JPH0811166A - Molded product and mold - Google Patents
Molded product and moldInfo
- Publication number
- JPH0811166A JPH0811166A JP14901794A JP14901794A JPH0811166A JP H0811166 A JPH0811166 A JP H0811166A JP 14901794 A JP14901794 A JP 14901794A JP 14901794 A JP14901794 A JP 14901794A JP H0811166 A JPH0811166 A JP H0811166A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- gate
- resin
- package
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims abstract description 109
- 229920005989 resin Polymers 0.000 claims abstract description 109
- 238000000465 moulding Methods 0.000 claims description 5
- 238000005336 cracking Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 9
- 239000008188 pellet Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910001111 Fine metal Inorganic materials 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/38—Cutting-off equipment for sprues or ingates
- B29C45/382—Cutting-off equipment for sprues or ingates disposed outside the mould
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、モ−ルド成形品および
モ−ルド金型に関する。尚、特に小型のモ−ルド成形品
およびモ−ルド金型に有効な技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to molded articles and molds. It should be noted that the present invention relates to a technique particularly effective for a small molded product and a mold.
【０００２】[0002]
【従来の技術】例えば、モ−ルド成形品には半導体装置
やコンデンサ等の電子部品がある。最近では、電子部品
を搭載した電気製品等において、小型化の要求が強まる
につれ、電子部品においても表面実装型の一例として
１．３ｍｍ×０．８ｍｍ×０．７ｍｍのサイズの小型の
ものが製品化され、ミニモ−ルド成形品と呼ばれてい
る。以下、モ−ルド成形品の一例として、上記ミニモ−
ルド成形品の半導体装置について説明する。上下一対の
金型の衝合面にそれぞれキャビティを有し、一方の金型
の衝合面に形成された金型ゲ−トからキャビティ内に溶
融樹脂を注入するモ−ルド金型の衝合面間に、半導体ペ
レットが搭載されたアイランドおよび前記ペレットと金
属細線で電気的に接合したリ−ドを有するリ−ドフレ−
ムを挿入する。つぎに、金型を閉じた後に、金型ゲ−ト
からキャビティ内に溶融樹脂を注入して、ミニモ−ルド
成形品を形成する。つぎに、金型を開いた後にミニモ−
ルド成形品を取り出し、樹脂ゲ−ト部の樹脂を除去す
る。つぎに、リ−ドフレ−ムを切断し、一個一個のミニ
モ−ルド成形品に分離する。（以上は図示せず） この一連の作業の内、樹脂ゲ−ト部の樹脂除去方法は、
図７に示すように、パッケ−ジ保持台１上にミニモ−ル
ド成形品のパッケ−ジ２（モ−ルド樹脂部）を載せ、パ
ッケ−ジ押さえ治具３で押さえる。つぎに、樹脂ゲ−ト
切断用のパンチ４でパッケ−ジ２近傍の樹脂ゲ−ト５を
切断し、樹脂ゲ−トを除去する。この時、樹脂ゲ−トの
一部がパッケ−ジ２に残る長さ（樹脂ゲ−ト残り長さ）
の要求される製品規格はミニモ−ルド成形品ではパッケ
−ジが小さく、それに対応して例えば１００μｍと小さ
い。2. Description of the Related Art For example, molded articles include electronic parts such as semiconductor devices and capacitors. In recent years, as demands for miniaturization of electronic products mounted with electronic parts have increased, electronic parts also have a small size of 1.3 mm x 0.8 mm x 0.7 mm as an example of a surface mount type product. And is called a mini-molded product. Hereinafter, as an example of a molded product, the above-mentioned mini model
A semiconductor device of a molded product will be described. A pair of upper and lower molds each have a cavity on the abutment surface, and a mold die formed on the abutment surface of one die injects molten resin into the cavity. A lead frame having an island on which a semiconductor pellet is mounted and a lead electrically connected to the pellet by a metal wire between the surfaces.
