically floated without being connected to a to 9a. These methods may be appropriately selected in consideration of the characteristics of the transformers 13 and 13a.

Next, a third embodiment of the present invention will be described with reference to FIG. The same parts as those in the first and second embodiments are designated by the same reference numerals, and detailed description of the common parts will be omitted. FIG. 13 shows a primary circuit board 16 of an arbitrary layer, which includes first and second conductive patterns 12, 12.
It is noted that each of the circling portions 21 and 21a of a is formed in a spiral shape on the same thin layer substrate 2. Reference numeral 66 is a plated through hole provided as a connection portion of the auxiliary circuit pattern 60.

When the first and second conductive patterns 12 and 12a are spirally formed on the same thin layer substrate 2 as in this embodiment, two inductance elements, that is, the first and second transformers 13 are formed. , 13a while having a structure
The thickness direction of the laminated thin layer substrates 2 can be made thinner than in the first and second embodiments.

Next, a fourth embodiment of the present invention will be described with reference to FIGS. 14 and 15. The same parts as those of the above-described embodiments are designated by the same reference numerals, and detailed description of the common parts will be omitted. As shown in FIG. 14, the coil body 1 of the present embodiment is configured by sequentially laminating 7 layers of thin-layer boards 2, and includes a first layer upper circuit board 51 and a fourth layer shield layer 53. In addition to the two-layer primary circuit board 16 is provided,
A two-layer secondary circuit board 17 is provided between the fourth shield layer 53 and the seventh lower circuit board 52. Further, the uppermost surface portion 55 of the thin layer substrate 2 that constitutes the upper circuit board 51 and the lowermost surface portion 56 of the thin layer substrate 2 that constitutes the lower circuit board 52.
In order to avoid electrical contact with the magnetic core 41, the conductive pattern is removed by etching in advance. FIG.
Reference numeral 5 shows the configuration of the uppermost circuit board 51 on the uppermost surface side 55, but in order to make an electrical connection to the outside, the lands 5, 9, 10, 65, 9a, which are connected to the plated through holes, 10a
Only the bottom surface 56 of the lower circuit board 52 is formed so that no conductive pattern is formed. Also,
The primary circuit board 16 and the secondary circuit board 17 include a thin layer board 2
The first and second conductive patterns 12 and 12a are formed on both surfaces of.

In the above embodiment, the primary circuit board 16 is laminated on one side of the shield layer 53, and the secondary circuit board 17 is laminated on the other side of the shield layer 53.
Thus, the stray capacitance of the entire primary circuit board 16 and the secondary circuit board 17 can be effectively reduced by the single shield layer 53. Also, the first and second conductive patterns
Since 12 and 12a are formed on both surfaces of the thin layer substrate 2, only one surface of the thin layer substrate 2 has the first and second conductive patterns 12, 12a.
The number of layers of the thin layer substrate 2 can be reduced as compared with the case where a is formed. Therefore, the two first and second
Although the structure has the transformers 13 and 13a described above, the thickness direction of the laminated thin layer substrates 2 can be made thinner than that in each of the above embodiments.

The present invention is not limited to the above embodiments, but can be modified as appropriate within the scope of the gist of the present invention.

[0061]

The inductance element according to claim 1 is
A first magnetic core provided corresponding to the first coil portion and a second magnetic core provided corresponding to the second coil portion are integrally formed by a set of magnetic cores. By halving the number of required magnetic members, the number of components and the cost can be reduced even if the number of elements increases.

In the inductance element according to a second aspect, the first coil portion and the second coil portion are
A first conductive pattern and a second conductive pattern are respectively formed on a common insulating thin layer substrate, a plurality of the thin layer substrates are laminated to form the first conductive pattern and the second conductive pattern in a winding shape. It is arranged and configured.
Not only the magnetic core but also the first and second coil parts can be made to have common parts, and even if the number of elements increases,
Further reduction of the number of parts and cost can be achieved.

In the inductance element according to a third aspect of the present invention, the first conductive pattern or the second conductive pattern has at least two or more circuit patterns on the same thin layer substrate. Not only can the number of parts be increased and the cost can be reduced even if the number of wires is increased, but it is possible to prevent the entire thin-layer substrate from becoming thick even if a circuit pattern that forms a winding circuit of another system is provided. Become.

The inductance element according to a fourth aspect is formed such that the thickness of the first conductive pattern and the thickness of the second conductive pattern are different depending on each thin layer substrate. Not only can the number of parts be increased and the cost can be reduced even if the number is increased, but also the entire thin layer substrate can be formed to have an optimum thickness according to the current capacity of each conductive pattern.

Further, the inductance element according to a fifth aspect of the present invention is configured such that the first conductive pattern and the second conductive pattern are not formed on the outermost surface of the laminated thin layer substrates. As a result, even if the number of elements increases, not only can the number of parts and the cost be reduced, but also without the interposition of an insulator,
It is possible to avoid contact between each conductive pattern and the magnetic core.

[Brief description of drawings]

FIG. 1 is an overall exploded perspective view showing a first embodiment of the present invention.

FIG. 2 is a front view of a primary circuit board serving as a second layer of the same.

FIG. 3 is a front view of a primary circuit board serving as a fourth layer of the above.

FIG. 4 is a front view of the same primary circuit board as the sixth layer.

FIG. 5 is a front view of a primary circuit board forming the eighth layer of the above.

FIG. 6 is a front view of the above secondary circuit board.

FIG. 7 is a circuit diagram of the transformer obtained in FIG. 1 above.

FIG. 8 is a schematic explanatory view of a coil body showing a second embodiment of the present invention.

FIG. 9 is a front view of the upper circuit board of the above.

FIG. 10 is a front view of the upper and lower circuit boards.

FIG. 11 is a front view of the above shield substrate.

FIG. 12 is a circuit diagram of the transformer obtained above.

FIG. 13 is a front view of a primary circuit board showing a third embodiment of the present invention.

FIG. 14 is a schematic explanatory view of a coil body showing a fourth embodiment of the present invention.

FIG. 15 is a front view of the upper circuit board of the above.

[Explanation of reference numerals] 2 thin layer substrate 11 first coil portion 11a second coil portion 12 first conductive pattern 12a second conductive pattern 14, 14a primary circuit pattern (circuit pattern) 15, 15a secondary circuit pattern (Circuit pattern) 41 Magnetic core 42 First magnetic core 42a Second magnetic core 60 Auxiliary circuit pattern (Circuit pattern)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01F 37/00 D 9375-5E A 9375-5E // H01F 19/00 4230-5E 9375-5E H01F 31/00 A

Claims (5)

[Claims] 1. A first magnetic core provided corresponding to a first coil portion, and a second magnetic core provided corresponding to a second coil portion.
An inductance element, characterized in that the magnetic core of (1) and the magnetic core of (1) are integrally formed by a pair of magnetic cores. 2. The first coil portion and the second coil portion each have a first conductive pattern and a second conductive pattern formed on a common insulating thin layer substrate, and the plurality of thin layer substrates are provided. The inductance element according to claim 1, wherein the inductance element is formed by stacking the first conductive pattern and the second conductive pattern in a winding shape. 3. The inductance element according to claim 2, wherein the first conductive pattern or the second conductive pattern has circuit patterns of at least two systems on the same thin layer substrate. 4. The first conductive pattern and the second conductive pattern.
3. The transformer according to claim 2, wherein the conductive pattern is formed to have a different thickness depending on each of the thin layer substrates. 5. The transformer according to claim 2, wherein the first conductive pattern and the second conductive pattern are not formed on the outermost surface of the laminated thin-layer substrates.