Insert the system. Next, after the mold is closed, a molten resin is injected from the mold gate into the cavity to form a mini-molded product. Next, after opening the mold,
Remove the molded resin product and remove the resin from the resin gate. Next, the lead frame is cut and separated into individual mini-molded products. (The above is not shown.) Of this series of operations, the resin removal method for the resin gate is
As shown in FIG. 7, a package 2 (mold resin part), which is a mini-molded product, is placed on the package holding base 1 and held by the package holding jig 3. Next, the resin gate 5 near the package 2 is cut by the resin gate cutting punch 4 to remove the resin gate. At this time, the length of part of the resin gate remaining in the package 2 (resin gate remaining length)
The required product standard of the mini-molded product is small and correspondingly small, for example, 100 μm.
【０００３】[0003]
【発明が解決しようとする課題】ところで、この樹脂ゲ
−ト５の切断時、モ−ルド成形時の金型のズレ等により
パッケ−ジ寸法にバラツキがあり、パッケ−ジ保持台１
の樹脂ゲ−ト側のコ−ナ−６（保持台樹脂ゲ−ト側コ−
ナ−）を樹脂ゲ−ト下面とパッケ−ジの境界７（パッケ
−ジの最大長さの時の）より、略５０μｍ凹ませてあ
る。保持台ゲ−ト側コ−ナ−６と、樹脂ゲ−ト下面とパ
ッケ−ジの境界７を結ぶ線の延長線と樹脂ゲ−ト上面の
交点８より、パッケ−ジ２側にパンチ４をあて切断する
と、保持台ゲ−ト側コ−ナ−６を支点に力が加わり、あ
る確率で保持台ゲ−ト側コ−ナ−６の方向に向かってク
ラックが発生し、樹脂カケが発生する。更に、ある確率
でこのクラックが、ペレットが搭載されたアイランド
（図示せず）方向に伸びる。一方、樹脂ゲ−ト上端面の
交点８より外側を切断すると、樹脂ゲ−ト下面９パッケ
−ジの境界７より外側の樹脂ゲ−ト下面９に剪断力が加
わり樹脂ゲ−ト下面９で切断され、樹脂カケは発生しな
い。しかし、パッケ−ジ２から、樹脂ゲ−ト５の切断位
置が離れるにつれて、樹脂ゲ−ト残りは大きくなり、樹
脂ゲ−ト残り規格を外れる。また、パンチ４を最適位置
に設定しても、切断を繰り返すと、パンチ４の磨耗が進
み樹脂ゲ−ト残りが大きくなり、樹脂ゲ−ト残り規格外
れの発生に至る。そのために、樹脂ゲ−ト残り規格外れ
が発生しないように、パンチ４の位置調整、交換が必要
となる。ところで、樹脂ゲ−ト下面からパッケ−ジの下
面までが長くなるにしたがって、切断時にパッケ−ジ保
持台１全体に、切断の力が分散するとともに、カケ、ク
ラックのために大きな破断力が必要になり、カケ、クラ
ックは発生しにくい。しかし、ミニモ−ルドのように小
形になると、樹脂ゲ−ト下面９からパッケ−ジの下面
（表示せず）までが、樹脂ゲ−ト５の厚さに対して短く
なり、樹脂ゲ−ト５の切断時のパッケ−ジ台樹脂ゲ−ト
側コ−ナ−６に力が集中して加わり、カケが発生しやす
くなる。このために、樹脂カケ、クラックの発生がな
く、且つ、樹脂ゲ−ト残り規格外れの発生しない樹脂ゲ
−ト切断位置範囲を長くする必要があった。By the way, when the resin gate 5 is cut, there are variations in the package dimensions due to mold deviation during molding of the mold, etc.
Resin gate side corner 6 (holding table resin gate side corner
The groove) is recessed from the boundary 7 between the lower surface of the resin gate and the package (at the maximum length of the package) by about 50 μm. The corner 4 of the holding base gate, the extension line of the line connecting the lower surface of the resin gate and the boundary 7 of the package, and the intersection 8 of the upper surface of the resin gate and the punch 4 toward the package 2 side. When the cutting is performed by applying a force, a force is applied to the holding base gate-side corner 6 as a fulcrum, and with a certain probability, a crack is generated in the direction of the holding base gate-side corner 6 and a resin chip is generated. appear. Further, with a certain probability, this crack extends toward the island (not shown) on which the pellet is mounted. On the other hand, when the outer side of the intersection 8 of the upper end surface of the resin gate is cut, a shearing force is applied to the lower surface 9 of the resin gate lower surface 9 outside the boundary 7 of the package, and the lower surface 9 of the resin gate is exposed. It is cut and no resin chipping occurs. However, as the cutting position of the resin gate 5 moves away from the package 2, the remaining resin gate becomes larger and the remaining resin gate standard is not met. Even if the punch 4 is set at the optimum position, if cutting is repeated, abrasion of the punch 4 progresses to increase the resin gate residue, resulting in occurrence of resin gate residue out of specification. Therefore, it is necessary to adjust and replace the position of the punch 4 so that the resin gate remains out of specification. By the way, as the length from the lower surface of the resin gate to the lower surface of the package becomes longer, the cutting force is distributed over the entire package holding base 1 at the time of cutting, and a large breaking force is required due to cracks and cracks. It is difficult for cracks and cracks to occur. However, when it becomes small like a mini mold, the distance from the lower surface 9 of the resin gate to the lower surface (not shown) of the package becomes shorter than the thickness of the resin gate 5, and the resin gate 5 becomes thinner. At the time of cutting of 5, the force is concentrated and applied to the package-gate resin gate side corner 6, which easily causes chipping. For this reason, it is necessary to lengthen the resin gate cutting position range in which resin chipping and cracking do not occur and the resin gate remains out of specification.
【０００４】[0004]
【課題を解決するための手段】上記目的を達成するため
の技術手段としてのこの発明は、上下金型の衝合面をも
つキャビティに樹脂モ−ルドされたモ−ルド成形品であ
って、この上部側樹脂ゲ−トのある側面を下部側側面よ
り突出させたことを特徴とするモ−ルド成形品である。
また、上型と下型の衝合面間にキャビティを形成し、上
型衝合面に金型ゲ−トを形成して樹脂注入するモ−ルド
金型において、前記金型ゲ−ト形成側における前記上型
のキャビティ内壁面と前記下型のキャビティの内壁面と
を段違いに形成したことを特徴とするモ−ルド金型であ
る。SUMMARY OF THE INVENTION The present invention as a technical means for achieving the above object is a molded resin product molded in a cavity having abutting surfaces of upper and lower molds. The molded product is characterized in that the side surface having the upper side resin gate is projected from the lower side surface.
In addition, in a mold for forming a cavity between the abutting surfaces of the upper die and the lower die, forming a die gate on the abutting surface of the upper die and injecting resin, the die gate is formed. The inner wall surface of the cavity of the upper mold and the inner wall surface of the cavity of the lower mold on the side of the mold are formed in different steps.
【０００５】[0005]
【作用】金型ゲ−トを有する側の金型により形成された
パッケ−ジの樹脂ゲ−ト側側面を、衝合する金型ゲ−ト
を有しない金型により形成されたパッケ−ジの相対する
側面間より、突出させる。このことにより、切断時の力
が切断位置からパッケ−ジ保持台へ向かうが、金型ゲ−
トを有する金型で形成されるパッケ−ジの樹脂ゲ−ト側
樹脂に伝りカケを生ずる場合があるが、金型ゲ−トを有
しない金型で形成されるパッケ−ジの樹脂ゲ−ト側側面
まではカケが発生しない。このことにより、ペレットア
イランドに向かうクラックも発生しない。A package formed by a mold having no mold gate for abutting the resin gate side surface of the package formed by the mold having the mold gate. It is made to project from between the opposite side surfaces of. As a result, the force at the time of cutting goes from the cutting position to the package holding table, but the mold
The resin side of the package formed by the mold having the mold may be transferred to the resin and may cause chipping, but the resin form of the package formed by the mold having no mold gate. -No chipping will occur up to the side surface on the G side. As a result, cracks toward the pellet island do not occur.
【０００６】[0006]
【実施例１】従来の技術で説明したミニモ−ルド成形品
の半導体装置を例に説明するが、その他コンデンサ等の
小形電子部品で樹脂ゲ−ト残りの規格が厳しく規定され
ている製品に適用した場合に効果は大である。図１、図
２、図３を用いて、本発明の実施例について説明する。
図１は本発明のミニモ−ルド成形品の斜視図、図２
（ａ）は図１のミニモ−ルド成形品の上下金型の衝合面
の平面図、および図２（ｂ）は図２（ａ）のＡ−Ａ’断
面図、図３はミニモ−ルド成形品の切断時の側断面図を
示す。図２に示したように、上下一対の金型の上金型４
２に上金型キャビティ４３、下金型４４に下金型キャビ
ティ４５を有し、上金型の衝合面に形成された金型ゲ−
ト４６からキャビティ４３、４５内に溶融樹脂を注入す
る金型の衝合面４１間に、半導体ペレット（図示せず）
が搭載されたアイランド（図示せず）および前記半導体
ペレットと金属細線で電気的に接合したリ−ド（図示せ
ず）を有するリ−ドフレ−ム（図示せず）を挿入し、つ
ぎに、金型を閉じた後に金型ゲ−ト４６からキャビティ
４３、４５内に溶融樹脂を注入して、ミニモ−ルド成形
品を形成する。この時の上金型のゲ−ト側側面４７よ
り、下金型のゲ−ト側側面４８が突出している。つぎ
に、金型を開いた後にミニモ−ルド成形品を取り出し、
樹脂ゲ−ト部の樹脂を除去する。つぎに、リ−ドフレ−
ムを切断し、図１に示すように一個一個のミニモ−ルド
成形品１２（リ−ドは図示せず）に分離する。この基本
構成は従来のミニモ−ルド成形品と異ならない。従来と
異なる点は、図１に示したように、ミニモ−ルド成形品
のパッケ−ジ１２の形状が、金型ゲ−トを有する金型
（上金型４２）より形成されたパッケ−ジの樹脂ゲ−ト
側側面２１を金型ゲ−トを有しない金型（下金型４４）
より形成されたパッケ−ジの樹脂ゲ−ト側側面２２より
突出して成ることにある。[First Embodiment] A semiconductor device of a mini-molded product described in the prior art will be described as an example, but it is applied to other small electronic parts such as capacitors in which the resin gate remaining standard is strictly regulated. If you do, the effect is great. An embodiment of the present invention will be described with reference to FIGS. 1, 2, and 3.
1 is a perspective view of a mini-molded product of the present invention, FIG.
(A) is a plan view of the abutting surfaces of the upper and lower molds of the mini-molded product of FIG. 1, FIG. 2 (b) is a sectional view taken along the line AA 'of FIG. 2 (a), and FIG. 3 is a mini-mold. The side sectional view at the time of cutting the molded product is shown. As shown in FIG. 2, a pair of upper and lower mold upper molds 4
2 has an upper mold cavity 43 and a lower mold 44 has a lower mold cavity 45, and is a mold gate formed on the abutting surface of the upper mold.
A semiconductor pellet (not shown) between the abutting surfaces 41 of the mold for injecting the molten resin into the cavities 43, 45 from the mold 46.
Insert a lead frame (not shown) having an island (not shown) on which is mounted and a lead (not shown) electrically connected to the semiconductor pellet with a fine metal wire, and then, After the mold is closed, a molten resin is injected from the mold gate 46 into the cavities 43 and 45 to form a mini-molded product. At this time, the gate side surface 48 of the lower mold projects from the gate side surface 47 of the upper mold. Next, after opening the mold, take out the mini mold molded product,
The resin in the resin gate portion is removed. Next, the lead frame
The pieces are cut into individual mini-molded products 12 (leads not shown) as shown in FIG. This basic structure is the same as the conventional mini-molded product. As shown in FIG. 1, the package 12 of the mini-molded product is different from the conventional one in that the package 12 is formed by a mold (upper mold 42) having a mold gate. The side surface 21 on the resin gate side of the mold has no mold gate (lower mold 44)
The package is formed so as to project from the side surface 22 on the resin gate side of the package.
【０００７】この樹脂ゲ−ト部の樹脂除去方法は図３に
示すようにパッケ−ジ保持台１上にミニモ−ルド成形品
のパッケ−ジ１２を載せ、パッケ−ジ押さえ治具３で押
さえる。つぎに、樹脂ゲ−ト切断用のパンチ４でパッケ
−ジ１２から、樹脂ゲ−ト残り２３（図１）長さ規格以
内の距離離れた位置で樹脂ゲ−ト１５を切断し、樹脂ゲ
−トを除去する。この時、樹脂ゲ−トの一部がパッケ−
ジ１２に残る長さ（樹脂ゲ−ト残り２３（図１）長さ）
の製品規格は、たとえば１００μｍである。この時、保
持台ゲ−ト側コ−ナ−６と、金型ゲ−トを有しない金型
４４（図２）から成形されたパッケ−ジの樹脂ゲ−ト側
側面２２とゲ−トを有する金型４２（図２）で形成され
た樹脂の交点１７（樹脂ゲ−ト下面とパッケ−ジの交
点）の延長線上の樹脂ゲ−ト上端との交点１９のパッケ
−ジ１２より遠い側を切断すると、金型ゲ−ト４６（図
２）を有する金型４２から成形されたパッケ−ジの樹脂
ゲ−ト側側面２１にのみカケが発生することがある。し
かし、このカケをオリジンとして、金型ゲ−トを有しな
い金型４４から形成されたパッケ−ジ１２にクラックの
進行はない。一方、更に切断面を遠ざけて、保持台樹脂
ゲ−ト側コ−ナ−６と、樹脂ゲ−トの付け根２０を結ぶ
延長線上の樹脂ゲ−トの上面との交点１８の、パッケ−
ジ１２より遠いところで切断すると、樹脂ゲ−トのクラ
ックは保持台樹脂ゲ−ト側コ−ナ−６に向かってクラッ
クが進行し、樹脂ゲ−ト下面１６に達したところで切断
され、樹脂カケは発生しない。本発明は、金型ゲ−トを
有しない金型４４（図２）で形成したパッケ−ジの樹脂
ゲ−ト側側面２２に対しては、パッケ−ジ保持台１を切
断側に近付けた効果を有する。突出する長さは、樹脂ゲ
−ト厚さ、樹脂ゲ−ト下面１６からパッケ−ジ下面迄の
長さ、金型ゲ−トを有する金型により形成されたパッケ
−ジの樹脂ゲ−ト側側面２１からパッケ−ジ保持台樹脂
ゲ−ト側コ−ナ−６までの長さ、樹脂ゲ−ト残り２３
（図１）規格を考慮して決める。As shown in FIG. 3, the method of removing the resin from the resin gate portion is as follows. A package 12 of a mini-molded product is placed on the package holding base 1 and is held by the package holding jig 3. . Next, the resin gate 15 is cut by the resin gate cutting punch 4 at a position separated from the package 12 by a distance within the length standard of the resin gate remaining 23 (FIG. 1). -Remove the grate. At this time, part of the resin gate is the package
Length remaining on the die 12 (resin gate remaining 23 (Fig. 1) length)
The product standard of is 100 μm, for example. At this time, the holding gate side corner 6 and the resin gate side surface 22 and the gate of the package formed from the die 44 (FIG. 2) having no die gate. 2 is farther than the package 12 at the intersection 19 with the resin gate upper end on the extension line of the resin intersection 17 (intersection between the resin gate lower surface and the package) formed by the mold 42 (FIG. 2) having When the side is cut, a crack may occur only on the resin gate side surface 21 of the package molded from the mold 42 having the mold gate 46 (FIG. 2). However, there is no progress of cracks in the package 12 formed from the mold 44 having no mold gate with this chip as an origin. On the other hand, with the cut surface further away, the package of the intersection 18 between the holding table resin gate side corner 6 and the upper surface of the resin gate on the extension line connecting the base 20 of the resin gate.
When the resin gate is cut away from the jig 12, the crack of the resin gate progresses toward the holding base resin gate side corner 6 and is cut when reaching the lower surface 16 of the resin gate. Does not occur. In the present invention, the package holding base 1 is brought closer to the cutting side with respect to the resin gate side surface 22 of the package formed by the mold 44 (FIG. 2) having no mold gate. Have an effect. The protruding length is the thickness of the resin gate, the length from the lower surface 16 of the resin gate to the lower surface of the package, and the resin gate of the package formed by the mold having the mold gate. The length from the side surface 21 to the package holding table resin gate side corner 6 and the remaining resin gate 23
(Fig. 1) Determined in consideration of standards.
【０００８】[0008]
【実施例２】従来の技術で説明したミニモ−ルド成形品
の半導体装置を例に説明するが、その他コンデンサ等の
小形電子部品でゲ−ト残りの規格が厳しく規定されてい
る製品に適用した場合に効果は大である。図４、図５、
図６を用いて、本発明の実施例について説明する。図４
は本発明のミニモ−ルド成形品の斜視図、図５（ａ）は
図４のミニモ−ルド成形品の上下金型の衝合面の平面
図、および図５（ｂ）は図５（ａ）のＡ−Ａ’断面図、
図５（ｃ）は図５（ａ）のＢ−Ｂ’の断面図、図６はミ
ニモ−ルド成形品の切断時の側断面図を示す。図５に示
すように、上下一対の金型の上金型５２に上金型キャビ
ティ５３、下金型５４の下金型キャビティ５５を有し、
上金型の衝合面５１に形成された金型ゲ−ト５６からキ
ャビティ５３、５５内に溶融樹脂を注入する金型の衝合
面５１間に、半導体ペレット（図示せず）が搭載された
アイランド（図示せず）、および前記半導体ペレットと
金属細線で電気的に接合したリ−ド（図示せず）を有す
るリ−ドフレ−ム（図示せず）を挿入し、つぎに、金型
を閉じた後に金型ゲ−ト５６からキャビティ５３、５５
内に溶融樹脂を注入して、ミニモ−ルド成形品を形成す
る。この時、上金型のキャビティ５３の金型ゲ−ト側面
５７より、下金型のキャビティ５５の金型ゲ−ト側側面
の金型ゲ−ト直下５８が金型下面まで金型ゲ−ト５６幅
より広く突出している。つぎに、金型を開いた後にミニ
モ−ルド成形品を取り出し、不要な樹脂ゲ−ト部の樹脂
を除去する。つぎに、リ−ドフレ−ムを切断し、一個一
個のミニモ−ルド成形品に分離する。この基本構成は従
来のミニモ−ルド成形品と異ならない。図４に示すよう
に、従来と異なる点は、ミニモ−ルド成形品のパッケ−
ジ３２の形状が、金型ゲ−トを有する金型（上金型５２
（図５））より形成された樹脂ゲ−ト側側面３１を、金
型ゲ−ト有しない金型（下金型５４（図５））より形成
されたパッケ−ジの樹脂ゲ−ト側側面３３のうち、樹脂
ゲ−ト直下の側面がパッケ−ジ下面まで樹脂ゲ−ト幅よ
り広く凹んだ凹部側面３４を形成して成ることにある。
樹脂ゲ−ト部の切断時の側断面図６は図３と同じにな
り、切断に対する効果は実施例１と同じになる。[Embodiment 2] A semiconductor device of a mini-molded product described in the prior art will be described as an example, but the present invention was applied to other small electronic parts such as capacitors in which the gate remaining standard is strictly regulated. The effect is great in some cases. 4, FIG.
An embodiment of the present invention will be described with reference to FIG. FIG.
Is a perspective view of the mini-molded product of the present invention, FIG. 5 (a) is a plan view of the abutting surfaces of the upper and lower molds of the mini-molded product of FIG. 4, and FIG. 5 (b) is FIG. ) AA 'sectional view,
5 (c) is a sectional view taken along the line BB 'in FIG. 5 (a), and FIG. 6 is a side sectional view of the mini-molded product at the time of cutting. As shown in FIG. 5, an upper mold cavity 53 and a lower mold cavity 55 of a lower mold 54 are provided in an upper mold 52 of a pair of upper and lower molds,
A semiconductor pellet (not shown) is mounted between the abutment surfaces 51 of the die for injecting the molten resin into the cavities 53, 55 from the die gate 56 formed on the abutment surface 51 of the upper die. And a lead frame (not shown) having an island (not shown) and a lead (not shown) electrically connected to the semiconductor pellet with a fine metal wire are inserted, and then a mold is formed. After closing the mold, from the mold gate 56 to the cavities 53, 55
A molten resin is injected into the inside to form a mini-molded product. At this time, from the mold gate side surface 57 of the upper mold cavity 53 to the mold lower surface 58 of the lower mold cavity 55, which is directly below the mold gate side surface of the mold gate side, to the lower surface of the mold. Projected wider than width 56. Next, after opening the mold, the mini-molded product is taken out to remove unnecessary resin in the resin gate portion. Next, the lead frame is cut and separated into individual mini-molded products. This basic structure is the same as the conventional mini-molded product. As shown in FIG. 4, the point different from the conventional one is the package of the mini-molded product.
The shape of the die 32 is a mold having a mold gate (upper mold 52
(FIG. 5)), the resin gate side surface 31 is formed by a mold (lower mold 54 (FIG. 5)) having no mold gate. Among the side surfaces 33, the side surface immediately below the resin gate is formed with a recess side surface 34 which is recessed to the lower surface of the package wider than the width of the resin gate.
6 is the same as FIG. 3 when the resin gate portion is cut, and the effect on cutting is the same as that of the first embodiment.
【０００９】[0009]
【発明の効果】本発明によれば、パンチを近付けても樹
脂ゲ−ト下のパッケ−ジにカケやクラックが発生せず、
ゲ−ト付け根部の樹脂にカケが発生しても進行性はな
い。したがって、樹脂カケ、クラックの発生がなく、且
つ、樹脂ゲ−ト残り規格外れの発生しない樹脂ゲ−ト切
断位置の許容範囲が広くなり、パンチの位置調整、交換
の頻度を低減できる。According to the present invention, even if a punch is brought close to the package, no crack or crack is generated in the package under the resin gate,
Even if chipping occurs in the resin at the base of the gate, it does not progress. Therefore, the allowable range of the resin gate cutting position where the resin chip and the crack are not generated, and the resin gate remains out of specification is widened, and the frequency of punch position adjustment and replacement can be reduced.
【図１】 本発明の実施例１のミニモ−ルド成形品の斜
視図FIG. 1 is a perspective view of a mini-molded product according to a first embodiment of the present invention.
【図２】（ａ）本発明の図１のミニモ−ルド金型の衝合
面の平面図 （ｂ）本発明の図２（ａ）のＡ−Ａ’の断面図2 (a) is a plan view of the abutment surface of the mini mold of FIG. 1 of the present invention (b) is a cross-sectional view of AA ′ of FIG. 2 (a) of the present invention.
【図３】 本発明の実施例１のミニモ−ルドの樹脂ゲ−
ト切断時の側断面図FIG. 3 is a resin mold of a mini mold according to the first embodiment of the present invention.
Side sectional view when cutting
【図４】 本発明の実施例２のミニモ−ルド形成品の斜
視図FIG. 4 is a perspective view of a mini-molded article of Example 2 of the present invention.
【図５】（ａ）本発明の図４のミニモ−ルド金型の衝合
面の平面図 （ｂ）本発明の図５（ａ）のＡ−Ａ’の断面図 （ｃ）本発明の図５（ｂ）のＢ−Ｂ’の断面図5 (a) is a plan view of the abutment surface of the mini mold of FIG. 4 of the present invention (b) is a cross-sectional view of AA ′ of FIG. 5 (a) of the present invention (c) of the present invention Sectional drawing of BB 'of FIG.5 (b)
【図６】 本発明の実施例２のミニモ−ルドの樹脂ゲ−
ト切断時の側断面図FIG. 6 is a resin mold of a mini mold according to a second embodiment of the present invention.
Side sectional view when cutting
【図７】 従来のパッケ−ジの樹脂ゲ−ト切断時の側断
面図FIG. 7 is a side sectional view of a conventional package at the time of cutting a resin gate.
１２ パッケ−ジ ２１ 金型ゲートを有する金型より形成されたパッケー
ジの樹脂ゲート側側面（上部側樹脂ゲートのある側面） ２２ 金型ゲートを有しない金型より形成されたパッケ
ージの樹脂ゲート側側面（下部側側面）12 Package 21 Resin Gate Side Side of Package Formed from Mold Having Mold Gate (Side Side with Upper Resin Gate) 22 Resin Gate Side Side of Package Formed from Mold without Mold Gate (Bottom side)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｌ 31:34 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display area // B29L 31:34
Claims (4)
モ−ルドされたモ−ルド成形品であって、この上部側樹
脂ゲ−トのある側面を下部側側面より突出させたことを
特徴とするモ−ルド成形品。1. A molded product obtained by molding a resin into a cavity having an abutting surface of upper and lower molds, the side surface having the upper side resin gate protruding from the lower side surface. Molded product characterized by
モ−ルドされたモ−ルド成形品であって、この上部側樹
脂ゲ−トのある側面より、下部側側面のうち樹脂ゲ−ト
直下に凹部を有することを特徴とするモ−ルド成形品。2. A molded product obtained by molding a resin into a cavity having an abutting surface of upper and lower molds, wherein the side surface having the upper side resin gate is lower than the lower side surface. -A molded product characterized in that it has a recess directly below the mold.
し、上型衝合面に金型ゲ−トを形成して樹脂注入するモ
−ルド金型において、前記金型ゲ−ト形成側における前
記上型のキャビティ内壁面と前記下型のキャビティの内
壁面とを段違いに形成したことを特徴とするモ−ルド金
型。3. A mold for forming a cavity between the abutting surfaces of an upper die and a lower die, forming a die gate on the abutting surface of the upper die, and injecting resin into the die. A mold for molding, wherein an inner wall surface of the cavity of the upper mold and an inner wall surface of the cavity of the lower mold are formed in different steps on the mold forming side.
し、上型衝合面に金型ゲ−トを形成して樹脂注入するモ
−ルド金型において、前記金型ゲ−ト形成側における前
記上型のキャビティ内壁面と前記下型のキャビティの内
壁面のうち金型ゲ−ト直下を段違いに形成したことを特
徴とするモ−ルド金型。4. A mold for forming a cavity between the abutting surfaces of an upper die and a lower die, forming a die gate on the abutting surface of the upper die, and injecting resin into the die. A mold for molding, wherein the inner wall surface of the cavity of the upper mold and the inner wall surface of the cavity of the lower mold on the side where the gate is formed are formed so as to have a step difference directly below the mold gate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14901794A JPH0811166A (en) | 1994-06-30 | 1994-06-30 | Molded product and mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14901794A JPH0811166A (en) | 1994-06-30 | 1994-06-30 | Molded product and mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0811166A true JPH0811166A (en) | 1996-01-16 |
Family
ID=15465858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14901794A Pending JPH0811166A (en) | 1994-06-30 | 1994-06-30 | Molded product and mold |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0811166A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023044584A (en) * | 2021-09-17 | 2023-03-30 | 株式会社東芝 | Semiconductor device |
-
1994
- 1994-06-30 JP JP14901794A patent/JPH0811166A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023044584A (en) * | 2021-09-17 | 2023-03-30 | 株式会社東芝 | Semiconductor device |
| US12564088B2 (en) | 2021-09-17 | 2026-02-24 | Kabushiki Kaisha Toshiba | Semiconductor device |
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